DATA CARRIER WITH ANTENNA IMPROVEMENT

Abstract

Provided is a data carrier that comprises at least one carrier body, at least one electronic module, at least one antenna, and at least one metallic layer. The electronic module is at least partially arranged in the carrier body. The antenna is in connection with the electronic module. The metallic layer comprises at least one recess, and the antenna comprises an electrically conducting wire that is at least partially arranged in the recess. At least part of the metallic layer is part of the antenna. Other embodiments disclosed.

Claims

1. A data carrier (1) comprising: at least one carrier body (2); at least one electronic module (3); at least one antenna (4); and at least one metallic layer (5), wherein the electronic module (3) is at least partially arranged in the carrier body (2), wherein the antenna (4) is in connection with the electronic module (3), wherein the metallic layer (5) comprises at least one recess (6), and wherein the antenna (4) comprises an electrically conducting wire (7) that is at least partially arranged in the recess (6), wherein at least part of the metallic layer (5) is part of the antenna (4).

2. The data carrier (1) according to claim 1, wherein the wire (7) is wound as a coil (9) comprising one or more windings (8), preferably a plurality of windings.

3. The data carrier (1) according to claim 2, wherein the metallic layer (5) constitutes an initial winding or a terminal winding of the antenna (4).

4. The data carrier (1) according to claim 2, wherein the coil (9) comprises two or more inner windings (8a) and two or more outer windings (8b), and wherein a pitch (10a) between the inner windings (8a) is larger than a pitch (10b) between the outer windings (8b), and/or wherein a pitch (10a) between the inner windings (8a) is between 0.05 millimeter and 6 millimeter, more preferably between 0.1 millimeter and 3 millimeter, and/or wherein a pitch (10b) between the outer windings (8b) is between 0.05 millimeter and 6 millimeter, more preferably between 0.01 millimeter and 3 millimeter.

5. The data carrier (1) according to claim 1, wherein the antenna (4) is configured such that a coupling, in particular an inductive coupling, is established between the metallic layer (5) and the wire (7), and/or wherein a lateral distance (dl) between an edge (11) of the metallic layer (5) delimiting the recess (6) and the wire (7) is between 0.05 millimeter and 6 millimeter, more preferably between 0.1 millimeter and 3 millimeter.

6. The data carrier (1) according to claim 1, wherein the data carrier (1) comprises an RFID device (12), and wherein the RFID device comprises the electronic module (3) and the antenna (4).

7. The data carrier (1) according to claim 1, wherein the data carrier (1) defines a cross-section with respect to a horizontal direction (H), and wherein the metallic layer (5) extends at least partially, preferably entirely along the cross-section of the data carrier (1) with respect to the horizontal direction (H).

8. The data carrier (1) according to claim 1, wherein the metallic layer (5) has the shape of a plate, and/or wherein the metallic layer (5) comprises or consists of one or more metals and/or one or more metal-containing compounds, and/or wherein the metallic layer (5) is electrically conducting.

9. The data carrier (1) according to claim 1, wherein the carrier body (2) comprises or consists of one or more polymers and/or plastics, preferably one or more thermoplastics and/or one or more transparent polymers, the one or more polymers preferably being polycarbonate and/or polyvinyl chloride and/or polyethylene terephthalate, and/or wherein the data carrier (1) furthermore comprises at least one insert element (13), and wherein the wire (7) and/or the electronic module (3) are at least partially arranged in the insert element (13), and/or wherein the insert element (13) is at least partially arranged in the recess (6).

10. The data carrier (1) according to claim 1, wherein the wire (7) comprises two free ends (7a, 7b), and wherein the wire (7) is connected to the metallic layer (5) in a region of one of its free ends (7a) and a region of its other free end (7b) is preferably connected to the electronic module (3), or wherein the wire (7) is connected to the metallic layer (5) in regions of both of its free ends (7a, 7b).

11. A secure article (100) comprising or consisting of at least one data carrier (1), the secure article (100) preferably being a smart card, a passport or an identity card, wherein said data carrier (1) comprises: at least one carrier body (2); at least one electronic module (3); at least one antenna (4); and at least one metallic layer (5), wherein the electronic module (3) is at least partially arranged in the carrier body (2), wherein the antenna (4) is in connection with the electronic module (3), wherein the metallic layer (5) comprises at least one recess (6), and wherein the antenna (4) comprises an electrically conducting wire (7) that is at least partially arranged in the recess (6), characterized in that at least part of the metallic layer (5) is part of the antenna (4).

