Aluminum alloy substrate for magnetic disk and method for manufacturing same, aluminum alloy base disk for magnetic disk and method for manufacturing same, and magnetic disk and method for manufacturing the same

Abstract

An aluminum alloy substrate for a magnetic disk including an aluminum alloy containing 0.1 to 3.0 mass % of Fe, 0.005 to 1.000 mass % of Cu, and 0.005 to 1.000 mass % of Zn, with a balance of Al and inevitable impurities, wherein in an outer peripheral surface thereof, the number of holes having maximum diameters of 10 μm or more is 200/mm.sup.2 or less, an aluminum alloy base disk for a magnetic disk and a magnetic disk, using the aluminum alloy substrate, and methods for manufacturing these.

Claims

1. An aluminum alloy substrate for a magnetic disk, comprising an aluminum alloy containing 0.1 to 3.0 mass % of Fe, 0.005 to 1.000 mass % of Cu, 0.005 to 1.000 mass % of Zn, and optionally one or more elements selected from a group comprising 0.1 to 3.0 mass % of Mn, 0.1 to 3.0 mass % of Si, 0.1 to 8.0 mass % of Ni, 0.01 to 1.00 mass % of Cr, and 0.01 to 1.00 mass % of Zr, and optionally one or more elements selected from a group comprising Ti, B, and V, of which a total content is 0.005 to 0.500 mass %, with a balance of Al and inevitable impurities, wherein in an outer peripheral surface thereof, the number of holes having maximum diameters of 10 μm or more is 200/mm.sup.2 or less.

2. An aluminum alloy base disk for a magnetic disk, including an electroless Ni-P plated layer on the aluminum alloy substrate for a magnetic disk, according to claim 1, wherein in an outer peripheral surface thereof, the number of convex portions having maximum diameters of 4 to 10 μm is 300/mm.sup.2 or less.

3. A magnetic disk including a magnetic substance layer on a surface of the aluminum alloy base disk for a magnetic disk, according to claim 2.

4. A method for manufacturing the aluminum alloy substrate for a magnetic disk, according to claim 1, comprising a semi-continuous casting step of semi-continuously casting an ingot, using the aluminum alloy, a hot rolling step of hot rolling the ingot, a cold rolling step of cold rolling the hot-rolled plate, a disk blank-stamping step of stamping the cold-rolled sheet into an annular disk blank, a pressure planarization and annealing step of pressure annealing the disk blank formed by stamping, an inner and outer diameter machining step of machining an inner peripheral surface and an outer peripheral surface of the pressure-annealed disk blank, a stress relief heat treatment step of applying stress relief heat to the disk blank subjected to inner and outer diameter machining, a compound removal step of removing compounds on a surface of the disk blank subjected to stress relief heat treatment, and a grinding step of grinding the disk blank subjected to compound removal, wherein the compound removal step comprises immersing the disk blank in a mixed solution of NHO.sub.3 and HF, which is a 10 to 60 mass % of a NHO.sub.3 solution at 10 to 30° C. and contains 10 to 80 g/L of HF, for 5 to 60 seconds.

5. A method for manufacturing the aluminum alloy substrate for a magnetic disk, according to claim 1, comprising a semi-continuous casting step of semi-continuously casting an ingot, using the aluminum alloy, a hot rolling step of hot rolling the ingot, a cold rolling step of cold rolling the hot-rolled plate, a disk blank-stamping step of stamping the cold-rolled sheet into an annular disk blank, a pressure planarization and annealing step of pressure annealing the disk blank formed by stamping, inner and outer diameter machining step of machining an inner peripheral surface and an outer peripheral surface of the pressure-annealed disk blank, a pre-griding step of pre-grinding the disk blank subjected to inner and outer diameter machining, a stress relief heat treatment step of applying stress relief heat to the disk blank subjected to pre-grinding, a compound removal step of removing compounds on a surface of the disk blank subjected to stress relief heat treatment, and a grinding step of grinding the disk blank subjected to compound removal, wherein the compound removal step comprises immersing the disk blank in a mixed solution of NHO.sub.3 and HF, which is a 10 to 60 mass % of a NHO.sub.3 solution at 10 to 30° C. and contains 10 to 80 g/L of HF, for 5 to 60 seconds.

6. A method for manufacturing the aluminum alloy substrate for a magnetic disk, according to claim 1, comprising a semi-continuous casting step of semi-continuously casting an ingot, using the aluminum alloy, a hot rolling step of hot rolling the ingot, a cold rolling step of cold rolling the hot-rolled plate, a disk blank-stamping step of stamping the cold-rolled sheet into an annular disk blank, a pressure planarization and annealing step of pressure annealing the disk blank formed by stamping, inner and outer diameter machining step of machining an inner peripheral surface and an outer peripheral surface of the pressure-annealed disk blank, a lathing step of lathing the disk blank subjected to inner and outer diameter machining, a stress relief heat treatment step of applying stress relief heat to the disk blank subjected to lathing, a compound removal step of removing compounds on a surface of the disk blank subjected to stress relief heat treatment, and a grinding step of grinding the disk blank subjected to compound removal, wherein the compound removal step comprises immersing the disk blank in a mixed solution of NHO.sub.3 and HF, which is a 10 to 60 mass % of a NHO.sub.3 solution at 10 to 30° C. and contains 10 to 80 g/L of HF, for 5 to 60 seconds.

7. A method for manufacturing the aluminum alloy substrate for a magnetic disk, according to claim 1, comprising a continuous casting step of continuously casting an ingot, using the aluminum alloy, a cold rolling step of cold rolling the ingot, a disk blank-stamping step of stamping the cold-rolled sheet into an annular disk blank, a pressure planarization and annealing step of pressure annealing the disk blank formed by stamping, inner and outer diameter machining step of machining an inner peripheral surface and an outer peripheral surface of the pressure-annealed disk blank, a stress relief heat treatment step of applying stress relief heat to the disk blank subjected to inner and outer diameter machining, a compound removal step of removing compounds on a surface of the disk blank subjected to stress relief heat treatment, and a grinding step of grinding the disk blank subjected to compound removal, wherein the compound removal step comprises immersing the disk blank in a mixed solution of NHO.sub.3 and HF, which is a 10 to 60 mass % of a NHO.sub.3 solution at 10 to 30° C. and contains 10 to 80 g/L of HF, for 5 to 60 seconds.

8. A method for manufacturing the aluminum alloy substrate for a magnetic disk, according to claim 1, comprising a continuous casting step of continuously casting an ingot, using the aluminum alloy, a cold rolling step of cold rolling the ingot, a disk blank-stamping step of stamping the cold-rolled sheet into an annular disk blank, a pressure planarization and annealing step of pressure annealing the disk blank formed by stamping, inner and outer diameter machining step of machining an inner peripheral surface and an outer peripheral surface of the pressure-annealed disk blank, a pre-grinding step of pre-grinding the disk blank subjected to inner and outer diameter machining, a stress relief heat treatment step of applying stress relief heat to the disk blank subjected to pre-grinding, a compound removal step of removing compounds on a surface of the disk blank subjected to stress relief heat treatment, and a grinding step of grinding the disk blank subjected to compound removal, wherein the compound removal step comprises immersing the disk blank in a mixed solution of NHO.sub.3 and HF, which is a 10 to 60 mass % of a NHO.sub.3 solution at 10 to 30° C. and contains 10 to 80 g/L of HF, for 5 to 60 seconds.

9. A method for manufacturing the aluminum alloy substrate for a magnetic disk, according to claim 1, comprising a continuous casting step of continuously casting an ingot, using the aluminum alloy, a cold rolling step of cold rolling the ingot, a disk blank-stamping step of stamping the cold-rolled sheet into an annular disk blank, a pressure planarization and annealing step of pressure annealing the disk blank formed by stamping, inner and outer diameter machining step of machining an inner peripheral surface and an outer peripheral surface of the pressure-annealed disk blank, a lathing step of lathing the disk blank subjected to inner and outer diameter machining, a stress relief heat treatment step of applying stress relief heat to the disk blank subjected to lathing, a compound removal step of removing compounds on a surface of the disk blank subjected to stress relief heat treatment, and a grinding step of grinding the disk blank subjected to compound removal, wherein the compound removal step comprises immersing the disk blank in a mixed solution of NHO.sub.3 and HF, which is a 10 to 60 mass % of a NHO.sub.3 solution at 10 to 30° C. and contains 10 to 80 g/L of HF, for 5 to 60 seconds.

Description

BRIEF DESCRIPTION OF DRAWINGS

(1) FIG. 1 is a flow diagram showing a method for manufacturing an aluminum alloy substrate for a magnetic disk, an aluminum alloy base disk for a magnetic disk, and a magnetic disk, according to the present disclosure, wherein a DC casting method is employed for a method for casting an aluminum alloy.

(2) FIG. 2 is a flow diagram showing another method for manufacturing an aluminum alloy substrate for a magnetic disk, an aluminum alloy base disk for a magnetic disk, and a magnetic disk, according to the present disclosure, wherein the DC casting method is employed for the method for casting an aluminum alloy.

(3) FIG. 3 is a flow diagram showing still another method for manufacturing an aluminum alloy substrate for a magnetic disk, an aluminum alloy base disk for a magnetic disk, and a magnetic disk, according to the present disclosure, wherein the DC casting method is employed for the method for casting an aluminum alloy.

(4) FIG. 4 is a flow diagram showing a method for manufacturing an aluminum alloy substrate for a magnetic disk, an aluminum alloy base disk for a magnetic disk, and a magnetic disk, according to the present disclosure, wherein a CC casting method is employed for a method for casting an aluminum alloy.

(5) FIG. 5 is a flow diagram showing another method for manufacturing an aluminum alloy substrate for a magnetic disk, an aluminum alloy base disk for a magnetic disk, and a magnetic disk, according to the present disclosure, wherein the CC casting method is employed for the method for casting an aluminum alloy.

(6) FIG. 6 is a flow diagram showing still another method for manufacturing an aluminum alloy substrate for a magnetic disk, an aluminum alloy base disk for a magnetic disk, and a magnetic disk, according to the present disclosure, wherein the CC casting method is employed for the method for casting an aluminum alloy.

DESCRIPTION OF EMBODIMENTS

(7) The present disclosure will be described in detail hereinafter based on embodiments. The present disclosure is characterized in that before a grinding step executed before an electroless Ni—P plating step, a compound removal step is provided, whereby it is made possible to improve the grindability of an aluminum alloy substrate for a magnetic disk, in which compounds are dispersed by addition of Fe for the purpose of reducing disk flutter, and suppress generation of nodules on an outer peripheral surface and an inner peripheral surface of an aluminum alloy base disk, which are caused by Ni—P plating when the aluminum alloy substrate is subsequently formed into the aluminum alloy base disk. The advantageous effects and details of the mechanism of these will be described hereafter.

1. Working of Disk Blank

(8) After a disk blank is subjected to inner and outer diameter machining and surface machining, the disk blank is subjected to a plating pretreatment step (including an alkaline degreasing treatment stage, an acid etching treatment stage, a desmutting treatment stage, and a zincate treatment stage, in the mentioned order) and then to electroless Ni—P plating. The inner and outer diameter machining is a step in which end faces of the disk blank, more specifically, an outer peripheral surface defining an outer diameter and an inner peripheral surface defining an inner diameter are worked into respective predetermined shapes. The surface machining after the inner and outer diameter machining includes a variety of patterns, such as “grinding step only”, “pre-grinding step and subsequent grinding step”, and “lathing step and subsequent grinding step” With each of these patterns of the surface machining, it is possible to obtain an aluminum alloy substrate for a magnetic disk, which is adjusted in thickness, improved in flatness, adjusted in roughness, reduced in waviness, and improved in like other respects. Further, before lathing, a stress relief heat treatment step and a compound removal step subsequent to the stress relief heat treatment step, which do not belong to the surface machining, are provided. Through the above-described steps, the aluminum alloy substrate for a magnetic disk (hereafter, sometimes simply referred to as the “aluminum alloy substrate”) is obtained.

