Roll Bond Evaporator Plate

Abstract

The application relates to a roll bond evaporator plate with a width and a height, wherein the roll bond evaporator plate comprises at least one cutout which is delimited at least on three side edges by the roll bond evaporator plate. The application further relates to a refrigerant circuit with such roll bond evaporator plate as well as to a laboratory chamber, climate chamber, cold chamber or environment simulation chamber with such roll bond evaporator plate.

Claims

1. A structure, comprising: a roll bond evaporator plate with a width and a height, and comprising a cutout, which is delimited on at least three side edges by the roll bond evaporator plate.

2. The structure of claim 1, wherein the cutout is delimited on four side edges by the roll bond evaporator plate.

3. The structure of claim 1, wherein the cutout is disposed approximately centrally along the width of the roll bond evaporator plate.

4. The structure of claim 1, wherein the roll bond evaporator plate comprises two cutouts which are disposed symmetrically with respect to a longitudinal axis of the roll bond evaporator plate.

5. The structure of claim 1, wherein the cutout is disposed in a lower third along the height of the roll bond evaporator plate.

6. The structure of claim 1, wherein the cutout has a cutout width which accounts for less than 50% of the width of the roll bond evaporator plate.

7. The structure of claim 1, wherein the cutout has a cutout height which accounts for less than 50% of the height of the roll bond evaporator plate.

8. The structure of claim 1, further comprising: a refrigerant circuit with a compressor, a condenser, and a dehumidification plate disposed in the cutout.

9. The structure of claim 8, wherein a temperature of the dehumidification plate can be different than a temperature of the roll bond evaporator plate.

10. The structure of claim 8, wherein the temperature of the dehumidification plate is controllable independently of the temperature of the roll bond evaporator plate or the temperature of the dehumidification plate is settable at a defined difference from the temperature of the roll bond evaporator plate.

11. The structure of claim 8, wherein the dehumidification plate is developed as a further roll bond evaporator plate.

12. The structure of claim 8, wherein the roll bond evaporator plate and the dehumidification plate are connected in parallel in the refrigerant circuit.

13. The structure of claim 8, further comprising: a laboratory chamber, climate chamber, cold chamber or environment simulation chamber with a sample compartment, wherein the roll bond evaporator plate is disposed on an outer side of the sample compartment.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0023] An embodiment example of the application will be explained in greater detail in conjunction with the following Figures. Therein depict:

[0024] FIG. 1 a schematic representation of a first embodiment example of a roll bond evaporator plate according to the application with a cutout, wherein in the cutout a dehumidification plate is disposed,

[0025] FIG. 2 a view onto the rear wall of a laboratory chamber, climate chamber, cold chamber or environment simulation chamber with a roll bond evaporator plate according to FIG. 1 disposed thereon,

[0026] FIG. 3 a representation of a second embodiment example of a roll bond evaporator plate according to the application with a cutout,

[0027] FIG. 4 the roll bond evaporator plate according to FIG. 3 with a dehumidification plate disposed in the cutout,

[0028] FIG. 5 a view onto the rear wall of a laboratory chamber, climate chamber, cold chamber or environment simulation chamber with a roll bond evaporator plate according to FIG. 4 disposed thereon, and

[0029] Fig. a schematic representation of a refrigerant circuit with a roll bond evaporator plate according to FIG. 1 or FIG. 4 disposed thereon.

DETAILED DESCRIPTION

[0030] Identical reference numbers denote in all Figures identical or functionally identical parts, wherein for greater clarity not all reference numbers are provided in all Figures.

[0031] FIG. 1 shows a schematic representation of a first embodiment example of a roll bond evaporator plate 10. The roll bond evaporator plate 10 was produced in a roll bonding process by joining together two metal sheets through rolling at high pressure, wherein certain regions of the metal sheet are recessed or are treated with separation means such that they cannot be bonded in these regions. These regions can subsequently be inflated by means of compressed air such that conduits can form. In the embodiment example depicted in FIG. 1 only one inlet 12 and one outlet 13 into a conduit disposed in the roll bond evaporator plate 10 are depicted; the conduit itself is not shown in this embodiment example.

[0032] The roll bond evaporator plate 10 is substantially developed in rectangular form with a front side 11a, a back side (not discernible in the Figures due to the plan view onto the front side 11a) and four side edges 10a, 10b, 10c, 10d. The roll bond evaporator plate 10 herein is of a height HR and a width BR.

[0033] The roll bond evaporator plate 10 comprises a cutout 20 which is developed, in particular, of rectangular form with a width BA, a height HA and four side edges 20a, 20b, 20c, 20d. The cutout 20 extends in particular from the front side 11aup to the back side and therewith penetrates the roll bond evaporator plate 10 completely. The cutout 20 is delimited on at least three side edges 20b, 20c, 20d by the roll bond evaporator plate 10. In this case the side edge 20a would lie on the side edge 10a of the roll bond evaporator plate 10 and the cutout 20 would form a lateral clearance or sidewise removal.

[0034] In the embodiment examples depicted in the Figures the cutout 20 is delimited at the four side edges 20a, 20b, 20c, 20d by the roll bond evaporator plate 10. The cutout 20 forms in this case a breakthrough opening in the interior of the roll bond evaporator plate 10.