12. A method of producing a data carrier (1), wherein the method comprises the steps of: Providing at least one carrier body (2); Providing at least one electronic module (3); Providing at least one antenna (4); and Providing at least one metallic layer (5); wherein the electronic module (3) is at least partially arranged in the carrier body (2), wherein the antenna (4) is in connection with the electronic module (3), wherein the metallic layer (5) comprises at least one recess (6), and wherein the antenna (4) comprises an electrically conducting wire (7) that is at least partially arranged in the recess (6), wherein at least part of the metallic layer (5) is part of the antenna (4).

13. The method according to claim 12, wherein the carrier body (2) comprises a surface (14), and wherein the metallic layer (5) is arranged on the surface (14), and/or further comprising the step of providing an insert element (13), wherein the wire (7) is at least partially arranged in the insert element (13) and/or wherein the insert element (13) is at least partially arranged in the recess (6).

14. The method according to claim 12, wherein the wire (7) comprises at least one connection region (15a), wherein the connection region (15a) is pressed onto a surface (16) of the metallic layer (5) in a pressing step and/or wherein the connection region (15a) is connected to a surface of the metallic layer (5) in a connection step, and wherein the pressing step and the connection step are preferably performed simultaneously and particularly preferably correspond to a step of thermocompression bonding or of anisotropic conductive film bonding.

15. The method according to claim 14, further comprising the step of providing at least one adhesive element (17) on the surface (16) of the metallic layer (5) in a region of connection to the connection region (15a) of the wire (7), the adhesive element (17) preferably being electrically conductive and/or silver glue or the like

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Preferred embodiments of the invention are described in the following with reference to the drawings, which are for the purpose of illustrating the present preferred embodiments of the invention and not for the purpose of limiting the same. In the drawings,

[0045] FIG. 1a shows a top view on a data carrier comprising a metallic layer and a wire being connected to the metallic layer according to a first embodiment of the invention;

[0046] FIG. 1b shows a sectional view of the data carrier of FIG. 1a along the line A-A of FIG. 1a;

[0047] FIG. 1c shows a sectional view of the data carrier of FIG. 1a along the line B-B of FIG. 1a;

[0048] FIG. 2 shows a top view on a data carrier comprising a metallic layer and a wire being connected to the metallic layer according to a further embodiment of the invention;

[0049] FIG. 3 shows a partial sectional view of a data carrier according to the invention and comprising an electronic module being arranged according to a first arrangement;

[0050] FIG. 4 shows a partial sectional view of a data carrier according to the invention and comprising an electronic module being arranged according to a further arrangement;

[0051] FIG. 5a-5c depict top views on data carriers being manufactured in a method according to the invention at different stages;

[0052] FIG. 5d shows an enlarged view of the data carrier depicted in FIG. 5c in the region C;

[0053] FIG. 6a depicts an enlarged view on the data carrier being depicted in FIG. 5d in the region D before the wire is attached to the metallic layer;

[0054] FIG. 6b depicts an enlarged view on the data carrier being depicted in FIG. 5d in the region D while the wire is attached to the metallic layer according to a first way of attachment;

[0055] FIG. 6c depicts an enlarged view on the data carrier being depicted in FIG. 5d in the region D while the wire is attached to the metallic layer according to a second way of attachment;

[0056] FIG. 6d depicts an enlarged view on the data carrier being depicted in FIG. 5d in the region D after the wire is attached to the metallic layer, wherein the data carrier furthermore comprises an adhesive element.

DESCRIPTION OF PREFERRED EMBODIMENTS

[0057] Various aspects of the data carriers 1 according to the invention and their methods of production are now discussed in greater detail with respect to the figures.

[0058] In the depicted examples, the data carriers 1 correspond in each case to a secure article 100 in the form of a smart card.

[0059] As best seen in FIGS. 1a to 4, the data carriers 1 according to the invention in each case comprise a carrier body 2, an electronic module 3 (not depicted in FIGS. 1a to 2), an electrically conducting wire 7, and an electrically conducting metallic layer 5. The metallic layer 5 comprises a rectangular recess 6, within which the wire 7 is arranged. The electronic module 3 corresponds to an RFID module and the metallic layer 5 together with the wire 7 constitute an antenna 4 via which RFID signals can be communicated from the electronic module 3 to an external reader (not depicted) and vice versa. That is, the data carrier 1 can be said to comprise an RFID device 12, wherein the RFID device 12 comprises the electronic module 3 and the antenna 4, and wherein the metallic layer 5 is part of the antenna 4.

