HIGH SPEED OPTICAL RECEIVER SYSTEM
20240413911 ยท 2024-12-12
Inventors
Cpc classification
H04B10/6166
ELECTRICITY
International classification
Abstract
Some implementations described herein provide an optical receiver system. The optical receiver system includes optical circuitry that may include a phase shifter device, a demultiplexer device, a power combiner device, and/or a power splitter device. Different combinations of such devices within the optical circuitry may balance and/or reduce photocurrents within the photodiode device to improve a performance (e.g., a bandwidth) of the optical receiver system relative to another optical receiver system that does not include the optical circuitry.
Claims
1. An optical receiver system, comprising: a phase shifter device; a power combiner device coupled with the phase shifter device; a power splitter device coupled with the power combiner device; and a photodiode device coupled with the power splitter device.
2. The optical receiver system of claim 1, wherein the phase shifter device comprises: a thermal phase shifter device including an integrated circuit that uses thermal-induced phase change, free-carrier injection to synchronize light waves of first incident light and second incident light.
3. The optical receiver system of claim 1, wherein the power combiner device comprises: a multimode interference device comprising a single input port and two output ports.
4. The optical receiver system of claim 1, wherein the power splitter device comprises: a directional coupler device configured to control a ratio of a first output of the power splitter device to a second output of the power splitter device.
5. The optical receiver system of claim 1, wherein a first waveguide of the photodiode device connects with a first output of the power splitter device, and wherein a second waveguide of the photodiode device connects with a second output of the power splitter device.
6. The optical receiver system of claim 1, wherein at least one input of the phase shifter device connects with an output of a two-dimensional grating coupler device.
7. The optical receiver system of claim 1, wherein the phase shifter device, the power combiner device, and the power splitter device are on a single semiconductor die.
8. The optical receiver system of claim 1, wherein the phase shifter device, the power combiner device, and the power splitter device are distributed across at least two semiconductor dies.
9. An optical receiver system, comprising: a demultiplexer device; a phase shifter device coupled with the demultiplexer device; a power splitter device; and a photodiode device coupled with the power splitter device.
10. The optical receiver system of claim 9, wherein the demultiplexer device comprises: a multimode device comprising two input ports and two output ports.
11. The optical receiver system of claim 9, wherein the power splitter device comprises: a multimode device comprising two input ports and two output ports, configured to control a ratio of a first output of the power splitter device to a second output of the power splitter device.
12. The optical receiver system of claim 9, wherein at least one input of the phase shifter device connects with an output of a two-dimensional grating coupler device (202), wherein at least one output of the phase shifter device connects with an input of the demultiplexer device, and wherein at least one output of the demultiplexer device connects with an input of the power splitter device.
13. The optical receiver system of claim 9, further comprising: a power combiner device, wherein at least one input of the demultiplexer device connects with an output of a two-dimensional grating coupler device, and wherein at least one input of the phase shifter device connects with an output of the demultiplexer device, wherein at least one input of the power combiner device connects with an output of the phase shifter device, and wherein at least one input of the power splitter device connects with an output of the power combiner device.
14. The optical receiver system of claim 13, wherein the power combiner device comprises: a y-junction device.
15. The optical receiver system of claim 13, wherein the demultiplexer device, the phase shifter device, the power combiner device, and the power splitter device are on a single semiconductor die.
16. The optical receiver system of claim 13, wherein the demultiplexer device, the phase shifter device, the power combiner device, and the power splitter device are distributed across at least two semiconductor dies.
17. A method, comprising: receiving, by an optical circuit between a two-dimensional grating coupler device and a photodiode device, first incident light and second incident light; converting, by the optical circuit and the photodiode device, the first incident light and the second incident light into respective time-fixed photocurrents; providing, by the photodiode device to a transimpedance amplifier, electrical currents based on the respective time-fixed photocurrents; and converting, by the transimpedance amplifier, the electrical currents to an output voltage that is used by an optical communication system.
