Multi-Die Fine Grain Integrated Voltage Regulation

Abstract

A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device may include one or more current consuming elements. A passive device may be coupled to the power consuming device. The passive device may include a plurality of passive elements formed on a semiconductor substrate. The passive elements may be arranged in an array of structures on the semiconductor substrate. The power consuming device and the passive device may be coupled using one or more terminals. The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.

Claims

1-20. (canceled)

21. A semiconductor device, comprising: a semiconductor substrate; a plurality of passive structures arranged in a pattern of tiles on the semiconductor substrate, wherein the tiles include passive elements formed on a frontside of the semiconductor substrate; at least one power supply rail coupled to a backside of the semiconductor substrate; and a plurality of terminals formed on the semiconductor substrate, wherein at least one terminal is positioned inside of each tile in the pattern of tiles, the at least one terminal being associated with the passive elements in the tile; wherein at least two or more of the tiles are coupled to the at least one power supply rail, each of the at least two or more of the tiles including at least one terminal that couples the passive elements in the tile on the frontside of the semiconductor substrate to the at least one power supply rail coupled to the backside of the semiconductor substrate.

22. The semiconductor device of claim 21, wherein at least one of the passive elements is a capacitor.

23. The semiconductor device of claim 21, wherein the at least one terminal that couples the passive elements in the tile on the frontside of the semiconductor substrate to the at least one power supply rail includes a route through-silicon via.

24. The semiconductor device of claim 21, wherein each of the at least two or more of the tiles coupled to the at least one power supply rail include at least one additional terminal configured to be coupled to an additional semiconductor device.

25. The semiconductor device of claim 24, wherein the at least one additional terminal in each of the at least two or more of the tiles coupled to the at least one power supply rail is configured to provide distinct power connections to the additional semiconductor device.

26. The semiconductor device of claim 24, wherein the terminals coupled to the additional semiconductor device are coupled to at least one logic block on the additional semiconductor device, the at least one logic block including a first set of one or more current consuming elements and a second set of one or more current consuming elements, and wherein the first set and the second set have separate functions in the at least one logic block.

27. The semiconductor device of claim 26, wherein a first tile is directly coupled to the first set, the first tile being coupled to the first set with at least one terminal distinctly associated with the first tile, and wherein a second tile is directly coupled to the second set, the second tile being coupled to the second set with at least one terminal distinctly associated with the second tile.

28. The semiconductor device of claim 21, wherein each of the at least two or more of the tiles coupled to the at least one power supply rail includes a route-through terminal coupled between the at least one power supply rail and the passive elements.

29. The semiconductor device of claim 21, further comprising at least one switch positioned in at least one of the tiles.

30. The semiconductor device of claim 21, further comprising a memory device formed on the semiconductor substrate.

31. The semiconductor device of claim 21, wherein the pattern of tiles comprises a regular array of tiles in x- and y-directions on the semiconductor substrate, the regular array in x- and y-directions comprising at least two passive elements arrayed in the x-direction and at least two passive elements arrayed in the y-direction.

32. A semiconductor device, comprising: a semiconductor substrate; a plurality of passive structures arranged in a pattern of tiles on the semiconductor substrate, wherein the tiles include passive elements formed on a frontside of the semiconductor substrate; at least one power supply rail coupled to a backside of the semiconductor substrate, the at least one power supply rail providing a first voltage; and a plurality of terminals formed on the frontside of the semiconductor substrate, wherein at least one terminal is positioned inside of each tile in the pattern of tiles, the at least one terminal being associated with the passive elements in the tile; wherein a first tile is coupled to the at least one power supply rail by at least one of the terminals inside the first tile, and wherein the first tile includes at least one additional terminal outputting a second voltage different than the first voltage; and wherein a second tile is coupled to the at least one power supply rail by at least one of the terminals inside the second tile, and wherein the second tile includes at least one additional terminal outputting a third voltage different from the second voltage.

33. The semiconductor device of claim 32, wherein the first tile includes a first switched capacitor circuit formed on the frontside of the semiconductor substrate, the first switched capacitor circuit comprising at least two capacitors configured to convert the first voltage to the second voltage.

34. The semiconductor device of claim 32, wherein the second tile includes a second switched capacitor circuit formed on the frontside of the semiconductor substrate, the second switched capacitor circuit comprising at least two capacitors configured to convert the first voltage to the third voltage.

