METHOD FOR MANUFACTURING A CAMERA MODULE, CAMERA MODULE
20220345595 ยท 2022-10-27
Inventors
Cpc classification
H04N23/55
ELECTRICITY
H04N23/54
ELECTRICITY
H04N23/57
ELECTRICITY
G03B43/00
PHYSICS
International classification
Abstract
A method for manufacturing a camera module. An objective is aligned in relation to an image sensor and is subsequently fixated in terms of position by connecting to a support receiving the image sensor or to a housing surrounding the image sensor. The objective is connected to the support or to the housing via at least two cylindrical pins, the cylindrical pins being in each case placed laterally against the objective and being welded on the one hand to the objective, and on the other hand to the support or the housing. A camera module is also described.
Claims
1-10. (canceled)
11. A method for manufacturing a camera module, comprising: aligning an objective in relation to an image sensor; and after the aligning, fixing the objective in terms of position by connecting the objective to a support receiving the image sensor or to a housing surrounding the image sensor, wherein the objective is connected indirectly to the support or to the housing via at least two cylindrical pins, each of the cylindrical pins being placed laterally against the objective and being welded on the one hand to the objective, and on the other hand to the support or the housing.
12. The method as recited in claim 11, wherein the cylindrical pins are respectively placed longitudinally on a flat contact surface of the support or of the housing and are welded at least in punctiform fashion in an area of a linear contact area to the support or to the housing.
13. The method as recited in claim 11, wherein the cylindrical pins are placed in each case on a flat contact surface of the objective and welded to the objective at least in punctiform fashion in an area of a linear contact area.
14. The method as recited in claim 13, wherein the flat contact surface is a flattened portion on the side of the outer circumference.
15. The method as recited in claim 11, wherein the cylindrical pins are pressed in a direction of contact surfaces of the objective and the support or housing during welding in each case with the aid of a holding force applied from outside.
16. The method as recited in claim 11, wherein a sealing element is arranged between the objective and the support or between the objective and the housing.
17. The method as recited in claim 16, wherein the sealing element is a sealing ring.
18. A camera module, comprising: an objective; and an image sensor arranged on a support and surrounded by a housing, wherein the objective is connected indirectly, to the support or to the housing, via at least two cylindrical pins, each of the cylindrical pins being welded on the one hand to the objective, and on the other hand to the support or to the housing.
19. The camera module as recited in claim 18, wherein each of the cylindrical pins in rests on a flat contact surface of the support or of the housing and are welded to the support or to the housing at least in punctiform fashion in an area of a linear contact area.
20. The camera module as recited in claim 18, wherein each of the cylindrical pins rest in each case on a flat contact surface of the objective and welded to the objective at least in punctiform fashion in an area of a linear contact area.
21. The camera module as recited in claim 20, where the flat contact surface is a flattened portion on a side of an outer circumference of the objective,
22. The camera module as recited in claim 18, wherein a sealing element is arranged between the objective and the support, or between the objective and the housing.
23. The camera module as recited in claim 22, wherein the sealing element is a sealing ring.
24. The camera module as recited in claim 18, wherein the camera module is manufactured by: aligning the objective in relation to the image sensor; and after the aligning, fixing the objective in terms of position by connecting the objective to a support receiving the image sensor or to a housing surrounding the image sensor, wherein the objective is connected indirectly to the support or to the housing via the at least two cylindrical pins, each of the cylindrical pins being placed laterally against the objective and being welded on the one hand to the objective, and on the other hand to the support or the housing.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS
[0031] The camera module 1 shown in
[0032] As can be furthermore gathered from
[0033] It can be gathered from
[0034] When the weld seams 10 are placed, the cylindrical pins 6 are pressed in the direction of the contact surfaces 7, 8 with the aid of a holding force F.sub.H applied from the outside (see
[0035] As shown in an exemplary fashion in