IMAGING APPARATUS AND CAMERA SYSTEM
20170310911 ยท 2017-10-26
Inventors
- Masanori Iwasaki (Kanagawa, JP)
- Ken Ozawa (Kanagawa, JP)
- Nobuyuki Matsuzawa (Tokyo, JP)
- Daisuke Hobara (Kanagawa, JP)
- Nozomi Kimura (Kanagawa, JP)
Cpc classification
H04N23/54
ELECTRICITY
H04N25/61
ELECTRICITY
H01L2224/48463
ELECTRICITY
H10F39/806
ELECTRICITY
H01L2924/00
ELECTRICITY
H04N25/62
ELECTRICITY
H10F39/18
ELECTRICITY
H01L2924/00
ELECTRICITY
H04N25/60
ELECTRICITY
International classification
Abstract
An imaging apparatus that forms an image of a light beam transmitted through an imaging lens on an imaging element includes a laminated material that is provided on the imaging element, the light beam being transmitted through the laminated material, the laminated material being provided at a position at which an end portion of an upper surface of the laminated material allows an outermost light beam out of light beams to be transmitted therethrough, the light beams entering a pixel in an outer end portion of the imaging element in an effective pixel area, the position having a width Hopt.
Claims
1. An imaging apparatus, comprising: a lens; a substrate; an imaging sensor on the substrate and including a pixel area configured to receive incident light through the lens; a wiring layer on the imaging sensor and electrically connected to the imaging sensor; a pad portion on the wiring layer and electrically connected to the wiring layer; a wiring electrically connected to the pad portion; and an optical member on the wiring layer and attached to the wiring layer via an adhesive member, wherein a horizontal distance between an outer edge of the pixel area and an outer edge of an upper surface of the optical element is larger than a distance Hopt, wherein Hopt is represented by the following formula:
Hopt=T*(f2*H*Fno)/(2*f*Fno+H), wherein T, f, Fno, and H represent a thickness of the optical element, a focal length of the lens, an F-number of the lens, and an image height of the imaging sensor, respectively, and wherein Hopt is greater than zero.
2. The imaging apparatus according to claim 1, wherein the outer edge of the upper surface of the optical element is between the outer edge of the pixel area and the pad portion in a horizontal direction.
3. The imaging apparatus according to claim 1, wherein an outer edge of the adhesive member is further away from the pixel area than the outer edge of the upper surface of the optical member in the horizontal direction.
4. The imaging apparatus according to claim 1, wherein a first distance between the outer edge of the pixel area and the outer edge of the upper surface of the optical member is larger than a second distance between the outer edge of the upper surface of the optical member and the pad portion in the horizontal direction.
5. The imaging apparatus according to claim 4, wherein a thickness of the optical member is larger than the second distance.
6. The imaging apparatus according to claim 1, wherein the adhesive member covers the pixel area.
7. The imaging apparatus according to claim 1, wherein an outer edge of the adhesive member is between the outer edge of the upper surface of the optical member and the pad portion in the horizontal direction.
8. The imaging apparatus according to claim 1, wherein the pad portion extends through the wiring layer to contact an upper surface of the substrate.
9. The imaging apparatus according to claim 1, wherein the outer edge of the upper surface of the optical element is between the outer edge of the pixel area and the pad portion in a horizontal direction, and wherein an outer edge of the adhesive member is further away from the pixel area than the outer edge of the upper surface of the optical member in the horizontal direction.
10. The imaging apparatus according to claim 9, wherein a first distance between the outer edge of the pixel area and the outer edge of the upper surface of the optical member is larger than a second distance between the outer edge of the upper surface of the optical member and the pad portion in the horizontal direction.
11. A camera system comprising: an imaging apparatus, comprising: a lens; a substrate; an imaging sensor on the substrate and including a pixel area configured to receive incident light through the lens; a wiring layer on the imaging sensor and electrically connected to the imaging sensor; a pad portion on the wiring layer and electrically connected to the wiring layer; a wiring electrically connected to the pad portion; and an optical member on the wiring layer and attached to the wiring layer via an adhesive member, wherein a horizontal distance between an outer edge of the pixel area and an outer edge of an upper surface of the optical element is larger than a distance Hopt, wherein Hopt is represented by the following formula:
Hopt=T*(f2*H*Fno)/(2*f*Fno+H), wherein T, f, Fno, and H represent a thickness of the optical element, a focal length of the lens, an F-number of the lens, and an image height of the imaging sensor, respectively, and wherein Hopt is greater than zero.
12. The imaging apparatus according to claim 11, wherein the outer edge of the upper surface of the optical element is between the outer edge of the pixel area and the pad portion in a horizontal direction.