35. The semiconductor device of claim 32, wherein the at least one of the terminals inside the first tile coupled to the at least one power supply rail includes a route through-silicon via.

36. The semiconductor device of claim 32, wherein the at least one of the terminals inside the second tile coupled to the at least one power supply rail includes a route through-silicon via.

37. The semiconductor device of claim 32, wherein the at least one additional terminal inside the first tile outputting the second voltage is configured to be coupled to an additional semiconductor device.

38. The semiconductor device of claim 32, wherein the at least one additional terminal inside the second tile outputting the third voltage is configured to be coupled to an additional semiconductor device.

39. An integrated circuit device, comprising: a semiconductor substrate; at least one power supply rail coupled to a backside of the semiconductor substrate, the at least one power supply rail providing a first voltage; and a switched capacitor circuit formed on a frontside of the semiconductor substrate, the switched capacitor circuit comprising at least two capacitors coupled to a current consuming element, wherein the at least two capacitors are configured to convert the first voltage to a second voltage different than the first voltage; wherein a first capacitor of the at least two capacitors is positioned in a first passive structure and a second capacitor of the at least two capacitors is positioned in a second passive structure, the first passive structure and the second passive structure being separate passive structures on the frontside of the semiconductor substrate, the first and second passive structures being part of a plurality of passive structures formed on the frontside of the semiconductor substrate, and wherein the plurality of passive structures is arranged in a tiled pattern on the semiconductor substrate.

40. The device of claim 39, wherein the first and second passive structures are coupled to the at least one power supply rail by at least one route-through via, each of the first and second passive structures including at least one terminal that couples the respective capacitor in the passive structure to the at least one power supply rail.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Features and advantages of the methods and apparatus of the embodiments described in this disclosure will be more fully appreciated by reference to the following detailed description of presently preferred but nonetheless illustrative embodiments in accordance with the embodiments described in this disclosure when taken in conjunction with the accompanying drawings in which:

[0010] FIG. 1 depicts an exploded view representation of an embodiment of a semiconductor device package.

[0011] FIG. 2 depicts a side-view representation of an embodiment of a semiconductor device package.

[0012] FIG. 3 depicts a representation of an embodiment of a passive device.

[0013] FIG. 4 depicts an enlarged view of an example of one possible embodiment of a structure.

[0014] FIG. 5 depicts a representation of an example of another possible embodiment of a structure.

[0015] FIG. 6 depicts a generic terminal footprint for the structure depicted in FIG. 5.

[0016] FIG. 7 depicts a representation of an example of an embodiment of a structure with only capacitors and terminals.

[0017] FIG. 8 depicts a representation of an embodiment of a terminal footprint for an array using structures.

[0018] FIG. 9 depicts a side-view representation of an embodiment of a package with a passive device, a power consuming device, and a memory device.

[0019] FIG. 10 depicts a side-view representation of another embodiment of a semiconductor device package.

[0020] FIG. 11 depicts a side-view representation of yet another embodiment of a semiconductor device package.

[0021] FIG. 12 depicts a side-view representation of another embodiment of a package with a passive device, a power consuming device, and a memory device.

[0022] While embodiments described in this disclosure may be susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. It should be understood, however, that the drawings and detailed description thereto are not intended to limit the embodiments to the particular form disclosed, but on the contrary, the intention is to cover all modifications, equivalents and alternatives falling within the spirit and scope of the appended claims.

DETAILED DESCRIPTION OF EMBODIMENTS

[0023] A semiconductor device package may include two or more semiconductor devices coupled together. In certain embodiments, at least one of the semiconductor devices in the package is a passive semiconductor device and at least one of the semiconductor devices is a power consuming semiconductor device (e.g., a device with current consumption elements such as an SOC device). As the passive device is integrated into the package, the passive device may be termed, for example, an integrated passive device (IPD).

