PHASE SHIFTER AND MANUFACTURING METHOD THEREOF
20250038384 ยท 2025-01-30
Inventors
Cpc classification
H05K1/024
ELECTRICITY
H05K2201/10098
ELECTRICITY
International classification
Abstract
A phase shifter includes a printed circuit board and a trace located on the printed circuit board that is configured to transmit signals. The printed circuit board includes a first part covered by the trace and a second part not covered by the trace, where the second part includes at least one hollowed out area near the trace.
Claims
1. A base station antenna, comprising: an antenna that comprises an array of radiating elements; a feed network that is configured to sub-divide a radio frequency (RF) signal that is to be transmitted by the antenna into a plurality of sub-components and to pass each sub-component of the RF signal to a respective sub-array of the antenna, where each sub-array includes one or more of the radiating elements; and a phase shifter that comprises a printed circuit board that includes a dielectric substrate and a conductive trace on the dielectric substrate, where the phase shifter is configured to adjust phases of the sub-components of the RF signal, wherein the printed circuit board includes a plurality of openings that extend all of the way through the dielectric substrate.
2. The phase shifter according to claim 1, wherein the openings are configured to reduce an insertion loss experienced by the sub-components of the RF signal.
3. The phase shifter according to claim 1, wherein a periphery of the dielectric substrate defines a frame and the plurality of openings are within an interior of the frame.
4. The phase shifter according to claim 3, wherein the frame includes a first side and a second side that is opposite the first side, and the dielectric substrate further includes a support bar that extends from the first side to the second side of the frame.
5. The phase shifter according to claim 4, wherein the support bar comprises a first support bar, the dielectric substrate further including a second support bar that extends from the first side to the second side of the frame.
6. The phase shifter according to claim 5, wherein the conductive trace extends over both the first support bar and the second support bar.
7. The phase shifter according to claim 2, wherein at least some of the openings are directly adjacent the conductive trace.
8. The phase shifter according to claim 2, wherein the conductive trace comprises a meandered conductive trace.
9. The phase shifter according to claim 2, wherein the conductive trace is directly on the dielectric substrate.
10. The phase shifter according to claim 2, wherein a first of the openings trace is directly adjacent a first side of the conductive trace and a second of the openings trace is directly adjacent a second side of the conductive trace.
11. A base station antenna, comprising: an antenna; and a phase shifter that is coupled to the antenna, the phase shifter comprising a printed circuit board that includes a dielectric substrate and a conductive trace on the dielectric substrate, wherein the printed circuit board includes a plurality of openings that extend all of the way through the dielectric substrate and a support bar is provided in between first and second of the openings.
12. The phase shifter according to claim 11, wherein the plurality of openings are configured to reduce an insertion loss experienced by the sub-components of the RF signal.
13. The phase shifter according to claim 12, wherein a periphery of the dielectric substrate defines a frame and the plurality of openings are within an interior of the frame.
14. The phase shifter according to claim 13, wherein at least some of the plurality of openings are directly adjacent the conductive trace.
15. The phase shifter according to claim 14, wherein the conductive trace comprises a meandered conductive trace.
16. A base station antenna, comprising: an antenna; and a phase shifter that is coupled to the antenna, the phase shifter comprising a printed circuit board that includes a dielectric substrate and a conductive trace on the dielectric substrate, wherein a periphery of the dielectric substrate defines a frame and a plurality of openings are within an interior of the frame, and the dielectric substrate further includes a first support bar that extends in between two of the openings.
17. The phase shifter according to claim 16, wherein the openings are configured to reduce an insertion loss experienced by the sub-components of the RF signal.
18. The phase shifter according to claim 16, wherein the dielectric substrate further including a second support bar, and the conductive trace extends over both the first support bar and the second support bar.
19. The phase shifter according to claim 18, wherein at least some of the openings are directly adjacent the conductive trace.
20. The phase shifter according to claim 16, wherein a first of the openings trace is directly adjacent a first side of the conductive trace and a second of the openings trace is directly adjacent a second side of the conductive trace.