13. The imaging apparatus according to claim 11, wherein an outer edge of the adhesive member is further away from the pixel area than the outer edge of the upper surface of the optical member in the horizontal direction.
14. The camera system according to claim 11, wherein a first distance between the outer edge of the pixel area and the outer edge of the upper surface of the optical member is larger than a second distance between the outer edge of the upper surface of the optical member and the pad portion in the horizontal direction.
15. The camera system according to claim 14, wherein a thickness of the optical member is larger than the second distance.
16. The camera system according to claim 11, wherein the adhesive member covers the pixel area.
17. The camera system according to claim 11, wherein an outer edge of the adhesive member is between the outer edge of the upper surface of the optical member and the pad portion in the horizontal direction.
18. The camera system according to claim 11, wherein the pad portion extends through the wiring layer to contact an upper surface of the substrate.
19. The camera system according to claim 11, wherein the outer edge of the upper surface of the optical element is between the outer edge of the pixel area and the pad portion in a horizontal direction, and wherein an outer edge of the adhesive member is further away from the pixel area than the outer edge of the upper surface of the optical member in the horizontal direction.
20. The camera system according to claim 19, wherein a first distance between the outer edge of the pixel area and the outer edge of the upper surface of the optical member is larger than a second distance between the outer edge of the upper surface of the optical member and the pad portion in the horizontal direction.
21. An imaging device, comprising: a substrate; an imaging sensor on the substrate and including a pixel area configured to receive incident light through the lens; a wiring layer on the imaging sensor and electrically connected to the imaging sensor; a pad portion on the wiring layer and electrically connected to the wiring layer; an optical member on the wiring layer and attached to the wiring layer via an adhesive member, wherein a horizontal distance between an outer edge of the pixel area and an outer edge of an upper surface of the optical element is larger than a distance Hopt, wherein Hopt is represented by the following formula:
Hopt=T*(f2*H*Fno)/(2*f*Fno+H), and wherein T, f, Fno, and H represent a thickness of the optical element, a focal length of the lens, an F-number of the lens, and an image height of the imaging sensor, respectively, and wherein Hopt is greater than zero.
22. The imaging device according to claim 21, wherein the outer edge of the upper surface of the optical element is between the outer edge of the pixel area and a pad portion on the wiring layer in a horizontal direction.
23. The imaging device according to claim 21, wherein an outer edge of the adhesive member is further away from the pixel area than the outer edge of the upper surface of the optical member in the horizontal direction.
24. The imaging device according to claim 21, wherein a first distance between the outer edge of the pixel area and the outer edge of the upper surface of the optical member is larger than a second distance between the outer edge of the upper surface of the optical member and the pad portion in the horizontal direction.
25. The imaging device according to claim 24, wherein a thickness of the optical member is larger than the second distance.
26. The imaging device according to claim 21, wherein the adhesive member covers the pixel area.
27. The imaging device according to claim 21, wherein an outer edge of the adhesive member is between the outer edge of the upper surface of the optical member and the pad portion in the horizontal direction.
28. The imaging device according to claim 21, wherein the pad portion extends through the wiring layer to contact an upper surface of the substrate.
29. The imaging device according to claim 21, wherein the outer edge of the upper surface of the optical element is between the outer edge of the pixel area and the pad portion in a horizontal direction, and wherein an outer edge of the adhesive member is further away from the pixel area than the outer edge of the upper surface of the optical member in the horizontal direction.
30. The imaging device according to claim 29, wherein a first distance between the outer edge of the pixel area and the outer edge of the upper surface of the optical member is larger than a second distance between the outer edge of the upper surface of the optical member and the pad portion in the horizontal direction.
Description
BRIEF DESCRIPTION OF DRAWINGS
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DETAILED DESCRIPTION OF EMBODIMENTS
[0047] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. It should be noted that the description will be given in the following order.