[0024] FIG. 1 depicts an exploded view representation of an embodiment of semiconductor device package 90. FIG. 2 depicts a side-view representation of an embodiment of semiconductor device package 90. In certain embodiments, package 90 includes passive device 100, power consuming (semiconductor) device 120, and build-up package 122. In some embodiments, passive device 100, power consuming device 120, and/or build-up package 122 use similar substrates (e.g., silicon-based substrates). Using similar substrates in passive device 100, power consuming device 120, and/or build-up package 122 may provide substantially similar thermal expansion properties in each of the devices, allowing for operation across a broad temperature range without causing strain on the connections between the two devices. In certain embodiments, passive device 100 is sized to fit inside a recess in build-up package 122. Passive device 100 may be smaller than power consuming device 120 to allow area on the power consuming device not covered by the passive device to be used for general purpose I/O for the power consuming device.

[0025] In certain embodiments, passive device 100 and the power consuming device 120 are directly coupled to each other. For example, the devices may be coupled using terminals 110, as shown in FIG. 2. Terminals 110 may be terminals such as face-to-face bumps or balls, through-silicon vias (TSVs), or other three-dimensional interconnection terminals. TSVs or other vias may be formed in a build-up layer using, for example, laser drilling. In certain embodiments, certain TSVs present on passive device 100 are only used as route-throughs through the passive device to the package or a printed circuit board. Coupling the devices directly may provide short and very high density connections between elements on the passive device and regulator elements and current consumption elements 121 on power consuming device 120.

[0026] Terminals 110 may also couple power consuming device 120 and/or passive device 100 directly to build-up package 122. Terminals 110 coupled between power consuming device 120 and build-up package 122 may be used for general purpose I/O connections or for power connections not involving the integrated regulator. In some embodiments, some terminals coupling passive device 100 to build-up package 122 are route-through (e.g., three-dimensional route-through) terminals from power consuming device 120 directly to build up package 122. As shown in FIG. 2, build-up package 122 may include routing 124 to package terminals 126. Package terminals 126 may be used to couple package 90 to a printed circuit board (PCB) or other device.

[0027] Power consuming device 120 may be, for example, an SOC device. In certain embodiments, passive device 100 includes one or more passive elements (e.g., passive structures or passive devices). The passive elements may be used in combination with elements on power consuming device 120 to control and regulate voltage provided to the power consuming device.

[0028] FIG. 3 depicts a representation of an embodiment of passive device 100. In certain embodiments, passive device 100 includes array 102. Array 102 may include a substantially regular pattern (array) of structures 104 (e.g., passive structures). For example, as shown in FIG. 3, array 102 includes structures 104 arranged in a tiled pattern. Structures 104 may, however, be arranged in any substantially regular pattern to form array 102 on passive device 100. In some embodiments, structures 104 are arranged in a semiregular pattern to form array 102 on passive device 100.

[0029] In certain embodiments, structures 104 are regular structures that include one or more passive elements such as, but not limited to, capacitors (e.g., trench or other form of high-density capacitors). Structures 104 may include other elements such as switches. FIG. 4 depicts an enlarged view of an example of one possible embodiment of structure 104. As shown in FIG. 4, structure 104 may include capacitor 106 and four switches 108. Terminals 110 may be used to couple elements (e.g., capacitor 106 and/or switches 108) in structure 104 to another structure or another semiconductor device. In some embodiments, connections to terminals of array structures 104 are directly coupled to the region of power consuming device 120 directly above or below the array structure via a local face to face bump or TSV.

[0030] In some embodiments, structure 104 includes additional elements such as inductors or bipolar devices that may be provided as part of a regular pattern on passive device 100. For example, the additional elements may be provided throughout array 102 or they may be provided on only a portion of the array (such as a ring around structure 104 used for an I/O periphery ring) as such structures may be only required for certain sub-functions and may consume excessive area.

[0031] In some embodiments, array 102 includes other low-resistance couplings (e.g., power supply rails) between certain portions of array structures 104. The low-resistance couplings may be provided in passive device 100, or in an additional device or a routing layer in the semiconductor device package that may be coupled to the backside of the passive device, for example, through the dual-sided nature of TSV connections. The low-resistance couplings may be used to lower power grid resistance and improve the programmability and/or usability of passive device 100 while minimizing impact on the routing layers of power consuming device 120. Moving power onto the low-resistance couplings may allow the power consuming device to effectively define local voltage domains between the power consuming device and passive device 100.

