LAMP ASSEMBLY WITH THERMAL TRANSPORTER
20230083673 · 2023-03-16
Assignee
Inventors
- Muhammed Aquil Hamid (Canton, MI, US)
- Steven Barman (Canton, MI, US)
- Charles F. Schweitzer (Livonia, MI, US)
- Chirag Hiremath (Detroit, MI, US)
Cpc classification
F21V29/87
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21S43/14
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V5/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21S45/48
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21S45/10
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21S43/19
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21S45/47
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21S43/27
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
F21V29/87
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21S43/14
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21S43/19
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21S43/27
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21S45/10
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21S45/47
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21S45/48
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Abstract
Lamp assembly with thermal transporter. The present disclosure includes disclosure of a lamp assembly, comprising a housing; a cover attached to the housing defining a volume; a light source disposed within the volume; and a thermal transporter in thermal communication with the light source; wherein the thermal transporter comprises a plurality of graphite sheets structured to transfer heat generated by the light source away from the light source.
Claims
1. An assembly, comprising: a light source; and a thermal transporter in communication with the light source, the thermal transporter comprising a plurality of graphene sheets having spaces therebetween, wherein the spaces are relatively smaller at a proximal end of the thermal transporter and are relatively larger at a distal end of the thermal transporter.
2. The assembly of claim 1, further comprising: a cover attached to the housing defining a volume; wherein the thermal transporter is further structured to dissipate the transferred heat to a relatively cool portion of the volume.
3. The lamp assembly of claim 2, wherein the proximal end of the thermal transporter is in thermal contact with the light source and wherein the distal end of the thermal transporter extends into the relatively cool portion of the volume.
4. The lamp assembly of claim 1, wherein the cover comprises a lens configured to allow light from the light source to travel therethrough.
5. The lamp assembly of claim 1, wherein the plurality of graphene sheets exhibit a relatively high thermal conductivity in a plane substantially parallel with the plurality of graphene sheets and a relatively low thermal conductivity in a direction substantially perpendicular with the plane.
6. The lamp assembly of claim 1, wherein the lamp assembly further comprises a circuit board in thermal contact with the thermal transporter, wherein the light source is attached to the circuit board.
7. The lamp assembly of claim 1, configured as an automotive headlamp.
8. The lamp assembly of claim 1, wherein the light source comprises at least one light-emitting diode comprising a die coupled to a slug.
9. The lamp assembly of claim 1, wherein the thermal transporter comprises a body portion and at least one leg portion, the body portion positioned at a proximal end of the thermal transporter and configured for placement at or near the light source so to be in thermal communication with the light source, and the at least one leg portion extending from the body portion to a distal end of the thermal transporter, the distal end located away from the light source.
10. A lamp assembly, comprising: a plurality of graphene sheets having a proximal end, a distal end, and spaces therebetween, and in communication with a light source; wherein the spaces are relatively smaller at the proximal end and are relatively larger at the distal end.
11. The assembly of claim 10, further comprising: a cover attached to the housing defining a volume; and a thermal transporter in thermal communication with the light source; wherein the thermal transporter is further structured to dissipate the transferred heat to a relatively cool portion of the volume.
12. The lamp assembly of claim 11, wherein the proximal end of the thermal transporter is in thermal contact with the light source and wherein the distal end of the thermal transporter extends into the relatively cool portion of the volume.
13. The lamp assembly of claim 10, wherein the cover comprises a lens configured to allow light from the light source to travel therethrough.
14. The lamp assembly of claim 10, wherein the plurality of graphene sheets exhibit a relatively high thermal conductivity in a plane substantially parallel with the plurality of graphene sheets and a relatively low thermal conductivity in a direction substantially perpendicular with the plane.
15. The lamp assembly of claim 10, configured to fit within a housing having a lens attached thereto, the housing configured as a lamp housing.
16. The lamp assembly of claim 10, further comprising intercalation ions positioned in between at least two graphene sheets of the plurality of graphene sheets.
17. An assembly, comprising: a plurality of graphene sheets having spaces therebetween, said spaces being larger at one end than at an opposite second end; wherein when the assembly is positioned relative to a light source, the assembly can transfer heat generated by the light source away from the light source.
18. The assembly of claim 17, further comprising: a cover attached to the housing defining a volume; and a thermal transporter in thermal communication with the light source; wherein the thermal transporter is further structured to dissipate the transferred heat to a relatively cool portion of the volume.
19. The lamp assembly of claim 18, wherein the proximal end of the thermal transporter is in thermal contact with the light source and wherein the distal end of the thermal transporter extends into the relatively cool portion of the volume.
20. The lamp assembly of claim 18, wherein the thermal transporter comprises a body portion and at least one leg portion, the body portion positioned at a proximal end of the thermal transporter and configured for placement at or near the light source so to be in thermal communication with the light source, and the at least one leg portion extending from the body portion to a distal end of the thermal transporter, the distal end located away from the light source.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION
[0051] The present application discloses various embodiments of a lamp assembly including a thermal transporter and methods for using and constructing the same. For the purposes of promoting an understanding of the principles of the present disclosure, reference will now be made to the embodiments illustrated in the drawings, and specific language will be used to describe the same. It will nevertheless be understood that no limitation of the scope of this disclosure is thereby intended.