18. The method of claim 17, wherein the first incident light and the second incident light comprise light waves of a single wavelength, and wherein converting the first incident light and the second incident light into respective time fixed photocurrents comprises: transmitting the first incident light and the second incident light through respective phase shifter devices, transmitting output from the respective phase shifter devices through a power combiner device, and transmitting an output from the power combiner device through a power splitter device having a controllable power splitting ratio.
19. The method of claim 17, wherein the first incident light and the second incident light include light waves of multiple wavelengths, and wherein converting the first incident light and the second incident light into respective time fixed photocurrents comprises: transmitting the first incident light through a first demultiplexer device, transmitting the second incident light through a second demultiplexer device, transmitting outputs of a same wavelength from the first demultiplexer device and the second demultiplexer device through respective phase shifter devices, transmitting outputs from the respective phase shifter devices through a power combiner device, and transmitting an output from the power combiner device through a power splitter device having a controllable power splitting ratio.
20. The method of claim 17, wherein the first incident light and the second incident light include light waves of multiple wavelengths, and wherein converting the first incident light and the second incident light into respective time fixed photocurrents comprises: transmitting the first incident light and the second incident light through respective phase shifter devices, transmitting outputs from the respective phase shifter devices to a demultiplexer device, transmitting an output of a first wavelength from the demultiplexer device through a first power splitter device having a first controllable power splitting ratio, and transmitting an output of a second wavelength from the demultiplexer device through a second power splitter device having a second controllable power splitting ratio.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0003] Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.
[0004]
[0005]
[0006]
[0007]
[0008]
[0009]
[0010]
[0011]
DETAILED DESCRIPTION
[0012] The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
[0013] An optical receiver system may include a photodiode device and a two-dimensional grating coupler. In some cases, a performance of the optical receiver system degrades when incident light received into inputs of the photodiode device is mismatched. For example, outputs of the two-dimensional grating coupler may include mismatched light waves (light waves having different amplitudes, different wavelengths, or asynchronous phases, among other examples). The mismatched light waves may cause imbalances and/or increases in photocurrents within the photodiode device to reduce a performance (e.g., a bandwidth) of the optical receiver system.
[0014] Some implementations described herein provide an optical receiver system. The optical receiver system includes optical circuitry that may include a phase shifter device, a demultiplexer device, a power combiner device, and/or a power splitter device. Different combinations of such devices within the optical circuitry may balance and/or reduce photocurrents within the photodiode device to improve a performance (e.g., a bandwidth) of the optical receiver system relative to another optical receiver system that does not include the optical circuitry.
[0015] In this way, the optical receiver system may satisfy a performance threshold requirement for a market of high-performance optical communication systems and realize an increase in manufacturing yield and a reduction in field failures. Increasing the manufacturing yield and reducing the rate of field failures may save manufacturing costs and reduce an amount of resources (e.g., raw materials, semiconductor manufacturing tools, labor, and/or computing resources) needed to support the market of high-performance optical communication systems.
[0016]
[0017] The optical receiver system 100 of
[0018] The two-dimensional grating coupler device 102 may receive light (e.g., electromagnetic waves) from an external optical medium (free space, waveguides, or fiber optic cables, among other examples) with another device that is transmissive to the light. In some implementations and based on patterns formed in surfaces of the two-dimensional grating coupler device 102, the two-dimensional grating coupler device 102 may output incident light 110a (e.g., first light waves) and incident light 110b (e.g., second light waves). In some implementations, the incident light 110a and the incident light 110b are mismatched (have different amplitudes, different wavelengths, and/or asynchronous phases, among other examples).
[0019] In some implementations, the incident light 110a and/or the incident light 110b are output from the two-dimensional grating coupler device 102 in a transverse electric (TE) mode. In the TE mode, a direction of the propagation of the incident light 110a and/or the incident light 110b is perpendicular to an electric field in the two-dimensional grating coupler device 102.
[0020] Alternatively, and in some implementations, the incident light 110a and/or the incident light 110b are output from the two-dimensional grating coupler device 102 in a transverse magnetic (TM) mode. In the TM mode, a direction of the propagation of the incident light 110a and/or the incident light 110b is perpendicular to a magnetic field in the two-dimensional grating coupler device 102.