2. Plating Pretreatment

(9) Next, the aluminum alloy substrate for a magnetic disk is subjected to the plating pretreatment step including the alkaline degreasing treatment stage, the acid etching treatment stage, the desmutting treatment stage, and the zincate treatment stage, in the mentioned order. In the zincate treatment stage, 1st zincate treatment, Zn peeling treatment, and 2nd zincate treatment are executed in the mentioned order. Note that in a case where the alkaline degreasing treatment stage and the acid etching treatment stage are simultaneously executed, the desmutting treatment stage is sometimes not executed.

3. Electroless Ni—P Plating

(10) The aluminum alloy substrate for a magnetic disk, which has been subjected to the plating pretreatment step, is subjected to the electroless Ni—P plating treatment to form an aluminum alloy base disk for a magnetic disk (hereafter sometimes simply referred to as the “aluminum alloy base disk”). On a front surface, a back surface, an inner peripheral surface, and an outer peripheral surface of the aluminum alloy base disk for a magnetic disk obtained by performing the electroless Ni—P plating treatment, nodules each having a circular convex shape exist in a scattered state.

4. Influence of Nodules After Electroless Ni—P Plating Step

4-1. Surfaces of Aluminum Alloy Base Disk for Magnetic Disk

(11) From the front and back surfaces of the aluminum alloy base disk subjected to the Ni—P plating step, nodules are removed by the grinding step subsequent thereto. Therefore, there is no problem of existence of nodules on the front and back surfaces.

4-2. Inner and Outer Peripheral Surfaces of Aluminum Alloy Base Disk for Magnetic Disk

(12) As described hereinbefore, nodules are generated also on the inner and outer peripheral surfaces, which are opposite end faces of the aluminum alloy base disk subjected to electroless Ni—P plating. After electroless Ni—P plating, no further treatment is performed on the inner and outer peripheral surfaces. Therefore, generated nodules remain as they are in the products of magnetic disks. After the electroless Ni—P plating step, there are executed the grinding step, a spattering step, and the like, and particularly in the spattering step, treatment is sometimes performed by supporting the outer peripheral surface of the aluminum alloy base disk for a magnetic disk, using a jig. In doing this, if nodules having convex shapes are rubbed against the jig, worn powder is sometimes produced and applied on the surfaces (front, back, inner peripheral, and outer peripheral surfaces) of the aluminum alloy substrate base disk. Application of such worn powder brings about a problem of a magnetic film formed by spattering being made non-uniform. Therefore, it is essentially required to reduce nodules on the outer peripheral surface of the aluminum alloy base disk to the minimum.

(13) Specifically, the above-mentioned problem is not brought about if the number of convex portions (nodules) having a maximum diameter of 4 to 10 μm is 300/mm.sup.2 or less, preferably 150/mm.sup.2 or less. Note that as the density is smaller, it is more preferable, but its lower limit value is naturally determined by the composition of aluminum alloy used and a manufacturing method, and in the present disclosure, approximately 30/mm.sup.2 is the lower limit. Convex portions having a maximum diameter of less than 4 μm are hardly changed into the above-mentioned worn powder, and therefore, no problem is brought about even if they exist. On the other hand, convex portions having a maximum diameter of more than 10 μm are not produced by electroless Ni—P plating, and therefore, no problem is brought about. For these reasons, the maximum diameter of convex portions on the outer peripheral surface is limited to 4 to 10

5. Generation of Nodules

(14) The above-mentioned nodules are ascribable to non-uniformity of the surfaces of the aluminum alloy substrate which are subjected to electroless Ni—P plating. The nodules are liable to be generated mainly on portions other than the uniform surface, such as compounds, ends of holes, and convex portions of the surfaces. In the electroless Ni—P plating, Ni—P randomly precipitates on the entire surfaces and portions forming islands are united to each other to grow into a uniform film. However, if there are portions where precipitation of Ni—P in Ni—P plating occurs at a slightly different timing than it occurs on the surfaces, the portions alone remain as convex portions to form nodules. As described hereinafter, a large amount of compounds exists in the aluminum alloy substrate according to the present disclosure, and therefore, in the surfaces of the aluminum alloy base disk after the electroless Ni—P plating step, there are a very large number of nodules ascribable to compounds and holes.

(15) Non-uniformity of ends of holes is one cause of generation of modules on the surfaces of the aluminum alloy base disk, as described above, but such holes are formed in large number by the compound-removing step for the aluminum alloy substrate. Therefore, it is important to suppress generation of nodules ascribable to holes formed in the compound removal step. Specifically, the number of holes having a maximum diameter of 10 μm or more on the outer peripheral surface of the aluminum alloy substrate is set to 200/mm.sup.2 or less, preferably to 100/mm.sup.2 or less, whereby it is possible to suppress generation of nodules on the surfaces of the aluminum alloy base disk found after the electroless Ni—P plating step. Note that as the density is lower, it is more preferable, but its lower limit value is naturally determined by the composition of aluminum alloy used and a manufacturing method, and in the present disclosure, approximately 30/mm.sup.2 is the lower limit. Note that holes having a maximum diameter of less than 10 μm are buried by electroless Ni—P plating, thereby making the front surface flat and smooth, and therefore, even if such holes are formed, they do not bring about the problem of generation of nodules. Further, the upper limit of the maximum diameter of holes is naturally determined by the composition of aluminum alloy used and a manufacturing method, and in the present disclosure, approximately 20 μm is the upper limit.

6. Alloy Composition of Aluminum Alloy Substrate for Magnetic Disk

(16) An aluminum alloy used for an aluminum alloy substrate for a magnetic disk, according to the present disclosure, has a composition containing 0.1 to 3.0 mass % (hereafter simply denoted as “%”) of Fe, 0.005 to 1.000% of Cu, and 0.005 to 1.000% of Zn, as essential elements, with a balance of Al and inevitable impurities. The composition may further contain one or more selected from 0.1 to 3.0% of Mn, 0.1 to 3.0% of Si, 0.1 to 8.0% of Ni, 0.01 to 1.00% of Cr, and 0.01 to 1.00% of Zr, as first selective elements. In addition, the composition may further contain one or more selected from Ti, B, and V at a total content of 0.005% to 0.500%, as second selective elements. Hereafter, the content and operation of each alloy component will be described.

Fe: 0.1 to 3.0%

(17) Fe exists principally in the form of second phase particles (Al—Fe-based compounds and the like) partly in a state solid-dissolved in a parent phase and has the effect of improving the strength and fluttering characteristic of an aluminum alloy substrate. When vibrations are applied to a magnetic disk using such an aluminum alloy substrate, vibrational energy is immediately absorbed due to viscous flow in the interface between the second phase particles and the parent phase, whereby a very high fluttering characteristic is obtained.

(18) An Fe content of less than 0.10% does not give sufficient strength and fluttering characteristic to the magnetic disk using the aluminum alloy substrate. On the other hand, an Fe content of more than 3.00% causes generation of a large number of coarse Al—Fe-based compounds. Even the Al—Fe-based compounds can be removed by the compound removal step, but concave portions formed by removal thereof are large, so that the outer peripheral surface subjected to electroless Ni—P plating has a large number of nodules formed thereon. Accordingly, the content of Fe in the aluminum alloy is set in a range of 0.1 to 3.0%. The content of Fe is preferably in a range of 0.5 to 1.5%.

Cu: 0.005 to 1.000%

(19) Cu exists principally in the form of second phase particles (Al—Cu-based compounds and the like) and has the effect of improving the strength and fluttering characteristic of the magnetic disk using the aluminum alloy substrate. Further, Cu also causes a zincate film to be uniformly, thinly, and closely generated, and has the effect of improving the smoothness of the electroless Ni—P plating.

(20) A Cu content of less than 0.005% makes the magnetic disk using the aluminum alloy substrate insufficient in strength and fluttering characteristic thereof, and also causes the zincate film to be non-uniform and lower the smoothness of the Ni—P plating. On the other hand, a Cu content of more than 1.000% causes generation of a large number of coarse Al—Cu-based compounds. Even the coarse Al—Cu-based compounds can be removed by the compound removal step, but concave portions formed by removal thereof are large, so that the outer peripheral surface subjected to electroless Ni—P plating has a large number of nodules formed thereon. Accordingly, the content of Cu is set in a range of 0.005 to 1.000%. The content of Cu is preferably in a range of 0.005 to 0.400%.

Zn: 0.005 to 1.000%

(21) Zn causes a zincate film to be uniformly, thinly, and closely generated and has the effect of improving the smoothness and adhesion of the electroless Ni—P plating. Further, Zn forms second phase particles in combination with other additional elements, and has the effect of improving the fluttering disk of the magnetic disk using the aluminum alloy substrate.

(22) A Zn content of less than 0.005% causes the zincate film to be non-uniform and thereby lower the smoothness of the electroless Ni—P plating. On the other hand, a Zn content of more than 1.000% causes the potential of the parent phase to be too electronegative so that the dissolution rate of the parent phase in the compound removal step and the Ni—P plating step becomes high. As a result, the surfaces of the aluminum alloy substrate have large concave and convex portions so that the smoothness of the electroless Ni—P plated front surface is lowered. Accordingly, the content of Zn is set in a range of 0.005 to 1.000%. The content of Zn is preferably in a range of 0.100 to 0.700%.

Mn: 0.1 to 3.0%

(23) Mn exists principally as second phase particles (Al—Mn-based compounds) and has the effect of improving the strength and fluttering characteristic of the magnetic disk using the aluminum alloy substrate. When vibrations are applied to the magnetic disk using the aluminum alloy substrate, vibrational energy is immediately absorbed due to viscous flow in the interface between the second phase particles and the parent phase, whereby a very high fluttering characteristic is obtained.

(24) A Mn content of less than 0.1% makes the magnetic disk using the aluminum alloy substrate insufficient in strength and fluttering characteristic thereof. On the other hand, a Mn content of more than 3.0% suppresses generation of a large number of coarse Al—Mn-based compounds. Even the coarse Al—Mn-based compounds can be removed by the compound removal step, but concave portions formed by removal thereof are large, so that the outer peripheral surface subjected to electroless Ni—P plating has a large number of nodules formed thereon. Accordingly, the content of Mn is set in a range of 0.1 to 3.0%. The content of Mn is more preferably in a range of 0.1 to 1.0%.

Si: 0.1 to 3.0%

(25) Si exists principally as second phase particles (Si particles and the like) and has the effect of improving the strength and fluttering characteristic of the magnetic disk using the aluminum alloy substrate. When vibrations are applied to the magnetic disk using the aluminum alloy substrate, vibrational energy is immediately absorbed due to viscous flow in the interface between the second phase particles and the parent phase, whereby a very high fluttering characteristic is obtained.

(26) A Si content of less than 0.1% makes the magnetic disk using the aluminum alloy substrate insufficient in strength and fluttering characteristic thereof. On the other hand, a Si content of more than 3.00% causes generation of a large number of coarse Si particles. The coarse Si particles are difficult to be removed by the compound removal step and therefore remain in the surfaces of the aluminum alloy substrate, causing lowering of the smoothness of the electroless Ni—P plated front surface and plating peeling. Accordingly, the content of Si is set in a range of 0.1 to 3.0%. The content of Si is preferably set in a range of 0.3 to 1.5%.