Description
BRIEF DESCRIPTION OF THE DRAWING
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[0039] Note, in the embodiments described below, the same signs are sometimes jointly used between different attached drawings to denote the same parts or parts with the same functions, and repeated descriptions thereof are omitted. In this Specification, similar labels and letters are used to indicate similar items. Therefore, once an item is defined in one attached drawing, it does not need to be further discussed in subsequent attached drawings.
[0040] For ease of understanding, the position, dimension, and range of each structure shown in the attached drawings and the like may not indicate the actual position, dimension, and range. Therefore, the disclosed invention is not limited to the positions, dimensions, and ranges disclosed in the attached drawings and the like.
DETAILED DESCRIPTION
[0041] Various exemplary embodiments of the present disclosure will now be described in detail by referencing the attached drawings. It should be noted: unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values of components and steps set forth in these embodiments do not limit the scope of the present disclosure.
[0042] The technologies, methods, and equipment known to those of ordinary skill in the art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be regarded as part of the granted Specification.
[0043] In all examples shown and discussed herein, any specific value should be construed as merely exemplary value and not as limiting value. Therefore, other examples of the exemplary embodiment may have different values.
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[0045] In addition, although it is not shown in
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[0048] Signals (for example, RF signals) may be transmitted over the trace 302. The trace 302 may be comprise a patterned metal layer of a printed circuit board.
[0049] The frame 303 may be part of the printed circuit board. For example, after forming the trace 302 on the printed circuit board, the part of the printed circuit board that does not form the trace 302 may be removed, only keeping the peripheral part of the printed circuit board as the frame 303. As such, the hollowed out area 304 may be formed in the printed circuit board.
[0050] The frame 303 and the base material of the printed circuit board located below the trace 302 are capable of providing support to the trace 302, keeping the trace 302 stable.
[0051] Removing the base material in the hollowed out area 304 helps to reduce insertion loss of signals transmitted through the phase shifter 300.
[0052] According to the above description, in the phase shifter 300 shown in
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[0054] The difference between the phase shifter 400 in
[0055] In some embodiments according to the present disclosure, the support bar 405 may be formed with the base material of the printed circuit board. For example, when forming the hollowed out area 404, apart from keeping the base material of the printed circuit board corresponding to the frame 403, a part of the base material may be kept appropriately to constitute the support bar 405.
[0056] Of course, the present disclosure is not limited thereto. For example, according to some embodiments of the present disclosure, one or a plurality of support bars 405 may be added to the phase shifter 300 shown in
[0057] The frame 403 of the phase shifter 400 is a rectangular frame and the left and right sides of the frame 403 (that is, third and fourth sides) are shorter than the length of the upper and lower sides of the frame 403. Installing a support bar 405 helps to improve the stability of the phase shifter 400 and prevents or reduces the deformation of the frame 403.
[0058] It should be understood that under the above teachings of the present disclosure, there are many ways to install the support bar.
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[0060] The difference between the phase shifter 500 in
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[0062] The difference between the phase shifter 600 in
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[0064] The phase shifter 700 further includes a resistor 706. The resistor 706 provided in the phase shifter 700 is capable of improving the vertical beam directivity of an antenna array formed by a feed network including the phase shifter and a radiating element.
[0065] The trace of existing phase shifters (for example, the phase shifter 200 shown in
[0066] In addition, in some embodiments of the present disclosure, the resistor 706 may be suspended, that is, the base material of the printed circuit board below the resistor 706 may be removed. In some other embodiments of the present disclosure, the base material of the printed circuit board below the resistor 706 may be kept such that the resistor 706 is placed on the printed circuit board, so as to further improve the stability of the resistor 706.
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[0068] In addition, one part of the frame 803 of the phase shifter 800 may be further provided with a metal layer 807, and the metal layer 807 is insulated from the trace 802. The metal layer 807 is capable of improving the strength of the frame 803 to provide support to the frame 803. According to some embodiments of the present disclosure, the metal layer 807 may be formed while forming the trace 802 on the printed circuit board. Alternatively, according to some other embodiments of the present disclosure, the metal layer 807 may be formed through methods such as bonding and deposition after forming the frame 803 and trace 802.
[0069] In the various embodiments shown in
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[0071] First, a printed circuit board is provided (Step 910). The printed circuit board may be single-sided copper clad or double-sided copper clad. Alternatively, the printed circuit board may be covered with one or a plurality of layers of other conductive materials, for example, gold, silver, aluminum, iron or tungsten. The base material of the printed circuit board is not limited and any suitable insulating medium may be used.
