Polishing and loading/unloading component module

Abstract

A polishing and loading/unloading component module comprises a loading/unloading module in the center and two polishing modules on both sides of the loading/unloading module. The loading/unloading module includes a loading/unloading table module which has two loading/unloading positions in a direction perpendicular to the arrangement direction of the two polishing modules. The loading/unloading table module can move back and forth between the two loading/unloading positions, or the two loading/unloading positions are provided with loading/unloading table modules apiece, corresponding to the two polishing modules respectively.

Claims

1. A method for wafer transfer using a polishing and loading/unloading component module, wherein the polishing and loading/unloading component module comprises a loading/unloading module in a center of the polishing and loading/unloading component module and two polishing modules, wherein one of the two polishing modules is on one side of the loading/unloading module, and another one of the two polishing modules is on another side of the loading/unloading module opposite to the one side, wherein the loading/unloading module comprises one loading/unloading table module, and a linear motion module; the said one loading/unloading table module comprises a loading/unloading stage configured for holding a wafer, and a first loading/unloading position and a second loading/unloading position, wherein the loading/unloading stage moves between the first loading/unloading position and the second loading/unloading position; the linear motion module comprises a sliding block, and a loading/unloading stage holder configured for positioning the loading/unloading stage of the said one loading/unloading table module, such that the said one loading/unloading table module is fixed on the sliding block of the linear motion module, and the sliding block connecting the first loading/unloading position and the second loading/unloading position enables the said one loading/unloading table module to move between the first loading/unloading position and the second loading/unloading position, the first loading/unloading position and the second loading/unloading position are in a direction perpendicular to an arrangement direction of the two polishing modules, and the method comprises following steps: S1: the said one loading/unloading table module stopping at the first loading/unloading position, waiting for a first polishing head corresponding to the first loading/unloading position and carrying a first wafer that has been polished in a first stage; S2: after the first polishing head is transferred to the first loading/unloading position, the first wafer is loaded to the said one loading/unloading table module, and the said loading/unloading table module is moved to the second loading/unloading position; S3: the first polishing head being cleaned at a position above the first loading/unloading position, and the first wafer on the said one loading/unloading table module at the second loading/unloading position being loaded to a second polishing head to start the polishing in a second stage, and after the second polishing head is transferred above a second polishing pad, loading a second wafer to be polished to the said one loading/unloading table module; S4: when the first polishing head corresponding to the first loading/unloading position being cleaned, the said one loading/unloading table module at the second loading/unloading position moving to below the first polishing head at the first loading/unloading position, and then the said one loading/unloading table module moving to above the first loading/unloading position, the first polishing head corresponding to the first loading/unloading position loading the second wafer to be polished and transferring the second wafer to be polished to a polishing area for polishing; S5: the said one loading/unloading table module at the first loading/unloading position moving to below the first loading/unloading position and then moving to the second loading/unloading position, while the second polishing head corresponding to the second loading/unloading position moving to a position above the second loading/unloading position, the said one loading/unloading table module moving to above the second loading/unloading position, and loading the first wafer that has been polished in the second stage, and then the said one loading/unloading table module moving to below the second loading/unloading position and moving from the second loading/unloading position to the first loading/unloading position; S6: the second polishing head corresponding to the second loading/unloading position being cleaned at the position above the second loading/unloading position, while removing the first wafer that has been polished in the second stage from the said one loading/unloading table module at the first loading/unloading position, and the said one loading/unloading table module waiting for the second wafer that has been polished in the first stage on the first polishing head; S7: after the first polishing head is transferred to the first loading/unloading position, the said one loading/unloading table module moving to above the first loading/unloading position to load the second wafer that has been polished in the first stage, and then moving to the second loading/unloading position; S8: repeating the preceding steps until all wafers are polished, wherein the polishing module comprises a fixed platform, a polishing pad, a polishing head, and a rotating shaft, the polishing pad is located on the fixed platform, and the rotating shaft drives the polishing head to rotate to at least one of the two loading/unloading positions.

2. The method according to claim 1, wherein the first loading/unloading position and the second loading/unloading position are respectively provided with a first nozzle module and a second nozzle module, and both the first nozzle module and the second nozzle module are fixed on a fixed frame.

3. The method according to claim 2, wherein the first nozzle module and the second nozzle module are respectively arranged at edges of the first loading/unloading position and the second loading/unloading position.