Ni: 0.1 to 8.0%

(27) Ni exists principally as second phase particles (Al—Ni-based compounds and the like) and has the effect of improving the strength and fluttering characteristic of the magnetic disk using the aluminum alloy substrate. When vibrations are applied to the magnetic disk using the aluminum alloy substrate, vibrational energy is immediately absorbed due to viscous flow in the interface between the second phase particles and the matrix, whereby a very high fluttering characteristic is obtained.

(28) A Ni content of less than 0.1% in the aluminum alloy makes the magnetic disk using the aluminum alloy substrate insufficient in strength and fluttering characteristic thereof. On the other hand, a Ni content of more than 8.0% causes generation of a large number of coarse Al—Ni-based compounds. Even the coarse Al—Ni-based compounds can be removed by the compound removal step, but concave portions formed by removal thereof are large, so that the outer peripheral surface subjected to electroless Ni—P plating has a large number of nodules formed thereon. Accordingly, the content of Ni is set in a range of 0.1 to 8.0%. The content of Ni is preferably in a range of 0.3 to 3.0%, more preferably in a range of 0.5 to 2.0%.

Cr: 0.01 to 1.00%

(29) Cr exists principally as second phase particles (Al—Cr-based compounds and the like) and has the effect of improving the strength and fluttering characteristic of the magnetic disk using the aluminum alloy substrate. A Cr content of less than 0.01% makes the magnetic disk using the aluminum alloy substrate insufficient in strength and fluttering characteristic thereof. On the other hand, a Cr content of more than 1.00% causes generation of a large number of coarse Al—Cr-based compounds. Even the coarse Al—Cr-based compounds can be removed by the compound removal step, but concave portions formed by removal thereof are large, so that the outer peripheral surface subjected to electroless Ni—P plating has a large number of nodules formed thereon. Accordingly, the content of Cr is set in a range of 0.01 to 1.00%. The content of Cr is preferably set in a range of 0.10 to 0.50%, more preferably in a range of 0.15 to 0.40%.

Zr: 0.01 to 1.00%

(30) Zr exists principally as second phase particles (Al—Zr-based compounds and the like) and has the effect of improving the strength and fluttering characteristic of the magnetic disk using the aluminum alloy substrate. A Zr content of less than 0.01% makes the magnetic disk using the aluminum alloy substrate insufficient in strength and fluttering characteristic thereof. On the other hand, a Zr content of more than 1.00% causes generation of a large number of coarse Al—Zr-based compounds. Even the coarse Al—Zr-based compounds can be removed by the compound removal step, but concave portions formed by removal thereof are large, so that the outer peripheral surface subjected to electroless Ni—P plating has a large number of nodules formed thereon. Accordingly, the content of Zr is set in a range of 0.01 to 1.00%, preferably in a range of 0.10 to 0.50%.

Ti, B, V: 0.005 to 0.500%

(31) Ti, B, V form, in a solidification process in casting, second phase particles (particles of borides, such as TiB.sub.2, Al.sub.3Ti, Ti—V—B, and the like), which become crystal grain nuclei, and therefore it is possible to make crystal grains finer. Finer crystal grains reduce the non-uniformity of the sizes of the second phase particles and variation in the strength and fluttering characteristic of the magnetic disk using the aluminum alloy substrate. However, it is impossible to obtain the above-mentioned effects when the total of the contents of Ti, B, and V is less than 0.005%. On the other hand, when the total of the contents of Ti, B, and V is more than 0.500% as well, the above effects are saturated and therefore, it is impossible to obtain more noticeable improvement effects than the above. Accordingly, the total of the contents of Ti, B, and V is set in a range of 0.005 to 0.500%. The total of the contents of Ti, B, and V is preferably set in a range of 0.005 to 0.100%. Note that the total of the contents of Ti, B, and V refers to the total of three elements when all the three elements are contained, to the total of two elements when only the two elements are contained, and to the total of one element when only one element is contained.

Other Elements

(32) The balance of the aluminum alloy base material for use in the aluminum alloy substrate according to the present disclosure comprises Al and inevitable impurities. Here, as the inevitable impurities, there may be mentioned Mg, Pb, Ga, Sn, and so forth, and the characteristics of the aluminum alloy substrate obtained in the present disclosure are not spoiled so long as each content is less than 0.10% and also the total content is less than 0.20%.

7. Compound Removal Step

(33) The aluminum alloy substrate reduced in disk fluttering, according to the present disclosure, contains Fe, so that compounds are large and also the distribution density thereof is high. Therefore, the aluminum alloy base disk subjected to electroless Ni—P plating has a large number of nodules formed thereon. However, as described hereinbefore, the nodules on the front and back surfaces of the aluminum alloy base disk are removed therefrom by the grinding step, and therefore, these modules do not bring about any problem. On the other hand, nodules formed on the inner and outer peripheral surfaces of the aluminum alloy base disk remain as they are. Therefore, by applying the compound removal step to the aluminum alloy substrate, the nodules on the front and back surfaces of the aluminum alloy base disk are removed in advance, whereby it is possible to prevent nodules from being generated on the inner and outer peripheral surfaces of the aluminum alloy base disk subjected to the electroless Ni—Pl plating step. The compounds, mentioned in the present disclosure, are intermetallic compounds, such as AL-Fe and Al—Fe—Mn.

(34) In the compound removal step, compounds remaining on the surfaces of the aluminum alloy substrate are removed by a chemical liquid. As the chemical liquid, there is used a mixed solution of HNO.sub.3 and HF, which is a solution of 10 to 60 mass % (hereinafter simply denoted as “%”) of HNO.sub.3 at 10 to 30° C., which contains 10 to 80 g/L of HF. This mixed solution has a strong etching power and increases a dissolving rate of compounds and their surroundings of the aluminum alloy substrate. Through dissolution of compounds and their surroundings of the aluminum alloy substrate, the compounds are removed, so that it is possible to selectively remove only compounds on the surfaces of the aluminum alloy substrate.

(35) In the above-described mixed solution, in a case where the concentration of HF is less than 10 g/L and the concentration of HNO.sub.3 is less than 10%, etching power is weak so that it is impossible to sufficiently remove compounds on the surfaces of the aluminum alloy substrate. On the other hand, in a case where the concentration of HF is more than 80 g/L and the concentration of HNO.sub.3 is more than 60%, etching power is too strong and the dissolution of the parent phase of the aluminum alloy substrate proceeds. As a result, concave and convex portions on the surfaces of the aluminum alloy substrate become large and it is impossible to achieve smoothness of the electroless Ni—P plated front surface formed by the electroless Ni—P plating step subsequent thereto. The concentration of HF is preferably 20 to 60 g/L and the concentration of HNO.sub.3 is preferably 25 to 50%.

(36) The temperature of the mixed solution is set to 10 to 30° C. If the temperature is lower than 10° C., the reaction rate is low so that it is impossible to sufficiently remove compounds on the surfaces of the aluminum alloy substrate. On the other hand, if the temperature is higher than 30° C., the reaction rate is too high so that the dissolution of the parent phase of the aluminum alloy substrate proceeds, resulting in larger concave and convex portions on the surfaces of the aluminum alloy substrate. The temperature of the mixed solution is preferably 15 to 25° C. Further, the treatment time in the compound removal step is 5 to 60 seconds. If the treatment time is less than 5 seconds, the reaction time is too short so that it is impossible to sufficiently remove compounds on the surfaces of the aluminum alloy substrate. On the other hand, if the treatment time is more than 60 seconds, the reaction time is too long so that the dissolution of the parent phase of the aluminum alloy substrate proceeds, resulting in larger concave and convex portions on the surfaces of the aluminum alloy substrate. The treatment time is preferably 10 to 30 seconds.

(37) The compound removal step is executed before the grinding step for the aluminum alloy substrate. More specifically, there is employed an order of “inner and outer diameter machining step—stress relief heat treatment step—compound removal step—grinding step”, or an order of “inner and outer diameter machining step—pre-griding step—stress relief heat treatment step—compound removal step—grinding step” or an order of “inner and outer diameter machining step—lathing step—stress relief heat treatment step—compound removal step—grinding step”.

8. Method for Manufacturing Aluminum Alloy Substrate for Magnetic Disk According to First Disclosure

8.1 Outline

(38) With reference to FIG. 1, the method for manufacturing the aluminum alloy substrate for a magnetic disk according to the first disclosure will be described. The aluminum alloy substrate according to the disclosure is manufactured by first production a molten alloy such that the alloy has a predetermined alloy composition (S101), semi-continuously rolling the molten alloy (S102), subjecting an ingot to desired homogenization treatment (S103), executing hot rolling (S104) and cold rolling (S105), to manufacture an aluminum alloy sheet (S106). Note that before or during cold rolling, the rolled plate may be subjected to annealing treatment.

(39) The aluminum alloy sheet thus made is stamped into an annular shape to form an annular disk blank (S107), and this disk blank is subjected to pressure planarization and annealing treatment (S108). Further, the inner and outer peripheral surfaces of the disk blank are subjected to inner and outer diameter machining (S109), and the disk blank is subjected to stress relief heat treatment (S110), compound removal (S111) and grinding (S112). Instead of the steps of S109 to S112, as shown in FIG. 2, after the inner and outer peripheral surfaces of the disk blank are subjected to inner and outer diameter machining (S109), the disk blank may be subjected to pre-grinding (S109-1), stress relief heat treatment (S110), compound removal (S111) and grinding (S112). Further alternatively, as shown in FIG. 3, after the inner and outer peripheral surfaces of the disk blank are subjected to inner and outer diameter machining (S109), the disk blank may be subjected to lathing (S109-2), stress relief heat treatment (S110), compound removal (S111) and grinding (S112). Thus, the disk blank is formed into the aluminum alloy substrate for a magnetic disk (S113). Hereafter, the steps are described in detail.

8-2. Casting Step

(40) First, a molten aluminum alloy is prepared according to a usual method by heating and dissolution such that the aluminum alloy has a predetermined composition range. The thus prepared molten aluminum alloy is cast by a semi-continuous casting method (DC casting method). The cooling rate during casting is preferably in a range of 0.1 to 1000° C./s.

8-3. Homogenization Treatment Step

(41) Next, the cast aluminum alloy ingot is subjected to homogenization treatment as required. The conditions of homogenization treatment are not particularly limited. For example, one-step heat treatment at 500° C. or higher for 0.5 hours or more may be executed. The upper limit of heating temperature during homogenization treatment is not particularly limited, but if the heating temperature is higher than 650° C., there is a fear of occurrence of dissolution of the aluminum alloy, and therefore the upper limit thereof is set to 650° C.

8-4. Hot Rolling Step

(42) The ingot of the aluminum alloy subjected to homogenization treatment or not subjected to homogenization treatment is hot-rolled into a plate. In the hot rolling step, in a case where homogenization treatment has been conducted, a hot rolling start temperature is preferably set to 300 to 550° C. and a hot rolling end temperature is preferably set to lower than 380° C., more preferably to lower than 300° C. The lower limit of the hot rolling end temperature is not particularly limited, but to prevent occurrence of defects, such as edge cracks, the lower limit is set to 200° C. On the other hand, in a case where homogenization treatment has not been conducted, the hot rolling start temperature is preferably set to than 380° C. or lower, more preferably to 350° C. or lower. The lower limit of the hot rolling end temperature is not particularly limited, but to prevent occurrence of defects, such as edge cracks, the lower limit is set to 200° C.

