PERMEABLE ELEMENT

Abstract

The invention relates to an element in the shape of a sensor, an active electronic component, a switch, a circuit, or an electric conducting path for integration into a surrounding medium. The element is penetrable by the surrounding medium and has a porous, non-conductive substrate and at least one circuit trace made of conductive material present on the substrate. The openings of the substrate are open in an area of the circuit trace. The use and manufacture of the element are also provided.

Claims

1-20. (canceled)

21. An element comprising: a porous, non-conductive substrate; and at least one circuit trace made of conductive material and present on the substrate; wherein the element is one of a sensor, an active electronic component, a switch, a circuit, and an electric conducting path for integration into a surrounding medium; wherein the element is penetrable by the surrounding medium; and wherein openings of the substrate are open in an area of the circuit trace.

22. The element of claim 21, wherein: the conductive material of the circuit trace encloses a material of the substrate; the material being present between said openings of the substrate in the area of the circuit trace; and the material of the circuit trace is present on both sides of the substrate.

23. The element of claim 21, wherein one of: the circuit trace is present in a meandering pattern; and at least two circuit traces are present with meshing comb structures.

24. The element of claim 21, wherein: the substrate has a porous structure in a shape of fibers; and the fibers are enclosed by the conductive material of the circuit trace.

25. The element claim 21, wherein the substrate has a porous structure and the conductive material is present in a coat thickness of at most 30% of an average pore size of the substrate on the porous structure of the substrate.

26. The element of claim 21, wherein the substrate is a cellulose fiber mat consisting of loose cellulosic fibers.

27. The element of claim 21, wherein the material of the circuit trace is a vapor-deposited metal.

28. The element of claim 21, wherein the porosity of the substrate is at least 10%.

29. A method of manufacturing at least one circuit trace on a permeable substrate, comprising: in a first step, planarly applying a conductive material to the permeable substrate, the substrate continuing to be permeable in an area of the conductive material; and in a second step, removing the planarly applied conductive material without destroying the substrate to form at least one circuit trace out of the conductive material.

30. The method of claim 29, wherein the conductive material is applied, in the first step, in one of a gaseous state and as a plasma.

31. The method of claim 29, wherein the conductive material is removed by a laser beam in the second step.

32. The method of claim 31, wherein the laser beam is directed to the substrate from one side and the conductive material is thereby removed on both sides of the substrate.

33. The method of claim 29, wherein: the method is used to produce an element, the element being one of a sensor, an active electronic component, a switch, a circuit, and an electric conducting path for integration into a surrounding medium; the element is penetrable by the surrounding medium and has a porous, non-conductive substrate and at least one circuit trace made of conductive material present on the substrate; and openings of the substrate are open in the area of the conductive material.

34. A method comprising: arranging an element in a surrounding medium, the element being in a form of one of a sensor, an active electronic component, a switch, a circuit, and an electric conducting path; wherein the element is penetrable by the surrounding medium and has a porous, non-conductive substrate and at least one circuit trace made of conductive material present on the substrate; wherein openings of the substrate are open in an area of the circuit trace; and wherein the element is penetrated by the surrounding medium during one of manufacture and use.

35. The method claim 34, wherein: the surrounding medium is a curing medium, the curing medium being present in one of a flowable and pulpy form during one of manufacture and use; and the element is enclosed in the surrounding medium by a curing process.

36. The method claim 34, wherein: the element is inserted in one of an adhesive joint and a glue joint of components; and the surrounding medium is one of an adhesive and a glue.

37. The method claim 34, wherein the element is present at one of the following: beneath a veneer layer; beneath a layer of one of a plywood board or a multiplex board; and in a material of one of a particle board and a fiber-reinforced plastic.

38. The method claim 34, wherein: the element is integrated in the surrounding medium applied to a surface; the element has been one of: previously placed on the surface; and placed in the surrounding medium one of during and after applying the surrounding medium; and the surrounding medium cures on the surface.

39. The method claim 38, wherein the surrounding medium is selected from one of the following: coating applied as a liquid; paint; lacquer; concrete; screed; plaster; and mortar.

40. The method claim 34, wherein the element is used to perform at least one of the following: delivering measurement values on a curing process of the surrounding medium; influencing the curing process of the surrounding medium; detecting or measuring changes in the surrounding medium after the curing process of the surrounding medium; detecting or measuring changes on, or in the vicinity of, a surface of the surrounding medium after the curing process of the surrounding medium; directing an electric flow to a surface of the surrounding medium or to an electronic component enclosed in the surrounding medium; and directing an electric flow beneath the surface of the cured surrounding medium.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0088] The invention is illustrated based on drawings:

[0089] FIG. 1: illustrates schematically a particularly preferred method of manufacturing a permeable element.

[0090] FIG. 2: illustrates schematically the setup of a first embodiment of a permeable element according to the invention.

[0091] FIG. 3: illustrates schematically the setup of a second embodiment of a permeable element according to the invention.

[0092] FIG. 4: illustrates schematically the setup of a third embodiment of a permeable element according to the invention.

