METHOD OF IMPROVING WIRE STRUCTURE OF CIRCUIT BOARD AND IMPROVING WIRE STRUCTURE OF CIRCUIT BOARD

Abstract

The invention discloses a method of improving a wire structure of a circuit board, comprising the following steps: providing a multi-layer circuit board, including an inner circuit and a surface circuit; forming an opening to expose the inner circuit; forming a first circuit layer in the opening; removing the first circuit layer, the first conductive circuit, and the surface circuit on the multi-layer circuit board and removing a part of the first circuit layer in the opening; forming an adhesion promoter layer in the opening and on the multi-layer circuit board; forming a second conductive circuit on the adhesion promoter layer and on the first conductive circuit layer in the opening; forming a photoresist layer on the second conductive circuit layer; forming a second circuit layer in the opening and on the multi-layer circuit board, and removing the photoresist layer and a part of the second conductive circuit.

Claims

1. A method of improving a wire structure of a circuit board, comprising the following steps: providing a multi-layer circuit board; wherein the multi-layer circuit board comprises an inner circuit; forming at least one opening on a surface of the multi-layer circuit board; wherein the at least one opening exposes a part of the inner circuit; forming a first circuit layer in the at least one opening; and forming a second circuit layer on the first circuit layer in the at least one opening and on the surface of the multi-layer circuit board; wherein the second circuit layer comprises a plurality of circuits, a height difference between each circuit protruding a surface of the at least one opening is less than a first preset value, and a circuit disposition range between the plurality of circuits on the surface of the multi-layer circuit board is less than a second preset value.

2. The method of improving a wire structure of a circuit board as claimed in claim 1, wherein the step for forming the first circuit layer comprises the following step: forming a first conductive circuit in the at least one opening and on a surface of the inner circuit; wherein the first circuit layer is filled in the at least one opening.

3. The method of improving a wire structure of a circuit board as claimed in claim 2, wherein the step for forming the second circuit layer comprises the following steps: removing the first conductive circuit on the surface of the multi-layer circuit board and removing a part of the first circuit layer in the at least one opening; forming an adhesion promoter layer in the at least one opening and on the surface of the multi-layer circuit board; forming a second conductive circuit on the adhesion promoter layer and on the first circuit layer in the at least one opening; forming a photoresist layer on the second conductive circuit on the surface of the multi-layer circuit board; forming the second circuit layer on the second conductive circuit in the at least one opening via the photoresist layer and on the second conductive circuit on the surface of the multi-layer circuit board; removing the photoresist layer; and removing the second conductive circuit disposed at a position of the photoresist layer on the multi-layer circuit board.

4. The method of improving a wire structure of a circuit board as claimed in claim 3, wherein a thickness of the second conductive circuit formed on the surface of the multi-layer circuit board is less than and equal to 0.85 μm.

5. The method of improving a wire structure of a circuit board as claimed in claim 3, wherein the second conductive circuit is removed by etching and a lateral length of the second conductive circuit removed by etching is less than 2 μm.

6. The method of improving a wire structure of a circuit board as claimed in claim 1, wherein the first preset value is 2 μm.

7. The method of improving a wire structure of a circuit board as claimed in claim 1, wherein the second preset value is 3.5 μm.

8. An improving wire structure of the circuit board, comprising: a multi-layer circuit board, comprising an inner circuit and at least one opening; wherein the at least one opening exposes a part of the inner circuit; a first circuit layer, disposed in the at least one opening, and a height of the first circuit layer being lower than a depth of the at least one opening; and a second circuit layer, disposed on the first circuit layer in the at least one opening and on a surface of the multi-layer circuit board; wherein the second circuit layer comprises a plurality of circuits, a height difference between the plurality of circuits protruding a surface of the at least one opening is less than a first preset value, and a circuit disposition range between the plurality of circuits on the surface of the multi-layer circuit board is less than a second preset value.

9. The improving wire structure of the circuit board as claimed in claim 8, further comprising a first conductive circuit, disposed in the at least one opening and on a surface of the inner circuit; wherein the first circuit layer is disposed on the first conductive circuit.

10. The improving wire structure of the circuit board as claimed in claim 9, further comprising an adhesion promoter layer, disposed in the at least one opening and on the surface of the multi-layer circuit board, and connected to the first conductive circuit.

11. The improving wire structure of the circuit board as claimed in claim 10, further comprising a second conductive circuit, disposed between the adhesion promoter layer and the second circuit layer and disposed between the first circuit layer and the second circuit layer.