[0060] As furthermore becomes apparent from FIGS. 1 and 2, the wire 7 is wound as a coil 9 comprising a plurality of windings 8. The metallic layer 5 constitutes an initial winding or a terminal winding of the antenna 4. In other words, the metallic layer 5 can be seen an additional wire that surrounds the coiled wire 7 being arranged in the recess 6. The coil 9 comprises several inner windings 8a and several outer windings 8b. A pitch 10a between the inner windings 8a, i.e. a distance between adjacent inner windings 8a, is larger than a pitch 10b between the outer windings 8b, i.e. a distance between adjacent outer windings 8b. Moreover, the antenna 4 being here provided by the metallic layer 5 and the coiled wire 7 is configured such that an inductive coupling is established between the metallic layer 5 and the coiled wire 7. To this end a lateral distance dl between an edge 11 of the metallic layer 5 delimiting the recess 6 and the coiled wire 7 is here between 0.5 millimeter to 1 millimeter.

[0061] From FIGS. 1b and 1c it follows that the data carrier 1 defines a cross-section with respect to a horizontal direction H, and wherein the metallic layer 5 extends entirely along the cross-section of the data carrier 1 and with respect to said horizontal direction H. In other words, apart from the recess 6 as well as a slit 18 extending from an outer surface 19 of the metallic layer 5 into the recess 6 the metallic layer 5 is a continuous layer that extends continuously, i.e. without any interruptions, along the horizontal direction H of the data carrier 1. The slit 18 extends along the horizontal direction H as well as along a vertical direction V running perpendicularly to the horizontal direction H. Thus, it is a continuous slit 18, which extends with respect to the vertical direction V from a top surface 16, i.e. a first outer surface, of the metallic layer 5 to a bottom surface 20, i.e. a second outer surface, of the metallic layer 5. The slit 18 furthermore extends with respect to the horizontal direction H from a lateral outer surface 19 of the metallic layer 5 into the recess 6 of the metallic layer 5.

[0062] The carrier body 2 corresponds to a card body as it is commonly known in the card industry and comprises several layers 2a, 2b, . . . of polymers and/or plastics, preferably thermoplastics. Here, the carrier body 2 comprises three layers 2a, 2b, 2c of polyvinyl chloride (PVC), which are arranged above one another with respect to the vertical direction V. When seen along the vertical direction V, the metallic layer 5 is arranged between two of these layers. In fact, a first layer 2a of the carrier body 2 corresponds to a top overlay sheet PVC, which is followed by a top sheet PVC 2b when seen along the vertical direction. After said top sheet PVC 2b, the metallic layer 5 is provided, and wherein a bottom overlay sheet PVC 2c is provided after the metallic layer 5 when seen along the vertical direction V. Other type of layers, e.g. layers of polycarbonate or polyethylene terephthalate and/or more layers or less layers are of course likewise conceivable.

[0063] As furthermore becomes apparent from FIGS. 1b and 1c, the data carrier 1 furthermore comprises an insert element 13. Said insert element 13 is arranged in the recess 6 of the metallic layer 5 and completely fills the recess 6 as well as the slit 18 mentioned above.

[0064] The insert element 13 consists here of a transparent thermoplastics and is a so-called PVC sheet. At least part of the wire 7 as well as of the electronic module 3 are arranged in the insert element 13. In fact, and as follows from FIGS. 1a and 2, the windings 8 of the wire 7 are embedded in the insert element 13. However, and as furthermore follows from these figures, the wire 7 in the regions of its connection 15a, 15b with the electronic module 3 and with the metallic layer 5 is not arranged in the insert element 13. These regions of connection 15a, 15b are the regions of the free ends 7a, 7b of the wire 7.

[0065] That is, the wire 7 comprises two free ends 7a, 7b, wherein in the embodiment depicted in FIGS. 1a to 1c, a region of one free end 7a of the wire 7 is connected to the metallic layer and the region of the other free end 7b is connected to the electronic module 3, and wherein in the embodiment depicted in FIG. 2, the regions of both free ends 7a, 7b of the wire 7 are connected to the metallic layer 5.

[0066] That is to say, in FIGS. 1a to 1c the region of the first free end 7a of the wire 7 is attached to the metallic layer 5 via thermocompression, ACF or an electrically conducting adhesive element 17 such as silver glue. The region of the second free end 7b of the wire 7 is attached to the electronic module 3, here via an antenna pad 21 that is formed by the depicted zigzag arrangement of the wire 7 in the region of its second free end 7b, and wherein said antenna pad 21 is attached to the electronic module 3 via ACF or an electrically conducting adhesive element 17, e.g. again silver glue. As indicated by the dash-dotted square in FIG. 1a, a further antenna pad 22 is formed, wherein said further antenna pad 22 establishes a connection between the metallic layer 5 and the electronic module 3. To this end the further antenna pad 22 is again attached by means of ACF or silver glue or the like.