[0093] FIG. 5: illustrates schematically the setup of a fourth embodiment of a permeable element according to the invention.

[0094] FIG. 6: illustrates a first preferred use of an element according to the invention.

[0095] FIG. 7: illustrates a second preferred use of an element according to the invention.

DETAILED DESCRIPTION

[0096] The embodiments shown in the Figures merely show potential embodiments, that is to say the invention is not limited to those specifically shown embodiments thereof, but that combinations of individual embodiments among one another and a combination of an embodiment with the overall description provided above are also possible. These further potential combinations do not require explicit mentioning, since these further potential combinations are within the skill of those in the art based on the technical information given by the present invention.

[0097] FIG. 1 shows a preferred method for manufacturing at least one circuit trace 1 on a permeable substrate 2 by applying a conductive material 3.

[0098] The starting material is a permeable substrate 2.

[0099] In the first step, the permeable substrate 2 is planarly provided with conductive material 3 in a device 4 for applying the conductive material 3. As shown, a sheet or strip of the permeable substrate 2 can be inserted into the device 4 and first be provided from one side with the conductive material 3, whereupon the substrate 2 is turned and provided with the conductive material 3 from the other side. This is preferably done be exposing the substrate 2 to a vapor 5 or plasma, so that a conductive layer is deposited around the structure of the permeable substrate 2.

[0100] In the second step, the conductive material 3 is removed from the substrate 2 to form one or more circuit traces 1. This is preferably done by guiding a laser beam 6 over the substrate 2 and subliming the conductive material 3. Removal of the conductive material 3 is preferably done by laser irradiation from one side.

[0101] The element manufactured according to this method has a permeable substrate 2, on which at least one circuit trace 1 is present. The circuit trace 1 as such is also permeable. The conductive material 3 of the circuit trace 1 encloses or sheathes the structure of the substrate 2.

[0102] FIG. 2 illustrates an element according to the invention, which can be employed, among other things, as a temperature sensor. A single circuit trace 1 is arranged in a meandering pattern on the permeable substrate 2. This allows increasing the lengths of the circuit trace 1 when little planar space is required. Measuring the resistance, or change in resistance, of the circuit trace 1 allows to derive changes in the surrounding medium of the sensors. To do so, voltage may be applied between the two ends of the circuit trace 1 and the resulting electric flow may be measured.

[0103] The substrate 2 of FIG. 2 is a non-woven fabric formed out of fibers 7. The fibers 7 may be laid out loosely or be spun or melted. In the area of the circuit trace 1, the fibers 7 are present with a sheath 8 out of conductive material 3. Openings 9 directly connecting the two planar sides of the element are present between the fibers 7 in the area of the exposed substrate 2 and in the area of the circuit trace 1 as well as in the border area between them. Preferably, the openings 9 are large enough for a surface present under the element to remain visible through the same. Preferably, the openings 9 are macroscopically visible. Preferably, the substrate 2 is more permeable and/or has larger pores than printing paper or post-it notes. Preferably, the individual fibers 7 of the substrate 2 are macroscopically visible. Preferably, the individual fibers 7 coated with metallic material are macroscopically visible in the area of the circuit trace 1.

[0104] The substrate 2 is preferably uncoated or unsized.

[0105] FIG. 3 illustrates an element according to the invention, where two circuit traces 1 separated from one another are attached to the substrate 2 in the shape of a first electrode 10 and a second electrode 11. Apart from the arrangement and number of the circuit traces 1, this element is equal to that of FIG. 2. The two electrodes 10, 11, for example, are each comb-shaped and interlaced. When the element according to the invention of FIG. 3 is inserted, or enclosed, in a surrounding medium, the openings 9 in the area of the uncoated substrate 2 and in the area of the circuit traces 1 are penetrated by the surrounding medium. The surrounding medium thus fills the openings 9 in the planar area of the substrate 2 between the electrodes 10, 11. A change in the surrounding medium between the electrodes 10, 11 can be measured by applying voltage between the electrodes 10 and 11 and measuring the resulting electric flow. This setup is suitable in particular for measuring curing processes in the surrounding medium.

[0106] FIG. 4 illustrates schematically the general setup of a preferred element according to the invention. The element has a thin layer of non-conductive substrate 2, which has openings or was provided with such prior to applying the circuit trace 1. The circuit trace 1 extends congruently as one path each over either of the two planar sides of the thin layer, with the two paths being connected in a conductive manner through the openings 9. As shown, openings 9 present entirely in the area of the circuit trace 1 are entirely surrounded by conductive material 3. Webs, fibers 7 or other structural elements of the substrate 2, which are present entirely in the area of the circuit trace 1, are entirely sheathed by conductive material 3, as illustrated in the sectional view of FIG. 4. The circuit trace 1 is thus not present on one side of the surface of the substrate 2 but encloses the structure of the substrate 2 through its openings 9. The circuit trace 1 encloses the permeable structure of the substrate 2 present in its area over the entire length of the circuit trace 1.

[0107] Preferably, the two paths of the circuit trace 1 are present in uniform manifestations on the opposite faces of the substrate 2, each continuously from the beginning to the end of the circuit trace 1.

