SLURRY COMPOSITION, USE THEREOF, AND POLISHING METHOD

Abstract

Provided is a slurry composition including abrasive particles, halogen oxide, and nitroxide compound. The combination of halogen oxide and nitroxide compound has a synergistic effect to remove a substrate containing tungsten and silicon oxide. Moreover, a use of the slurry composition and a polishing method using the slurry composition are provided.

Claims

1. A slurry composition, comprising: a plurality of abrasive particles; a halogen oxide; and a nitroxide compound.

2. The slurry composition of claim 1, wherein the abrasive particles are selected from colloidal silicon oxide, fumed silicon oxide, nano aluminum oxide, or a combination of any two or more of the above.

3. The slurry composition of claim 1, wherein the halogen oxide is selected from chlorate, bromate, iodate, sodium hypochlorite, or a combination of any two or more of the above.

4. The slurry composition of claim 1, wherein the nitroxide compound is selected from pyridine-N-oxide, 4-methylpyridine-N-oxide, 2-methylpyridine-N-oxide, N-methylmorpholine-N-oxide, 5.5-dimethyl-1-pyrroline N-oxide, trimethylamine oxide, quinoline oxide, 2-mercaptopyridine oxide, or a combination of any two or more of the above.

5. The slurry composition of claim 1, wherein at least one nitrogen atom in the nitroxide compound is directly bonded to an oxygen atom.

6. The slurry composition of claim 1, wherein a content of the abrasive particles is 0.5 wt % to 10 wt %.

7. The slurry composition of claim 1, wherein a content of the halogen oxide is 100 ppm to 10000 ppm.

8. The slurry composition of claim 1, wherein a content of the nitroxide compound is 100 ppm to 10000 ppm.

9. The slurry composition of claim 1, wherein a content of the nitroxide compound is 300 ppm to 3000 ppm.

10. The slurry composition of claim 1, wherein a pH value of the slurry composition is between 2 and 6.

11. The slurry composition of claim 1, further comprising water-soluble starch having a molecular weight less than 8000.

12. The slurry composition of claim 11, wherein a content of the water-soluble starch is 100 ppm to 500 ppm.

13. The slurry composition of claim 1 for performing chemical-mechanical polishing on a substrate containing tungsten and silicon oxide, wherein when a content of the abrasive particles is 0.5 wt % to 10 wt % and a content of the halogen oxide is greater than or equal to 3000 ppm, a removal ratio of tungsten to silicon oxide is greater than 1.

14. The slurry composition of claim 1 for performing chemical-mechanical polishing on a substrate containing tungsten and silicon oxide, wherein when a content of the abrasive particles is 7.5 wt % to 10 wt % and a content of the halogen oxide is less than or equal to 1600 ppm, a removal ratio of tungsten to silicon oxide is less than 1.

15. A use of the slurry composition of claim 1 for polishing the substrate containing tungsten and silicon oxide.

16. A polishing method, comprising: performing polishing on the substrate containing tungsten and silicon oxide using the slurry composition of claim 1.

Description

DESCRIPTION OF THE EMBODIMENTS

[0027] First, the slurry composition of the present embodiment is described. The slurry composition of the present embodiment is suitable for a chemical-mechanical polishing method to perform polishing on a substrate containing tungsten and silicon oxide; and a use thereof is, for instance, polishing a substrate containing tungsten and silicon oxide.

[0028] The slurry composition of the present embodiment includes a plurality of abrasive particles, halogen oxide, and nitroxide compound. In an embodiment, the pH value of the slurry composition is between 2 and 6.

[0029] Specifically, based on the total amount of the slurry composition, the content of the slurry particle can be, for instance, 0.5 wt % to 10 wt %. The abrasive particles are selected from colloidal silicon oxide, fumed silicon oxide, nano aluminum oxide, or a combination of any two or more of the above.

[0030] Based on the total amount of the slurry composition, the content of halogen oxide is 100 ppm to 10000 ppm. The halogen oxide is selected from chlorate, bromate, iodate, sodium hypochlorite, or a combination of any two or more of the above.