4. The method according to claim 1, wherein the said one loading/unloading table module is moved to above or below the first loading/unloading position or the second loading/unloading position in a vertical direction to complete wafer transfer with a polishing head.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The embodiments of the invention are further described with reference to the accompanying drawings, in which:

(2) FIG. 1 is a 3D effect diagram of an overall polishing and loading/unloading module of the invention;

(3) FIG. 2 is a schematic structural diagram of a loading/unloading module in which a loading/unloading table module can move back and forth between two loading/unloading positions;

(4) FIG. 3 is a schematic structural diagram of a loading/unloading module in which the loading/unloading table modules are respectively provided at the two loading/unloading positions;

(5) The meaning of the signs used in the drawings:

(6) 1: First loading/unloading position, 2: First polishing head rotating shaft, 3: First polishing head, 4: First polishing pad, 5: First fixed platform, 6: Second loading/unloading position, 7: Second polishing head rotating shaft, 8: Second polishing head, 9: Second polishing pad, 10: Second fixed platform, 11: Water tank, 12: First isolation cover, 13: First nozzle module, 14: Second loading/unloading table fixed block, 15: Second loading/unloading table module, 16: Second nozzle module, 17: Second isolation cover, 18: First loading/unloading table module, 19: First loading/unloading table fixed block, 20: Fixed frame, 21: Linear motion module, 22: Loading/unloading table module, 23: Loading/unloading table fixed block, 24: Isolation cover.

BEST MODE TO CARRY OUT THE INVENTION

(7) The present invention is described in detail below with reference to the drawings and specific embodiments. The embodiments are implemented on the premise of the technical solution of the present invention, and a detailed implementation mode and specific operation process are given, but the protection scope of the invention is not limited to the following embodiments.

(8) The embodiment provides a polishing and loading/unloading component module for CMP equipment. The polishing and loading/unloading component module comprises one loading/unloading module and two polishing modules, with the layout shown in FIG. 1, including a first loading/unloading position 1, a first polishing head rotating shaft 2, a first polishing head 3, a first polishing pad 4, a first fixed platform 5, a second loading/unloading position 6, a second polishing head rotating shaft 7, a second polishing head 8, a second polishing pad 9, and a second fixed platform 10.

(9) The polishing pad, the polishing rotating shaft and other components are fixed on the fixed platform, and the polishing head is fixed on the polishing rotating shaft. The polishing rotating shaft drives the polishing head to rotate to the loading/unloading position, and after the action, the polishing rotating shaft drives the polishing head to rotate to above the polishing pad for polishing. The first loading/unloading position 1 corresponds to the first polishing head 3, and the second loading/unloading position 6 corresponds to the second polishing head 8.

(10) The structure of the loading/unloading module with a loading/unloading table module that can move back and forth between two loading/unloading positions is shown in FIG. 2, including: the first loading/unloading position 1, the second loading/unloading position 6, a water tank 11, a first nozzle module 13, a linear motion module 21, a second nozzle module 16, a loading/unloading table module 22, a loading/unloading table fixed block 23, an isolation cover 24, and a fixed frame 20. The water tank 11 and the linear motion module 21 are fixed on the fixed frame 20. The loading/unloading table fixed block 23 is fixed on the linear motion module 21, while the loading/unloading table module 22 is fixed on the loading/unloading table fixed block 23, and the lower part of the loading/unloading table fixed block 23 is provided with an isolation cover 24 to isolate the lower part of the loading/unloading table from liquid. The linear motion module 21 can make the loading/unloading table module 22 move back and forth between the first loading/unloading position 1 and the second loading/unloading position 6. The edges of the first loading/unloading position 1 and the second loading/unloading position 6 correspond to the first nozzle module 13 and the second nozzle module 16. The two nozzle modules are fixed on the fixed frame 20.

(11) The process of wafer transfer using the loading/unloading module with the loading/unloading table module that can move back and forth between the two loading/unloading positions is described as follows.

(12) First, the loading/unloading table module 22 stops at the first loading/unloading position 1, waits for the first polishing head 3 corresponding to the first loading/unloading position 1 and carrying the wafer that has been polished in the first stage to be transferred to the first loading/unloading position 1.

(13) The loading/unloading table module 22 rises to load the wafer, and then directly moves to the second loading/unloading position 6, and the first polishing head 3 corresponding to the first loading/unloading position 1 is cleaned above the first loading/unloading position 1. Through the movement of the loading/unloading table module 22, the first polishing head 3 does not need to return from the position above the first polishing pad 4 for cleaning, saving transfer time and improving efficiency.

(14) Simultaneously, the second polishing head 8 is transferred to the second loading/unloading position 6, and then the polished wafer on the loading/unloading table module 22 at the second loading/unloading position 6 is taken away by the second polishing head 8, and the robot arm loads the wafer to be polished on the loading/unloading table module 22 at the second loading/unloading position 6.

(15) When the first polishing head 3 corresponding to the first loading/unloading position 1 is cleaned, the loading/unloading table module 22 at the second loading/unloading position 6 moves to beneath the first polishing head 3 at the first loading/unloading position 1. Subsequently, the loading/unloading table module 22 rises, and the first polishing head 3 corresponding to the first loading/unloading position 1 loads the wafer to be polished and transfers the wafer to the polishing area for polishing, and the polishing of the next wafer is started.

