System and method for high power diode based additive manufacturing

Abstract

A system is disclosed for performing an Additive Manufacturing (AM) fabrication process on a powdered material forming a substrate. The system may make use of a diode array for generating an optical signal sufficient to melt a powdered material of the substrate. A mask may be used for preventing a first predetermined portion of the optical signal from reaching the substrate, while allowing a second predetermined portion to reach the substrate. At least one processor may be used for controlling an output of the diode array.

Claims

1. A method for performing Additive Manufacturing (AM) comprising: irradiating a first powdered material layer of a substrate using an electromagnetic signal sufficient to induce a material phase change of at least a substantial portion of an entire two dimensional area within which the substrate is positioned; using a dynamically controllable, two dimensional digitally electronically addressable mask for receiving the electromagnetic signal and controllably selecting portions of the electromagnetic signal passing therethrough such that first portions of the electromagnetic signal pass through the mask without selection, and thus reach the powdered material layer without being altered, and second portions of the electromagnetic signal pass through the mask but are selected for rejection, and thus do not reach the powdered material layer; placing a second powdered material layer over the first powdered material layer; irradiating the second powdered material layer using the electromagnetic signal while using the mask to selectively block additional portions of the electromagnetic signal from reaching the second powdered material layer of the substrate; wherein the using a mask to selectively block portions of the electromagnetic signal comprises using a digitally electronically addressable mask; wherein the using a digitally electronically addressable mask comprises: using a liquid crystal module to rotate the first portions of the electromagnetic signal while allowing the second portions of the electromagnetic signal to pass therethrough in an unrotated condition; and using a polarizing element downstream of the liquid crystal module to reject a selected one of the first portions or the second portions, and thus impede the selected one of the first or second portions from reaching the substrate; further including using an electronically addressable spray source to deposit at least two different material types to form at least one of the first and second powdered material layers; and further controlling the mask in accordance with the at least two different material types being irradiated.

2. The method of claim 1, wherein the irradiating a powdered layer of a substrate using an electromagnetic signal comprises using a diode array to generate the electromagnetic signal.

3. The method of claim 2, wherein the using the diode array comprises using a diode array configured to generate a power density of at least about 10 kW/cm.sup.2.

4. The method of claim 1, further comprising using a computer to control the digitally electronically addressable mask.

5. The method of claim 2, further comprising using a computer to control the diode array.

6. A method for performing Additive Manufacturing (AM) comprising: generating an electromagnetic signal toward a powdered material forming a substrate, wherein the electromagnetic signal is sufficient to induce a material phase change of an entire two dimensional area of the substrate; using a liquid crystal polarization rotator to receive the electromagnetic signal before the electromagnetic signal reaches the substrate; controlling the liquid crystal polarization rotator to act as a mask by: controlling a first component of the liquid crystal polarization rotator to receive and rotate a first portion of the electromagnetic signal passing therethrough while allowing a second portion of the electromagnetic signal to pass therethrough without being rotated; controlling a second component of the liquid crystal polarization rotator to reject one of the first or second portions of the electromagnetic signal received from the first component, and thus to prevent the one of the first or second portions of the electromagnetic signal from reaching the powdered material, while the second component allows the other one of the first or second portions of the electromagnetic signal to reach the powdered material; wherein the controlling a first component of the liquid crystal polarization rotator to receive and to rotate a first portion of the electromagnetic signal comprises using a liquid crystal module; and wherein the controlling a second component of the liquid crystal polarization rotator to reject one of the first or second portions of the electromagnetic signal comprises using a polarizer; further including providing the powdered material as a first material type; providing an additional powdered material as a second material type different from the first material type; using an electronically addressable spray source to sequentially deposit the first and second material types to form first and second layers; and further controlling operation of the mask depending on the first and second material types to melt each of the first and second material types.

7. The method of claim 6, wherein the operation of generating an electromagnetic signal comprises using a diode array.

8. The method of claim 6, wherein the operation of using a liquid crystal module comprises using a computer controllable liquid crystal module.

9. The method of claim 6, wherein the operation of using a polarizer comprises using a polarization mirror.

10. The method of claim 6, wherein the operation of generating an electromagnetic signal comprises using a diode array to generate a pulsed electromagnetic signal.

11. A method for performing Additive Manufacturing (AM) comprising: using a laser diode to generate an electromagnetic signal toward a first layer of powdered material forming a substrate, wherein the electromagnetic signal is sufficient to irradiate an entire two dimensional area of the powdered material; using a liquid crystal polarization rotator having a liquid crystal module and a polarizer to receive the electromagnetic signal before the electromagnetic signal reaches the first layer of powdered material; controlling the liquid crystal polarization rotator to act as a mask by: controlling the liquid crystal module to rotate a first portion of the electromagnetic signal passing therethrough while allowing a second portion of the electromagnetic signal to pass therethrough without being rotated; controlling the polarizer to reject one of the first or second portions of the electromagnetic signal received from the liquid crystal module, and thus to prevent the one of the first or second portions of the electromagnetic signal from reaching the first layer of powdered material, while the polarizer allows the other one of the first or second portions of the electromagnetic signal to reach the first layer of powdered material and to melt the first layer of powdered material; subsequent to melting of the first layer of powdered material, applying a second layer of powdered material on at least a portion of the first layer of powdered material; and using the laser diode and the liquid crystal polarization rotator to melt at least a portion of the second layer of powdered material; further including using an electronically addressable spray source to deposit at least two different material types to form at least one of the first and second powdered material layers; and further controlling the mask in accordance with the at least two different material types being irradiated.