[0035] The cutout 20 can be disposed in particular approximately centrally along the width BR of the roll bond evaporator plate 10. If several cutouts 20 are provided (not shown), they can be disposed, in particular, symmetrical with respect to the longitudinal axis of the roll bond evaporator plate 10. The cutout 20, furthermore, can be disposed in the lower third along the height HR of the roll bond evaporator plate 10 (cf. FIG. 1).

[0036] The width BA of the cutout 20 accounts, in particular, for less than 50%, preferably less than 40%, for example less than 25% of the width BR of the roll bond evaporator plate 10. The height HA of cutout 20 accounts, in particular, for less than 50%, preferably less than 40%, for example less than 25% of the height HR of the roll bond evaporator plate 10.

[0037] As depicted in FIG. 1, in the cutout 20 can be disposed a dehumidification plate 40. In terms of its dimensions this dehumidification plate 40 is, in particular, developed such that it substantially fills the cutout 20 completely. The dehumidification plate 40 can, for example, also be developed as a roll bond evaporator plate and comprise an inlet 42 and an outlet 43 into a conduit not depicted in FIG. 1.

[0038] FIG. 2 shows the roll bond evaporator plate 10 according to FIG. 1 with the dehumidification plate 40 in a chamber 50 which is developed as a laboratory chamber, climate chamber, cold chamber or environment simulation chamber. The chamber 50 comprises a sample compartment 52 with a rear wall 54, wherein the roll bond evaporator plate 10, in particular, is disposed on the outer side of the rear wall 54.

[0039] The embodiment example of a roll bond evaporator plate 10 depicted in FIG. 3 substantially differs from the roll bond evaporator plate 10 depicted in FIG. 1 thereby that conduit 15 between the inlet 12 and the outlet 13 is additionally discernible. Furthermore, the height of the roll bond evaporator plate 10 is developed in two parts, with an upper roll bond evaporator plate 10a and a lower roll bond evaporator plate 10b, wherein an outlet 13 of the upper roll bond evaporator plate 10a is directly connected with an inlet 12 of the lower roll bond evaporator plate 10b. The cutout 20 is only disposed in the lower roll bond evaporator plate 10b while the upper roll bond evaporator plate 10a does not comprise a cutout. Through such a series connection of two roll bond evaporator plates 10a, 10b the area of the roll bond evaporator plate 10 can be enlarged in simple manner in order to be able, for example, to adapt it to the area of the corresponding chamber 50.

[0040] FIG. 4 shows the roll bond evaporator plate 10 according to FIG. 3 with the dehumidification plate 40 disposed in cutout 20, wherein this dehumidification plate 40 differs substantially from the dehumidification plate 40 depicted in FIG. 1 in that additionally the conduit 45 between the inlet 42 and the outlet 43 is discernible. FIG. 5 illustrates the disposition of the roll bond evaporator plate 10 according to FIG. 4 in the chamber 50.

[0041] FIG. 6 shows schematically a refrigerant circuit 30 with a compressor 31, a condenser 32 and a roll bond evaporator plate 10 with the dehumidification plate 40 as described previously, wherein the temperature of the dehumidification plate 40 is controllable independently of the temperature of the roll bond evaporator plate 10. The control can take place in particular thereby that the roll bond evaporator plate 10 and the dehumidification plate 40 in the refrigerant circuit 30 are connected in parallel. The supply of refrigerant into the roll bond evaporator plate 10 can be controlled across a valve 34, the supply of refrigerant into the dehumidification plate 40 can be controlled across a valve 35. The valves 34, 35 are herein in particular actuatable across a control unit 60. Such refrigerant circuit 30 can, in particular, be applied in the chamber 50 according to FIG. 2 or 5.

[0042] The independent temperature control for roll bond evaporator plate 10 and dehumidification plate 40 enable setting specifically a colder temperature on the dehumidification plate 40 in order to effect condensation only at a desired position within the sample compartment 52, namely on the dehumidification plate 40. There is also the feasibility to set a temperature on the dehumidification plate 40 which is lower by a fixed number of degrees than the temperature on the roll bond evaporator plate 10. The positioning of the dehumidification plate 40 substantially centrally in the lower third of the rear wall 54 of the sample compartment enables good drainage of the condensate without significantly affecting the temperature distribution provided by the roll bond evaporator plate 10.

List of Reference Symbols

[0043] 10 Roll bond evaporator plate [0044] 10 Roll bond evaporator plate [0045] 10a Upper roll bond evaporator plate [0046] 10b Lower roll bond evaporator plate [0047] 10a Side edge [0048] 10b Side edge [0049] 10c Side edge [0050] 10d Side edge [0051] 11a Front side [0052] 12 Inlet [0053] 12 Inlet [0054] 13 Outlet [0055] 13 Outlet [0056] 15 Conduit [0057] 20 Cutout [0058] 20a Side edge [0059] 20b Side edge [0060] 20c Side edge [0061] 20d Side edge [0062] 30 Refrigerant circuit [0063] 31 Compressor [0064] 32 Condenser [0065] 34 Valve [0066] 35 Valve [0067] 40 Dehumidification plate [0068] 40 Dehumidification plate [0069] 42 Inlet [0070] 43 Outlet [0071] 45 Conduit [0072] 50 Chamber [0073] 52 Sample compartment [0074] 54 Rear wall [0075] 60 Control unit [0076] BR Width [0077] HR Height [0078] BA Width [0079] HA Height