COLOR TUNABLE THIN FILM PHOTOVOLTAIC DEVICES
20170278994 ยท 2017-09-28
Inventors
Cpc classification
H10F77/315
ELECTRICITY
H10F10/167
ELECTRICITY
H10F77/00
ELECTRICITY
Y02E10/541
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H10F10/16
ELECTRICITY
Y02E10/52
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H10F77/126
ELECTRICITY
H10F77/45
ELECTRICITY
International classification
Abstract
A method of fabricating a color tunable thin film photovoltaic device includes depositing a layer of a semiconducting compound configured to exhibit a photovoltaic effect, and depositing a buffer layer over the layer of the semiconducting compound. Depositing transparent conducting oxides (TCO) over the buffer layer is followed by selecting two or more layers of optically transparent materials such that constructive interference among wavelengths reflected by the buffer layer, the TCO, and the two or more layers results in a desired exhibited color and depositing the two or more layers of the optically transparent materials above the TCO.
Claims
1. A method of fabricating a color tunable thin film photovoltaic device, the method comprising: depositing a layer of a semiconducting compound configured to exhibit a photovoltaic effect; depositing a buffer layer over the layer of the semiconducting compound; depositing transparent conducting oxides (TCO) over the buffer layer; selecting two or more layers of optically transparent materials such that constructive interference among wavelengths reflected by the buffer layer, the TCO, and the two or more layers results in a desired exhibited color; and depositing the two or more layers of the optically transparent materials above the TCO.
2. The method according to claim 1, wherein the depositing the two or more layers of the optically transparent materials includes selecting a thickness of each of the two or more layers to control the exhibited color.
3. The method according to claim 1, wherein the depositing the two or more layers of the optically transparent materials includes depositing a first set of the two or more layers arranged in a first stacked configuration adjacent to a second set of the two or more layers arranged in a second stacked configuration, the exhibited color of the first set of the two or more layers being different than the exhibited color of the second set of the two or more layers.
4. The method according to claim 3, wherein the depositing the first set of the two or more layers and the depositing the second set of the two or more layers includes selecting a different thickness for the first stacked configuration than the second stacked configuration, the different thickness affecting a texture of the photovoltaic device.
5. The method according to claim 1, further comprising forming metal lines over the TCO configured to carry current generated by the semiconducting compound.
6. The method according to claim 5, wherein the semiconducting compound comprises one of copper-zinc-tin- sulfide (CZTS), copper-zinc-tin-selenium (CZTSe), selenium (Se), copper-zinc-tin-sulfur-selenium (Cu.sub.2ZnSn(S.sub.xSe.sub.1-x).sub.4), silver-copper-zinc-tin-selenium AgCZTSe, and silver-zinc-tin-selenium AgZT Se.
7. The method according to claim 1, further comprising depositing a molybdenum layer over soda-lime glass, wherein the depositing the layer of the semiconducting compound is on the molybdenum layer.
8. The method according to claim 6, wherein the depositing the molybdenum layer includes controlling a thickness to 700 nanometers.
9. The method according to claim 1, wherein the depositing the TCO includes depositing two oxide layers.
10. The method according to claim 1, wherein the depositing the two or more layers includes depositing magnesium fluoride (MgF.sub.2), silicon dioxide (SiO.sub.2), cerium fluoride (CeF.sub.3), yttrium fluoride (YF.sub.3), or thorium tetrafluoride (ThF.sub.4) as one of the two or more layers and depositing aluminum oxide (Al.sub.2O.sub.3) or yttrium oxide (Y.sub.2O.sub.3) as another of the two or more layers.
11-20. (canceled)
21. The method according to claim 9, wherein the depositing the two oxide layers includes depositing zinc oxide as one of the two oxide layers.
22. The method according to claim 21, wherein the depositing the two oxide layers includes depositing indium tin oxide as another of the two oxide layers.
23. The method according to claim 5, wherein the forming the metal lines includes forming lines comprised of aluminum.
24. The method according to claim 5, wherein the forming the metal lines includes forming lines comprised of nickel aluminum.
25. The method according to claim 1, wherein the depositing the buffer layer includes depositing a p-type material.
26. The method according to claim 25, wherein the depositing the p-type material includes depositing copper oxide (Cu2O) or zinc telluride (ZnTe).
27. The method according to claim 25, wherein the depositing the layer of the semiconducting compound includes depositing a layer of n-type material.
28. The method according to claim 1, wherein the depositing the buffer layer includes depositing an n-type material.
29. The method according to claim 28, wherein the depositing the p-type material includes depositing cadmium sulfide (CdS).
