SYSTEM AND METHOD FOR THERMAL CONTROL OF POWERED SYSTEMS ON-BOARD A FLIGHT VEHICLE USING PHASE CHANGE MATERIALS (PCMs)
20230087209 · 2023-03-23
Inventors
- Brendon R. Holt (Tucson, AZ, US)
- Gerald P. Uyeno (Tucson, AZ, US)
- Vanessa Reyna (Tucson, AZ, US)
- Olga Vargas (Tucson, AZ, US)
- Jordan Sawyer (Marana, AZ, US)
- Brayden Peery (Vail, AZ, US)
Cpc classification
B64G5/00
PERFORMING OPERATIONS; TRANSPORTING
International classification
Abstract
Thermal control of powered systems on-board a flight vehicle is achieved by leveraging the latent heat storage capacity of Phase Change Materials (PCMs) to maintain the operating temperature at or slightly above the melting temperature of the PCM. The invention is particularly well suited for use with powered systems such as laser, microwave emitters, RF sensors and high-density power electronics that must operate at a desired operating temperature while generating considerable waste heat in a confined packaging volume of smaller flight vehicles such as missiles, rockets, guided projectiles, drones or other such platforms.
Claims
1. A method of maintaining a desired operating temperature for a powered system on-board a flight vehicle, the method comprising: placing a reservoir containing a phase change material (PCM) in direct thermal contact with the powered system, said PCM having a melting point temperature between 20° C. and 45° C. and at or less than the desired operating temperature; prior to launching the flight vehicle, lowering the temperature of the reservoir and PCM to below its melting point to ensure that the PCM is in a solid phase; and during flight, activating the powered system thereby generating waste heat that is transferred to the reservoir to initiate a phase change of the solid PCM to a liquid state at the melting point temperature thereby maintaining the temperature of the powered device at the desired operating temperature.
2. The method of claim 1, wherein the powered system is one of a laser, a microwave emitter, an RF sensor and high-density power electronics.
3. The method of claim 1, wherein the reservoir is placed in direct thermal contact with the powered system through a thermal interface (TIN).
4. The method of claim 1, wherein the melting point temperature is between approximately 0° C. and 10° C. of the desired operating temperature.
5. The method of claim 1, further comprising: thermally isolating the reservoir of PCM to minimize the transfer of waste heat from other sources to the reservoir.
6. The method of claim 1, wherein the flight vehicle has a heat sinking requirement for the powered system, further comprising: selecting the mass of said PCM to have a latent heat storage capacity in excess of the heat sinking requirement for the flight vehicle.
7. The method of claim 1, wherein prior to launch, further comprising: mounting the flight vehicle on a launch platform, said launch platform including a cold plate that is thermally coupled to the reservoir pre-launch; and a cooling source configured to extract heat from the cold plate to lower the temperature of the cold plate to solidify the PCM pre-launch.
8. The method of claim 7, wherein prior to launch, further comprising: measuring an ambient temperature outside the flight vehicle; if the ambient temperature is less than the melting point temperature minus a threshold temperature, determining that the PCM is in the solid phase.
9. The method of claim 7, wherein an outer surface of the reservoir opposite the powered system provides, or is conformal with, an outer surface of the flight vehicle for coupling to the cold plate.
10. The method of claim 7, wherein the reservoir is displaced from a surface of the flight vehicle, further comprising: providing a thermally conductive tab that provides a thermally conductive path from the reservoir to the surface of the flight vehicle for coupling to the cold plate.
11. The method of claim 1, wherein the flight vehicle has a heat sinking requirement for the powered system, further comprising: selecting the mass of said PCM to have a latent heat storage capacity less than the heat sinking requirement for the flight vehicle; placing a thermo-electric cooler (TEC) in direct thermal contact with the reservoir opposite the powered system; during flight, activating the TEC to remove heat from the reservoir to slow the phase change of the PCM from solid to liquid to effectively increase the latent heat storage capacity of the PCM to greater than the heat sinking requirement.
12. The method of claim 11, wherein prior to launch, using the TEC to lower the temperature of the reservoir and PCM to below the melting point to ensure that the PCM is in a solid phase.
13. The method of claim 11, wherein prior to launch, mounting the flight vehicle on a launch platform, said launch platform including a cold plate that is thermally coupled to the reservoir or backside of the TEC pre-launch; and a cooling source configured to extract heat from the cold plate to lower the temperature of the cold plate to solidify the PCM pre-launch.