1. First embodiment (example in which an optically-necessary width is set in a laminated material)
2. Second embodiment (example in which an optically-necessary width is set by providing a reverse-tapered portion, i.e., making the upper side of a laminated material large)
3. Third Embodiment (example in which an optically-necessary width is set by providing a tapered portion, i.e., making the upper side of a laminated material small)
4. Fourth Embodiment (example in which an optically-necessary width and a lithography tolerance are taken into account)
5. Fifth Embodiment (example in which an optically-necessary width, a lithography tolerance, and bonding accuracy are taken into account)
6. Sixth Embodiment (example in which an optically-necessary width, a lithography tolerance, bonding accuracy, and an adhesive layer are taken into account)
7. Seventh Embodiment (example in which an optically-necessary width, a lithography tolerance, bonding accuracy, and an adhesive layer in a laminated body in a reverse-tapered shape are taken into account)
1. First Embodiment
[0048] The top and bottom of
[0049] Incident light that is emitted from above the upper side of
[0050] It should be noted that as shown in the top of
[0051] As shown in the lower portion of
[0052] In the following description, a length (protruding amount) in which the laminated material 101 protrudes from the end portion of the imaging device 102 at the end portion of the laminated material 101 is referred to also as optically-necessary width Hopt, and is described as Hopt as shown in the lower portion of
(Setting of Optically-Necessary Width)
[0053] The optically-necessary width Hopt needs to be set to a length in which the laminated material 101 does not interfere with the pad portion 105 and the entire size of the chip configuration is not too large unnecessarily. More specifically, the optically-necessary width Hopt is set such that an outermost light beam out of light beams that have entered the imaging device 102 from the lens 100, which form an image on the imaging device 102 and enter a pixel that performs photoelectric conversion on light at the outermost periphery of the imaging device 102 in the effective pixel area is transmitted through the end portion of the upper surface of the laminated material (optical filter or the like) 101 that is in contact with the imaging device 102.
[0054] Now, a specific method of setting the optically-necessary width Hopt will be described.
[0055] An F-number Fno of the lens 100 through which incident light that enter the imaging device 102 via the laminated material 101 is transmitted will be described first. The F-number Fno is represented by the following equation (1). Specifically, as shown in the left portion of
[0056] At this time, as shown in the left portion of
[0057] Based on these conditions, the optically-necessary width Hopt is set as shown in the right portion of
[0058] Moreover, when the equation (2) is modified, tan(Fno) is represented by the following equation (4).
[0059] Furthermore, as shown in the right portion of
if .sub.Fno>.sub.fH
tan(.sub.Fno.sub.fH)T=H.sub.opt(5)
[0060] Here, when the equation (3) and the equation (4) are applied to tan(Fno) and tan(fH) in the equation (5), the optically-necessary width Hopt is obtained as shown in the following equation (6).
[0061] As described above, it is possible to set the optically-necessary width Hopt to an appropriate value with the thickness T of the laminated material 101 formed of an optical filter, the focal length f of the lens 100, the F-number Fno, and the image height H.
[0062] Moreover, as shown in the equation (6), the optically-necessary width Hopt takes the maximum value when the focal length f is infinite or in a telecentric optical system, and is set as shown in the following equation (7).
[0063] It should be noted that the optically-necessary width Hopt set by the equations (6) and (7) takes a simplified value in the case where the optical filter of the laminated material 101 has a refractive index of 1.
[0064] In view of the above, by setting a thickness t of the laminated material 101 taking into account of a refractive index instead of the thickness T of the laminated material 101 with no consideration of a refractive index, it is possible to set the optically-necessary width Hopt to a value taking into account a refractive index as shown in the following equation (8).
[0065] Here, t represents a thickness at which incident light arrives in the laminated material 101 with no consideration of a refractive index at the same incident position as that of the thickness t taking into account a refractive index, and represents a thickness in the same position in the horizontal direction when the incident light arrives at a lower surface of the laminated material 101 taking into account a refractive index. More specifically, the thickness t can be described as below.
[0066] Specifically, as shown in
[0067] It should be noted that based on the law of refraction (Snell's law), the following equation (9) is established.
n sin .sub.Fno=n sin .sub.Fno(9)
[0068] Moreover, based on the relationships between the distances p, t, and t and the angles Fno and Fno, the following equations (10) and (11) are established.
P=t tan .sub.Fno(10)
P=t tan .sub.Fno(11)
[0069] Furthermore, based on the relationship between the equation (10) and the equation (11), the following equation (12) is established.
t tan .sub.Fnot tan .sub.Fno(12)
[0070] Here, the equation (9) is modified to obtain x represented by the following equation (13). In this case, tan (Fno) is represented by the following equation (14).
[0071] Moreover, the equation (9) is modified to obtain y represented by the following equation (15). In this case, tan (Fno) is represented by the following equation (16).
[0072] When the equation (14) and the equation (16) are applied to the equation (12), the following equation (17) is established.
[0073] It should be noted that the left side can be modified to the following equation (18).
[0074] Furthermore, when the modified left side represented by the equation (18) is applied to the equation (17), the following equation (19) is established.
[0075] It should be noted that when the equation (1) is solved for a coefficient t, the following equation (20) is established.
[0076] Here, the refractive index n in upper space of the laminated material 101 is assumed to be 1. The coefficient t is represented by the following equation (21).