30. The method according to claim 28, wherein the depositing the layer of the semiconducting compound includes depositing a layer of p-type material.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] The subject matter which is regarded as the invention is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification. The forgoing and other features, and advantages of the invention are apparent from the following detailed description taken in conjunction with the accompanying drawings in which:
[0006]
[0007]
[0008]
[0009]
[0010]
[0011]
[0012]
DETAILED DESCRIPTION
[0013] Various embodiments of the present disclosure are described herein with reference to the related drawings. Alternative embodiments may be devised without departing from the scope of this disclosure. It is noted that various connections and positional relationships (e.g., over, below, adjacent, etc.) are set forth between elements in the following description and in the drawings. These connections and/or positional relationships, unless specified otherwise, may be direct or indirect, and the present disclosure is not intended to be limiting in this respect. Accordingly, a coupling of entities may refer to either a direct or an indirect coupling, and a positional relationship between entities may be a direct or indirect positional relationship. As an example of an indirect positional relationship, references in the present disclosure to forming layer A over layer B include situations in which one or more intermediate layers (e.g., layer C) is between layer A and layer B as long as the relevant characteristics and functionalities of layer A and layer B are not substantially changed by the intermediate layer(s).
[0014] The following definitions and abbreviations are to be used for the interpretation of the claims and the specification. As used herein, the terms comprises, comprising, includes, including, has, having, contains or containing, or any other variation thereof, are intended to cover a non-exclusive inclusion. For example, a composition, a mixture, process, method, article, or apparatus that comprises a list of elements is not necessarily limited to only those elements but can include other elements not expressly listed or inherent to such composition, mixture, process, method, article, or apparatus.
[0015] Additionally, the term exemplary is used herein to mean serving as an example, instance or illustration. Any embodiment or design described herein as exemplary is not necessarily to be construed as preferred or advantageous over other embodiments or designs. The terms at least one and one or more may be understood to include any integer number greater than or equal to one, i.e. one, two, three, four, etc. The terms a plurality may be understood to include any integer number greater than or equal to two, i.e. two, three, four, five, etc. The term connection may include both an indirect connection and a direct connection.
[0016] For the sake of brevity, conventional techniques related to semiconductor device and IC fabrication may not be described in detail herein. Moreover, the various tasks and process steps described herein may be incorporated into a more comprehensive procedure or process having additional steps or functionality not described in detail herein. In particular, various steps in the manufacture of semiconductor devices and semiconductor-based ICs are well known and so, in the interest of brevity, many conventional steps will only be mentioned briefly herein or will be omitted entirely without providing the well-known process details.
[0017] As previously noted herein, photovoltaic devices are increasingly used as an alternate means of on-site power generation. Thin film photovoltaic devices may be installed outside or within structures to generate power directly from light. These photovoltaic devices must be exposed in order to easily receive the light needed to generate electricity. Yet, the exposure of the photovoltaic devices makes them conspicuous and may detract from the architectural or aesthetic features on the exterior or interior of a building. The concerns about appearance may reduce the appeal of photovoltaic devices as power generation alternatives.
[0018] A known approach to reducing the negative aesthetic or architectural impact of photovoltaic devices involves fabricating the photovoltaic films with a sufficiently small thickness so that the appearance of the underlying structure (e.g., wall, tile) is visible. However, this approach may present several issues. The color of the underlying structure may be skewed to a red shade because of the wavelengths that are able to penetrate the farthest in typical photovoltaic absorber materials with a 1 to 1.5 electron-volt (eV) band gap. The band gap indicates the energy difference between the top of the valence band and the bottom of the conduction band or an energy range in which no electron states can exist. In addition, decreased efficiency may result from partial absorption of the incident light or shunting (low resistance across the device), which is common in ultrathin photovoltaic devices.
[0019] Another known approach to reducing the negative aesthetic or architectural impact of photovoltaic devices involves locating the photovoltaic devices in a pattern that leaves open areas through which significant portions of the building structure remain visible. However, with fewer photovoltaic devices that can receive the available light, efficiency drops.
[0020] Turning now to an overview of the present disclosure, one or more embodiments provide fabrication methodologies and resulting structures for tuning the color of a thin-film photovoltaic device. More specifically, one or more embodiments of the systems and methods detailed herein control the color and/or two-dimensional characteristics exhibited by photovoltaic devices so that they blend in with or enhance the decorative aspects of the underlying structure on which they are arranged. According to one or more embodiments, the color and/or decorative properties of a photovoltaic device are controlled by controlling the top transparent layers that may be used as anti-reflection (AR) coatings in a photovoltaic device. When the top transparent layers act as AR coatings, the thicknesses of the full stack of dielectrics including the buffer and absorber below the transparent layers are optimized to minimize reflection of light that is incident on the device. The transparent layers are composed of alternating layers of MgF.sub.2 and SiO.sub.2 or similar pairs of materials with differing indices of refraction. To achieve reflectance of a single color of light (narrow band of wavelengths centered on the desired reflected color), the transparent layers work in conjunction with the transparent conducting oxide (TCO) layers, the n-type buffer layer (typically CdS), and the photovoltaic film layer to produce the color exhibited by the device. Thus, materials for the transparent layers are selected such that constructive interference among wavelengths reflected by all the layers of the device results in the desired exhibited color. Colors can be patterned by varying the thickness of the transparent layers.