12. The improving wire structure of the circuit board as claimed in claim 8, wherein the first preset value is 2 μm.

13. The improving wire structure of the circuit board as claimed in claim 8, wherein the second preset value is 3.5 μm.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0013] FIG. 1A to FIG. 1K are a schematic flowchart of the method of improving the wire structure of the circuit board of the present invention;

[0014] FIG. 1L is a partial enlargement view of the circuit board structure of the improving wire structure of the circuit board;

[0015] FIG. 2 is a cross sectional view of the improving wire structure of the circuit board;

[0016] FIG. 3A to FIG. 3G are the schematic flowchart of the conventional circuit board structure; and

[0017] FIG. 3H is the partial enlargement view of the conventional circuit board structure.

DETAILED DESCRIPTION OF THE INVENTION

[0018] Refer to FIG. 1A to FIG. 1K. FIG. 1A to FIG. 1K are the schematic flowchart of the method of improving the wire structure of the circuit board of the present invention. The method of improving the wire structure of the circuit board includes the following steps: as shown in FIG. 1A, in the step S11, providing a multi-layer circuit board 11; wherein the multi-layer circuit board comprises an inner circuit 111 and a surface circuit 112; as shown in FIG. 1B, in the step S12, forming at least one opening 113 in the multi-layer circuit board 11 to expose a part of the inner circuit 111; as shown in FIG. 1C, in the step S13, forming a first conductive circuit 12 in the at least one opening 113 and on the surface circuit 112; as shown in FIG. 1D, in the step S14, forming a first circuit layer 13 in the at least one opening 113 so that the first circuit layer 13 is filled in the at least one opening 113; in an embodiment of the present invention, the first circuit layer 13 being disposed on the first conductive circuit with the least thickness; as shown in FIG. 1E, in the step S15, removing first the conductive circuit 12, the surface circuit 112 and the first circuit layer 13 on the multi-layer circuit board 11 and removing a part of the first circuit layer 13 in the at least one opening 113; as shown in FIG. 1F, in the step S16, forming an adhesion promoter layer 14 in the at least one opening 113 and on the surface of the multi-layer circuit board 11; as shown in FIG. 1G, in the step S17, forming a second conductive circuit 15 on the adhesion promoter layer 14 and on the first circuit layer 13 in the at least one opening 113; as shown in FIG. 1H, in the step S18, forming a photoresist layer P on the second conductive circuit 15 on the surface of the multi-layer circuit board 11; as shown in FIG. 1I, in the step S19, forming a second circuit layer 16 in the at least one opening 113 and on the surface of the multi-layer circuit board 11 by the photoresist layer P so that a height difference between a plurality of circuits of the second circuit layer 16 protruding a surface of the at least one opening 113 is less than a first preset value, and so that a circuit disposition range between the plurality of circuits of the second circuit layer 16 disposed on the surface of the multi-layer circuit board 11 is less than a second preset value; as shown in FIG. 1J, in the step S20, removing the photoresist layer P; as shown in FIG. 1K, in the step S21, removing the second conductive circuit 15 disposed at the position of the photoresist layer P on the multi-layer circuit board 11. After that, the improving wire structure of the circuit board 1 is completed.

[0019] In the step S12, the method for forming the opening 113 comprises a laser drill process. After the process, the step S12 further removes residual glue Gin the opening 113 to smooth the surface inside the opening 113.

[0020] In the step S16, the adhesion promoter layer 14 contacts with the the surface of the first circuit layer 13 in the opening 113. By the adhesion promoter layer 14, the bonding strength between the second circuit layer 16 disposed on the adhesion promoter layer 14 and the surface (the material at the bottom) of the multi-layer circuit board 11 and the inner surface of the opening 113 can be enhanced. In one embodiment of the present invention, after the tension test, the tension for the loading attains to 0.03 (kgf/cm) without the adhesion promoter layer 14. In another embodiment of the present invention, after the tension test, the tension for the loading further attains to 0.2-0.3 (kgf/cm) with the adhesion promoter layer 14.

[0021] In the step S13 and the step S17, the method for forming the first conductive circuit 12 and the second conductive circuit 15 comprises the electroplating (copper) process. The thickness of electroplating is less than and equal to 0.85 μm. That is, the thickness of copper on the surface of the improving wire structure of the circuit board 1 is less than and equal to 0.85 μm.

[0022] In the step S21, the method for removing the second conductive circuit 15 comprises the etching process. Moreover, in addition to removing the second conductive circuit 15 in the vertical direction, the etching process further removes the second conductive circuit 15 in the lateral direction (etching bias). In an embodiment, the length of the second conductive circuit 15 etched in the lateral direction is less than 2 μm. In details, since the thickness of the second conductive circuit 15 is less than and equal to 0.85 μm, the length of the second conductive circuit 15 etched in the lateral direction is less than 2 μm on condition that the vertical thickness is thinner.

