RECYCLE GRINDING DEVICE

Abstract

A recycle grinding device is provided. A grinding device for cleaning probes includes a placement platform and a grinding block. The grinding block is located in the placement space. The grinding block includes a base layer and a grinding layer. The grinding layer covers the base layer and is integrally formed with the base layer, wherein the thickness of the grinding layer is greater than or equal to 1 millimeter. Therefore, the invention provides users with convenient cleaning, reduced replacement frequency, and improved performance and quality.

Claims

1. A recycle grinding device, comprising: a placement platform, having a placement space; and a grinding block, located in the placement space, the grinding block comprising a base layer and a grinding layer, wherein the grinding layer is sintered to be formed on the base layer, and a thickness of the grinding layer is greater than or equal to 1 millimeter (mm).

2. The recycle grinding device according to claim 1, wherein the thickness of the grinding layer is between 1 mm and 10 mm.

3. The recycle grinding device according to claim 1, wherein a grinding particle granularity of the grinding layer is between #1000 and #5000.

4. The recycle grinding device according to claim 3, wherein the grinding layer comprises a plurality of grinding particles, and the grinding particle diameter of the plurality of grinding particles is between 0.00321 mm and 0.016 mm.

5. The recycle grinding device according to claim 1, wherein the grinding layer is made of silicon carbide or diamond.

6. The recycle grinding device according to claim 1, wherein the grinding layer is sintered on the base layer at a predetermined temperature, and the grinding layer formed by sintering forms a grinding surface and a first welded surface that are opposite to each other; the base layer has a second welded surface and a bottom surface, and the first welded surface is bonded to the second welded surface after sintering formation.

7. The recycle grinding device according to claim 6, wherein a parallelism between the grinding surface and the bottom surface of the base layer is less than or equal to 0.0003 (m/m).

8. The recycle grinding device according to claim 1, wherein the placement platform further comprises a driving transmission mechanism, on which the grinding block is located, so as to control a movement of the grinding block through the driving transmission mechanism.

9. The recycle grinding device according to claim 1, wherein the placement platform is provided with a plurality of first positioning members, and both ends of the plurality of first positioning members are a fixed end and an inserted end; the fixed end is located on a surface of the placement space, and the fixed end protrudes outward to form the inserted end; a position of a bottom surface of the base layer corresponding to the plurality of first positioning members is provided with a plurality of first positioning holes, the inserted end is inserted in the first positioning hole, and the bottom surface of the base layer is adjacent to the fixed end for positioning the grinding block on the placement platform.

10. The recycle grinding device according to claim 1, wherein the placement platform is provided with a plurality of second positioning members, and a side wall of the base layer corresponding to the plurality of second positioning members is provided with a plurality of second positioning holes, and the plurality of second positioning members are locked in the plurality of second positioning holes for positioning the grinding block on the placement platform.

11. The recycle grinding device according to claim 1, wherein the placement space is recessed on the placement platform, and an inner side wall of the placement space is provided with a protrusion; the base layer is provided with a groove, and the protrusion in the placement space is engaged with the groove for positioning and placing the grinding block in the placement space.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0018] FIG. 1 is a cross-sectional view of a first embodiment of a recycle grinding device according to the invention:

[0019] FIG. 2 is a top view of the first embodiment of the recycle grinding device according to the invention:

[0020] FIG. 3 is a partial enlarged view of part R1 in FIG. 1;

[0021] FIG. 4 is a partial enlarged view of part R2 in FIG. 1;

[0022] FIG. 5 is a cross-sectional view of a second embodiment of the recycle grinding device according to the invention:

[0023] FIG. 6 is a top view of the second embodiment of the recycle grinding device according to the invention;

[0024] FIG. 7 is a bottom view of the second embodiment of the recycle grinding device according to the invention;

[0025] FIG. 8 is a cross-sectional view of a third embodiment of the recycle grinding device according to the invention:

[0026] FIG. 9 is a three-dimensional view of a grinding block of the third embodiment according to the invention:

[0027] FIG. 10 is a cross-sectional view of a fourth embodiment of the recycle grinding device according to the invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0028] Embodiments of the invention will be further explained with the help of the related drawings below. Wherever possible, in the drawings and the description, the same reference numbers refer to the same or similar components. In the drawings, shapes and thicknesses may be exaggerated for simplicity and convenience. It should be understood that the elements not particularly shown in the drawings or described in the specification have forms known to those skilled in the art. Those skilled in the art can make various changes and modifications based on the content of the invention.

[0029] With reference to FIGS. 1 to 4, a recycle grinding device of the invention includes a placement platform 10A and a grinding block 20A. The placement platform 10A has a placement space 100. The grinding block 20A is located in the placement space 100. The grinding block 20A includes a base layer 22 and a grinding layer 24. The grinding layer 24 covers the base layer 22 and is integrally formed with the base layer 22, wherein a thickness h of the grinding layer 24 is greater than or equal to 1 millimeter.

[0030] In the embodiment, the thickness h of the grinding layer 24 is preferably between 1 mm and 10 mm, and a grinding particle granularity of the grinding layer 24 is preferably between #1000 and #5000. # is also known as the number, refers to the number of meshes per square inch, for example, #100 means that 100100 grinding particles are distributed in an area of one square inch. In addition, it is marked with # in the US specification, while in the European specification it is marked with P.