[0072] Then, the trace is formed on the printed circuit board (Step 920). For example, the trace may be formed by manufacturing the trace on the printed circuit board. More specifically, according to some embodiments of the present disclosure, the surface of the printed circuit board may be covered with a layer of a photosensitive material (for example, photoresist); then, the photosensitive material layer is patterned so that the pattern of the remaining photosensitive material on the printed circuit board is the same as the pattern of the trace to be formed; next, the conductive material on the surface of the printed circuit board may be etched (for example, wet etching) and the conductive material not covered by the photosensitive material is removed; finally, the remaining photosensitive material is removed to obtain the trace.
[0073] In addition, according to some embodiments of the present disclosure, the metal layer 807 shown in
[0074] Finally, one part of the printed circuit board may be removed to form a hollowed out area (Step 930). For example, the base material of the printed circuit board near the trace may be removed, only keeping the peripheral part of the printed circuit board as the frame. Alternatively, the support bar and other structures may be kept as needed.
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[0082] The words front, rear, top, bottom, above, below, etc. in the Specification and Claims, if present, are used for descriptive purposes and are not necessarily used to describe constant relative positions. It should be understood that the terms used in this way are interchangeable under appropriate circumstances, so that the embodiments of the present disclosure described herein, for example, can operate on other orientations that differ from those orientations shown herein or otherwise described.
[0083] As used herein, the word exemplary means serving as an example, instance, or illustration rather than as a model to be copied exactly. Any realization method described exemplarily herein is not necessarily interpreted as being preferable or advantageous over other realization methods. Furthermore, the present disclosure is not limited by any expressed or implied theory given in the above technical field, background art, summary of the invention or embodiments.
[0084] As used herein, the word basically means comprising any minor changes caused by design or manufacturing defects, device or component tolerances, environmental influences, and/or other factors. The term basically further allows the gap from the perfect or ideal situation due to parasitic effects, noise, and other practical considerations that may be present in the actual realization.
[0085] The above description may indicate elements or nodes or features that are connected or coupled together. As used herein, unless specified otherwise, connect means that an element/node/feature is directly electrically, mechanically, logically connected, or connected in other manners (or directly communicated) with another element/node/feature. Similarly, unless explicitly stated otherwise, coupled means that one element/node/feature can be mechanically, electrically, logically or otherwise connected with another element/node/feature in a direct or indirect manner to allow interaction, even though the two features may not be directly connected. That is, couple is intended to comprise direct and indirect linking of elements or other features, including connection using one or a plurality of intermediate components.
[0086] In addition, for reference purposes only, certain terms may be used in the description below without intending to be limitative. For example, unless the context clearly indicates, the words first, second and other such numerical words involving structures or elements do not imply a sequence or order.
[0087] It should also be understood that when the term include/comprise is used in this text, it indicates the presence of the specified feature, entirety, step, operation, unit and/or component, but does not exclude the presence or addition of one or more other features, entireties, steps, operations, units and/or components and/or combinations thereof.
[0088] In the present disclosure, the term provide is used in a broad sense to cover all ways of obtaining an object, so providing an object includes but is not limited to purchase, preparation/manufacturing, arrangement/setting, installation/assembly, and/or order of the object, etc.
[0089] Those skilled in the art should realize that the boundaries between the above operations are merely illustrative. A plurality of operations can be combined into a single operation, which may be distributed in the additional operation, and the operations can be executed at least partially overlapping in time. Also, alternative embodiments may include a plurality of instances of specific operations, and the order of operations may be changed in various other embodiments. However, other modifications, changes and substitutions are also possible. Therefore, the Specification and attached drawings hereof should be regarded as illustrative rather than restrictive.
[0090] Although some specific embodiments of the present disclosure have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration rather than for limiting the scope of the present disclosure. The embodiments disclosed herein can be combined arbitrarily without departing from the spirit and scope of the present disclosure. Those skilled in the art should also understand that various modifications can be made to the embodiments without departing from the scope and spirit of the present disclosure. The scope of the present disclosure is defined by the attached claims.