EPITAXIAL STRUCTURE OF NONPOLAR AlGaN-BASED DEEP-ULTRAVIOLET (DUV) PHOTOELECTRIC DETECTOR AND PREPARATION METHOD THEREOF

Abstract

An epitaxial structure of a nonpolar AlGaN-based deep-ultraviolet (DUV) photoelectric detector and a preparation method thereof are provided. The epitaxial structure of the nonpolar AlGaN-based DUV photoelectric detector includes a nonpolar AlN buffer layer, a nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer, and a nonpolar Al.sub.0.7Ga.sub.0.3N epitaxial layer that are sequentially grown on a LaAlO.sub.3 substrate. The LaAlO.sub.3 substrate takes a (100) plane as an epitaxial plane, and AlN[11-20] as an epitaxial growth direction. With the LaAlO.sub.3 substrate, the epitaxial structure reduces dislocations and stresses between the substrate and the epitaxial buffer layer. By designing two AlGaN epitaxial buffer layers with different components, the epitaxial structure reduces a dislocation density and a surface roughness of the nonpolar AlGaN epitaxial layer, further accelerates photoresponse and detectivity of the detector, and enhances overall performance of the nonpolar AlGaN-based DUV photoelectric detector.

Claims

1. An epitaxial structure of a nonpolar AlGaN-based deep-ultraviolet (DUV) photoelectric detector, comprising a LaAlO.sub.3 substrate, wherein a nonpolar AlN buffer layer, a nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer, and a nonpolar Al.sub.0.7Ga.sub.0.3N epitaxial layer are sequentially grown on the LaAlO.sub.3 substrate; and the LaAlO.sub.3 substrate takes a (100) plane as an epitaxial plane, and AlN[11-20] as an epitaxial growth direction.

2. The epitaxial structure of the nonpolar AlGaN-based DUV photoelectric detector according to claim 1, wherein the nonpolar AlN buffer layer has a thickness of 300 nm to 400 nm.

3. The epitaxial structure of the nonpolar AlGaN-based DUV photoelectric detector according to claim 1, wherein the nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer has a thickness of 350 nm to 400 nm.

4. The epitaxial structure of the nonpolar AlGaN-based DUV photoelectric detector according to claim 1, wherein the nonpolar Al.sub.0.7Ga.sub.0.3N epitaxial layer has a thickness of 450 nm to 550 nm.

5. A preparation method of an epitaxial structure of a nonpolar AlGaN-based deep-ultraviolet (DUV) photoelectric detector, comprising: selecting a LaAlO.sub.3 substrate, and cleaning a surface of the LaAlO.sub.3 substrate to obtain a cleaned LaAlO.sub.3 substrate; putting the cleaned LaAlO.sub.3 substrate into an ultrahigh vacuum (UHV) chamber, and annealing the cleaned LaAlO.sub.3 substrate at a high temperature to remove surface contamination; charging nitrogen to the UHV chamber, and epitaxially growing a nonpolar AlN buffer layer on the LaAlO.sub.3 substrate by pulsed laser deposition (PLD); changing a target material in an environment of growing the nonpolar AlN buffer layer, and growing a nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer on the nonpolar AlN buffer layer in-situ; and changing the target material in the environment of growing the nonpolar AlN buffer layer, and growing a nonpolar Al.sub.0.7Ga.sub.0.3N epitaxial layer on the Al.sub.0.15Ga.sub.0.85N buffer layer; wherein the LaAlO.sub.3 substrate takes a (100) plane as an epitaxial plane, and AlN[11-20] as an epitaxial growth direction.

6. The preparation method according to claim 5, wherein the environment of growing the nonpolar AlN buffer layer is as follows: by keeping a vacuum degree in the UHV chamber, a laser energy at 220 mJ to 300 mJ, a laser frequency at 15 Hz to 30 Hz, a nitrogen flow at 2 sccm to 8 sccm, and a nitrogen pressure in the UHV chamber at 6 mTorr to 10 mTorr, the nonpolar AlN buffer layer is grown in an N-rich atmosphere.

7. The preparation method according to claim 5, wherein the nonpolar AlN buffer layer is epitaxially grown on the LaAlO.sub.3 substrate, and an Al source is an AlN high-purity ceramic target material.

8. The preparation method according to claim 5, wherein the nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer is grown on the nonpolar AlN buffer layer in-situ, and the target material is gallium-rich AlGaN ceramic.

9. The preparation method according to claim 5, wherein the nonpolar Al.sub.0.7Ga.sub.0.3N epitaxial layer is grown on the Al.sub.0.15Ga.sub.0.85N buffer layer, and the target material is aluminum-rich AlGaN ceramic.