8-5. Cold Rolling Step

(43) Next, the hot-rolled plate is cold-rolled into a cold-rolled sheet having a thickness of 0.45 to 1.8 mm. Thus, the hot-rolled plate is cold-rolled to a required product thickness. The conditions of cold rolling are not particularly limited, but they are only required to be determined according to a required product sheet strength and thickness, and a cold-rolling ratio is preferably set to 10 to 95%. Before or during cold rolling, there may be provided an annealing step for ensuring cold rolling workability. In a case where annealing is executed, for batch-type annealing, for example, the conditions are a temperature of 200° C. or higher and 380° C. or lower and a treatment time of 0.1 to 10 hours.

8-6. Disk Blank-Stamping Step and Pressure Planarization and Annealing Treatment Step

(44) The aluminum alloy sheet made as described above is stamped into an annular shape to prepare an annular aluminum alloy sheet. Then, pressure planarization and annealing treatment is conducted on the annular aluminum alloy sheet at 220 to 450° C. for 30 minutes or more, to prepare a flattened annular disk blank.

8-7. Machining Step, Stress relief Heat Treatment, and Compound Removal Step

(45) Next, the flattened disk blank is subjected, as shown in FIG. 1, to inner and outer diameter machining (S109), stress relief heat treatment (S110), compound removal (S111), and grinding (S112), or as shown in FIG. 2, the pre-grinding step (S109-1) is provided between the steps 109 and S110 appearing in FIG. 1, or alternatively, as shown in FIG. 3, the lathing (S109-2) is provided between t between the steps 109 and S110 appearing in FIG. 1. Here, in the stress relief heat treatment step, the aluminum alloy sheet is subjected to heat treatment preferably at a temperature of 250 to 400° C. for 5 to 15 minutes. Further, the compound removal (S111) is executed as described hereinabove. Thus, the aluminum alloy substrate is obtained.

9. Method for Manufacturing Aluminum Alloy Substrate for Magnetic Disk According to Second Disclosure

9.1 Outline

(46) With reference to FIG. 4, the method for of manufacturing the aluminum alloy substrate for a magnetic disk according to the second disclosure will be described. The aluminum alloy substrate according to the disclosure is manufactured by first producing a molten alloy such that the alloy has a predetermined alloy composition (S101), continuously rolling the molten alloy (S102), subjecting an ingot to desired homogenization treatment (S103), executing cold rolling (S104), to manufacture an aluminum alloy sheet (S105). Note that before or during cold rolling, the rolled plate may be subjected to annealing treatment.

(47) The aluminum alloy sheet thus made is stamped into an annular shape to form an annular disk blank (S106), and this disk blank is subjected to pressure planarization and annealing treatment (S107). Further, the inner and outer peripheral surfaces of the disk blank are subjected to inner and outer diameter machining (S1089), and the disk blank is subjected to stress relief heat treatment (S109), compound removal (S110), and grinding (S111). Instead of the steps of S108 to S11, as shown in FIG. 5, after the inner and outer peripheral surfaces of the disk blank are subjected to inner and outer diameter machining (S108), and the disk blank may be subjected to pre-grinding (S108-1), stress relief heat treatment (S109), compound removal (S110), and grinding (S111). Further alternatively, as shown in FIG. 6, after the inner and outer peripheral surfaces of the disk blank are subjected to inner and outer diameter machining (S108), and the disk blank may be subjected to lathing (S108-2), stress relief heat treatment (S109), compound removal (S110), and grinding (S111). Thus, the disk blank is formed into the aluminum alloy substrate for a magnetic disk (S112). Hereafter, the steps are described in detail.

9-2. Casting Step

(48) First, a molten aluminum alloy is prepared according to a usual method by heating and dissolution such that the aluminum alloy has a predetermined composition range. The thus prepared molten aluminum alloy is cast by a continuous casting method (CC casting method) to form a thin aluminum alloy plate having a thickness of approximately 2.0 to 10.0 mm. Here, in the continuous casting method, the molten metal is supplied between a pair of rolls (alternatively belt casters or block casters) through a casting nozzle, and is cooled by the rollers, to directly cast a rolled plate of the aluminum alloy. In casting a thin rolled plate of the aluminum alloy by the continuous casting method, it is preferably to set the temperature of the rolled plate at the lapse of one minute after being cast to 230 to 350° C. Further, the temperature of the rolled plate at the lapse of ten minutes after being cast to 150° C. or higher and lower than 230° C. Thus, by setting the temperature of the rolled pate at the lapse of one minute to 230 to 350° C. and the temperature of the rolled pate at the lapse of ten minutes after being cast to 150° C. or higher and lower than 230° C., it is possible to disperse a large number of fine second phase particle (mainly Al—Fe compounds) and thereby obtain the effect of strength improvement. By dispersing a large number of such fine second particles, it is possible to further achieve the effect of strength improvement compared with the DC casting method. Note that as a method for cooling the cast plate in the CC casting method, it is possible to employ air cooling with a fan, mist cooling, shower cooling, water cooling, and the like.

9-3. Homogenization Treatment Step

(49) Next, the cast aluminum alloy ingot is subjected to homogenization treatment as required. The conditions of homogenization treatment are not particularly limited. For example, the heating conditions are preferably set to 300 to 450° C. and 0.5 to 24 hours. This suppresses non-uniformity of sizes of second phase particles, whereby it is possible to obtain the effect of reducing variation in the strength and fluttering characteristic of the aluminum alloy substrate.

9-4. Cold Rolling Step

(50) Next, the hot-rolled plate is cold-rolled into a cold-rolled sheet having a thickness of 0.45 to 1.8 mm. Thus, the hot-rolled late is cold-rolled to a required product thickness. The conditions of cold rolling are not particularly limited, but they are only required to be determined according to a required product sheet strength and thickness, and a cold-rolling ratio is preferably set to 10 to 95%. Before or during cold rolling, there may be provided an annealing step for ensuring cold rolling workability. In a case where annealing is executed, for batch-type annealing, for example, the conditions are a temperature of 200° C. or higher and 380° C. or lower and a treatment time of 0.1 to 10 hours.

9-5. Disk blank-Stamping Step and Pressure Planarization and Annealing Treatment Step

(51) The aluminum alloy sheet made as described above is stamped into an annular shape to prepare an annular aluminum alloy sheet. Then, pressure planarization and annealing treatment is conducted on the annular aluminum alloy sheet at 220 to 450° C. for 30 minutes or more, to prepare a flattened annular disk blank.

9-6 Machining Step, Stress Relief Heat Treatment and Compound Removal Step

(52) Next, the flattened disk blank is subjected, as shown in FIG. 1, to inner and outer diameter machining (S108), stress relief heat treatment (S109), compound removal (S110) and grinding (S111), or as shown in FIG. 2, the pre-grinding step (S108-1) is provided between the steps 108 and S109 appearing in FIG. or alternatively, as shown in FIG. 3, the lathing step (S108-2) is provided between the steps 108 and S109 appearing in FIG. 1. Here, in the stress relief heat treatment step, the aluminum alloy sheet is subjected to heat treatment preferably at a temperature of 250 to 400° C. for 5 to 15 minutes. Further, the compound removal (S110) is executed as described above. Thus, the aluminum alloy substrate is obtained.

10. Method for Manufacturing Aluminum Alloy Base Disk for Magnetic Disk

(53) The step of producing an aluminum alloy base disk by treating the aluminum alloy substrate made as described above is the same for the aluminum alloy substrate manufactured in the first disclosure and the aluminum alloy substrate manufactured in the second disclosure. More specifically, after the surfaces of the aluminum alloy substrate are subjected to degreasing treatment, acid etching treatment, and desmutting treatment, the surfaces are subjected to zincate treatment (Zn substitution treatment) (S114 in FIG. 1 and S113 in FIG. 4). Further, the surfaces of the aluminum alloy substrate subjected to the zincate treatment are subjected to Ni—P plating treatment as undercoat treatment (S115 in FIG. 1 and S114 in FIG. 4). Thus, the aluminum alloy base disk for a magnetic disk is made (S116 in FIG. 1 and S115 in FIG. 4). Hereafter, the above-mentioned steps will be described in detail.

(54) Degreasing treatment is preferably performed by using a commercially available degreasing solution of AD-68F (made by C. Uyemura & Co., Ltd.), under the conditions of a temperature of 40 to 70° C., a treatment time of 3 to 10 minutes, and a concentration of 200 to 800 mL/L. Acid etching treatment is preferably performed by using a commercially available degreasing solution of AD-107F (made by C. Uyemura & Co., Ltd.), under the conditions of a temperature of 50 to 75° C., a treatment time of 0.5 to 5 minutes, and a concentration of 20 to 100 mL/L. After the acid etching treatment, usual desmutting treatment is preferably performed using HNO.sub.3 under the conditions of a temperature of 15 to 40° C., a treatment time of 10 to 120 seconds, and a concentration of 10 to 60%.

(55) 1st zincate treatment is performed by using a commercially available zincate treatment solution of AD-301F-3X (made by C. Uyemura & Co., Ltd.), under the conditions of a temperature of 10 to 35° C., a treatment time of 0.1 to 5 minutes, and a concentration of 100 to 500 mL/L. After the 1st zincate treatment, Zn peeling treatment is preferably performed using HNO.sub.3 under the conditions of a temperature of 15 to 40° C., a treatment time of 10 to 120 seconds, and a concentration of 10 to 60%. Thereafter, 2nd zincate treatment is conducted under the same conditions as the 1st zincate treatment.

(56) An electroless Ni—P plating treatment step is performed as undercoat plating treatment on the surfaces of the aluminum alloy base material subjected to 2nd zincate treatment (S115 in FIG. 1 and S114 in FIG. 4). Electroless Ni—P plating treatment is preferably performed using a commercially available plating solution of Nimden HDX (made by C. Uyemura & Co., Ltd.) or the like, under the conditions of a temperature of 80 to 95° C., a treatment time of 30 to 180 minutes, a Ni concentration of 3 to 10 g/L.

(57) Through the plating pretreatment step and the Ni—P plating treatment step, an undercoat-plated aluminum alloy base disk for a magnetic disk is obtained (S116 in FIG. 1 and S115 in FIG. 4).

11. Manufacturing of Magnetic Disk

(58) Finally, the front surface of the aluminum alloy base disk subjected to the undercoat plating treatment is made flat and smooth by polishing, and an undercoat layer is provided on the polished front surface, whereafter a magnetic layer is formed on the undercoat layer by application through spattering (S117 in FIG. 1 and S116 in FIG. 4), to produce a magnetic disk. Note that it is preferable to further provide a protective film and a lubricant layer on the magnetic layer.

EMBODIMENTS

(59) Hereafter, the present disclosure will be described in more detail with reference to Embodiments, which should not be construed as limiting the scope of the invention.

1. First Embodiment

Examples 1 to 47 and Comparative Examples 1 to 23

(60) In the first embodiment, examples are shown in which the DC casting method was used as the method for casting an aluminum alloy.

(61) First, each of aluminum alloys having respective compositions shown in Table 1 was melted in accordance with a usual method to prepare a molten aluminum alloy. Next, the molten aluminum alloy was cast by the DC method to produce an ingot. Opposite sides of the ingot was face-cut to a depth of 15 mm and the ingot was subjected to homogenization treatment at 520° C. for one hours. Then, hot rolling was conducted at a hot-rolling start temperature of 460° C. and a hot-rolling end temperature of 280° C. to form a hot-rolled plate having a thickness of 3.0 mm. The hot-rolled plate was cold-rolled (at a reduction ratio of 73.3%) to a thickness of 0.8 mm to yield a final rolled sheet. The aluminum alloy sheet thus obtained was stamped into an annular shape having an outer diameter of 98 mm and an inner diameter of 24 mm to produce an annular aluminum alloy sheet. Note that in FIG. 1, “−” indicates less than the measurement limit.