12. The method of claim 11, further comprising using a computer to control the liquid crystal polarization rotator.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The drawings described herein are for illustration purposes only and are not intended to limit the scope of the present disclosure in any way. In the drawings:

(2) FIG. 1 is a diagrammatic view of one embodiment of the present system and method for performing an Additive Manufacturing (AM) fabrication process using a high power diode array and a mask;

(3) FIG. 2 is a diagrammatic side view of the system of FIG. 1 showing how a portion of the optical rays from the diode array are reflected by a polarizing mirror during the fabrication process to prevent them from reaching the substrate;

(4) FIG. 3 is a chart illustrating the average power flux required to melt various types of metals;

(5) FIG. 4 is a graph that shows a plurality of curves representing various temperatures required to melt various materials, along with the time required to melt each material;

(6) FIG. 5 shows an alternative form of the system of the present disclosure in which distinct tiles (predetermined areas) corresponding to pixels of the substrate are digitally controlled during the AM fabrication process;

(7) FIG. 6 is another alternative form of the system of the present disclosure in which a plurality of focusing lenses are used to simultaneously focus the output from the diode array onto specific sections of the substrate for simultaneously melting distinct, separate sheets of material; and

(8) FIG. 7 is a diagrammatic side view of a method of deposition of different material types in powder form prior to illumination by diode array generated light to melt/sinter the dissimilar powders together.

DETAILED DESCRIPTION

(9) The following description is merely exemplary in nature and is not intended to limit the present disclosure, application, or uses. It should be understood that throughout the drawings, corresponding reference numerals indicate like or corresponding parts and features.

(10) Referring to FIG. 1 a system 10 is shown in accordance with one embodiment of the present disclosure for performing an Additive Manufacturing (AM) fabrication process. The system 10 may include a high power diode array 12 and a computer controlled, selective area mask 14 (hereinafter simply mask 14). A suitable power supply 16 may be used for providing electrical power to the diode array 12. A computer 18 or other suitable form of processor or controller may be used for controlling the power supply 16 to control the on/off application of power to the diode array 12 as well as selectively (i.e., digitally) controlling the mask 14 and shaping or focusing the optical beam. Optionally, separate processors or computers may be used to control the diode array 12 and the mask 14. Selectively electronically controlling the mask 14 with the computer 18 allows the optical beam from the diode array 12 to be prevented from reaching specific selected portions of powder that forms a substrate 20 (i.e., powder bed) so that those portions are irradiated by the beam. In FIG. 1 portion 15 is cross hatched to represent a portion of the output from the diode array 12 that does not reach the powdered material of the substrate 20.

(11) In one preferred form the diode array 12 may comprise a single large diode bar. Alternatively a plurality of diode bars located adjacent one another may be used to form the diode array 12. In one preferred form the diode array may be made up of arrays of diode bars each being about 1 cm0.015 cm to construct a 25 cm25 cm diode array. However, any number of diode bars may be used, and the precise number and configuration may depend on the part being constructed as well as other factors. Suitable diode bars for forming the diode array 12 are available from Lasertel of Tucson, Ariz., Oclaro Inc. of San Jose, Calif., nLight Corp. of Vancouver, Wash., Quantel Inc. of New York, N.Y., DILAS Diode Laser, Inc. of Tucson, Ariz., and Jenoptik AG of Jena, Germany, as well as many others. The diode array 12 is able to provide a minimum power density of about 10 kW/cm.sup.2 and maximum >100 kW/cm.sup.2 at two percent duty cycle. This makes it feasible to generate sufficient optical power to melt a wide variety of materials. FIG. 3 provides a table of the average power flux that has been calculated to melt various types of materials. FIG. 4 shows a graph that illustrates the effectiveness of the diode array 12 on a variety of metal powders (i.e., Aluminum, Titanium, Iron and Tungsten), at a power flux sufficient to melt all the materials. The calculations to obtain the graphs shown in FIG. 4 were performed in MATLAB with conductive and radiative losses taken into account. A conservative 30% absorptivity was assumed along with a powder layer thickness of 100 m.