10. The preparation method according to claim 5, wherein the nonpolar AlN buffer layer has a thickness of 300 nm to 400 nm; the nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer has a thickness of 350 nm to 400 nm; and the nonpolar Al.sub.0.7Ga.sub.0.3N epitaxial layer has a thickness of 450 nm to 550 nm.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0032] To describe the technical solutions in the embodiments of the present disclosure or in the prior art more clearly, the following briefly describes the drawings required for describing the embodiments or the prior art. Apparently, the drawings in the following description show some embodiments of the present disclosure, and those of ordinary skill in the art may still derive other drawings from these drawings without creative efforts.

[0033] FIG. 1 illustrates a schematic structural view of an epitaxial structure of a nonpolar AlGaN-based DUV photoelectric detector according to an embodiment of the present disclosure;

[0034] FIG. 2 illustrates a reflection high-energy electron diffraction (RHEED) pattern of a nonpolar AlGaN epitaxial wafer in a direction according to Embodiment 1 of the present disclosure; and

[0035] FIG. 3 illustrates a test graph of an X-ray rocking curve of a nonpolar AlGaN(11-20) thin film according to Embodiment 1 of the present disclosure.

[0036] In FIG. 1: [0037] 1LaAlO.sub.3 substrate, 2nonpolar AlN buffer layer, 3nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer, and 4nonpolar Al.sub.0.7Ga.sub.0.3N epitaxial layer.

DETAILED DESCRIPTION OF THE EMBODIMENTS

[0038] In order to make objectives, technical solutions and advantages in the embodiments of the present disclosure clearer, the technical solutions in the embodiments of the present disclosure are clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure. Apparently, the described embodiments are merely a part rather than all of the embodiments of the present disclosure. All other embodiments derived from the embodiments in the present disclosure by a person of ordinary skill in the art without creative efforts should fall within the protection scope of the present disclosure. It should be understood that the specific embodiments described herein are merely used to explain the present disclosure, rather than to limit the present disclosure.

[0039] An embodiment provides a preparation method of an epitaxial structure of a nonpolar AlGaN-based DUV photoelectric detector, including the following steps:

[0040] (1) Selection of a substrate and a crystal orientation: The LaAlO.sub.3 substrate takes a (100) plane as an epitaxial plane, and an AlN[11-20] direction as an epitaxial growth direction of a material.

[0041] (2) Surface cleaning of the substrate: The LaAlO.sub.3 substrate is sequentially put into acetone, anhydrous ethanol and deionized water for ultrasonic cleaning, taken out, washed with the deionized water, and blow-dried with hot high-purity nitrogen.

[0042] (3) Surface annealing of the substrate for impurity removal: The LaAlO.sub.3 substrate is put into a UHV chamber. By pumping a vacuum degree in the chamber to 2.5*10-10 torr to 2.9*10-10 torr, and heating the chamber to 600 C. to 800 C., the substrate is annealed to remove surface contamination and obtain a flat surface.

[0043] (4) Growth of a nonpolar AlN buffer layer: After the substrate is annealed, by cooling the chamber to 450 C., and keeping the vacuum degree in the chamber, a laser energy at 220 mJ to 300 mJ, a laser frequency at 15 Hz to 30 Hz, a nitrogen flow at 2 sccm to 8 sccm, and a nitrogen pressure in the vacuum chamber at 6 mTorr to 10 mTorr, the nonpolar AlN buffer layer is grown by PLD in an N-rich atmosphere. An Al source is an AlN high-purity ceramic target material.

[0044] (5) Epitaxial growth of a nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer: Upon the growth of the nonpolar AlN buffer layer, by keeping the vacuum degree in the chamber, the laser energy, the laser frequency and the nitrogen flow unchanged, and changing a target material into gallium-rich AlGaN ceramic, the nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer is grown on the nonpolar AlN buffer layer in-situ.

[0045] (6) Growth of a nonpolar Al.sub.0.7Ga.sub.0.3N epitaxial layer: Upon the growth of the nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer, by keeping the vacuum degree in the chamber, the laser energy, the laser frequency and the nitrogen flow unchanged, and changing the target material into aluminum-rich AlGaN ceramic, the nonpolar Al.sub.0.7Ga.sub.0.3N epitaxial layer is epitaxially grown on the nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer.

[0046] As shown in FIG. 1, the epitaxial structure of a nonpolar AlGaN-based DUV photoelectric detector prepared in the embodiment includes the nonpolar AlN buffer layer 2, the nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer 3, and the nonpolar Al.sub.0.7Ga.sub.0.3N epitaxial layer 4 that are sequentially grown on the LaAlO.sub.3 substrate 1. The nonpolar AlN layer has a thickness of 300 nm to 400 nm. The nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer has a thickness of 350 nm to 400 nm. The nonpolar Al.sub.0.7Ga.sub.0.3N epitaxial layer has a thickness of 450 nm to 550 nm.