[0077] As described above, in the case where a refractive index is taken into account, it is possible to set the optically-necessary width Hopt to an appropriate value with the refractive index n in upper space of the laminated material 101 and the refractive index n in space in the laminated material 101 in addition to the thickness t of the laminated material 101, the focal length f of the lens 100, the F-number Fno, and the image height H.
[0078] By setting the optically-necessary width Hopt as described above, as shown in the lower portion of
2. Second Embodiment
[0079] Incidentally, if the optically-necessary width Hopt is set such that the light beams L1, L2, and L3 are transmitted through the laminated material 101 from the upper surface to the lower surface thereof as shown in
[0080] However, as shown in
[0081] In view of the above, as shown in
3. Third Embodiment
[0082] Moreover, based on the similar reason, the width of the lower surface may be larger than the optically-necessary width Hopt as long as the optically-necessary width Hopt is set for the upper surface of the laminated material 101. Therefore, as shown in
[0083] It should be noted that when the laminated material 101 is produced, after the laminated material 101 is applied to the imaging device 102 of a silicon wafer by spin-coating or the like and is cured, there is a need to remove the laminated material 101 in the case where it is necessary to provide an opening or the like for the pad portion 105 for energization on the imaging device 102. As shown in
4. Fourth Embodiment
[0084] In the above description, the example in which the optically-necessary width Hopt is set for the upper surface of the laminated material 101 has been described. However, for example, for the position at which the laminated material 101 is set, a lithography (including etching) tolerance may be taken into account. Specifically, as shown in
5. Fifth Embodiment
[0085] Moreover, in the case where the laminated material 101 is placed on the substrate 103 by being bonded thereto, a bonding accuracy Hmount may be further added as shown in
6. Sixth Embodiment
[0086] Furthermore, in the case where the laminated material 101 is bonded to the imaging device 102 via an adhesive layer 151, as shown in
7. Seventh Embodiment
[0087] Moreover, even in the case where the shape of the side surface cross-section of the laminated material 101 is an inverted trapezoidal shape, as shown in
(F-Number and Optically-Necessary Width (Protruding Amount))
[0088] Incidentally, the incidence angle of a principal light beam from the lens 100 to an imaging surface generally is increased as the image height H is high. In the case where the incidence angle is larger than that of the light beams shown in
[0089] It should be noted that the left portion of
[0090] The right portion of
[0091] As shown in the graph of the right portion of
[0092] Moreover, in the case of the telecentric lens, the incidence angle of principal light beam is 0 degree (perpendicular) regardless of the focal length and the optically-necessary width Hopt is the largest. In this case, the above-mentioned equation (7) is used to calculate the optically-necessary width Hopt.
(Influence of Tapered Shape)
[0093] As shown in
[0094] It should be noted that when a light beam that has entered the upper surface of the laminated material 101 having a tapered shape or a reverse-tapered shape enters the side wall (e.g., position indicated by a point shown in the left portion of
[0095]
(Conditions where Light is not Totally Reflected)
[0096] Next, with reference to
[0097] Here, based on the Snell's law, the following equation (22) is established from the relationship of
n sin .sub.An sin .sub.B(22)
[0098] Moreover, from
[0099] The conditions where light is totally reflected on the inclining portion of the side wall W are represented by the following equation (26) based on the Snell's law.
n sin .sub.c>1(26)
[0100] Here, when the equation (25) is applied to the equation (26), the following equation (27) is satisfied.
n sin(.sub.E.sub.B)>1(27)
[0101] Furthermore, the equation (27) is developed to the following equation (28) including the incidence angle A and the angle E between the upper surface of the laminated material 101 and the side wall W using sum-to-product identities of trigonometric functions or the like.
[0102] The equation (28) is conditions of total reflection. Therefore, the following equation (29) obtained by reversing the inequality sign of the equation (28) is conditions where light is not totally reflected.
[0103] Here, the inclined angle tilt of the side wall can be represented by the angle E between the upper surface of the laminated material 101 and the side wall W, which is represented by the following equation (30).
.sub.tilt=90.sub.E(30)
[0104] Therefore, when the equation (29) and the equation (30) are satisfied, it is possible to cause light not to be totally reflected. Therefore, in
[0105] Accordingly, when the relationship between the inclined angle of the side wall W of the laminated material 101 and the incidence angle satisfies the equation (29) and the equation (30), it is possible to reduce noise light such as flare and ghost.
[0106] As described above, according to the present disclosure, because light beams that have entered the imaging element of the image sensor can be transmitted through the laminated material (optical filter or the like), it is possible to sufficiently exert the desired performance of the laminated material (optical filter). In addition, by making the laminated material in a shape that satisfies the conditions where light is not totally reflected, it is possible to reduce the influence due to noise light such as flare and ghost.