(62) TABLE-US-00001 TABLE 1 COMPOSITION (mass %) Al + INEVITABLE ALLOY No. Fe Cu Zn Mn Si Ni Cr Zr Ti IMPURITIES Al 1.2 0.020 0.500 0.7 0.2 — — — — Bal. A2 1.3 0.010 0.300 0.5 — — — — — Bal. A3 0.5 0.010 0.300 0.2 0.2 0.5 — — — Bal. A4 0.1 0.020 0.500 — — — — — — Bal. A5 3.0 0.020 0.500 — — — — — — Bal. A6 1.2 0.005 0.500 — — — — — — Bal. A7 1.2 1.000 0.500 — — — — — — Bal. A8 1.2 0.020 0.005 — — — — — — Bal. A9 1.2 0.020 1.000 — — — — — — Bal. A10 1.2 0.020 0.500 0.1 — — — — — Bal. A11 1.2 0.020 0.500 3.0 — — — — — Bal. A12 1.2 0.020 0.500 — 0.1 — — — — Bal. A13 1.2 0.020 0.500 — 3.0 — — — — Bal. A14 1.2 0.020 0.500 — — 0.1 — — — Bal. A15 1.2 0.020 0.500 — — 8.0 — — — Bal. A16 1.2 0.020 0.500 — — — 0.01 — — Bal. A17 1.2 0.020 0.500 — — — 1.00 — — Bal. A18 1.2 0.020 0.500 — — — — 0.01 — Bal. A19 1.2 0.020 0.500 — — — — 1.00 — Bal. A20 1.2 0.020 0.500 — — — — — 0.005 Bal. A21 1.2 0.020 0.500 — — — — — 0.500 Bal. B1 0.05 0.020 0.500 0.7 — — — — — Bal. B2 3.5 0.020 0.500 0.7 — — — — — Bal. B3 1.2 0.002 0.500 0.7 — — — — — Bal. B4 1.2 1.500 0.500 0.7 — — — — — Bal. B5 1.2 0.020 0.002 0.7 — — — — — Bal. B6 1.2 0.020 1.500 0.7 — — — — — Bal. B7 1.2 0.020 0.500 0.07 — — — — — Bal. B8 1.2 0.020 0.500 3.5 — — — — — Bal. B9 1.2 0.020 0.500 0.7 4.0 — — — — Bal. B10 1.2 0.020 0.500 0.7 — 10.0 — — — Bal. B11 1.2 0.020 0.500 0.7 — — 1.50 — — Bal. B12 1.2 0.020 0.500 0.7 — — — 1.50 — Bal.

(63) The annular aluminum alloy sheet thus obtained was subjected to pressure planarization and annealing under a pressure of 1.5 MPa at 300° C. for 3 hours to yield a disk blank. An aluminum alloy substrate was made by executing steps shown in Tables 2 and 3, and an outer peripheral surface of the aluminum alloy substrate was observed for evaluation. Note that the aluminum alloy sheet was subjected to inner and outer diameter lathing such that it was formed into a shape having an outer diameter of 97 mm and an inner diameter of 25 mm. Note that in Tables 2 and 3, “↑” indicates that values are the same as in the upper row. For example, in the case of inner and outer diameter machining, C1 has the same “outer diameter of 97 mm and inner diameter of 25 mm” as entered in the upper row, and similarly thereafter, C3 to C27 has the “outer diameter of 97 mm and inner diameter of 25 mm”. This also similarly applies to stress relief heat treatment and so forth.

(64) TABLE-US-00002 TABLE 2 INNER AND STRESS OUTER DIAMETER RELIEF COMPOUND MACHINING HEAT REMOVAL STEP OUTER TREAT- HF HNO.sub.3 SOLUTION TREAT- DIAMETER 97 mm MENT CONCEN- CONCEN- TEMPER- MENT STEP INNER PRE- (300° C., TRATION TRATION ATURE TIME No. DIAMETER 25 mm LATHING GRINDING 10 min) (g/L) (mass %) (° C.) (min) C1  ↑ — — ↑ 40 50 25 20 C2  ↑ — — ↑ 10 50 25 20 C3  ↑ — — ↑ 80 50 25 20 C4  ↑ — — ↑ 40 10 25 20 C5  ↑ — — ↑ 40 60 25 20 C6  ↑ — — ↑ 40 50 10 20 C7  ↑ — — ↑ 40 50 30 20 C8  ↑ — — ↑ 40 50 25 5 C9  ↑ — — ↑ 40 50 25 60 C10 ↑ — 10 μm ↑ 40 50 25 20 (ONE SIDE) C11 ↑ — 10 μm ↑ 10 50 25 20 (ONE SIDE) C12 ↑ — 10 μm ↑ 80 50 25 20 (ONE SIDE) C13 ↑ — 10 μm ↑ 40 10 25 20 (ONE SIDE) C14 ↑ — 10 μm ↑ 40 60 25 20 (ONE SIDE) C15 ↑ — 10 μm ↑ 40 50 10 20 (ONE SIDE) C16 ↑ — 10 μm ↑ 40 50 30 20 (ONE SIDE) C17 ↑ — 10 μm ↑ 40 50 25 5 (ONE SIDE) C18 ↑ — 10 μm ↑ 40 50 25 60 (ONE SIDE) C19 ↑ 10 μm — ↑ 40 50 25 20 (ONE SIDE) C20 ↑ 10 μm — ↑ 10 50 25 20 (ONE SIDE) C21 ↑ 10 μm — ↑ 80 50 25 20 (ONE SIDE) C22 ↑ 10 μm — ↑ 40 10 25 20 (ONE SIDE) C23 ↑ 10 μm — ↑ 40 60 25 20 (ONE SIDE) C24 ↑ 10 μm — ↑ 40 50 10 20 (ONE SIDE) C25 ↑ 10 μm — ↑ 40 50 30 20 (ONE SIDE) C26 ↑ 10 μm — ↑ 40 50 25 5 (ONE SIDE) C27 ↑ 10 μm — ↑ 40 50 25 60 (ONE SIDE) ALKALINE DE- ACID 1st Zn 2nd ELECTRO- GREASING ETCHING DESMUTTING ZINCATE PEELING ZINCATE LESS Ni—P AD-68F AD-107F HNO.sub.3 AD-301F HNO.sub.3 AD-301F PLATING (400 mL/L) (50 mL/L) (30 mass %) (300 mL/L) (30 mass %) (300 mL/L) HDX STEP (50° C., (60° C., (25° C., (25° C., (25° C., (25° C., (90° C., No. GRINDING 5 min) 3 min) 50 sec) 50 sec) 50 sec) 1 min) 120 min) C1  15 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) C2  15 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) C3  15 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) C4  15 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) C5  15 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) C6  15 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) C7  15 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) C8  15 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) C9  15 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) C10  5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) C11  5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) C12  5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) C13  5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) C14  5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) C15  5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) C16  5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) C17  5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) C18  5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) C19  5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) C20  5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) C21  5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) C22  5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) C23  5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) C24  5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) C25  5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) C26  5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) C27  5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE)

(65) TABLE-US-00003 TABLE 3 INNER AND STRESS OUTER DIAMETER RELIEF COMPOUND MACHINING HEAT REMOVAL STEP OUTER TREAT- HF HNO.sub.3 SOLUTION TREAT- DIAMETER 97 mm MENT CONCEN- CONCEN- TEMPER- MENT STEP INNER PRE- (300° C., TRATION TRATION ATURE TIME No. DIAMETER 25 mm LATHING GRINDING 10 min) (g/L) (mass %) (° C.) (min) D1  ↑ — — ↑ NONE NONE NONE NONE D2  ↑ — 10 μm ↑ NONE NONE NONE NONE (ONE SIDE) D3  ↑ 10 μm — ↑ NONE NONE NONE NONE (ONE SIDE) D4  ↑ — 10 μm ↑ 5 50 25 20 (ONE SIDE) D5  ↑ — 10 μm ↑ 100 50 25 20 (ONE SIDE) D6  ↑ — 10 μm ↑ 40 5 25 20 (ONE SIDE) D7  ↑ — 10 μm ↑ 40 70 25 20 (ONE SIDE) D8  ↑ — 10 μm ↑ 40 50 5 20 (ONE SIDE) D9  ↑ — 10 μm ↑ 40 50 40 20 (ONE SIDE) D10 ↑ — 10 μm ↑ 40 50 25 2 (ONE SIDE) D11 ↑ — 10 μm ↑ 40 50 25 70 (ONE SIDE) ALKALINE ACID 1st Zn 2nd ELECTRO- DE- ETCHING DESMUTTING ZINCATE PEELING ZINCATE LESS Ni—P GREASING AD-107F HNO.sub.3 AD-301F HNO.sub.3 AD-301F PLATING AD-68F (50 mL/L) (30 mass %) (300 mL/L) (30 mass %) (300 mL/L) HDX STEP (400 mL/L) (60° C., (25° C., (25° C., (25° C., (25° C., (90° C., No. GRINDING (50° C., 5 min) 3 min) 50 sec) 50 sec) 50 sec) 1 min) 120 min) D1  15 μm  ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) D2  5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) D3  5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) D4  5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) D5  5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) D6  5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) D7  5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) D8  5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) D9  5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) D10 5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE) D11 5 μm ↑ ↑ ↑ ↑ ↑ ↑ ↑ (ONE SIDE)

(66) Thereafter, the aluminum alloy substrate was subjected to plating pretreatment. First, alkaline degreasing was conducted using AD-68F (made by C. Uyemura & Co., Ltd.) with a concentration of 400 mL/L at 50° C. for 5 minutes, and then acid etching was conducted using AD-107F (made by C. Uyemura & Co., Ltd.) with a concentration of 50 mL/L at 60° C. for 3 minutes. Further, desmutting was conducted using a 30% HNO.sub.3 aqueous solution at room temperature (25° C.) for 50 seconds. Then, 1st zincate treatment was conducted using a zincate treatment solution (AD-301F made by C. Uyemura & Co., Ltd.) with a concentration of 300 mL/L at 25° C. for 50 seconds. After the 1st zincate treatment, peeling of a zincate (Zn) layer was conducted using a 30% HNO.sub.3 aqueous solution (25° C.) for 60 seconds, and 2nd zincate treatment was conducted using a zincate treatment solution (AD-301F made by C. Uyemura & Co., Ltd.) with a concentration of 300 mL/L at 25° C. for one minute.

(67) On the aluminum alloy substrate subjected to the 2nd zincate treatment, electroless plating of Ni—P was conducted using an electroless Ni—P plating solution (Nimden HDX, made by C. Uyemura & Co., Ltd.) at 90° C. to a thickness of 14 (120 minutes), and then finish polishing was conducted using a feather cloth (one-side polishing quantity of 4 μm) to obtain an aluminum alloy base disk for evaluation. Then, evaluation was performed by observing an outer peripheral surface of the aluminum alloy base disk.