[0047] The RHEED diffraction pattern for a surface of the nonpolar AlGaN thin film of the grown epitaxial structure in the direction is as shown in FIG. 2. The diffraction pattern shows subtle stripes, which indicates that there are single crystals with a good quality on the surface. The test result of the X-ray rocking curve of the nonpolar AlGaN (11-20) thin film is as shown in FIG. 3. The half-peak width is 0.11, which indicates that the thin film has a good crystalline quality.

Embodiment 1

[0048] The embodiment provides a preparation method of an epitaxial structure of a nonpolar AlGaN-based DUV photoelectric detector, including the following steps:

[0049] (1) Selection of a substrate and a crystal orientation: The LaAlO.sub.3 substrate takes a (100) close-packed plane as an epitaxial plane, and an AlN[11-20] direction as an epitaxial growth direction of a material.

[0050] (2) Surface cleaning of the substrate: The LaAlO.sub.3 substrate is sequentially put into acetone, anhydrous ethanol and deionized water to ultrasonically clean for 5 min, taken out, washed with the deionized water, and blow-dried with hot high-purity nitrogen.

[0051] (3) Surface annealing of the substrate for impurity removal and leveling: The cleaned LaAlO.sub.3 substrate is put into a UHV chamber. By pumping a vacuum degree in the chamber to 2.5*10-10 torr, and heating the chamber to 600 C., the substrate is annealed for 30 min.

[0052] (4) Growth of a nonpolar AlN buffer layer: by cooling the chamber to 450 C., keeping a vacuum degree in the chamber at 2.5*10-10 torr, a laser energy at 220 mJ and a laser frequency at 15 Hz, charging a nitrogen flow of 2 sccm, and keeping a nitrogen pressure at 6 mTorr, the AlN nucleating layer is grown by PLD in an N-rich atmosphere. An Al source is an AlN high-purity ceramic target material.

[0053] (5) Epitaxial growth of a nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer: By keeping parameters the same as those in Step (4), and changing a target material into gallium-rich AlGaN ceramic, the nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer is grown on the nonpolar AlN buffer layer in-situ.

[0054] (6) Growth of a nonpolar Al.sub.0.7Ga.sub.0.3N epitaxial layer: By keeping parameters the same as those in Step (4), and changing the target material into aluminum-rich AlGaN ceramic, the nonpolar Al.sub.0.7Ga.sub.0.3N buffer layer is grown on the nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer in-situ.

[0055] As shown in FIG. 1, the epitaxial structure of a nonpolar AlGaN-based DUV photoelectric detector prepared in the embodiment includes the nonpolar AlN buffer layer 2, the nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer 3, and the nonpolar Al.sub.0.7Ga.sub.0.3N epitaxial layer 4 that are sequentially grown on the LaAlO.sub.3 substrate 1. The nonpolar AlN buffer layer has a thickness of 300 nm. The nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer has a thickness of 360 nm. The nonpolar Al.sub.0.7Ga.sub.0.3N epitaxial layer has a thickness of 500 nm.

Embodiment 2

[0056] The embodiment provides a preparation method of an epitaxial structure of an N-polar-plane AlAlGaN-based DUV photoelectric detector, specifically including the following steps:

[0057] (1) Selection of a substrate and a crystal orientation: The LaAlO.sub.3 substrate takes a (100) close-packed plane as an epitaxial plane, and an AlN[11-20] direction as an epitaxial growth direction of a material.

[0058] (2) Surface cleaning of the substrate: The LaAlO.sub.3 substrate is sequentially put into acetone, anhydrous ethanol and deionized water to ultrasonically clean for 5 min, taken out, washed with the deionized water, and blow-dried with hot high-purity nitrogen.

[0059] (3) Surface annealing of the substrate for impurity removal and leveling: The cleaned LaAlO.sub.3 substrate is put into a UHV chamber. By pumping a vacuum degree in the chamber to 2.5*10-10 torr, and heating the chamber to 700 C., the substrate is annealed for 30 min.

[0060] (4) Growth of a nonpolar AlN buffer layer: by cooling the chamber to 450 C., keeping a vacuum degree in the chamber at 2.5*10-10 torr, a laser energy at 280 mJ and a laser frequency at 25 Hz, charging a nitrogen flow of 5 sccm, and keeping a nitrogen pressure at 8 mTorr, a thin film of the AlN nucleating layer is grown by PLD in an N-rich atmosphere. An Al source is an AlN high-purity ceramic target material.

[0061] (5) Epitaxial growth of a nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer: By keeping parameters the same as those in Step (4), and changing a target material into gallium-rich AlGaN ceramic, the nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer is grown on the nonpolar AlN buffer layer in-situ.