[0021] The optical circuit 104, which may include one or more of a phase shifter device, a power combiner device, a power splitter device, and/or a demultiplexer device, may receive the incident light 110a and 110b from the two-dimensional grating coupler device 102. The optical circuit 104 may convert the incident light 110a and 110b into optical signals 112a and 112b.
[0022] As shown in
[0023] The transimpedance amplifier device 108 converts the electrical currents 120a and 120b into an output voltage 124 for use by the optical communication system including the optical receiver system 100. Fluctuations and/or variations in the electrical currents 120a and 120b (e.g., based on imbalances in, and/or magnitudes of, photocurrents 118a and 118b that may be caused by mismatched optical signals within the optical receiver system 100) can have several effects on performance of the transimpedance amplifier device 108, including introducing fluctuations and/or variations in the output voltage 124, distorting output signals from the transimpedance amplifier device 108, and/or limiting a bandwidth performance of the transimpedance amplifier device 108. Additionally, or alternatively, fluctuations and/or variations in the electrical currents 120a and 120b may introduce instabilities to feedback devices and/or control devices that may be included in the transimpedance amplifier device 108, among other examples. Such effects can cause a performance of the optical receiver system 100 (e.g., a speed or bandwidth in gigahertz (GHz)) to not satisfy a performance threshold for a high-performance optical communication system.
[0024] As described in greater detail in connection with
[0025] Further, and as described in connection with
[0026] In this way, the optical receiver system may satisfy a performance threshold requirement for a market of high-performance optical communication systems and realize an increase in manufacturing yield and a reduction in field failures. Increasing the manufacturing yield and reducing the rate of field failures may save manufacturing costs and reduce an amount of resources (e.g., raw materials, semiconductor manufacturing tools, labor, and/or computing resources) needed to support the market of high-performance optical communication systems.
[0027] The number and arrangement of devices shown in
[0028]
[0029] The example implementation of
[0030] As shown in
[0031] Each phase shifter device, of the phase shifter devices 202a and 202b, is a device that modifies a phase of a light wave passing through the phase shifter device. In other words, and as shown in
[0032] Examples of the phase shifter devices 202a and 202b include a thermal phase shifter device, an electro-optic phase shifter device, an acousto-optic phase shifter device, a liquid crystal phase shifter device, and/or a waveguide-based phase shifter device. A selection of a type of device used for the phase shifter devices 202a and/or 202b may depend on a design requirement of the optical circuit 104a, such as a desired range of phases, a frequency or a speed, a power consumption, and/or an integration compatibility with other devices included in the optical circuit 104a, and/or a context in which the optical receiver system 100a is used.
[0033] As further shown in the example implementation of
[0034] The power combiner device 204 is a device that merges optical signals into a single output. In other words, and as shown in
[0035] Examples of the power combiner device 204 include a fiber-based power combiner device, a coherent power combiner device, a free-space power combiner device, and/or a waveguide-based power combiner device. A selection of a type of device for the power combiner device 204 may depend on a design requirement of the optical circuit 104a, such as a power level of input signals, a desired efficiency, a wavelength range, and/or an integration compatibility with other devices included in the optical circuit 104a, and/or a context in which the optical receiver system 100a is used.
[0036] As further shown in the example implementation of
[0037] The power splitter device 206 (sometimes referred to as a beam splitter device or an optical splitter device) is a device that divides an optical signal into multiple output signals with reduced power. In other words, and as shown in
[0038] Examples of the power splitter device 206 include a fiber-based power splitter device, a planar light wave circuit power splitter device, a free-space power splitter device, and/or a waveguide-based power splitter device. A selection of a type of device for the power splitter device 206 may depend on a design requirement of the optical circuit 104a, such as a desired splitting ratio, a wavelength range, a power level, and/or an integration compatibility with other devices included in the optical circuit 104a, and/or a context in which the optical receiver system 100a is used. Further, and in some implementations, the power splitter device 206 has a controllable splitting ratio (e.g., an adjustable splitting ratio) or a fixed splitting ratio.