14. A method of maintaining a desired operating temperature for a powered system on-board a flight vehicle, the method comprising: placing a reservoir containing a phase change material (PCM) in direct thermal contact with the powered system, said PCM having a melting point temperature between 20° C. and 45° C. and at or less than the desired operating temperature, said PCM having a latent heat storage capacity less than a heat sinking requirement for the flight vehicle; placing a thermo-electric cooler (TEC) in direct thermal contact with the reservoir opposite the powered system; prior to launching the flight vehicle, lowering the temperature of the reservoir and PCM to below its melting point to ensure that the PCM is in a solid phase; and during flight, activating the powered system thereby generating waste heat that is transferred to the reservoir to initiate a phase change of the solid PCM to a liquid state at the melting point temperature thereby maintaining the temperature of the powered device at the desired operating temperature; and activating the TEC to remove heat from the reservoir to slow the phase change of the PCM from solid to liquid to effectively increase the latent heat storage capacity of the PCM to greater than the heat sinking requirement.
15. The method of claim 11, wherein prior to launch, using an external cooling source to lower the temperature to ensure the PCM is in the solid phase.
16. A flight system, comprising: a flight vehicle including an airframe; a powered system within the airframe, said powered system having a desired operating temperature; and a reservoir containing a phase change material (PCM) in direct thermal contact with the powered system, said PCM having a melting point temperature between 20° C. and 45° C. and at or less than the desired operating temperature; and a launch platform including a cold plate that is thermally coupled to the reservoir pre-launch; and a cooling source configured to extract heat from the cold plate to lower the temperature of the cold plate to solidify the PCM pre-launch, wherein during flight, the reservoir of solid PCM is configured to receive waste heat from the powered system to initiate a phase change to a liquid phase at the melting point temperature to maintain the temperature of the powered system at the desired operating temperature.
17. The flight system of claim 16, wherein the powered system is one of a laser, a microwave emitter, an RF sensor and high-density power electronics.
18. The flight system of claim 16, further comprising: a thermal interface (TIN) that places the reservoir in direct thermal contact with the powered system.
19. The flight system of claim 16, wherein the flight vehicle has a heat sinking requirement for the powered system, wherein said PCM has a mass selected to have a latent heat storage capacity in excess of the heat sinking requirement for the flight vehicle.
20. The flight system of claim 16, wherein the flight vehicle has a heat sinking requirement for the powered system, wherein said PCM has a mass selected to have a latent heat storage capacity less than the heat sinking requirement for the flight vehicle, further comprising: a thermo-electric cooler (TEC) in direct thermal contact with the reservoir opposite the powered system, wherein during flight, the TEC is activated to remove heat from the reservoir to slow the phase change of the PCM from solid to liquid to effectively increase the latent heat storage capacity of the PCM to greater than the heat sinking requirement.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION OF THE INVENTION
[0019] There are two primary methods of storing thermal energy, sensible heat and latent heat. Sensible heat is the heat stored in a substance by raising the temperature of the solid or liquid. Latent heat is the thermal energy associated with the phase change of a material, measured as a latent heat of fusion (freezing/melting, [kJkg.sup.−1]). As shown in
[0020] The present invention provides a system and method for thermal control of powered systems on-board a flight vehicle using PCMs. This approach leverages the large latent heat storage capacity of PCMs to maintain the operating temperature at or slightly above the melting temperature of the PCM. The invention is particularly well suited for use with powered systems such as lasers, microwave emitters, RF sensors and high-density power electronics that must operate at a desired operating temperature while generating considerable waste heat in a confined packaging volume of smaller flight vehicles such as missiles, rockets, guided projectiles, drones or other such platforms.
[0021] One issue was how to transition and maintain the PCM in its solid phase on-board the flight vehicle until it was needed to store waste heat from the powered system. In the confined packaging volume of the platforms of interest, there is simply not enough space to provide active cooling system of sufficient capability to extract heat from and solidify the PCM under time, power and volume constraints. The solution was to solidify the PCM prior to launching the flight vehicle. This allowed for either the use of a large cooling system such as a chilled liquid loop, HVAC chiller or large-scale TEC to rapidly solidify the PCM or the use of a small-scale TEC on-board the flight vehicle having sufficient time to solidify the PCM. The small-scale TEC on-board the flight vehicle can also be used in flight to effectively increase the heat storage capacity of the PCM. Whether to include a small TEC on-board is a volume and mass design trade-off versus the mass of the PCM and will be application specific.
