HEATING ARRANGEMENT

Abstract

A heating arrangement has a coolant housing with an inflow connection and an outflow connection for a coolant. Heating elements are arranged on opposite housing walls and include connections for the supply of power. Three circuit-board pieces of a circuit board are arranged in a row and connected to one another via flexible regions. Power electronic components and connections for connecting to the power-supply connections of the heating elements are arranged on the two edge circuit-board pieces. The circuit board is bent in flexible regions such that the two edge circuit-board pieces lie opposite one another. The coolant housing lies between the opposite edge circuit-board pieces. The power-supply connections of the heating elements and the connections on the edge circuit-board pieces are in electrical contact.

Claims

1-4. (canceled)

5. A heating arrangement, comprising: a coolant housing having an inflow connection and an outflow connection for a coolant; heating elements arranged on at least two opposite housing walls of said coolant housing, said heating elements having power supply connections; a circuit board with at least three circuit board pieces, said circuit-board pieces being disposed in a row and being connected to one another via flexible regions, said circuit board pieces including two edge circuit-board pieces carrying power electronic components and connections for connecting to said power-supply connections of said heating elements; said circuit board being bent at said flexible regions to arrange said two edge circuit-board pieces to lie opposite one another; and wherein said coolant housing is disposed between said edge circuit-board pieces, and wherein said power-supply connections of said heating elements and said connections on said edge circuit-board pieces are in electrical contact with one another.

6. The heating arrangement according to claim 5, wherein said at least three circuit-board pieces include a central circuit-board piece carrying a logic circuit on said central circuit-board piece.

7. The heating arrangement according to claim 5, wherein said heating elements are heating rods.

8. The heating arrangement according to claim 5, wherein said heating elements are formed by spray-applied resistive meanders.

Description

[0014] The invention shall be described in more detail below with reference to an exemplary embodiment with the aid of figures, in which:

[0015] FIG. 1 shows a heating arrangement according to the invention; and

[0016] FIG. 2 shows a three-piece circuit board.

[0017] FIG. 1 shows schematically a coolant housing 1, which has an inflow connection and an outflow connection 2 for a coolant, of which only one is shown in the diagram, however.

[0018] Heating elements 3 (not shown in detail), which may be in the form of resistive meanders, for instance, are arranged on the upper face and lower face of the coolant housing 1. It would also be possible to provide further heating elements on the front face and rear face (from the perspective of the viewer of FIG. 1) and possibly even on the end face.

[0019] A circuit board 4 is shown as a three-piece circuit board, and hence comprises a central circuit-board piece 4a and two edge circuit-board pieces 4b, 4c. The three circuit-board pieces 4a, 4b, 4c are connected to one another via flexible regions 5a, 5b; this is shown schematically in FIG. 2. In the exemplary embodiment, the central circuit-board piece 4a is intended to be provided with logic circuits (and/or analog circuits) for signal provision and signal processing, whereas the edge circuit-board pieces 4b, 4c carry mainly power electronic circuits. They also comprise connections 5a, 5b, by means of which they are connected to power-supply connections of the heating elements 3 in order to supply power thereto.

[0020] The heating arrangement shown in FIG. 1 thus allows a highly compact, space-saving yet high-performance design.