[0031] Based on the total amount of the slurry composition, the content of nitroxide compound is 100 ppm to 10000 ppm. In another embodiment, the content of nitroxide compound is 300 ppm to 3000 ppm. The nitroxide compound is selected from

##STR00001##

or a combination of any two or more of the above. More specifically, at least one nitrogen atom in nitroxide compound can be directly bonded to an oxygen atom.

[0032] It should be mentioned that, the combination of halogen oxide and nitroxide compound of the present embodiment provides a synergistic effect. Specifically, the slurry composition of the present embodiment is used to perform a chemical-mechanical polishing process on a substrate containing tungsten and silicon oxide. As a result, a tungsten/silicon oxide removal rate of 50 /minute to 1000 /minute can be achieved. In comparison to prior art, the slurry composition of the present embodiment has lower tungsten metal removal rate and lower static etch rate. As a result, the slurry composition of the present embodiment is suitable for an advanced process or the polishing process of a thinner tungsten metal layer.

[0033] Moreover, in the slurry composition of the invention, the selection ratio of tungsten metal and silicon oxide can be adjusted as needed. In an embodiment, the slurry composition is used to perform chemical-mechanical polishing on a substrate containing tungsten and silicon oxide, wherein when the content of the abrasive particles is 0.5 wt % to 10 wt % and the content of halogen oxide is greater than or equal to 3000 ppm, the removal ratio of tungsten to silicon oxide is greater than 1. However, the invention is not limited thereto, and in another embodiment, when the content of the abrasive particles is 7.5 wt % to 10 wt % and the content of halogen oxide is less than or equal to 1600 ppm, the removal ratio of tungsten to silicon oxide can also be less than 1. In another embodiment, the content of the abrasive particles and the content of halogen oxide can also be adjusted, such that the removal ratio of tungsten to silicon oxide is equal to 1.

[0034] Moreover, since the slurry composition of the present embodiment does not contain a metal ion catalyst and an oxidant that is readily decomposed (such as hydrogen peroxide), the slurry composition of the present embodiment can provide a longer pot life. As a result, the slurry composition of the present embodiment can lower the cost of a chemical-mechanical polishing process. In an embodiment, the pot life of the slurry composition can be greater than or equal to 1 week. Moreover, since the slurry composition of the present embodiment does not contain a metal ion catalyst and an oxidant that is readily decomposed, the slurry composition of the present embodiment also does not need a metal ion chelate or a deactivating agent to extend the pot life or prevent over-polishing.

[0035] In an embodiment, the slurry composition can further include water-soluble starch having a molecular weight less than 8000. Based on the total amount of the slurry composition, the content of the water-soluble starch is 100 ppm to 500 ppm. In the present embodiment, when potassium iodate is used as the oxidant and tungsten metal polishing is performed, the water-soluble starch can generate a complex with the resulting iodine element (I.sub.2) to prevent the iodine element (or iodine vapor) from volatilizing and escaping into air.

EXPERIMENTS

[0036] In the following, actual experimental testing is performed. The chemical mechanical polishing machine and the experimental settings used in experimental example 1 and comparative examples 1 to 8 are as follows: [0037] Chemical-mechanical polishing machine: 8-inch Mina polisher [0038] Substrate to be polished: a substrate containing tungsten and silicon oxide [0039] Polishing pad: IC1000 (product name, made by Dow Chemical Company) [0040] Polishing head down force: 1.5 psi [0041] Platen speed: 73 rpm [0042] Polishing head speed: 67 rpm [0043] Polishing time: 60 seconds

[0044] The slurry compositions of experimental example 1 and comparative examples 1 to 8 all contain 1 wt % of the abrasive particles, water is the carrier, and the pH value is acidic. Specifically, the slurry composition of experimental example 1 has potassium iodate (KIO.sub.3) in a content of 3000 ppm and N-methylmorpholine-N-oxide (NMO) in a content of 3000 ppm, wherein the amount is based on the total amount of the slurry composition, and the definition of the amount is not repeated herein. The slurry compositions of comparative examples 1 and 2 only have potassium iodate, and the amount thereof is respectively 100 ppm and 3000 ppm. The slurry compositions of comparative examples 3 and 4 only have NMO, and the amount thereof is respectively 100 ppm and 3000 ppm. The slurry composition of comparative example 5 has potassium iodate in a content of 3000 ppm and hydrogen peroxide (H.sub.2O.sub.2) in a content of 10000 ppm. The slurry composition of comparative example 6 has NMO in a content of 3000 ppm and hydrogen peroxide (H.sub.2O.sub.2) in a content of 10000 ppm. The slurry composition of comparative example 7 has potassium iodate in a content of 3000 ppm and ammonium persulfate ((NH.sub.3).sub.2S.sub.2O.sub.8) in a content of 10000 ppm. The slurry composition of comparative example 8 has NMO in a content of 3000 ppm and ammonium persulfate ((NH.sub.3).sub.2S.sub.2O.sub.8) in a content of 10000 ppm.