(12) It will also be appreciated that a significant advantage of using a diode array comprised of one or more diode bars is that such an assembly is readily scalable. Thus, diode arrays of various sizes can be constructed to meet the needs of making a specific sized part. For example, the diode array 12 may be constructed to have a one square meter area, which would allow correspondingly large scale components to be constructed through an AM fabrication process, provided of course that a suitably sized powder bed is available to support fabrication of the part. Another significant advantage is that the system 10 can be integrated into existing AM fabrication systems with the added benefit of no moving parts. The system 10 allows for the AM fabrication of traditionally difficult to fabricate and join metal such as ODS (oxide dispersion strengthened) steels or any alloy traditionally formed using solid state (i.e. non-melt) processing techniques.

(13) Referring to FIG. 2, in one preferred form the mask 14 forms a liquid crystal polarization rotator comprised of a liquid crystal module (LCM) 14a and a polarizing element 14b, in this example a polarizing mirror (hereinafter polarizing mirror 14b). The polarizing mirror 14b directs the light defined by the liquid crystal polarization rotator and shapes the optical pattern that irradiates the substrate 20. The LCM 14a that helps to form the mask 14 may be made up of one or more two dimensional, electronically (i.e., digitally) addressable arrays of pixels. Liquid crystal polarizers are commercially available and form two dimensional arrays of addressable pixels which work by changing the polarity of an incoming photon that is then rejected by a polarization element. However, with the system 10, the polarizing element 14b may form a discrete component of the mask 14 that may be used to help focus and/or shape the optical signal.

(14) In FIG. 2 the mask 14 receives light 22 being output from the diode array 12 as the light irradiates the LCM 14a. Pixels of the LCM 14a are independently addressed using the computer 18 to reject light at specific select areas of the substrate 20. Using the LCM 14a and the polarizing mirror 14b to form the mask 14 enables the light generated by the diode array 12 to be controllably directed onto only selected areas of the substrate 20 as needed. In FIG. 2 light indicated by lines 22a is able to pass through the polarizing mirror 14b while light indicated by lines 22b is rejected by the polarizing mirror. An important advantage of using a computer controlled LCM 14a is that only a very small amount of optical energy is absorbed into the polarizing mirror 14b, thus making it feasible to prevent damage to the mirror.

(15) During an actual AM fabrication operation, a first layer of powdered material may be acted on by the system by pulsing the diode array 12 to melt selected portions (or possibly the entire portion) of the first layer. A subsequent (i.e., second) layer of powdered material may then be added over the layer just acted on by the system 10 and the process would be repeated. The diode array 12 may be pulsed to melt one or more selected subportions (or possibly the entirety) of the second layer of material. With each layer the system 10 electronically controls the pixels of the mask 14 to selectively block specific, predetermined portions of the substrate 20 from being irradiated by the pulsed optical signal from the diode array 12. This process is repeated for each layer, with the computer 18 controlling the mask 14 so that, for each layer, one or more selected subportions (or possibly the entirety) of the powdered material is blocked by the mask 14 from being exposed to the pulsed optical signal. Preferably, an entire two dimensional area of each layer is melted or sintered at once by pulsing the diode array 12. However, it is just as feasible to raster scan the diode array 12 over the two dimensional area in the event the entire two dimensional area cannot be completely irradiated by the diode array.

(16) An alternative to the addressable mask 14 is a non-addressable mask. A non-addressable mask may be a precision cut piece of metal (e.g., tungsten) that would simply block portions of the light beam. While such a machined mask can be used to build simple geometries, the full potential of the system 10 described herein will be maximized if an addressable mask such as mask 14 is used.

(17) Referring to FIGS. 5 and 6, two alternative systems 100 and 200 in accordance with additional implementations of the present disclosure are shown. System 100 includes a diode array 102 and a diode relay telescope 104. The diode relay telescope 104 is used to provide digital control over tiles within an array image to the pixels in the substrate 20 (powder bed). FIG. 6 illustrates a system 200 having a diode array 202 and a plurality of focusing lenses 206 that are used to focus the optical energy from the array onto a corresponding plurality of sheets representing the substrate 20.

(18) The systems 10, 100 and 200 are able to melt and sinter each layer in a single pass or, put differently, in a single operation by pulsing the diode array 12. The need to raster scan an optical beam dozens, hundreds or more times, back and forth across a surface, is therefore eliminated. This significantly reduces the time required to melt and sinter each layer of powder material during the AM fabrication process.

(19) Referring to FIG. 7, a method of deposition of different material types in powder form is illustrated in system 300. Nozzles 301, 302, and 303 are capable of depositing layers of different material powders 304 onto the substrate 20. The nozzle heads 301, 302 and 303 are rastered across the part surface covering it with material addressed by a programmable source. Both the irradiation from the diode array 12 and operation of the mask 14, as described in connection with the system 10, can be controlled such that each material deposited from the nozzles 301, 302 and 303 receives the correct amount of optical energy for a controlled melt or sintering.

(20) While various embodiments have been described, those skilled in the art will recognize modifications or variations which might be made without departing from the present disclosure. The examples illustrate the various embodiments and are not intended to limit the present disclosure. Therefore, the description and claims should be interpreted liberally with only such limitation as is necessary in view of the pertinent prior art.