Evaluation 1: Observation of Outer Peripheral Surface After Grinding

(68) An aluminum alloy substrate after grinding immediately before plating pretreatment was used as a sample for evaluation, and an outer peripheral surface of the aluminum alloy substrate was photographed at a magnification of 2000 times via five fields of view using a digital microscope (VHX-6000 made by Keyence Corporation). From the photographed images, the maximum diameters and number of holes were measured for evaluation. The number of holes per 1 mm.sup.2 was calculated as an average of values thereof obtained via the five fields of view. When the number of holes having a maximum diameter of 10 um or more was less than 100/mm.sup.2, an evaluation of “Excellent” (A) was given, when the same was 100/mm.sup.2 or more and 200/mm.sup.2 or less, an evaluation of “Good” (B) was given, and when the same was more than 200/mm.sup.2, an evaluation of “Poor” (C) was given. “Excellent” (A) and “Good” (B) were regarded as acceptable and “Poor” (C) was regarded as unacceptable. Results are shown in Tables 4 and 5.

(69) TABLE-US-00004 TABLE 4 OUTER PERIPHERAL OUTER PERIPHERAL SURFACE OF SURFACE OF ALUMINUM ALUMINUM PLATING FLUTTERING ALLOY STEP ALLOY SUBSTRATE ALLOY BASE DISK SMOOTHNESS CHARACTERISTIC EXAMPLE 1 A1 C1 A A A A EXAMPLE 2 A1  C10 A A A A EXAMPLE 3 A1  C19 A A A A EXAMPLE 4 A2 C1 A A A A EXAMPLE 5 A3 C1 A A A A EXAMPLE 6 A4 C1 B B B B EXAMPLE 7 A5 C1 B B B A EXAMPLE 8 A6 C1 B B B B EXAMPLE 9 A7 C1 B B B A EXAMPLE 10 A8 C1 B B B B EXAMPLE 11 A9 C1 B B B A EXAMPLE 12  A10 C1 A A A B EXAMPLE 13  A11 C1 B B B A EXAMPLE 14  A12 C1 A A A A EXAMPLE 15  A13 C1 B B B A EXAMPLE 16  A14 C1 A A A A EXAMPLE 17  A15 C1 B B B A EXAMPLE 18  A16 C1 A A A A EXAMPLE 19  A17 C1 A A A A EXAMPLE 20  A18 C1 A A A A EXAMPLE 21  A19 C1 A A A A EXAMPLE 22  A20 C1 A A A A EXAMPLE 23  A21 C1 B B B A COMPARATIVE B1 C1 A A A C EXAMPLE 1 COMPARATIVE B2 C1 C C C A EXAMPLE 2 COMPARATIVE B3 C1 B B C C EXAMPLE 3 COMPARATIVE B4 C1 C C C A EXAMPLE 4 COMPARATIVE B5 C1 B B C C EXAMPLE 5 COMPARATIVE B6 C1 C C C A EXAMPLE 6 COMPARATIVE B7 C1 A A A C EXAMPLE 7 COMPARATIVE B8 C1 C C C A EXAMPLE 8 COMPARATIVE B9 C1 C C C A EXAMPLE 9 COMPARATIVE  B10 C1 — — — — EXAMPLE 10 COMPARATIVE  B11 C1 C C C A EXAMPLE 11 COMPARATIVE  B12 C1 C C C A EXAMPLE 12

(70) TABLE-US-00005 TABLE 5 OUTER PERIPHERAL OUTER PERIPHERAL SURFACE OF SURFACE OF ALUMINUM ALUMINUM PLATING FLUTTERING ALLOY STEP ALLOY SUBSTRATE ALLOY BASE DISK SMOOTHNESS CHARACTERISTIC EXAMPLE 24 A1 C2  A A A A EXAMPLE 25 A1 C3  B B B A EXAMPLE 26 A1 C4  A A A A EXAMPLE 27 A1 C5  A A A A EXAMPLE 28 A1 C6  B B B A EXAMPLE 29 A1 C7  B B B A EXAMPLE 30 A1 C8  B B B A EXAMPLE 31 A1 C9  A A A A EXAMPLE 32 A1 C11 A A A A EXAMPLE 33 A1 C12 B B B A EXAMPLE 34 A1 C13 A A A A EXAMPLE 35 A1 C14 A A A A EXAMPLE 36 A1 C15 B B B A EXAMPLE 37 A1 C16 B B B A EXAMPLE 38 A1 C17 B B B A EXAMPLE 39 A1 C18 A A A A EXAMPLE 40 A1 C20 A A A A EXAMPLE 41 A1 C21 B B B A EXAMPLE 42 A1 C22 A A A A EXAMPLE 43 A1 C23 A A A A EXAMPLE 44 A1 C24 B B B A EXAMPLE 45 A1 C25 B B B A EXAMPLE 46 A1 C26 B B B A EXAMPLE 47 A1 C27 A A A A COMPARATIVE A1 D1  A C B A EXAMPLE 13 COMPARATIVE A1 D2  A C B A EXAMPLE 14 COMPARATIVE A1 D3  A C B A EXAMPLE 15 COMPARATIVE A1 D4  B C B A EXAMPLE 16 COMPARATIVE A1 D5  C C C A EXAMPLE 17 COMPARATIVE A1 D6  B C C A EXAMPLE 18 COMPARATIVE A1 D7  B C B A EXAMPLE 19 COMPARATIVE A1 D8  B C B A EXAMPLE 20 COMPARATIVE A1 D9  C C C A EXAMPLE 21 COMPARATIVE A1 D10 B C B A EXAMPLE 22 COMPARATIVE A1 D11 C C C A EXAMPLE 23

Evaluation 2: Observation of Outer Peripheral Surface of Aluminum Alloy Base Disk After Electroless Ni—P Plating

(71) An aluminum alloy base disk after electroless Ni—P plating was used as a sample for evaluation, and an outer peripheral surface of the aluminum alloy base disk was photographed at a magnification of 1000 times via five fields of view using an SEM. From the photographed images, the maximum diameters and number of convex portions were measured for evaluation. The number of convex portions per 1 mm.sup.2 was calculated as an average of values thereof obtained via the five fields of view. When the number of convex portions having a maximum diameter of 4 to 10 pm was less than 150/mm.sup.2, an evaluation of “Excellent” (A) was given, when the same was 150/mm.sup.2 or more and 300/mm.sup.2 or less, an evaluation of “Good” (B) was given, and when the same was more than 300/mm.sup.2, an evaluation of “Poor” (C) was given. “Excellent” (A) and “Good” (B) were regarded as acceptable and “Poor” (C) was regarded as unacceptable. Results are shown in Tables 4 and 5.

Evaluation 3: Plating Smoothness

(72) An aluminum alloy base disk after electroless Ni—P plating was used as a sample for evaluation, and was immersed in a 50% by volume solution of nitric acid at 50° C. for three minutes to etch the Ni—P plated front surface. Five fields of view of the etched Ni—P plated front surface were photographed using an SEM at a magnification of 5000 times. The area of each field of view was set to 536 μm.sup.2. The numbers of plating defects were measured based on images obtained by photographing the five fields of view, and the arithmetic mean value of values obtained via the five fields of view was determined. When the arithmetic mean value was less than 5 per field of view, an evaluation of “Excellent” (A) was given, when the same was 5 or more and less than 10 per field of view, an evaluation of “Good” (B) was given, and when the same was 10 or more per field of view, an evaluation of “Poor” (C) was given. “Excellent” (A) and “Good” (B) were regarded as acceptable while “Poor” (C) was regarded as unacceptable. Results are shown in Tables 4 and 5.

Evaluation 4: Fluttering Characteristic

(73) The aluminum alloy base disk after electroless Ni—P plating and surface polishing was used as a sample for evaluation of a fluttering characteristic. Note that evaluation should be performed on a magnetic disk having a magnetic substance applied thereto, as a product, but it was already confirmed that results of evaluation of aluminum alloy base disks do not differ from those of evaluation of magnetic disks.

(74) The fluttering characteristic was evaluated by placing the sample for evaluation on a commercially available hard disk drive in the presence of air. ST2000 (trade name) manufactured by Seagate Technology Inc. was used as the hard disk drive, and a motor to which SLD102 (trade name) manufactured by Techno Alive Co. was directly connected was driven. The rotational speed of the motor was set to 7200 rpm, and a plurality of disks were always set to observe the vibrations of a surface of the top magnetic disk of each disk using LDV1800 (trade name), which is a laser Doppler meter manufactured by ONO SOKKI CO., LTD. The observed vibrations were subjected to spectrum analysis using an FFT analysis apparatus DS3200 (trade name) manufactured by ONO SOKKI CO., LTD. The observation was performed by observing the disk surface through a hole formed in the lid of the hard disk drive. In addition, the evaluation was performed by removing a squeeze plate set in the commercially available hard disk.

(75) A fluttering characteristic was evaluated with the maximum displacement (disk fluttering (nm)) of a broad peak in an approximate range of 300 to 1500 Hz at which fluttering appears. Such a broad peak, referred to as non-repeatable run out (NRRO), is known to have a significant influence on the positioning error of a head. As evaluation of a fluttering characteristic in air, when the maximum displacement is 30 nm or less, an evaluation of “Excellent” (A) was given, when the same was more than 30 nm and 50 nm or less, an evaluation of “Good” (B) was given, and when the same was more than 50 nm, an evaluation of “Poor” (C) was given. “Excellent” (A) and “Good” (B) were regarded as acceptable while “Poor” (C) was regarded as unacceptable. Results are shown in Tables 4 and 5.

(76) Examples 1 to 23 and Comparative Examples 1 to 12 are examples with the varying compositions of aluminum alloys, while Examples 24 to 47 and Comparative Examples 13 to 23 are examples with varying steps of treatment of aluminum alloy substrates.

(77) In Examples 1 to 47, all evaluation results were acceptable because the alloy compositions and the conditions of the compound removal step thereof were within the scope of the present disclosure.

(78) In Comparative Example 1, the number of second phase particles was small because of the small content of Fe, so that the fluttering characteristic was unacceptable.

(79) In Comparative Example 2, the amount of coarse Al—Fe-based compounds was large because of the large content of Fe so that a large number of holes were found after the compound removal step and accordingly a large number of convex portions were also found after Ni—P plating. As a result, plating smoothness was unacceptable.

(80) In Comparative Example 3, the number of second phase particles was small because of the small content of Cu, so that the fluttering characteristic was unacceptable. Further, plating smoothness was unacceptable because a zincate film was non-uniform and defects were generated in the plated front surface.

(81) In Comparative Example 4, the amount of coarse Al—Cu-based compounds was large because of the large content of Cu, so that a large number of holes were found after the compound removal step and accordingly a large number of convex portions were also found after Ni—P plating. As a result, plating smoothness was unacceptable.

(82) In Comparative Example 5, the number of second phase particles was small because of the small content of Zn, so that the fluttering characteristic was unacceptable. In addition, a zincate film was non-uniform, so that defects were generated on the plated front surface, and therefore plating smoothness was unacceptable.

(83) In Comparative Example 6, the potential of a parent phase was too electronegative because of the large content of Zn, and therefore, the parent phase was intensively dissolved in each step of plating treatment, causing generation of a large number of concave and convex portions. As a result, there were found to have been generated convex portions on the outer peripheral surface and defects on the plated front surface after Ni—P plating, so that plating smoothness was unacceptable.

(84) In Comparative Example 7, the number of second phase particles was small because of the small content of Mn, so that the fluttering characteristic was unacceptable.

(85) In Comparative Example 8, the amount of coarse Al—Mn-based compounds was large because of the large content of Mn, so that a large number of holes were found after the compound removal step and accordingly a large number of convex portions were also found after Ni—P plating. As a result, plating smoothness was unacceptable.

(86) In Comparative Example 9, the number of coarse Si particles was large because of the large content of Si, and it was impossible to remove the coarse Si particles even if the compound removal step was applied. Therefore, there were found to have been generated convex portions on the outer peripheral surface and defects on the plated front surface after Ni—P plating, so that plating smoothness was unacceptable.