[0108] Even though FIG. 4 is merely a schematic representation, the substrate 2 of the present invention can be present in this or a similar shape. What would be suitable therefore is a non-conductive foil or sheet material 12 that is in itself impermeable but has been provided with openings 9, for example in the shape of electric, laser, or mechanical perforations before the material was provided with the circuit trace 1.

[0109] FIG. 5 illustrates the present invention with a woven fabric 13 as the substrate 2. The structural elements of the woven fabric 13 are sheathed by the conductive material 3 in the area of the circuit trace 1 such that the two congruent paths of the circuit trace 1 at the two faces of the woven fabric 13 are connected through the openings 9 between the structural elements in the area of the circuit trace 1. The structural elements may be fibers 7 or threads.

[0110] FIG. 6 illustrates a preferred use of an element according to the invention as a joint sensor 14. The sensor is placed in an adhesion or gluing face in the adhesive 16, in particular glue, between two components 17, 17, so that it is penetrated by the adhesive 16. The adhesive 16 thus penetrates the openings 9 in the substrate 2, in particular also in the area of the circuit trace 1.

[0111] FIG. 7 illustrates a preferred use of an element according to the invention as an enclosure sensor 18. The sensor is employed in a curing mass 20, so that it is enclosed in the same as it cures. The curing mass 20 is typically applied to a surface 19. The curing mass 20 can adhere to the surface 19, for example as a coating. However, the surface 19 can also be a mold or casing, so that surface 19 and the cured mass 20 can be separated from one another. The sensor, or enclosure sensor 18, can either be supported on or attached (for example glued) to the surface 19 prior to applying or introducing the mass 20 or be inserted into the mass 20 at a distance from the surface 19. In embodiments, the face of the sensor is oriented to be parallel to the surface 19 and/or parallel to a surface of the curing mass 20. The mass, or at least parts of the mass 20, penetrate the openings in the surface 2, in particular also in the area of the circuit trace 1.

[0112] In the examples of FIGS. 6 and 7, the sensors 14, 18 have contact leads 15, which protrude outside from the components 17 or the mass 20 to be contactable or readable from the outside. In another embodiment, at least part of a circuit trace 1 is a planar coil or RFID antenna to be able to transfer energy through a component 17 or the mass 20 in a contactless manner Alternatively, a conventional coil or a conventional RFID antenna, which is connected to the sensor 14, 18 in an electrically conductive manner, may be additionally provided in the mass 20 or in or between the components 17.

[0113] The element according to the invention may find use not only as a sensor but also as an active component.

[0114] The element according to the invention may, for example, be used to deliver thermal energy to the adhesive 16 or the mass 20. To do so, the element according to the invention has at least one circuit trace 1. When applying voltage, the circuit trace 1 warms up due to the electric flow. Curing of the adhesive 16 or the mass 20 is faster at higher temperatures.

[0115] Should adhesives 16 or masses 20 exist or be discovered in which the curing is initiated by electrocution or applying voltage the element according to the invention could also be used to make an adhesive 16 or mass 20 cure from the inside. In a similar manner, the element may be inserted into a combustible or explosive to make it combust or explode, respectively, from the inside due to heat development or applying voltage.

[0116] However, the element according to the invention can also be used to provide circuit traces for other electric components. In an embodiment, light-emitting materials or components such as light-emitting diodes or light-sensitive materials or components such as photosensors may be applied or attached to the element according to the invention, for example to create illumination behind a surface or veneer layer or to detect light through a surface or veneer layer.

[0117] In an embodiment, the circuit traces 1 are present on the element according to the invention as circuit traces of an electronic circuit, with the electric components being able to be present directly on the permeable substrate 2, so that they can be inserted, in particular enclosed, in a surrounding medium together. In an embodiment, the element according to the invention with the circuit traces 1 thereon is present behind the surface of a mass 20 or component 17, for example a veneer or cover layer, with holes being shaped, in particular drilled, in the surface, so that the circuit traces 1 are contactable from the outside. This allows electric components to be attached to the surface and interconnected behind the surface through the circuit traces 1.

[0118] As can be seen from FIGS. 1-7, the circuit traces 1 run in plane of the permeable substrate 2. The electric flow from a first interface on a circuit trace 1 to a second interface on a circuit trace 1 is in the direction of the plane of the permeable substrate 2. In other words, the at least one circuit trace 1 or several circuit traces 1 and the electric flow run parallel to the two largest faces of the substrate 2 opposite one another. The electric flow between two interfaces at least in portions or at least mainly runs along at least one circuit trace 1, while, preferably, circuit trace 1 does not run the shortest way between the interfaces. Preferably, two interfaces are spaced apart on the largest face of the substrate 2, with the way of the electric flow between the interfaces being longer than the distance between them.

[0119] This distinguishes the present element from the prior art, where interfaces are present on the two largest faces of the substrate 2 opposite one another, resulting in a vertical electric flow through the plane of the substrate 2 (taking the shortest way between the interfaces or electrodes).