[0045] The polishing results of the slurry compositions of experimental example 1 and comparative examples 1 to 8 respectively on the substrate containing tungsten and silicon oxide are as shown in Table 1.

TABLE-US-00001 TABLE 1 Tungsten Silicon oxide removal Removal KIO.sub.3 NMO H.sub.2O.sub.2 (NH.sub.3).sub.2S.sub.2O.sub.8 rate rate Item (ppm) (ppm) (ppm) (ppm) (/min) (/min) Comparative 100 0 0 0 30 129 example 1 Comparative 3000 0 0 0 50 138 example 2 Comparative 0 100 0 0 5 120 example 3 Comparative 0 3000 0 0 15 136 example 4 Experimental 3000 3000 0 0 548 121 example 1 Comparative 3000 0 10000 0 52 122 example 5 Comparative 0 3000 10000 0 18 134 example 6 Comparative 3000 0 0 10000 48 111 example 7 Comparative 0 3000 0 10000 20 122 example 8

[0046] It can be known from comparative examples 1 to 4 that when potassium iodate and NMO exist independently, a lower removal rate of tungsten metal is achieved. However, when potassium iodate and NMO both exist, as shown in example 1, the removal rate of tungsten metal can be significantly increased.

[0047] Moreover, when potassium iodate and NMO are independently mixed with 1 wt % hydrogen peroxide (H.sub.2O.sub.2) or 1 wt % ammonium persulfate, a significant increase in the removal rate of tungsten metal thereof is not observed, as shown in comparative examples 5 to 8. Therefore, the mixture (or combination) of potassium iodate and NMO has a specificity toward the increase of tungsten metal removal rate, and cannot be achieved by arbitrarily increasing the oxidant concentration or mixing any two oxidants. Moreover, it can be known from the results of comparative examples 1 to 4 that, the content of the oxidant (i.e., potassium iodate or NMO) has a lesser effect on the silicon oxide removal rate.

[0048] Moreover, similar to the chemical-mechanical polishing machine and the experimental settings above, a polishing process is performed on a substrate containing tungsten and silicon oxide respectively using the slurry compositions of experimental examples 1 to 6, and the polishing results thereof are as shown in Table 2.

TABLE-US-00002 TABLE 2 Silicon Abrasive Tungsten oxide particles NMO KIO.sub.3 removal rate removal rate Item (wt %) (ppm) (ppm) (/min) (/min) Experimental 0.5 3000 3000 541 98 example 2 Experimental 1 3000 3000 548 121 example 1 Experimental 5 3000 3000 552 227 example 3 Experimental 10 3000 3000 560 558 example 4 Experimental 7.5 3000 1600 372 401 example 5 Experimental 10 3000 1600 382 557 example 6

[0049] The slurry compositions of experimental examples 1 to 6 contain water as the carrier, the pH value is acidic, and the amounts of the abrasive particles and the oxidant are as shown in Table 2 above. It can be known from experimental examples 1 to 6 that, the content of the abrasive particles has a greater effect on the removal rate of silicon oxide. In other words, a greater content of the abrasive particles indicates greater removal rate of silicon oxide. Moreover, the content of potassium iodate has a greater effect on the removal rate of tungsten metal. In other words, a greater amount of potassium iodate indicates a greater removal rate of tungsten metal. Therefore, in the invention, the selection ratio of tungsten metal to silicon oxide can be adjusted by adjusting the content of the abrasive particles and the content of potassium iodate to make it greater than 1 (as shown in experimental examples 1 to 3), close to 1 (as shown in experimental example 4), or less than 1 (as shown in experimental examples 5 to 6).