[0039] In some implementations, the phase shifter devices 202a and 202b, the power combiner device 204, and the power splitter device 206 of
[0040] As described in connection with
[0041] The example implementation of
[0042] As shown in
[0043] Each of the demultiplexer devices 212a and 212b is a device that separates multiplexed optical signals carrying light waves of multiple wavelengths into individual optical signals carrying light waves of individual wavelengths. In other words, and as shown in
[0044] Examples of the demultiplexer devices 212a and 212b include a fiber-based demultiplexer device, a planar light wave circuit demultiplexer device, a free-space demultiplexer device, and/or a prism-based demultiplexer device. A selection of a type of device for the demultiplexer devices 212a and 212b may depend on a design requirement of the optical circuit 104b, such as a quantity of channels, a wavelength range, a channel spacing, and/or an integration compatibility with other devices included in the optical circuit 104a, and/or a context in which the optical receiver system 100b is used. Further, and in some implementations, the power splitter device 206 has a controllable splitting ratio or a fixed splitting ratio.
[0045] As further shown in the example implementation of
[0046] As further shown in the example implementation of
[0047] As further shown in the example implementation of
[0048] The example implementation of
[0049] As shown in
[0050] As further shown in
[0051] In some implementations, the phase shifter devices 202, the power splitter devices 206, and the demultiplexer devices 212 of
[0052] As described in connection with
[0053] The number and arrangement of devices shown in
[0054]
[0055] As shown in
[0056]
[0057] The intrinsic hot carrier injection region 308 may be a region within the integrated circuit 306 in which carriers (e.g., electrons or electron holes) gain kinetic energy through an impact ionization mechanism or a tunneling mechanism. The p-type region 310 may be a region within the integrated circuit 306 that includes a p-type dopant (a concentration of approximately 410.sup.17 boron (B) atoms per cubic centimeter, among other examples). In the p-type region 310, a majority of carriers may be electron holes. The n-type region 312 may be another region within the integrated circuit that includes an n-type dopant (a concentration of approximately 310.sup.17 phosphorous (P) atoms per cubic centimeter, among other examples). In the n-type region 312, a majority of carriers may be electrons.
[0058] An electrical current multi-layer photodiode device 314 may be applied to the integrated circuit 306. In such a case, and within the intrinsic hot carrier injection region 308, carriers may gain sufficient kinetic energy to increase a temperature of the integrated circuit 306 (e.g., increase a temperature of the waveguide structure 304). Increasing the temperature of the waveguide structure 304 may alter a refractive index of the waveguide structure 304, allowing for precise control of a phase of an optical signal (e.g., a light wave) transmitted through the waveguide structure.
[0059] As indicated above,
[0060]
[0061]
[0062] In some implementations, the MMI device 402 includes a waveguide-based structure that utilizes principles of multimode interference to achieve functionality. The MMI device 402 may include a multimode waveguide section (e.g., waveguides formed on a substrate of a semiconductor material) that splits or combines an input optical signal into two (or more) output optical signals, depending on a specific configuration.
[0063]
[0064] In some implementations, the y-junction device 404 includes a waveguide-based structure on a substrate. The y-junction device 404 may include a single input waveguide that splits into multiple output waveguides in a y-shaped configuration. The y-junction structure enables an efficient division of an input optical signal between two (or more) output paths.
[0065]
[0066] In some implementations, the directional coupler device 406 includes waveguides to split or combine optical signals. In some implementations, the directional coupler device 406 includes optical fibers to split or combine optical signals.
[0067] As an example, and within the directional coupler device 406, two waveguides or two optical fibers may be close in proximity, allowing evanescent coupling of energy (e.g., light waves) within the directional coupler device 406. For example, an optical signal may enter an input port of the directional coupler device 406 and be split into two paths (e.g., a first path associated with the input port of the directional coupler device 406 and a second, adjacent path associated with an output port of the directional coupler device 406). Within a coupling region of the directional coupler device 406 (e.g., adjacent waveguides or optical fibers included along the first and second paths), energy may be transferred.