[0031] The grinding layer 24 includes a plurality of grinding particles 240, and a grinding particle diameter d of the plurality of grinding particles 240 is between 0.0032 mm and 0.016 mm.

[0032] The grinding particle granularity is related to the grinding particle diameter d, which may meet the following relational formula:

[00001]$d=16\left(\mathrm{the}\mathrm{grinding}\mathrm{particle}\mathrm{granularity}\right).$

[0033] The grinding layer 24 may be made of silicon carbide or diamond, which is sintered on the base layer 22 at a predetermined temperature. The grinding layer 24 formed by sintering forms a grinding surface 24A and a first welded surface 24B that are opposite to each other; the base layer 22 has a second welded surface 22A and a bottom surface 22B, and the first welded surface 24B is bonded to the second welded surface 22A after sintering formation. A parallelism between the grinding surface 24A and the bottom surface 22B of the base layer 22 is preferably less than or equal to 0.0003 (r/m).

[0034] The recycle grinding device of the invention may improve the performance of the grinding probe and may be cleaned in various ways, e.g., by means of blowing, suction, sticking, washing and other methods; further, the device may be used repeatedly without frequent replacement, and only needs to scrape off and smooth the surface layer to be used continuously once the grinding surface 24A has scratches.

[0035] At the same time, since the grinding layer 24 has a high hardness structure, no adhesive residues will be caused when the probe is ground, and there is no need to worry about whether the grinding layer 24 will be pierced by the probe and hence the base layer is scratched. Due to the provision of the grinding layer 24, the base layer 22 may be made of aluminum, thereby reducing costs and achieving high grinding efficiency.

[0036] Next, according to the above embodiment, the invention further provides a second embodiment to a fourth embodiment for further illustration.

[0037] With reference to FIGS. 5 to 7, the embodiment differs from the above first embodiment in that the placement platform 10B further includes a driving transmission mechanism 12 and a plurality of first positioning members 14, and the bottom surface 22B of the base layer 22 is provided with a plurality of first positioning holes 222.

[0038] A grinding block 20B is located on the driving transmission mechanism 12, so as to control a movement of the grinding block 20B through the driving transmission mechanism 12.

[0039] The placement platform 10B is provided with the plurality of first positioning members 14, and both ends of the plurality of first positioning members 14 are a fixed end 142 and an inserted end 144; the fixed end 142 is located on a surface of the placement space 100, and the fixed end 142 protrudes outward to form the inserted end 144; the bottom surface 22B of the base layer 22 corresponding to the plurality of first positioning members 14 is provided with the plurality of first positioning holes 222, the inserted end 144 is inserted in the first positioning hole 222, and the bottom surface 22B of the base layer 22 is adjacent to the fixed end 142 for positioning the grinding block 20B on the placement platform 10B.

[0040] The plurality of first positioning members 14 may be a kind of guide pins for guiding the positioning of the grinding block 20B so as to prevent the grinding block 20B from being displaced.

[0041] With reference to FIGS. 8 to 9, the embodiment differs from the first embodiment in that a placement platform 10C is provided with a plurality of second positioning members 16, and a side wall 220 of the base layer 22 is provided with a plurality of second positioning holes 224.

[0042] A position of the side wall 220 of the base layer 22 corresponding to the plurality of second positioning members 16 is provided with the plurality of second positioning holes 224, and the plurality of second positioning members 16 are locked in the plurality of second positioning holes 224 for positioning a grinding block 20C on the placement platform 10C.

[0043] The second positioning member 16 may be a screw or a stud for locking the grinding block 20C on the placement platform 10C.

[0044] With reference to FIG. 10, the embodiment differs from the first embodiment in that a placement space 100 may be recessed on a placement platform 10D, and an inner side wall 100A of the placement space 100 is provided with a protrusion 18; the base layer 22 is provided with a groove 226, and the protrusion 18 in the placement space 100 is engaged with the groove 226 for positioning and placing the grinding block 10D in the placement space 100.

[0045] Therefore, the positioning structures described in the second embodiment to the fourth embodiment provide the user with easier operation to replace the integrally formed grinding block, and facilitate the user to clean the grinding block for reuse; at the same time, the positioning structures of the invention may further be arranged in combination according to the needs of users, or may be implemented as a single positioning structure, which is not limited thereto.

[0046] Also, the recycle grinding device of the invention may perform dry grinding or wet grinding according to environmental requirements and probe design in the grinding state, so grinding may be performed no matter in the dry grinding state or the wet grinding state.

[0047] It should be noted that the conventional soft abrasive patch may not be made of materials such as silicon carbide or diamond because the larger particles of these materials may cause damage to the probe; while in the invention, the grinding layer 24 is formed by sintering to overcome the problems caused by the lack of conventional art, so that the invention may greatly shorten the grinding process time (about 1020 minutes) in applications by using silicon carbide or diamond; by saving 90% of the time, the probe may be quickly ground and then introduced into the next process, which has the effect of improving the automation efficiency of the equipment.

[0048] The above description is only to illustrate the preferred implementation mode of the invention, and is not intended to limit the scope of implementation. All simple replacements and equivalent changes made according to the patent scope of the invention and the content of the patent specification all belong to the scope of the patent application of the invention.