[0050] Similar to the chemical-mechanical polishing machine and the experimental settings above, a polishing process is performed on a substrate containing tungsten and silicon oxide respectively using the slurry compositions of experimental examples 7 to 14, and the polishing results thereof are as shown in Table 3.

TABLE-US-00003 TABLE 3 Silicon Tungsten oxide removal removal NaClO.sub.3 NaBrO.sub.3 KIO.sub.3 NaClO rate rate Item (ppm) (ppm) (ppm) (ppm) (/min) (/min) Experimental 100 0 0 0 150 211 example 7 Experimental 10000 0 0 0 351 218 example 8 Experimental 0 100 0 0 122 205 example 9 Experimental 0 10000 0 0 261 223 example 10 Experimental 0 0 100 0 181 230 example 11 Experimental 0 0 10000 0 851 228 example 12 Experimental 0 0 0 100 110 208 example 13 Experimental 0 0 0 10000 401 211 example 14

[0051] The slurry compositions of experimental examples 7 to 14 contain 5 wt % of the abrasive particles and 3000 ppm of NMO, water is used as the carrier, the pH value is acidic, and the type and the content of the halogen oxide thereof are as shown in Table 3 above. As shown in experimental examples 7 to 14, in the halogen oxide, the effect of potassium iodate is better. In other words, the slurry composition containing potassium iodate can achieve a greater removal rate of tungsten metal, and a greater amount of potassium iodate results in a greater removal rate of tungsten metal (as shown in experimental examples 11 to 12). It should also be mentioned that, if potassium iodate is used as the oxidant, then when tungsten metal polishing is performed, iodine element (I.sub.2) is readily generated. Therefore, in the invention, water-soluble starch in a content of 100 ppm can be added in the slurry composition to prevent iodine vapor from escaping.

[0052] Moreover, similar to the chemical-mechanical polishing machine and the experimental settings above, a polishing process is performed on a substrate containing tungsten and silicon oxide respectively using the slurry compositions of experimental examples 1 and 15 to 19, and the polishing results thereof are as shown in Table 4.

TABLE-US-00004 TABLE 4 Silicon Nitroxide Tungsten oxide compound removal removal amount rate rate Item Nitroxide compound ppm (/min) (/min) Experimental N-methylmorpholine-N- 3000 548 121 example 1 oxide (NMO) Experimental N-methylmorpholine-N- 300 235 122 example oxide (NMO) 15 Experimental 2-pyridinethiol-1-oxide 3000 501 120 example 16 Experimental 2-pyridinethiol-1-oxide 300 195 124 example 17 Experimental Trimethylamine oxide 3000 493 118 example 18 Experimental Trimethylamine oxide 300 176 115 example 19

[0053] The slurry compositions of experimental examples 1 and 15 to 19 contain 1 wt % of the abrasive particles, 3000 ppm of potassium iodate, and 300 ppm or 3000 ppm of nitroxide compound, water is used as the carrier, the pH value is acidic, and the type and the content of nitroxide compound thereof are as shown in Table 4 above. As shown in experimental examples 1 and 15 to 19, NMO has a better effect on the removal rate of tungsten metal, and a greater amount of NMO results in a greater removal rate of tungsten metal (as shown in experimental examples 1 and 15).

[0054] Based on the above, in the invention, via the combination of halogen oxide and nitroxide compound, a synergistic effect can be achieved so as to provide lower tungsten metal removal rate and lower static etch rate. Moreover, in the invention, since a metal ion catalyst and an oxidant that is readily decomposed (such as hydrogen peroxide) are not included, the slurry composition of the invention can provide a longer pot life. Moreover, in the slurry composition of the invention, the selection ratio of tungsten metal and silicon oxide can be adjusted as needed, and therefore the slurry composition of the invention is suitable for an advanced process or the polishing process of a thinner tungsten metal layer.

[0055] Although the invention has been described with reference to the above embodiments, it will be apparent to one of ordinary skill in the art that modifications to the described embodiments may be made without departing from the spirit of the invention. Accordingly, the scope of the invention is defined by the attached claims not by the above detailed descriptions.