[0068]
[0069] As an example, the two input ports of the MMI device 408a are separated along a horizontal direction and connect with a first waveguide structure. The MMI device 408a further includes a second waveguide structure that is adjacent to and connects with the first waveguide structure. Furthermore, the two output ports of the MMI device 408a are separated along the horizontal direction and connect with the second waveguide structure.
[0070] As another example, the two input ports of the MMI device 408b are joined along a horizontal direction and connect with a first waveguide structure. The MMI device 408b further includes a second waveguide structure that is adjacent to and connects with the first waveguide structure, a third waveguide structure that is adjacent to and connects with the second waveguide structure, and a fourth waveguide structure that is adjacent to and connects with the third waveguide structure. Furthermore, the two output ports of the MMI device 408b are joined along the horizontal direction and connect with the fourth waveguide structure.
[0071] As another example, the two input ports of the MMI device 408c are joined along a horizontal direction and connect with a first waveguide structure. The MMI device 408c further includes a second waveguide structure that is adjacent to and connects with the first waveguide structure. Furthermore, the two output ports of the MMI device 408c are joined along the horizontal direction and connect with the second waveguide structure.
[0072] As indicated above,
[0073]
[0074] As shown in
[0075]
[0076] In some implementations, each of the MMI devices 508a-508g includes an implementation of a power splitter device (e.g., the power splitter device 206 as described in connection with
[0077] In some implementations, outputs of one or more of the MMI devices 508a-508g may correspond to different degrees of an insertion loss (e.g., different degrees of an insertion loss in decibels (dB)) associated with each of the MMI devices 508a-508g. For example, an output of the MMI device 508a may correspond to an approximate insertion loss 510a associated with the MMI device 508a, an output of the MMI device 508b may correspond to an approximate insertion loss 510b associated with the MMI device 508b, an output of the MMI device 508d may correspond to an approximate insertion loss 510d associated with the MMI device 508d, and an output of the MMI device 508e may correspond to an insertion loss 510e associated with the MMI device 508c.
[0078] The insertion losses 510a, 510b, 510d, and/or 510e may represent differences in power between input and output signals of the MMI devices 508a, 508b, 508d, and/or 508c. The differences in power between the input and output signals of the MMI devices 508a, 508b, 508d, and/or 508e may be due to optical power that is lost or attenuated due to various factors, including power splitting ratios, imperfections, scattering, reflections, or absorption associated with the MMI devices 508a, 508b, 508d, and/or 508c.
[0079] As indicated above,
[0080]
[0081]
[0082] As described in connection with
[0083]
[0084] The directional coupler device 406 of
[0085]
[0086] The MMI devices 408a-408c of
[0087]
[0088] The simulation data of
[0089] In
[0090] As shown in
[0091] As indicated above,
[0092]
[0093] The bus 710 may include one or more components that enable wired and/or wireless communication among the components of the device 700. The bus 710 may couple together two or more components of
[0094] The memory 730 may include volatile and/or nonvolatile memory. For example, the memory 730 may include random access memory (RAM), read only memory (ROM), a hard disk drive, and/or another type of memory (e.g., a flash memory, a magnetic memory, and/or an optical memory). The memory 730 may include internal memory (e.g., RAM, ROM, or a hard disk drive) and/or removable memory (e.g., removable via a universal serial bus connection). The memory 730 may be a non-transitory computer-readable medium. The memory 730 may store information, one or more instructions, and/or software (e.g., one or more software applications) related to the operation of the device 700. In some implementations, the memory 730 may include one or more memories that are coupled (e.g., communicatively coupled) to one or more processors (e.g., processor 720), such as via the bus 710. Communicative coupling between a processor 720 and a memory 730 may enable the processor 720 to read and/or process information stored in the memory 730 and/or to store information in the memory 730.