[0032] FIG. 5 depicts a representation of an example of another possible embodiment of array element structure 104. FIG. 6 depicts a generic terminal footprint for structure 104 depicted in FIG. 5. As shown in FIG. 5, structure 104 may include capacitor 106 and switches 108 in a generic 6-switch configuration. Structure 104 may include eight terminals 110 (shown in FIG. 6) with four terminals used for power connections and four terminals used for gate controls. Terminals 110 may be bumps or TSVs. One or more structures 104 may be arrayed in a generic layout and the passive device using the structures may be effectively programmed using the connectivity of another semiconductor device (e.g., power consuming device 120 shown in FIGS. 1 and 2) that is coupled to the passive device through terminals 110. In this manner, the same design for passive device 100, shown in FIG. 3, can be used for different functions with different power consuming devices 120.

[0033] In certain embodiments, the number of switches (or other active elements) in passive device 100, shown in FIG. 3, is minimized. For example, passive device 100 may include only capacitors (e.g., passive elements) or the passive device may include capacitors and only a few switches or power supply rails. The capacitors and few switches may be coupled together within structure 104 in array 102 to increase the granularity of the array until the array granularity best matches the granularity of terminals (TSVs, bumps, or other connections) used to couple to passive device 100.

[0034] FIG. 7 depicts a representation of another example of an embodiment of passive device structure 104 with only capacitors 106 and terminals 110. In certain embodiments, structure 104 (and array 102) may be laid out (e.g., designed) with a maximum distance of separation between positive terminals 110.sup.CAT and negative terminals 110.sup.ANO. Separating positive terminals 110.sup.CAT and negative terminals 110.sup.ANO with the maximum distance possible for a given power connection density may minimize the potential for shorting between capacitors 106. In some embodiments, separating positive terminals 110.sup.CAT and negative terminals 110.sup.ANO substantially inhibits shorting between capacitors 106. Misalignment between terminals may result in a structure with an open failure (e.g., a soft failure) for a particular cell in the array or a short between two cells in the array. The open failure, however, may only result in a small reduction in capacitance that may be compensated for in a closed-loop regulator whereas a short failure (caused by too little distance between the terminals) may result in yield loss of passive device 100.

[0035] FIG. 8 depicts a representation of an embodiment of terminal footprint 800 for an array using structures similar to structure 104 (shown in FIG. 7). Array 102, as shown in FIG. 8, includes 9 (nine) structures 104, which include 22 grids of terminals 110. Terminals 110 may be, for example, TSVs or bumps. Each structure 104 includes terminals for cathodes (CAT) and anodes (ANO) of capacitors in the structure in addition to either terminals for route-through (RT) resources (e.g., three-dimensional routed resources), horizontal track (HT), or vertical track (VT).

[0036] CAT and ANO terminals may be placed at opposite corners of each structure 104 to reduce the likelihood of shorting between the terminals. RT terminals, HT terminals, and VT terminals may be alternated between structures 104 in array 102 in both the x- and y-directions. HT terminals and VT terminals may be provided for connection to horizontal tracks and/or vertical tracks, which may be used as power rails. The horizontal and vertical tracks may include, for example, metal routing (rails) 112 within passive device 100 that provide an ability to connect power to one or more structures. HT terminals and VT terminals may be provided in fewer structures as low-resistance horizontal tracks and vertical tracks are typically less frequently required than capacitor connections. Non-shaded structures 104 in array 102 (e.g., structures outside the center shaded structure) may be overlapped areas of the array when the array is stepped in either the x- or y-direction (e.g., areas may overlap when array 102 is used as a base array to produce a larger array).

[0037] Using a structure without switches (such as structure 104 or structure 104) in passive device 100 may allow switching elements or other active elements to primarily (or completely) be located on a power consuming device (e.g., power consuming device 120 shown in FIGS. 1 and 2) coupled to the passive device in a semiconductor device package (e.g., package 90). Thus, processing technology for forming passive device 100 may be focused on producing better capacitors (e.g., producing capacitors as close to ideal capacitors as possible) and/or other passive elements such as inductors or low-resistance power supply rails. Focusing the processing technology on producing passive devices instead of producing these devices in combination with other active elements (such as components of the voltage regulator) may provide improved reliability and operation for the capacitors in package 90. For example, the capacitors may have less equivalent series resistance (ESR) and/or have less parasitic capacitance to ground from their anode or cathode terminals. In addition, the switches are primarily moved to power consuming device 120, which typically has good technology for producing switches. In some embodiments, passive device 100 may also contain switches or other components that are developed using a significantly different process than power consuming device 120. For example, a Gallium Nitride (GaN) process may be used in order to support higher conductance and tolerate higher voltages. Such process optimization for passive device 100 can be made independently of the optimization of process for power consuming device 120.