(87) In Comparative Example 10, it was impossible to perform rolling because of the large content of Ni, so that it was impossible to obtain a sample for evaluation.

(88) In Comparative Example 11, the amount of coarse Al—Cr-based compounds was large because of the large content of Cr, and it was impossible to remove the coarse Al—Cr-based compounds even if the compound removal step was applied. Therefore, there were found to have been generated convex portions on the outer peripheral surface and defects on the plated front surface after Ni—P plating, so that plating smoothness was unacceptable.

(89) In Comparative Example 12, the amount of coarse Al—Zn-based compounds was large because of the large content of Zn, and it was impossible to remove the coarse Al—Zn-based compounds even if the compound removal step was applied. Therefore, there were found to have been generated convex portions on the outer peripheral surface and defects on the plated front surface after Ni—P plating, so that plating smoothness was unacceptable.

(90) In Comparative Examples 13 to 15, the compound removal step was not applied. As a result, although plating smoothness was good due to polishing of the front surface, a large number of convex portions were found on the outer peripheral surface after plating, causing generation of a large number of nodules, so that each Comparative Example was unacceptable.

(91) In Comparative Example 16, it was impossible to sufficiently remove compounds on the outer peripheral surface because of a low concentration of HF in a chemical liquid used for the compound removal step, so that there were found a large number of convex portions on the outer peripheral surface after plating, causing generation of a large number of nodules, so that Comparative Example 16 was unacceptable.

(92) In Comparative Example 17, the amount of dissolution of the aluminum alloy substrate was large because of a high concentration of HF in a chemical liquid used for the compound removal step, and a large number of concave and convex portions were generated, so that there were found a large number of convex portions on the outer peripheral surface and defects on the plated front surface after plating, to produce plating smoothness unacceptable.

(93) In Comparative Example 18, it was impossible to sufficiently remove compounds on the outer peripheral surface because of a low concentration of HF in a chemical liquid used for the compound removal step, so that there were found a large number of convex portions on the outer peripheral surface after plating, causing generation of a large number of nodules. Further, the amount of dissolution of the aluminum alloy substrate was large and a large number of concave and convex portions were generated, causing defects to be generated on the plated front surface, so that plating smoothness was unacceptable.

(94) In Comparative Example 19, it was impossible to sufficiently remove compounds on the outer peripheral surface because of too high a concentration of HNO.sub.3 in a chemical liquid used for the compound removal step, so that there were found a large number of convex portions on the end faces of the outer peripheral portion after plating, causing generation of a large number of nodules, which made Comparative Example 19 unacceptable.

(95) In Comparative Example 20, the temperature of a chemical liquid used for the compound removal step was low so that the reaction rate was low and it was impossible to sufficiently remove compounds and sufficiently remove compounds on the outer peripheral surface. As a result, there were found a large number of convex portions on the outer peripheral surface after plating, causing generation of a large number of nodules, which made Comparative Example 20 unacceptable.

(96) In Comparative Example 21, the temperature of a chemical liquid used for the compound removal step was high so that the reaction rate was high to produce the amount of dissolution of the aluminum alloy substrate large, causing generation of a large number of concave and convex portions. As a result, there were found a large number of convex portions on the outer peripheral surface and defects on the plated front surface after Ni—P plating, so that plating smoothness was unacceptable.

(97) In Comparative Example 22, the reaction time was not sufficient because of a short time of the compound removal step, so that compounds were not sufficiently removed and it was impossible to sufficiently remove compounds on the outer peripheral surface. As a result, there were found a large number of convex portions on the outer peripheral surface after plating, causing generation of a large number of nodules, which made Comparative Example 22 unacceptable.

(98) In Comparative Example 23, the reaction proceeds too much because of a long time of the compound removal step, so that the amount of dissolution of the aluminum substrate was large and a large number of concave and convex portions were generated. As a result, there were found to have been generated convex portions on the outer peripheral surface and defects on the plated front surface after Ni—P plating, so that plating smoothness was unacceptable.

2. Second Embodiment

Examples 48 to 94 and Comparative Examples 24 to 46

(99) In the second embodiment, examples are shown in which the CC casting method was used as the method for casting an aluminum alloy.

(100) First, each of aluminum alloys having respective compositions shown in Table 1 was melted in accordance with a usual method to prepare a molten aluminum alloy. Next, the molten aluminum alloy was cast by the CC method to produce a thin cast plate having a thickness of 6 mm. Next, the cast plate was cold-rolled to a thickness of 0.8 mm to yield a final rolled sheet. The aluminum alloy sheet thus obtained was stamped into an annular shape having an outer diameter of 98 mm and an inner diameter of 24 mm to produce an annular aluminum alloy sheet.

(101) The annular aluminum alloy sheet thus obtained was subjected to pressure planarization and annealing under a pressure of 1.5 MPa at 300° C. for 3 hours to yield a disk blank. An aluminum alloy substrate was made by executing the steps shown in Tables 2 and 3, and an outer peripheral surface of the aluminum alloy substrate was observed for evaluation. Note that the aluminum alloy sheet was subjected to inner and outer diameters lathing such that it was formed into a shape having an outer diameter of 97 mm and an inner diameter of 25 mm.

(102) Thereafter, the aluminum alloy substrate was subjected to plating pretreatment. First, alkaline degreasing was conducted using AD-68F (made by C. Uyemura & Co., Ltd.) with a concentration of 400 mL/L at 50° C. for 5 minutes, and then acid etching was conducted using AD-107F (made by C. Uyemura & Co., Ltd.) with a concentration of 50 mL/L at 60° C. for 3 minutes. Further, desmutting was conducted using a 30% HNO.sub.3 aqueous solution at room temperature (25° C.) for 50 seconds. Then, 1st zincate treatment was conducted using a zincate treatment solution (AD-301F made by C. Uyemura & Co., Ltd.) with a concentration of 300 mL/L at 25° C. for 50 seconds. After the 1st zincate treatment, peeling of a zincate (Zn) layer was conducted using a 30% HNO.sub.3 aqueous solution (25° C.) for 60 seconds, and 2nd zincate treatment was conducted using a zincate treatment solution (AD-301F made by C. Uyemura & Co., Ltd.) with a concentration of 300 mL/L at 25° C. for one minute.

(103) On the aluminum alloy substrate subjected to the 2nd zincate treatment, electroless plating of Ni—P was conducted using an electroless Ni—P plating solution (Nimden HDX made by C. Uyemura & Co., Ltd.) at 90° C. (120 minutes) to a thickness of 14 μm, and then finish polishing was conducted using a feather cloth (one-side polishing quantity of 4 μm) to obtain an aluminum alloy base disk for evaluation. Then, evaluation was performed by observing an outer peripheral surface of the aluminum alloy base disk.

Evaluation 1: Observation of Outer Peripheral Surface After Grinding

(104) An aluminum alloy substrate after grinding immediately before plating pretreatment was used as a sample for evaluation, and an outer peripheral surface of the aluminum alloy substrate was photographed at a magnification of 2000 times via five fields of view using a digital microscope (VHX-6000 made by Keyence Corporation). From the photographed images, the maximum diameters and number of holes were measured for evaluation. The number of holes per 1 mm.sup.2 was calculated as an average of values thereof obtained via the five fields of view. When the number of holes having a maximum diameter of 10 μm or more was less than 100/mm.sup.2, an evaluation of excellent (A) was given, when the same was 100/mm.sup.2 or more and 200/mm.sup.2 or less, an evaluation of good (B) was given, and when the same was more than 200/mm.sup.2, an evaluation of poor (C) was given. “Excellent” (A) and “Good” (B) were regarded as acceptable while “Poor” (C) was regarded as unacceptable. Results are shown in Tables 6 and 7.

(105) TABLE-US-00006 TABLE 6 OUTER PERIPHERAL OUTER PERIPHERAL SURFACE OF SURFACE OF ALUMINUM ALUMINUM PLATING FLUTTERING ALLOY STEP ALLOY SUBSTRATE ALLOY BASE DISK SMOOTHNESS CHARACTERISTIC EXAMPLE 48 A1  C1 A A A A EXAMPLE 49 A1   C10 A A A A EXAMPLE 50 A1   C19 A A A A EXAMPLE 51 A2  C1 A A A A EXAMPLE 52 A3  C1 A A A A EXAMPLE 53 A4  C1 B B B B EXAMPLE 54 A5  C1 B B B A EXAMPLE 55 A6  C1 B B B B EXAMPLE 56 A7  C1 B B B A EXAMPLE 57 A8  C1 B B B B EXAMPLE 58 A9  C1 B B B A EXAMPLE 59 A10 C1 A A A B EXAMPLE 60 A11 C1 B B B A EXAMPLE 61 A12 C1 A A A A EXAMPLE 62 A13 C1 B B B A EXAMPLE 63 A14 C1 A A A A EXAMPLE 64 A15 C1 B B B A EXAMPLE 65 A16 C1 A A A A EXAMPLE 66 A17 C1 A A A A EXAMPLE 67 A18 C1 A A A A EXAMPLE 68 A19 C1 A A A A EXAMPLE 69 A20 C1 A A A A EXAMPLE 70 A21 C1 B B B A COMPARATIVE B1  C1 A A A C EXAMPLE 24 COMPARATIVE B2  C1 C C C A EXAMPLE 25 COMPARATIVE B3  C1 B B C C EXAMPLE 26 COMPARATIVE B4  C1 C C C A EXAMPLE 27 COMPARATIVE B5  C1 B B C C EXAMPLE 28 COMPARATIVE B6  C1 C C C A EXAMPLE 29 COMPARATIVE B7  C1 A A A C EXAMPLE 30 COMPARATIVE B8  C1 C C C A EXAMPLE 31 COMPARATIVE B9  C1 C C C A EXAMPLE 32 COMPARATIVE B10 C1 — — — — EXAMPLE 33 COMPARATIVE B11 C1 C C C A EXAMPLE 34 COMPARATIVE B12 C1 C C C A EXAMPLE 35

(106) TABLE-US-00007 TABLE 7 OUTER PERIPHERAL OUTER PERIPHERAL SURFACE OF SURFACE OF ALUMINUM ALUMINUM PLATING FLUTTERING ALLOY STEP ALLOY SUBSTRATE ALLOY BASE DISK SMOOTHNESS CHARACTERISTIC EXAMPLE 71 A1 C2  A A A A EXAMPLE 72 A1 C3  B B B A EXAMPLE 73 A1 C4  A A A A EXAMPLE 74 A1 C5  A A A A EXAMPLE 75 A1 C6  B B B A EXAMPLE 76 A1 C7  B B B A EXAMPLE 77 A1 C8  B B B A EXAMPLE 78 A1 C9  A A A A EXAMPLE 79 A1 C11 A A A A EXAMPLE 80 A1 C12 B B B A EXAMPLE 81 A1 C13 A A A A EXAMPLE 82 A1 C14 A A A A EXAMPLE 83 A1 C15 B B B A EXAMPLE 84 A1 C16 B B B A EXAMPLE 85 A1 C17 B B B A EXAMPLE 86 A1 C18 A A A A EXAMPLE 87 A1 C20 A A A A EXAMPLE 88 A1 C21 B B B A EXAMPLE 89 A1 C22 A A A A EXAMPLE 90 A1 C23 A A A A EXAMPLE 91 A1 C24 B B B A EXAMPLE 92 A1 C25 B B B A EXAMPLE 93 A1 C26 B B B A EXAMPLE 94 A1 C27 A A A A COMPARATIVE A1 D1  A C B A EXAMPLE 36 COMPARATIVE A1 D2  A C B A EXAMPLE 37 COMPARATIVE A1 D3  A C B A EXAMPLE 38 COMPARATIVE A1 D4  B C B A EXAMPLE 39 COMPARATIVE A1 D5  C C C A EXAMPLE 40 COMPARATIVE A1 D6  B C C A EXAMPLE 41 COMPARATIVE A1 D7  B C B A EXAMPLE 42 COMPARATIVE A1 D8  B C B A EXAMPLE 43 COMPARATIVE A1 D9  C C C A EXAMPLE 44 COMPARATIVE A1 D10 B C B A EXAMPLE 45 COMPARATIVE A1 D11 C C C A EXAMPLE 46