[0062] (6) Growth of a nonpolar Al.sub.0.7Ga.sub.0.3N epitaxial layer: By keeping parameters the same as those in Step (4), and changing the target material into aluminum-rich AlGaN ceramic, the nonpolar Al.sub.0.7Ga.sub.0.3N buffer layer is grown on the nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer in-situ.

[0063] As shown in FIG. 1, the epitaxial structure of a nonpolar AlGaN-based DUV photoelectric detector prepared in the embodiment includes the nonpolar AlN buffer layer 2, the nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer 3, and the nonpolar Al.sub.0.7Ga.sub.0.3N epitaxial layer 4 that are sequentially grown on the LaAlO.sub.3 substrate 1. The nonpolar AlN buffer layer has a thickness of 300 nm. The nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer has a thickness of 360 nm. The nonpolar Al.sub.0.7Ga.sub.0.3N epitaxial layer has a thickness of 450 nm.

Embodiment 3

[0064] The embodiment provides a preparation method of an epitaxial structure of an N-polar-plane AlAlGaN-based DUV photoelectric detector, specifically including the following steps:

[0065] (1) Selection of a substrate and a crystal orientation: The LaAlO.sub.3 substrate takes a (100) close-packed plane as an epitaxial plane, and an AlN[11-20] direction as an epitaxial growth direction of a material.

[0066] (2) Surface cleaning of the substrate: The LaAlO.sub.3 substrate is sequentially put into acetone, anhydrous ethanol and deionized water to ultrasonically clean for 5 min, taken out, washed with the deionized water, and blow-dried with hot high-purity nitrogen.

[0067] (3) Surface annealing of the substrate for impurity removal and leveling: The cleaned LaAlO.sub.3 substrate is put into a UHV chamber. By pumping a vacuum degree in the chamber to 2.5*10-10 torr, and heating the chamber to 800 C., the substrate is annealed for 30 min.

[0068] (4) Growth of a nonpolar AlN buffer layer: by cooling the chamber to 450 C., keeping a vacuum degree in the chamber at 2.5*10-10 torr, a laser energy at 300 mJ and a laser frequency at 30 Hz, charging a nitrogen flow of 8 sccm, and keeping a nitrogen pressure at 10 mTorr, a thin film of the AlN nucleating layer is grown by PLD in an N-rich atmosphere. An Al source is an AlN high-purity ceramic target material.

[0069] (5) Epitaxial growth of a nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer: By keeping parameters the same as those in Step (4), and changing a target material into gallium-rich AlGaN ceramic, the nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer is grown on the nonpolar AlN buffer layer in-situ.

[0070] (6) Growth of a nonpolar Al.sub.0.7Ga.sub.0.3N epitaxial layer: By keeping parameters the same as those in Step (4), and changing the target material into aluminum-rich AlGaN ceramic, the nonpolar Al.sub.0.7Ga.sub.0.3N buffer layer is grown on the nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer in-situ.

[0071] As shown in FIG. 1, the epitaxial structure of a nonpolar AlGaN-based DUV photoelectric detector prepared in the embodiment includes the nonpolar AlN buffer layer 2, the nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer 3, and the nonpolar Al.sub.0.7Ga.sub.0.3N epitaxial layer 4 that are sequentially grown on the LaAlO.sub.3 substrate 1. The nonpolar AlN buffer layer has a thickness of 350 nm. The nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer has a thickness of 380 nm. The nonpolar Al.sub.0.7Ga.sub.0.3N epitaxial layer has a thickness of 500 nm.

[0072] In conclusion, the epitaxial structure of a nonpolar AlGaN-based DUV photoelectric detector provided by the present disclosure includes the nonpolar AlN buffer layer, the nonpolar Al.sub.0.15Ga.sub.0.85N buffer layer, and the nonpolar Al.sub.0.7Ga.sub.0.3N epitaxial layer that are sequentially grown on the LaAlO.sub.3 substrate. The LaAlO.sub.3 substrate takes the (100) plane as the epitaxial plane, and the AlN[11-20] as the epitaxial growth direction, so the present disclosure enhances a power and a detectivity of the AlGaN-based DUV photoelectric detector, and improves photoresponse of the DUV photoelectric detector. The epitaxial structure of a nonpolar AlGaN-based DUV photoelectric detector provided by the present disclosure reduces a dislocation density and a surface roughness of the grown nonpolar AlGaN epitaxial layer, reduces the dark current of the detector, accelerates the photoresponse and detectivity, and enhances overall performance of the nonpolar AlGaN-based DUV photoelectric detector.

[0073] The above described are merely preferred embodiments of the present disclosure, and the protection scope of the present disclosure is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art according to the technical solutions and concepts of the present disclosure within the technical scope of the present disclosure should fall within the protection scope of the present disclosure.