[0038] Power consuming device 120 may include elements of a typical regular SOC device. In certain embodiments, power consuming device 120 is coupled to passive device 100, as shown in FIGS. 1 and 2, such that the power consuming device utilizes the grid (e.g., array) of terminals for elements (e.g., capacitors) on the passive device to produce distinct (e.g., separate and localized) voltage regulators (e.g., distinct voltage regulators represented by dashed lines 123 in FIG. 2) with fine granularity between the regulators. The distinct voltage regulators may be provided a higher input voltage than groups of structures or elements (e.g., blocks such as IP blocks) on power consuming device 120 may require and/or may tolerate directly. The distinct voltage regulators may operate at the higher input voltage because separating and localizing the voltage regulators allows each voltage regulator to provide a desired input voltage directly to its corresponding block (e.g., selected block) without using package connection resources.

[0039] In embodiments that use face-to-face bumps or balls as terminals (e.g., TSVs are not used through passive device 100), high input voltages may need to be provided to power consuming device 120 without going through the passive device (e.g., the terminals for the high input voltages must be located outside the area covered by the passive device). For example, for the embodiment shown in FIG. 2, terminals 110 directly connecting passive device 100 and power consuming device 120 may be face-to-face bumps or balls and thus, terminals outside the edges of the passive device (e.g., terminals 110B) may be used as the terminals for the high input voltages. These high input voltages, however, may be provided at lower currents than packages without passive device 100 because the distinct voltage regulators built with a combination of elements from passive device 100 and power consuming device 120 allow localized reduction of the voltage to levels compliant for blocks on power consuming device 120. As power=voltage*current, providing higher input voltages (e.g., 3-8 times higher than the voltages used for blocks on power consuming device 120) allows for less current to be provided to achieve the same power levels in the power consuming device and fewer terminals (e.g., bumps or balls) may thus be used to provide power and ground to the package.

[0040] The distinct voltage regulators may be designed as different types of voltage regulators including, but not limited to, single or multi-level switched-cap converters, buck converters, or hybrid converters (e.g., a combination of both buck and switched-cap converters). Hybrid or Buck converters may require the use of inductors on either passive device 100 or power consuming device 120.

[0041] Power consuming device 120 utilizes the array (e.g., array 102) on passive device 100 to produce distinct, localized voltage regulators by mapping the array (and the array's subset of structures such as structures 104 or structures 104) into the properties needed to produce the voltage regulators for the power consuming device. The array may be mapped by using logic, connectivity, or any structures on power consuming device 120 to program or determine the connectivity between structures or elements on passive device 100 and blocks on the power consuming device. Thus, power consuming device 120 may determine what properties are needed in each voltage regulator (e.g., regions covered and connected, voltage division ratios, operating frequency, feedback point, enable controls, etc.) according to the needs of the corresponding block on the power consuming device.

[0042] In certain embodiments, structures on passive device 100 used in combination with a selected block on power consuming device 120 are localized in an area at or near the selected block. For example, the structures on passive device 100 used in combination with the selected block may be just below or just above the selected block if the passive device is vertically stacked relative to power consuming device 120. Localizing the structures on passive device 100 used in combination with the selected block on power consuming device 120 reduces (or minimizes) the distance between the voltage regulator and the selected block being providing power by the voltage regulator. Reducing the distance between the voltage regulator and the selected block and reducing the connected impedance (which, in the case of 3D connectivity, is largely defined by the array of terminals over the selected block) may reduce or minimize the voltage I*R drop experienced by the selected block and improve power efficiency of distribution to the selected block. Reducing the distance may also reduce the voltage drop by providing very fast and local feedback of the supplied voltage into the voltage regulation loop (e.g., a highly localized feedback response, which minimizes voltage margin requirements and reduces feedback time), providing lower resistance using TSV or bump connectivity, and providing a shorter distance for the higher current, lower voltage path (e.g., little to no board trace). In addition, reducing the voltage I*R drop to the selected block may allow the device's maximum operating frequency to be increased or the minimum operating voltage to be reduced. The operating frequency or operating voltage for selected blocks may be increased using active feedback controls to reduce aging effects in power consuming device 120.