[0067] In the second embodiment depicted in FIG. 2, the region of the first free end 7a of the wire 7 as well as the region of the second free end 7b of the wire 7 are attached to the metallic layer 5 via thermocompression, ACF, silver glue or the like. In addition, the wire 7 forms two antenna pads 21, 22, here again in the form of the above-mentioned zigzag arrangement, and wherein the wire 7 is attached to the electronic module 3 by means of these two antenna pads 21, 22. The connection is again established via ACF or silver glue or the like.

[0068] In any case, and as best seen in FIGS. 3 and 4, the electronic module 3 is at least partially arranged in the carrier body 2. To this end a cavity 23 is milled into the carrier body 2, and wherein said cavity 23 extends through the top overlay sheet PVC 2a, the top sheet PVC 2b, the insert element 13 being arranged in the recess 6 of the metallic layer 5. In the embodiment depicted in FIG. 4, the cavity 23 furthermore extends at least partially into the bottom overlay sheet PVC 2c. The examples depicted in FIGS. 3 and 4 differ from one another in that the electronic module 3 is connected to the metallic layer 5 as well as to the wire 7 of the antenna 4 being arranged in the insert element 13 in FIG. 3, whereas the electronic module 3 is not connected to the metallic layer 5 but to the wire 7 of the antenna 4 being arranged in the insert element 13 in FIG. 4. In both examples, a connection of the electronic module 3 is achieved by an adhesive element 17 in the form of a silver glue dispensing.

[0069] FIGS. 5a to 5d depict different stages of the method of producing a data carrier 1 according to the invention.

[0070] In fact, and as follows from FIG. 5a, a PVC sheet 24 that will be used as the inlay PVC sheet 13 is provided in a first step. Several recesses 25 are formed in said PVC sheet 24, and wherein several metallic layers 5 are placed into said recesses 25. In a second step depicted in FIG. 5b, wires 7 that will participate in the formation of the antenna 4 as well as the electronic modules 3 are embedded and connected to one another and the metallic layers 5.

[0071] FIGS. 5c and 5d illustrate the connection of the wire 7 to the metallic layer 5 in greater detail. In fact, the wire 7 comprises a connection region 15a, wherein the connection region 15a is pressed onto a top surface 16 of the metallic layer 5 in a pressing step. Furthermore, said connection region 15a of the wire 7 is connected to the top surface 16 of the metallic layer 5 in a connection step, and wherein the pressing step and the connection step are preferably performed simultaneously and particularly preferably correspond to a step of thermocompression bonding or of anisotropic conductive film (ACF) bonding as mentioned earlier. In the depicted examples, the wire 7 is cut in a step of cutting before the wire 7 is connected to the metallic layer 5, whereby the free end 7a of the wire 7 being connected to the metallic layer 5 mentioned above is formed.

[0072] The steps of connection and pressing are illustrated in FIGS. 6a to 6d. In fact, after the wire 7 is cut so as to form the first free end 7a of the wire 7 (FIG. 6a), a thermocompression head 26 (FIG. 6b) or a heating head 27 (FIG. 6c) is used to press the connection region 15a, i.e. here the region of the first free end 7a of the wire 7, onto the metallic layer 5. At the end of the step of pressing, the wire 7 is connected to the top surface 16 of the metallic layer 5. FIG. 6d depicts a connection of the wire 7 via an adhesive element 17, here silver glue, wherein said adhesive element 17 is arranged on the top surface 16 of the metallic layer 5 such that said top surface 16 of the metallic layer 5 is in connection with the wire 7 via said adhesive element 17.

TABLE-US-00001 LIST OF REFERENCE SIGNS 1 data carrier 2 carrier body 2a, 2b, . . . layer 3 electronic module 4 antenna 5 metallic layer 6 recess 7 wire 7a free end 7b free end 8 winding 8a inner winding 8b outer winding 9 coil 10a pitch 10b pitch 11 edge 12 RFID device 13 insert element 14 surface 15a connection region 15b connection region 16 surface 17 adhesive element 18 slit 19 surface 20 surface 21 antenna pad 22 antenna pad 23 cavity 24 sheet 25 recess 26 thermocompression head 27 heating head 100 secure article dl lateral distance H horizontal direction V vertical direction