[0052] Improvements in semiconductor materials and in the packaging of microelectronic devices, such as integrated circuits and light-emitting diodes (“LEDs”), have enabled many new applications for these devices but have also resulted in new technical challenges. For example, the efficacy of LEDs has improved to the point that their use in exterior automotive lighting is technically and economically feasible, including for such high light output functions as headlamps. However, one challenge is the need to dissipate significant quantities of heat generated by these newer LEDs, which have ever-increasing power densities. The performance and longevity of LEDs are particularly sensitive to heat because excessive junction temperatures not only limit the light output of an LED but may also shorten its operating life significantly. Therefore, it is critical that heat generated by the LED be transferred away from the LED at a rate great enough to maintain the interface between the different semiconductor materials comprising the LED (i.e., the junction) within an acceptable operating temperature range.
[0053] For LED usage in an automotive headlamp, the heat dissipation problem is further compounded by the operating environment of an automotive headlamp, which typically combines exposure to high temperatures from the engine compartment, limited packaging volume due to the space constraints at the front end of an automobile, and a fully enclosed package needed to prevent dust and moisture from degrading the performance of the headlamp. Known solutions, such as conventional heat sinks with large fins or active cooling mechanisms, are costly and bulky and are not practical solutions for an LED headlamp application. The use of cooling fans adds mass, volume, and cost to a headlamp and requires additional power consumption, at least partially negating a primary advantage of using LEDs. Likewise, due in part to the enclosed package of a headlamp, conventional heat sinks must be heavy and bulky to effectively cool the LEDs. Accordingly, a need exists for a means of thermal transport for use with LEDs in a vehicle headlamp that reduces mass, volume, and the need for additional power requirements.
[0054]
[0055] In at least one embodiment, the light source 18 may be one or more light-emitting diodes (LEDs) as shown in
[0056] Though the details of construction vary by manufacturer, an LED 15 generally includes a light-emitting diode chip or die 80 mounted to, but electrically isolated from, a thermally conductive substrate sometimes referred to as a slug 82. The thermal capacitance of the slug 82 is not adequate to maintain the junction temperature of the die 80 within a safe operating range, under even normal operating conditions of supply current and ambient temperature, without additional means for transferring heat from the die 80. Consequently, it is advantageous to thermally connect the slug 82 to an external heat sink to improve the potential rate of heat transfer, and thereby cooling, of the LED 15 die 80. As such, thermal transporter 20 embodiments of the present disclosure can be coupled to, or otherwise in thermal communication with, slugs 82 so to dissipate heat generated by LEDs 15.
[0057] The thermal transporter 20 of the present disclosure provides an improved means of heat transfer particularly suited for use in cooling a light source of one or more LEDs 15 within a lamp assembly, such as the light source 18 in the lamp assembly 10. Certain embodiments of the thermal transporter 20 may be useful for transporting heat from the light source 18 where the lamp assembly 10 is an automotive vehicle lamp. Further, the thermal transporter 20 may be useful to cool any heat-generating electronic component, including without limitation microelectronic integrated circuit chips, laser diodes, and the like.
[0058] The thermal transporter 20 may include a proximal end 22 in thermal communication with the light source 18 and a distal end 24 extending from the proximal end 22. As shown in
[0059] In at least one embodiment according to the present disclosure, the thermal transporter 20 may include a plurality of graphite sheets 100, such as shown in
[0060] Because of the layered structure of the graphite sheets 100, the thermal transporter 20 is highly anisotropic, meaning its properties are directionally dependent. For instance, the thermal conductivity of the thermal transporter 20 is significantly greater in a direction parallel to the plane of the graphite sheets 100 than in a direction perpendicular thereto (i.e., between graphite sheets). As shown in
[0061] In certain embodiments, the separation between the graphite sheets 100 of the thermal transporter 20, and thus its anisotropic thermal conductivity, may be enhanced by the insertion of an intercalant ion into the space 110, as shown in
[0062] Referring back to
[0063] The lamp assembly 10 may further include a carrier 26 structured to support at least the proximal end 22 of the thermal transporter 20. The carrier 26 may further support the thermal transporter 20 at a location where the thermal transporter 20 is mounted to the housing 12. In certain embodiments, the carrier 26 may be made of an insulating material to thermal insulate the thermal transporter 20 from the housing 12.
[0064] The lamp assembly 10 may further include a lens holder 14, which may be mounted in relation to the light source 18 to securely position an inner lens 19, such as shown in
[0065]
[0066] The thermal transporter 20 uses conductive heat transfer to draw heat from the light source 18 and to transport that heat from the proximal end 22 to the distal end 24. The thermal transporter 20 further uses convective heat transfer, driven by the buoyance effect of a temperature gradient, to dissipate the transported heat to the internal atmosphere of the volume 11. Though the thermal transport 20 may dissipate heat via convection along its entire length and width, convective heat transfer is greatest in the presence of a greater temperature difference. Accordingly, as the distal end 24 extends into a relatively cool region of the volume 11, the degree of heat dissipation from the thermal transporter to the internal atmosphere may increase.
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[0068] While various embodiments of a lamp assembly including a thermal transporter and methods for using and constructing the same have been described in considerable detail herein, the embodiments are merely offered by way of non-limiting examples of the disclosure described herein. It will therefore be understood that various changes and modifications may be made, and equivalents may be substituted for elements thereof, without departing from the scope of the disclosure. Indeed, this disclosure is not intended to be exhaustive or to limit the scope of the disclosure.
[0069] Further, in describing representative embodiments, the disclosure may have presented a method and/or process as a particular sequence of steps. However, to the extent that the method or process does not rely on the particular order of steps set forth herein, the method or process should not be limited to the particular sequence of steps described. Other sequences of steps may be possible. Therefore, the particular order of the steps disclosed herein should not be construed as limitations of the present disclosure. In addition, disclosure directed to a method and/or process should not be limited to the performance of their steps in the order written. Such sequences may be varied and still remain within the scope of the present disclosure.