[0095] The input component 740 may enable the device 700 to receive input, such as user input and/or sensed input. For example, the input component 740 may include a touch screen, a keyboard, a keypad, a mouse, a button, a microphone, a switch, a sensor, a global positioning system sensor, a global navigation satellite system sensor, an accelerometer, a gyroscope, and/or an actuator. The output component 750 may enable the device 700 to provide output, such as via a display, a speaker, and/or a light-emitting diode. The communication component 760 may enable the device 700 to communicate with other devices via a wired connection and/or a wireless connection. For example, the communication component 760 may include a receiver, a transmitter, a transceiver, a modem, a network interface card, and/or an antenna.
[0096] The device 700 may perform one or more operations or processes described herein. For example, a non-transitory computer-readable medium (e.g., memory 730) may store a set of instructions (e.g., one or more instructions or code) for execution by the processor 720. The processor 720 may execute the set of instructions to perform one or more operations or processes described herein. In some implementations, execution of the set of instructions, by one or more processors 720, causes the one or more processors 720 and/or the device 700 to perform one or more operations or processes described herein. In some implementations, hardwired circuitry may be used instead of or in combination with the instructions to perform one or more operations or processes described herein. Additionally, or alternatively, the processor 720 may be configured to perform one or more operations or processes described herein. Thus, implementations described herein are not limited to any specific combination of hardware circuitry and software.
[0097] The number and arrangement of components shown in
[0098]
[0099] As shown in
[0100] As further shown in
[0101] As further shown in
[0102] As further shown in
[0103] Process 800 may include additional implementations, such as any single implementation or any combination of implementations described below and/or in connection with one or more other processes described elsewhere herein.
[0104] In a first implementation, and as described in connection with
[0105] In a second implementation, alone or in combination with the first implementation and as described in connection with
[0106] In a third implementation, alone or in combination with one or more of the first and second implementations and as described in connection with
[0107] Although
[0108] Some implementations described herein provide an optical receiver system. The optical receiver system includes optical circuitry that may include a phase shifter device, a demultiplexer device, a power combiner device, and/or a power splitter device. Different combinations of such devices within the optical circuitry may balance and/or reduce photocurrents within the photodiode device to improve a performance (e.g., a bandwidth) of the optical receiver system relative to another optical receiver system that does not include the optical circuitry.
[0109] In this way, the optical receiver system may satisfy a performance threshold requirement for a market of high-performance optical communication systems and realize an increase in manufacturing yield and a reduction infield failures. Increasing the manufacturing yield and reducing the rate of field failures may save manufacturing costs and reduce an amount of resources (e.g., raw materials, semiconductor manufacturing tools, labor, and/or computing resources) needed to support the market of high-performance optical communication systems.
[0110] As described in greater detail above, some implementations described herein provide an optical receiver system. The optical receiver system includes a phase shifter device. The optical receiver system includes a power combiner device coupled with the phase shifter device. The optical receiver system includes a power splitter device coupled with the power combiner device. The optical receiver system includes a photodiode device coupled with the power splitter device.
[0111] As described in greater detail above, some implementations described herein provide an optical receiver system. The optical receiver system includes a demultiplexer device. The optical receiver system includes a phase shifter device coupled with the demultiplexer device. The optical receiver system includes a power splitter device. The optical receiver system includes a photodiode device coupled with the power splitter device.
[0112] As described in greater detail above, some implementations described herein provide a method. The method includes receiving, by an optical circuit between a two-dimensional grating coupler device and a photodiode device, first incident light and second incident light. The method includes converting, by the optical circuit and the photodiode device, the first incident light and the second incident light into respective time-fixed photocurrents. The method includes providing, by the photodiode device to a transimpedance amplifier, electrical currents based on the respective time-fixed photocurrents. The method includes converting by the transimpedance amplifier, the electrical currents to an output voltage that is used by an optical communication system.
[0113] As used herein, satisfying a threshold may, depending on the context, refer to a value being greater than the threshold, greater than or equal to the threshold, less than the threshold, less than or equal to the threshold, equal to the threshold, not equal to the threshold, or the like.
[0114] As used herein, the term and/or, when used in connection with a plurality of items, is intended to cover each of the plurality of items alone and any and all combinations of the plurality of items. For example, A and/or B covers A and B, A and not B, and B and not A.
[0115] The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.