Evaluation 2: Observation of Outer Peripheral Surface of Aluminum Alloy Base Disk After Electroless Ni—P Plating

(107) An aluminum alloy base disk after electroless Ni—P plating was used as a sample for evaluation, and an outer peripheral surface of the aluminum alloy base disk was photographed at a magnification of 1000 times via five fields of view using an SEM. From the photographed images, the maximum diameters and number of convex portions were measured for evaluation. The number of convex portions per 1 mm.sup.2 was calculated as an average of values thereof obtained via the five fields of view. When the number of convex portions having a maximum diameter of 4 to 10 μm was less than 150/mm.sup.2, an evaluation of “Excellent” (A) was given, when the same was 150/mm.sup.2 or more and 300/mm.sup.2 or less, an evaluation of “Good” (B) was given, and when the same was more than 300/mm.sup.2, an evaluation of “Poor” (C) was given. “Excellent” (A) and “Good ” (B) were regarded as acceptable and “Poor” (C) was regarded as unacceptable. Results are shown in Tables 4 and 5.

Evaluation 3: Plating Smoothness

(108) An aluminum alloy base disk after electroless Ni—P plating was used as a sample for evaluation, and was immersed in a 50% by volume solution of nitric acid at 50° C. for three minutes to etch the Ni—P plated front surface. Five fields of view of the etched Ni—P plated front surface were photographed using an SEM at a magnification of 5000 times. Note that the area of each field of view was set at 536 The numbers of plating defects were measured based on images obtained by photographing the five fields of view, and the arithmetic mean value of values obtained via the five fields of view was determined. When the arithmetic mean value was less than 5 per field of view, an evaluation of “Excellent” (A) was given, when the same was 5 or more and less than 10 per field of view, an evaluation of “Good” (B) was given, and when the same was 10 or more per field of view, an evaluation of “Poor” (C) was given. “Excellent” (A) and

(109) “Good” (B) were regarded as acceptable while “Poor” (C) was regarded as unacceptable. Results are shown in Tables 6 and 7.

Evaluation 4: Fluttering Characteristic

(110) The aluminum alloy base disk after electroless Ni—P plating and surface polishing was used as a sample for evaluation of a fluttering characteristic. Note that evaluation should be performed on a magnetic disk having a magnetic substance applied thereto, as a product, but it was already confirmed that results of evaluation of aluminum alloy base disks do not differ from those of evaluation of magnetic disks.

(111) The fluttering characteristic was evaluated by placing the sample for evaluation on a commercially available hard disk drive in the presence of air. ST2000 (trade name) manufactured by Seagate Technology Inc. was used as the hard disk drive, and a motor to which SLD102 (trade name) manufactured by Techno Alive Co. was directly connected was driven. The rotational speed of the motor was set to 7200 rpm, and a plurality of disks were always set to observe the vibrations of a surface of the top magnetic disk of each disk using LDV1800 (trade name), which is a laser Doppler meter manufactured by ONO SOKKI CO., LTD. The observed vibrations were subjected to spectrum analysis using an FFT analysis apparatus DS3200 (trade name) manufactured by ONO SOKKI CO., LTD. The observation was performed by observing the disk surface through a hole formed in the lid of the hard disk drive. In addition, the evaluation was performed by removing a squeeze plate set in the commercially available hard disk.

(112) A fluttering characteristic was evaluated with the maximum displacement (disk fluttering (nm)) of a broad peak in an approximate range of 300 to 1500 Hz at which fluttering appears. Such a broad peak, referred to as non-repeatable run out (NRRO), is known to have a significant influence on the positioning error of a head. As evaluation of a fluttering characteristic in air, when the maximum displacement is 30 nm or less, an evaluation of “Excellent” (A) was given, when the same was more than 30 nm and 50 nm or less, an evaluation of “Good” (B) was given, and when the same was more than 50 nm, an evaluation of “Poor” (C) was given. “Excellent” (A) and “Good” (B) were regarded as acceptable while “Poor” (C) was regarded as unacceptable. Results are shown in Tables 6 and 7.

(113) Examples 48 to 70 and Comparative Examples 24 to 35 are examples with the varying compositions of aluminum alloys, while Examples 71 to 94 and Comparative Examples 36 to 46 are examples with varying steps of treatment of aluminum alloy substrates.

(114) In Examples 48 to 94, all evaluation results were acceptable because the alloy compositions and the conditions of the compound removal step thereof were within the scope of the present disclosure.

(115) In Comparative Example 24, the number of second phase particles was small because of the small content of Fe, so that the fluttering characteristic was unacceptable.

(116) In Comparative Example 25, the amount of coarse Al—Fe-based compounds was large because of the large content of Fe, so that a large number of holes were found after the compound removal step and accordingly a large number of convex portions were also found after Ni—P plating. As a result, plating smoothness was unacceptable.

(117) In Comparative Example 26, the number of second phase particles was small because of the small content of Cu, so that the fluttering characteristic was unacceptable. Further, plating smoothness was unacceptable because a zincate film was non-uniform and defects were generated on the plated front surface.

(118) In Comparative Example 27, the amount of coarse Al—Cu-based compounds was large because of the large content of Cu, so that a large number of holes were found after the compound removal step and accordingly a large number of convex portions were also found after Ni—P plating. As a result, plating smoothness was unacceptable.

(119) In Comparative Example 28, the number of second phase particles was small because of the small content of Zn, so that the fluttering characteristic was unacceptable. In addition, a zincate film was non-uniform, so that defects were generated on the plated front surface, and therefore plating smoothness was also unacceptable.

(120) In Comparative Example 29, the potential of a parent phase was too electronegative because of the large content of Zn, and therefore, the parent phase was intensively dissolved in each step of plating treatment, causing generation of a large number of concave and convex portions. As a result, there were found to have been generated convex portions on the outer peripheral surface and defects on the plated front surface after Ni—P plating, so that plating smoothness was unacceptable.

(121) In Comparative Example 30, the number of second phase particles was small because of the small content of Mn, so that the fluttering characteristic was unacceptable.

(122) In Comparative Example 8, the amount of coarse Al—Mn-based compounds was large because of the large content of Mn, so that a large number of holes were found after the compound removal step and accordingly a large number of convex portions were also found after Ni—P plating. As a result, plating smoothness was unacceptable.

(123) In Comparative Example 32, the number of coarse Si particles was large because of the large content of Si, and it was impossible to remove the coarse Si particles even if the compound removal step was applied. Therefore, there were found to have been generated convex portions on the outer peripheral surface and defects on the plated front surface after Ni—P plating, so that plating smoothness was unacceptable.

(124) In Comparative Example 33, it was impossible to perform rolling because of the large content of Ni, so that it was impossible to obtain a sample for evaluation.

(125) In Comparative Example 34, the amount of coarse Al—Cr-based compounds was large because of the large content of Cr, and it was impossible to remove the coarse Al—Cr-based compounds even if the compound removal step was applied. Therefore, there were found to have been generated convex portions on the outer peripheral surface and defects on the plated front surface after Ni—P plating, so that plating smoothness was unacceptable.

(126) In Comparative Example 35, the amount of coarse Al—Zn-based compounds was large because of the large content of Zn, and it was impossible to remove the coarse Al—Zn-based compounds even if the compound removal step was applied. Therefore, there were found to have been generated convex portions on the outer peripheral surface and defects on the plated front surface after Ni—P plating, so that plating smoothness was unacceptable.

(127) In Comparative Examples 36 to 38, the compound removal step was not applied. As a result, although plating smoothness was good due to polishing of the surface, a large number of convex portions were found on the outer peripheral surface after plating, causing generation of a large number of nodules, so that each Comparative Example was unacceptable.

(128) In Comparative Example 39, it was impossible to sufficiently remove compounds on the outer peripheral surface because of a low concentration of HF in a chemical liquid used for the compound removal step, so that there were found a large number of convex portions on the outer peripheral surface after plating, causing generation of a large number of nodules, which made Comparative Example 39 unacceptable.

(129) In Comparative Example 40, the amount of dissolution of the aluminum alloy substrate was large because of a high concentration of HF in a chemical liquid used for the compound removal step, and a large number of concave and convex portions were generated, so that there were found a large number of convex portions on the outer peripheral surface and defects on the plated front surface after Ni—P plating, which made plating smoothness unacceptable.

(130) In Comparative Example 41, it was impossible to sufficiently remove compounds on the outer peripheral surface because of a low concentration of HF in a chemical liquid used for the compound removal step, so that there were found a large number of convex portions on the outer peripheral surface after plating, causing generation of a large number of nodules. Further, the amount of dissolution of the aluminum alloy substrate was large and a large number of concave and convex portions were generated, causing defects to be generated on the plated front surface, which made plating smoothness unacceptable.

(131) In Comparative Example 42, it was impossible to sufficiently remove compounds on the outer peripheral surface because of too high a concentration of HNO.sub.3 in a chemical liquid used for the compound removal step, so that there were found a large number of convex portions on the end faces of the outer peripheral portion after plating, causing generation of a large number of nodules, which made Comparative Example 42 unacceptable.

(132) In Comparative Example 43, the temperature of a chemical liquid used for the compound removal step was low so that the reaction rate was low and it was impossible to sufficiently remove compounds and sufficiently remove compounds on the outer peripheral surface. As a result, there were found a large number of convex portions on the outer peripheral surface after plating, causing generation of a large number of nodules, which made Comparative Example 43 unacceptable.

(133) In Comparative Example 44, the temperature of a chemical liquid used for the compound removal step was high so that the reaction rate was high to produce the amount of dissolution of the aluminum alloy substrate large, causing generation of a large number of concave and convex portions. As a result, there were found a large number of convex portions on the outer peripheral surface and defects on the plated front surface after Ni—P plating, so that plating smoothness was unacceptable.

(134) In Comparative Example 45, the reaction time was not sufficient because of a short time of the compound removal step, so that compounds were not sufficiently removed and it was impossible to sufficiently remove compounds on the outer peripheral surface. As a result, there were found a large number of convex portions on the outer peripheral surface, causing generation of a large number of nodules, which made Comparative Example 45 unacceptable.

(135) In Comparative Example 46, the reaction proceeds too much because of a long time of the compound removal step, so that the amount of dissolution of the aluminum substrate was large, causing generation of a large number of concave and convex portions. As a result, there were found to have been generated convex portions on the outer peripheral surface and defects on the plated front surface after Ni—P plating, so that plating smoothness was unacceptable.

INDUSTRIAL APPLICABILITY

(136) By providing an aluminum alloy base disk for a magnetic disk substrate, which has features of reduced disk flutter and reduced defects on an electroless Ni—P plated front surface, it is possible to provide a magnetic disk that enables the number of mounted magnetic disks to be increased due to thinning of each magnetic disk and a storage capacity per magnetic disk to be increased, to thereby contributing to the higher capacity of an HDD