(16) Then the loading/unloading table module 22 in the first loading/unloading position 1 moves to the second loading/unloading position 6. Simultaneously, the second polishing head 8 corresponding to the second loading/unloading position 6 moves to the position above the second loading/unloading position 6, and the loading/unloading table module 22 rises and sucks the polished wafer, and then moves from the second loading/unloading position 6 to the first loading/unloading position 1, and the second polishing head 8 corresponding to the second loading/unloading position 6 is cleaned at the position above the second loading/unloading position 6. This has the advantage that the second polishing pad 8 does not need to return from the position above the second polishing pad 9 for cleaning, saving transfer time and improving efficiency.

(17) Simultaneously, the robot arm takes away the polished wafer on the loading/unloading table module 22 at the first loading/unloading position 1, and loads the loading/unloading table module 22 with the wafer to be polished, and then the loading/unloading table module 22 stops at the first loading/unloading position 1 and waits for the first polishing head 3 corresponding to the first loading/unloading position 1 to unload the polished wafer for starting the cycle again.

(18) The schematic structural diagram of the loading/unloading module in which the loading/unloading table modules are respectively provided at the two loading/unloading positions is shown in FIG. 3, including the first loading/unloading position 1, the second loading/unloading position 6, the water tank 11, the first isolation cover 12, the first nozzle module 13, the second loading/unloading table fixed block 14, the second loading/unloading table module 15, the second nozzle module 16, the second isolation cover 17, the first loading/unloading table module 18, the first loading/unloading table fixed block 19, and the fixed frame 20. The first loading/unloading table module 18 corresponds to the first loading/unloading position 1, and the second loading/unloading table module 15 corresponds to the second loading/unloading position 6. The water tank 11, the first loading/unloading table fixed block 19 and the second loading/unloading table fixed block 14 are fixed on the fixed frame 20. The isolation cover is fixed on the loading/unloading fixed table to isolate the lower part of the loading/unloading table from the liquid. The loading/unloading table module is fixed on the loading/unloading table fixed block, and the corresponding nozzle module is provided at the edge of the loading/unloading position. All nozzle modules are fixed on the fixed frame 20.

(19) The process of wafer transfer using the loading/unloading module in which the loading/unloading table modules are respectively provided at the two loading/unloading positions is given in detail. At the beginning, the first loading/unloading table module 18 waits for the first polishing head 3 to rotate the wafer polished in the first stage to the first loading/unloading position 1 by the first polishing head rotating shaft 2.

(20) After the polished wafer is rotated by the first polishing head rotating shaft 2 to the first loading/unloading position 1, the loading/unloading table module 18 rises to load the wafer that have been polished.

(21) The first polishing head 3 then returns to above the first polishing pad 4, and the robot arm starts to remove the wafer that has been polished in the first stage from the first loading/unloading table module 18 and place the wafer on the second loading/unloading table module 15 at the second loading/unloading position 6, and the first polishing head 3 returns to the first loading/unloading position 1 for cleaning.

(22) After cleaning, the first polishing head 3 returns to above the first polishing pad 4, while the second polishing head 8 returns to the second loading/unloading position 6, the second loading/unloading table module 15 rises, and the second polishing head 8 takes away the wafer that has been polished in the first stage and simultaneously, the robot arm places the unpolished wafer on the first loading/unloading table module 18 at the first loading/unloading position 1. The transfer of wafers through two polishing heads corresponding to two loading/unloading table modules saves wafer transfer time and improves efficiency.

(23) Subsequently, the second polishing head 8 returns to above the second polishing pad 9 for polishing. The first polishing head 3 rotates to the first loading/unloading position 1 to remove the wafer to be polished and then starts polishing. After the polishing of the second polishing head 8 is completed, the second polishing head 8 rotates to the second loading/unloading position 6 to place the wafer polished in the second stage on the second loading/unloading table module 15, and then rotates back to the second polishing pad 9. The robot arm takes away the polished wafer, and the second polishing head 8 rotates back to the second loading/unloading position 6 for cleaning, and the cleaned second polishing head 8 returns to above the second polishing pad 9. The first loading/unloading table module 18 waits for the wafer on the first polishing head 3 at the first loading/unloading position 1 for starting the cycle.

(24) Advantages of the wafer loading/unloading component structure of the present invention include the following. The modularization of the loading/unloading portion and polishing portion enables to assemble into the layout in FIG. 1. The layout simplifies the device structure, improves the manufacturing efficiency of the device and reduces the occupation space of the device. Furthermore, the layout can be expanded freely as needed, and 3 or more modules in the layout shown in FIG. 1 can be spliced to further improve the flexibility of wafer manufacturing, improve manufacturing efficiency, reduce equipment space, and increase output. In addition, the displacement movement of the loading/unloading table module and the separated placement of the cleaning part, together with the robot arm for transferring the wafers, enables the parallel operation of processes between multiple polishing modules, greatly improving the manufacturing efficiency of the device.

(25) The preferred embodiments of the present invention are described in detail above. It should be understood that those of ordinary skill in the art can make many modifications and changes according to the concept of the invention without creative work. Therefore, all technical solutions that can be obtained by those skilled in the art through logical analysis, reasoning or limited experiments based on the concept of the invention on the basis of the prior art, shall fall within the protection scope determined by the claims.