[0021] Turning now to a more detailed description of one or more embodiments,
[0022]
[0023]
[0024]
[0025] More specifically, the layers 410a, 410b are selected in consideration of constructive interference among reflected wavelengths not only of the layers 410a, 410b but also of the TCO layers 220, 230, buffer layer 210, and photovoltaic film 130, because the exhibited color of the photovoltaic device 400 is a result of constructive interference of reflected wavelengths from all these layers, as further discussed below. The layers 410 are color tunable because the ranges of wavelengths that are ultimately exhibited by the photovoltaic device 400 may be controlled based on the selection of the layers 410 and their thicknesses. Both the materials chosen for each of the layers 410 and the thickness of each of the layers 410 affect the exhibited color. Reflectance and thickness have a linear relationship such that a change in thickness of one of the layers 410 has a proportional effect on reflectance of that layer.
[0026] Because the layers 410 act predominantly as an AR coating, they work in conjunction with the buffer layer 210 and the TCO layers 220, 230 to maximize the light that reaches the photovoltaic film 130 for conversion to direct current. In this regard, the layers 410 represent a departure from the above-noted previous approaches to addressing the aesthetic aspect of photovoltaic devices 400 that reduce the efficiency of the photovoltaic devices 400.
[0027] Exemplary materials that may be used as layers 410a, 410b are shown below in Table 1. Materials in two ranges of index of refraction values are shown. If layer 410a is selected from one index of refraction column (e.g., n<1.6), then layer 410b is selected from the other index of refraction column (1.6<n<1.8). The wavelength (of incident light) corresponding with the index of refraction values is also indicated, because refractive index is not constant over all wavelengths for most of the materials. For example, as Table 1 indicates, the refractive index of MgF.sub.2 is below 1.6 only up to a wavelength of 1100 nm, while the refractive index of YF.sub.3 is below 1.6 only above a 5,000 nm wavelength..
TABLE-US-00001 TABLE 1 Exemplary materials for layers 410. Wavelength range (nm) n < 1.6 1.6 < n < 1.8 250-400 magnesium fluoride (MgF.sub.2) aluminum oxide (Al.sub.2O.sub.3) silicon dioxide (SiO.sub.2) yttrium oxide (Y.sub.2O.sub.3) cerium fluoride (CeF.sub.3) 400-1100 magnesium fluoride (MgF.sub.2) aluminum oxide (Al.sub.2O.sub.3) silicon dioxide (SiO.sub.2) yttrium oxide (Y.sub.2O.sub.3) 1100-5,000 silicon dioxide (SiO.sub.2) aluminum oxide (Al.sub.2O.sub.3) cerium fluoride (CeF.sub.3) yttrium oxide (Y.sub.2O.sub.3) 5,000-12,000 cerium fluoride (CeF.sub.3) yttrium fluoride (YF.sub.3) thorium tetrafluoride (ThF.sub.4)
Although two layers 410a, 410b are shown for the exemplary embodiment in
[0028] As noted above, the reflected light due to each of the layers 410 constructively interferes with reflected light due to the TCO layers 220, 230, buffer layer 210, and photovoltaic film 130 to exhibit a particular color. Thus, to obtain a desired exhibited color, materials and thicknesses may be selected for two or more layers 410. The determination of thicknesses and materials (based on their corresponding refractive indexes) for the two or more layers 410 to obtain the desired exhibited color is not straight-forward and may be achieved according to the teachings of the present disclosure by using well-known models. These known models provide reflectance response resulting from multiple layers as a function of the refractive index of each of the layers and impedance at each interface of layers, which is a function of the thickness of each layer. For a given photovoltaic device 400, the materials and their thicknesses are known for the TCO layers 220, 230, buffer layer 210, and photovoltaic film 130. The reflected wavelength that is ultimately desired (the exhibited color) is also known. These known values may be used in conjunction with the known models to define and solve for the layers 410 as the unknown values.
[0029]
[0030]
[0031] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms a, an and the are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms comprises and/or comprising, when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, element components, and/or groups thereof
[0032] The corresponding structures, materials, acts, and equivalents of all means or step plus function elements in the claims below are intended to include any structure, material, or act for performing the function in combination with other claimed elements as specifically claimed. The description of the present invention has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the invention. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
[0033] The flow diagrams depicted herein are just one example. There may be many variations to this diagram or the steps (or operations) described therein without departing from the spirit of the invention. For instance, the steps may be performed in a differing order or steps may be added, deleted or modified. All of these variations are considered a part of the claimed invention.
[0034] While the preferred embodiment to the invention had been described, it will be understood that those skilled in the art, both now and in the future, may make various improvements and enhancements which fall within the scope of the claims which follow. These claims should be construed to maintain the proper protection for the invention first described.
[0035] The descriptions of the various embodiments of the present invention have been presented for purposes of illustration, but are not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein was chosen to best explain the principles of the embodiments, the practical application or technical improvement over technologies found in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.