[0107] It should be noted that embodiments of the present disclosure are not limited to the above-mentioned embodiments and various modifications can be made without departing from the gist of the present disclosure.
[0108] Moreover, the present disclosure may also take the following configurations.
(1) An imaging apparatus that forms an image of a light beam transmitted through an imaging lens on an imaging element, including
[0109] a laminated material that is provided on the imaging element, the light beam being transmitted through the laminated material, the laminated material being provided at a position at which an end portion of an upper surface of the laminated material allows an outermost light beam out of light beams to be transmitted therethrough, the light beams entering a pixel in an outer end portion of the imaging element in an effective pixel area, the position having a width Hopt.
(2) The imaging apparatus according to (1), in which
[0110] the width Hopt of the laminated material that allows the outermost light beam to be transmitted therethrough is represented based on a thickness of the laminated material, a focal length of a lens, an F-number of the lens, and an image height of an image sensor, by the following formula:
Hopt=T*(f2*H*Fno)/(2*f*Fno+H)
[0111] in which T, f, Fno, and H represent the thickness of the laminated material, the focal length of the lens, the F-number of the lens, and the image height of the image sensor, respectively.
(3) The imaging apparatus according to (2), in which
[0112] based on, in addition to the thickness of the laminated material, the focal length of the lens, the F-number of the lens, and the image height of the image sensor, a refractive index in an area adjacent to an upper side of the laminated material, a refractive index of the laminated material, and a one side angle of incident light beams, the width Hopt is represented by the following formula:
Hopt=T*/{(n2n*n sin(Fno))/(n2n*n sin(Fno))}*(f2*H*Fno)/(2*f*Fno+H)
[0113] in which n, n, and Fno represent a refractive index in an area adjacent to an upper side of the laminated material, a refractive index of the laminated material, and a one side angle of incident light beams having an F-number of Fno.
(4) The imaging apparatus according to (3), in which
[0114] the laminated material has a side wall inclined angle tilt, and the side wall inclined angle tilt satisfies the following formula:
n*sin(E)(2*n)/n*sin 2(A)n*sin(A)*sin(E)<1
[0115] wherein A and E represent an incident angle on the laminated material and 90-tilt, respectively.
(5) The imaging apparatus according to (1), in which
[0116] a position of an end portion of a lower surface of the laminated material is located on a side of the effective pixel area nearer than a position of the end portion of the upper surface thereof.
(6) The imaging apparatus according to (2), in which
[0117] the upper surface of the laminated material has a width larger than one of a width obtained by adding the effective pixel area, the width Hopt, and a lithography tolerance and a width obtained by adding the effective pixel area, the width Hopt, the lithography tolerance, and bonding accuracy of the laminated material.
(7) The imaging apparatus according to (6), in which
[0118] the laminated material is in contact with the imaging element via an adhesive layer having a width larger than one of the width obtained by adding the effective pixel area, the lithography tolerance, and the bonding accuracy of the laminated material and a width of a lower surface of the laminated material, whichever is larger.
(8) The imaging apparatus according to (1), in which
[0119] the laminated material is an optical filter.
(9) A camera system including
[0120] an imaging apparatus that forms an image of a light beam transmitted through an imaging lens on an imaging element, the imaging apparatus including [0121] a laminated material that is provided on the imaging element, the light beam being transmitted through the laminated material, the laminated material being provided at a position at which an end portion of an upper surface of the laminated material allows an outermost light beam out of light beams to be transmitted therethrough, the light beams entering a pixel in an outer end portion of the imaging element in an effective pixel area, the position having a width Hopt.
(10) The camera system according to (9), in which
[0122] the width Hopt of the laminated material that allows the outermost light beam to be transmitted therethrough is represented based on a thickness of the laminated material, a focal length of a lens, an F-number of the lens, and an image height of an image sensor, by the following formula:
Hopt=T*(f2*H*Fno)/(2*f*Fno+H)
[0123] in which T, f, Fno, and H represent the thickness of the laminated material, the focal length of the lens, the F-number of the lens, and the image height of the image sensor, respectively.
(11) The camera system according to (9), in which
[0124] a position of an end portion of a lower surface of the laminated material is located on a side of the effective pixel area nearer than a position of the end portion of the upper surface thereof.
(12) The camera system according to (9), in which
[0125] the laminated material is an optical filter.
[0126] It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and alterations may occur depending on design requirements and other factors insofar as they are within the scope of the appended claims or the equivalents thereof.