[0043] In certain embodiments, separating and localizing the distinct voltage regulators allows input voltage for the selected block to be reduced to a minimum operating point for a desired operating frequency. Thus, separate DVFS (dynamic voltage & frequency scaling) settings and power-down functions may be provided to an individual block without affecting other blocks in power consuming device 120. In such cases, level converters may be required for connections between blocks operating in different DVFS voltage domains. In addition, using distinct voltage regulators allows a relatively high power block to utilize a different power supply voltage from a block that has a speed limiting critical path and may be furthest from the PMU). Without distinct voltage regulators, the high power block and the block with the speed limiting critical path may have to share a power supply and thus the voltage provided to the high power block has to be maintained at a minimum level to maintain performance in the block with the speed limiting critical path, thus wasting power in the high-power block, which may not contain the same critical path. Separating voltage regulation of the high power block from voltage regulation of the block with the speed limiting critical path allows the power provided the high power block to be optimized to its own critical path (e.g., by reducing the voltage) without affecting the performance of the block with the speed limiting critical path. Depending on modes of operation or other conditions, different blocks can have vastly differing critical paths and power consumption, making sharing of power supplies between such blocks a poor idea for optimum power consumption.

[0044] In some embodiments, sub-portions of blocks in power consuming device 120 (e.g., a separate function such as an ALU or MPY within a CPU or FPU) are able to operate off their own voltage regulators. For example, power consuming device 120 may define voltage regulators using passive device 100 that are localized and distinct for sub-portions of the blocks in the power consuming device. Separating and localizing voltage regulation for the sub-portions allows optimization of voltage for each function controlled by the different sub-portions. Thus, power consumption at the desired operating frequency may be minimized even further. Such critical path optimization of voltage (e.g., optimization based on sub-portion function) may be done, for example, using matching paths, lookup tables, early/late redundant flops as detectors on paths, or other similar methods.

[0045] In some embodiments, one or more of the distinct voltage regulators or certain sub-components of the regulators act as a power-gating devices to inhibit low-power leakage and essentially replace existing power-gating devices used to reduce leakage on power consuming devices. For example, when a selected block on power consuming device 120 is powered down, one or more switches in the distinct voltage regulator (e.g., a switched-cap implementation of the voltage regulator) may be shutoff. Shutting off the switches may reduce leakage in an active block without the need for additional power-gating devices, which are currently included in power consuming device 120.

[0046] In some embodiments, adjacent distinct voltage regulators are able to share resources on passive device 100 according to needs of blocks on power consuming device 120. For example, certain functions on power consuming device 120 are known to not operate simultaneously. In such embodiments, portions of structures or elements on passive device 100 (e.g., capacitors or tiles on the passive device) may be alternatively allocated to one distinct voltage regulator or another by continuing the row or column connections to include the shared devices via, for example, switches to a common rail within the row or column.

[0047] In certain embodiments, passive device 100 includes a regular array of structures that is generic (e.g., the passive device may be used with two or more different designs of power consuming structures). Properties of the distinct voltage regulators created using the generic passive device may be controlled by the power consuming device coupled to the generic passive device. For example, granularity choices (e.g., localization patterns), control, and drive circuitry for the voltage regulators may be placed on the power consuming device. Thus, the generic passive device may be used with several different power consuming devices or across several different generations of similar power consuming devices without modifying the design of the generic passive device. For example, footprint 800, shown in FIG. 8, may be used to generate a generic passive device that is used with many different power consuming devices (even power consuming devices from different manufacturers) and/or the generic passive device may be manufactured by different manufacturers to the same generic specifications or footprints of the generic passive device connections. Providing a generic passive device design allows the design and/or manufacturing of the generic passive device to be optimized and costs for producing the generic passive device to be reduced as the generic passive device may be produced as a commodity useable across several platforms and/or generations of devices.

[0048] In some embodiments, a semiconductor device package includes one or more additional devices in addition to passive device 100 and power consuming device 120. For example, the semiconductor device package may include a memory device (e.g., a DRAM device such as a high-speed or low-power DRAM core) in addition to passive device 100 and power consuming device 120. FIG. 9 depicts a side-view representation of an embodiment of package 200 with passive device 100, power consuming device 120, and memory device 250. Package 200 may include top build-up package 122A and bottom build-up package 122B.