[0023] In the step S14, the method for forming the first circuit layer 13 utilizes the chemical copper mixed by solution with an excellent capability for copper electroplating with horizontal pulse to fill the opening.

[0024] In the step S17, the second conductive circuit 16 is formed by disposing the chemical copper mixed by the solution with excellent homogeneity on the first circuit layer 13 in the opening 113 to complete the height of the circuit in the opening 113.

[0025] Refer to FIG. 1L. FIG. 1L is the partial enlargement view of the circuit board structure of the improving wire structure of the circuit board. According to the aforementioned method, a height difference between the surface of each circuit of the second circuit layer 16 is less than the first preset value R1, 2 μm, and a circuit disposition range between each circuit of the second circuit layer 16 on the surface of the multi-layer circuit board 11 is less than a second preset value, 3.5 μm.

[0026] Refer to FIG. 2. FIG. 2 is the cross sectional view of the improving wire structure of the circuit board 1 of the present invention. The improving wire structure of the circuit board 1 comprises a multi-layer circuit board 11, a first conductive circuit 12, a first circuit layer 13, an adhesion promoter layer 14, a second conductive circuit 15, and a second circuit layer 16. The multi-layer circuit board 11 comprises an inner circuit 111 and at least one opening 113. The at least one opening 113 exposes the inner circuit 111. The first conductive circuit 12 is disposed in the at least one opening 113 and on the inner circuit 111. The first circuit layer 13 is disposed on the first conductive circuit 12 in the at least one opening 113 and the height of the first circuit layer 13 is lower than the depth of the at least one opening 113. The adhesion promoter layer 14 is disposed in the at least one opening 113 and on the surface of the multi-layer circuit board 11 and connected to the first conductive circuit 12. The second conductive circuit 15 is disposed on the adhesion promoter layer 14 and on the first circuit layer 13 in the at least one opening 113. The second circuit layer 16 is disposed on the second conductive circuit 15 in the at least one opening 113 and on the second conductive circuit 15 on the multi-layer circuit board 11. The second circuit layer 16 comprises a plurality of circuits. A height difference between the plurality of circuits of the second circuit layer 16 protruding a surface of the at least one opening 113 is less than a first preset value. A circuit disposition range between the plurality of circuits of the second circuit layer 16 on the surface of the multi-layer circuit board 11 is less than a second preset value.

[0027] In an embodiment of the present invention, the thickness of the first conductive circuit 12 and the thickness the second conductive circuit 15 are less than and equal to 0.85 μm, that is, the copper thickness on the surface of the improving wire structure of the circuit board 1 is less than and equal to 0.85 μm.

[0028] In an embodiment of the present invention, the height difference between the plurality of circuits of the second circuit layer 16 protruding the surface of the at least one opening 113 is less than the first preset value, 2 μm. The circuit disposition range between the plurality of circuits of the second circuit layer 16 on the surface of the multi-layer circuit board 11 is less than the second preset value, 3.5 μm.

[0029] In summary, the method of improving the wire structure of the circuit board and the improving wire structure of the circuit board of the present invention utilize the circuit to be filled in the opening in two stages to complete the height of the circuit in the opening, wherein the method comprises the first stage for forming the first circuit layer utilizing the chemical copper mixed by solution with the excellent capability for copper electroplating to fill the opening, and the second stage for forming the second conductive circuit by disposing the chemical copper mixed by the solution with excellent homogeneity on the first circuit layer in the opening to complete the height of the circuit in the opening.

[0030] Accordingly, the present invention achieves the effects that the height difference between the plurality of circuits protruding the at least one opening is less than the first preset value, 2 μm, and the circuit disposition range between the plurality of circuits on the surface of the multi-layer circuit board is less than the second preset value, 3.5 μm. Consequently, the homogeneity of the circuit layer can be promoted, the density of the circuit board can be increased and the reliability of the circuit layer can be improved. Besides, the method of improving a wire structure of a circuit board achieves the effect that the thickness of copper formed on the surface of the improving wire structure of the circuit board is less than and equal to 0.85 m. Therefore, the development for the fine circuit of the improving wire structure of the circuit board can be promoted. In addition, by the adhesion promoter layer disposed on the bottom material (the multi-layer circuit board) and in the opening, the bonding strength and the attachment ability between the second circuit layer, the bottom material, and the opening can be enhanced. Hence, the improving wire structure of the circuit board can be applied on the 5G product with low roughness in the future and the transmission rate of the 5G product can be significantly upgraded.

[0031] Even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only. Changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.