[0022] Referring now to
[0023] A system designer first has to define the desired operating temperature of powered system 22 and the heat storage capacity requirement to absorb waste heat from the powered system to maintain that desired operating temperature (step 40). The system designer selects a particular PCM whose melting temperature (phase change temperature from solid to liquid) is at or somewhat less than the desired operating temperature (step 42). Ideally, there would be no thermal losses between the powered system and reservoir but in any practical system there is a measure of thermal resistance such that the melting temperature will need to be some what less than the operating temperature, typically between approximately 0° C. and 10° C. The systems are typically engineered to make the delta as close to zero as possible. Powered systems of interest such as lasers, microwave emitters, RF sensors and high-density power electronics will require a melting point temperature in a range between 20° C. and 45° C. A representative but not exhaustive list of suitable PCMs 44 with melting temperatures in this range are provided in
[0024] To configure the latent heat storage system, the PCM reservoir 24 is placed in direct thermal contact with the powered system 22 (step 50). A thermal interface (TIN) may be placed between the reservoir 24 and the powered system 22 to minimize thermal resistance. In other cases, a surface of the reservoir 24 is placed in direct mechanical and thermal contact with a surface of the powered system. As part of the overall system design, the reservoir 24 is suitably thermally isolated from other heat sources inside the flight vehicle so that all of its heat storage capacity is available to absorb waste heat from the powered system (step 52). Isolation may be achieved by placing the reservoir 24 as far as possible for other sources of heat or by insulating the reservoir 24. No design is perfect but the goal is to reduce other thermally conductive paths to the reservoir as much as possible.
[0025] Prior to launch (step 54), the automated systems on the launch platform 26 or flight vehicle 20 must ensure that the reservoir of PCM is fully solidified. If a measured ambient temperature outside the flight vehicle is sufficiently below the melting point (e.g. ambient temp<melting point temp−threshold), the system can assume with confidence that the PCM is in its solid phase (step 56). If not, the system employs either the launcher's cooling system 28 or the vehicle's TEC 58 (if one is provided) to lower the temperature of the reservoir and PCM to below the melting point to transition the PCM from a liquid to a solid phase (step 60). Even if the vehicle is provided with a TEC, it may be preferable to use the launcher's larger, hence faster, cooling system to solidify the PCM.
[0026] In flight (step 62), waste heat is transferred from the powered system 22 into the reservoir 24 to initiate a phase change of the solid PCM at the melting temperature thereby maintaining the powered system's operating temperature at the desired operating temperature (step 64). As the mission progresses and more waste heat is stored in the reservoir the percentage of the PCM that is liquefied continues to increase but (per design) will never fully liquefy, and thus the reservoir will remain at the melting temperature. If the small on-board TEC is provided, it can draw heat from the reservoir to slow the liquefaction of the PCM thereby effectively increasing the heat storage capacity of the reservoir (step 66). The heat drawn from the TEC is transferred to the surface of the flight vehicle and dumped into the atmosphere.
[0027] As shown in
[0028] Referring now to
[0029] A launch platform 120 includes a cold plate 122 that is thermally coupled to the reservoir 110 as, or conformal with, the outer surface of the flight vehicle pre-launch and a cooling source 124 (e.g. a large-scale thermo-electric cooler (TEC), HVAC chiller or chilled liquid loop) configured to extract heat from the cold plate 122 to lower the temperature of the cold plate to solidify the PCM pre-launch. Thermal control circuits 126 use a temperature-measuring device 128 such as a thermo-couple to measure the ambient air temperature and to decide whether active cooling is required to solidify the PCM. If the ambient temperature is sufficiently lower than the melting temperature than the PCM is safely solidified.
[0030] Referring now to
[0031] Referring now to
[0032] A launch platform 220 includes cold plates 222a and 222b that are thermally coupled to reservoirs 210a and 210b via conduction tabs 214a and 214b and cooling sources 224a and 224b (e.g. a large-scale thermo-electric cooler (TEC), HVAC chiller or chilled liquid loop) configured to extract heat from the cold plates 222a and 222b to lower the temperature of the cold plate to solidify the PCM pre-launch. Thermal control circuits 226a and 226b use temperature measuring devices 228a and 228b such as a thermo-couple to measure the ambient air temperature and decide whether active cooling is required to solidify the PCM. If the ambient temperature is sufficiently lower than the melting temperature than the PCM is safely solidified.
[0033] Referring now to
[0034] As shown in
[0035] As shown in
[0036] While several illustrative embodiments of the invention have been shown and described, numerous variations and alternate embodiments will occur to those skilled in the art. Such variations and alternate embodiments are contemplated, and can be made without departing from the spirit and scope of the invention as defined in the appended claims.