[0049] Memory device 250 may be coupled to top package 122A while passive device 100 and power consuming device 120 are coupled together and sandwiched between the top package and bottom package 122B. In certain embodiments, passive device 100 and power consuming device 120 lie in a recess in top package 122A. As shown in FIG. 9, passive device 100 and power consuming device 120 may be approximately the same size. Thus, passive device 100 may include route-through terminals 128 (e.g., TSVs) to provide general I/O connections between bottom package 122B and power consuming device 120. In some embodiments, passive device 100 is smaller than power consuming device 120 and connections are provided to power consuming device outside the area overlapped by passive device 100 as described earlier.

[0050] In some embodiments, passive device 100 includes one or more other structures in the passive device in addition to the array of passive devices. For example, passive device 100 may include structures such as memory device 250 or other structures. FIG. 10 depicts a side-view representation of an embodiment of package 90 with memory device 250 integrated in passive device 100. FIG. 11 depicts a side-view representation of an embodiment of package 200 with memory device 250 integrated in passive device 100. The passive elements (e.g., capacitors) may be made during a process used to form memory device 250. In some embodiments, the process for forming memory device 250 is slightly modified to include forming the passive elements.

[0051] Because passive device 100 is located relatively close to power consuming device 120, as shown in FIGS. 10 and 11, the passive device has a high degree of connectivity with the power consuming device. Thus, passive device 100 may provide high-bandwidth, low power connections for other structures in the passive device (e.g., memory device 250) using face-to-face bump connections or other packaging connections discussed herein. Because the embodiments of package 90 and package 200, shown in FIGS. 10 and 11, have memory device 250 inside passive device 100, such embodiments may supply both high-bandwidth, low power memory connections between the memory device and power consuming device 120 and passive devices for supply filtering or power regulation when the passive devices are combined into various different regulator structures described herein (e.g., the distinct voltage regulators).

[0052] In some embodiments, the regulator structures are fully contained within passive device 100. In other embodiments, portions of the regulator structures are located on power consuming device 120. In certain embodiments, as shown in FIG. 10, passive device 100 (and memory device 250) are smaller than power consuming device 120. In some embodiments, passive device 100 is substantially smaller than power consuming device 120. When passive device 100 is smaller than power consuming device 120, a portion of the bump area of the power consuming device is available for I/O or other power delivery connections. In some embodiments, as shown in FIG. 11, passive device 100 (with memory device 250) is substantially similar in size to power consuming device 120.

[0053] FIG. 12 depicts a side-view representation of an embodiment of package 200 with passive device 100 containing TSVs 128, power consuming device 120, and memory device 250. Package 200 may include passive device 100 and memory device 250 sandwiched between build-up package 122 and power consuming device 120. Passive device 100 may include route-through terminals to provide connections between power consuming device 120 and memory device 250. In some embodiments, passive device 100 is offset from power consuming device 120 to allow direct general I/O connections between the power consuming device and build-up package 122. In some embodiments, build-up package 122 may include routing for connection between power consuming device 120 and memory device 250 without going through passive device 100. In some embodiments, TSVs are built into passive device 100, or, alternately, power consuming device 120, or both devices. In some embodiments, the functions of memory device 250 and passive device 100 are combined to be on a single die. This may be particularly useful if the memory device is a DRAM which contains a high-density capacitor array as part of its fundamental process. Other combinations of die function are possible and will be apparent to those skilled in the art.

[0054] In some embodiments, standard package techniques such as use of build-up material, staggering, and face-to-face connectivity can be combined with system requirements and applied by those skilled in the art to eliminate TSVs from the different devices in the system and thereby reduce cost.

[0055] Further modifications and alternative embodiments of various aspects of the embodiments described in this disclosure will be apparent to those skilled in the art in view of this description. Accordingly, this description is to be construed as illustrative only and is for the purpose of teaching those skilled in the art the general manner of carrying out the embodiments. It is to be understood that the forms of the embodiments shown and described herein are to be taken as the presently preferred embodiments. Elements and materials may be substituted for those illustrated and described herein, parts and processes may be reversed, and certain features of the embodiments may be utilized independently, all as would be apparent to one skilled in the art after having the benefit of this description. Changes may be made in the elements described herein without departing from the spirit and scope of the following claims.