Encapsulating composition

Abstract

The present application relates to a composition for encapsulating an organic electronic element and an organic electronic device comprising the same, and provides the composition which forms an encapsulating structure capable of effectively blocking water or oxygen introduced from the outside into the organic electronic device, thereby securing the lifetime of the organic electronic device and implementing endurance reliability of the encapsulating structure at high temperature and high humidity, and has high shape retention characteristics, and an organic electronic device comprising the same.

Claims

1. A composition for encapsulating an organic electronic element, the composition comprising: an olefin-based resin, a curable monomer, and a curable oligomer which is comprised in an amount of 20 to 90 parts by weight relative to 100 parts by weight of the olefin-based resin and has a glass transition temperature of 0° C. or less after curing, wherein the olefin-based resin has at least one reactive functional group.

2. The composition according to claim 1, wherein the olefin-based resin has a weight average molecular weight of 100,000 or less.

3. The composition according to claim 1, wherein the reactive functional group comprises an acid anhydride group, a carboxyl group, an epoxy group, an amino group, a hydroxyl group, an isocyanate group, an oxazoline group, an oxetane group, a cyanate group, a phenol group, a hydrazide group or an amide group.

4. The composition according to claim 1, wherein the curable oligomer has a weight average molecular weight in a range of 400 to 50,000 g/mol.

5. The composition according to claim 1, wherein the curable oligomer comprises one or more curable functional groups.

6. The composition according to claim 5, wherein the curable functional group comprises an epoxy group, a glycidyl group, an isocyanate group, a hydroxyl group, a carboxyl group, an amide group, a urethane group, an epoxide group, a cyclic ether group, a sulfide group, an acetal group or a lactone group.

7. The composition according to claim 1, wherein the curable monomer has a weight average molecular weight of less than 400 g/mol.

8. The composition according to claim 1, wherein the curable monomer comprises an epoxy compound, an oxetane compound or an acrylate monomer.

9. The composition according to claim 1, wherein the curable monomer is comprised in an amount of 10 to 45 parts by weight relative to 100 parts by weight of the olefin-based resin.

10. The composition according to claim 1, further comprising an inorganic filler.

11. The composition according to claim 10, wherein the inorganic filler is comprised in an amount of 0.1 parts by weight to 30 parts by weight relative to 100 parts by weight of the olefin-based resin.

12. The composition according to claim 1, further comprising a cationic initiator or a radical initiator.

13. The composition according to claim 1, further comprising a cationic initiator and a radical initiator, where the cationic initiator is comprised in an amount of 0.01 to 5 parts by weight relative to 100 parts by weight of the olefin-based resin and the radical initiator is comprised in an amount of 3 to 12 parts by weight relative to 100 parts by weight of the olefin-based resin.

14. The composition according to claim 1, further comprising a moisture adsorbent.

15. The composition according to claim 14, wherein the moisture adsorbent comprises a moisture-reactive adsorbent.

16. The composition according to claim 14, wherein the moisture adsorbent has an average particle diameter in a range of 0.1 to 10 μm.

17. The composition according to claim 14, wherein the moisture adsorbent is comprised in an amount of 10 to 150 parts by weight relative to 100 parts by weight of the olefin-based resin.

18. An organic electronic device comprising a substrate; an organic electronic element formed on the substrate; and a side encapsulation layer formed on the periphery of the substrate so as to surround side surfaces of the organic electronic element and comprising the composition for encapsulating an organic electronic element according to claim 1.

19. A method for manufacturing an organic electronic device comprising steps of applying the composition for encapsulating an organic electronic element of claim 1 on the periphery of a substrate on which an organic electronic element is formed, so as to surround side surfaces of the organic electronic element, and curing the composition for encapsulating an organic electronic element.

Description

BRIEF DESCRIPTION OF DRAWINGS

(1) FIG. 1 is a cross-sectional view showing an organic electronic device according to one example of the present invention.

EXPLANATION OF REFERENCE NUMERALS

(2) 1: encapsulating composition 10: side encapsulation layer 11: top encapsulation layer 21: substrate 22: cover substrate 23: organic electronic element

BEST MODE

(3) Hereinafter, the present invention will be described in more detail by way of examples according to the present invention and comparative examples not according to the present invention, but the scope of the present invention is not limited by the following examples.

(4) Hereinafter, in Examples and Comparative Examples, as the olefin-based resin, an acid anhydride-modified polyisobutylene resin (BASF, Glissopal SA, hereinafter, PIBSA) was used. As the bifunctional (multifunctional) curable oligomer, epoxy acrylate (Sartomer, CN110, Tg 60° C.), urethane acrylate (Sartomer, CN9021, Tg −54° C.) and a flexible epoxy (Epiclon-EXA-4816, hereinafter, EXA4816, Tg −20° C.) were used and as the curable monomer, an alicyclic epoxy resin (Daicel, Celloxide 2021P, Mw: 250 g/mol, epoxy equivalent: 130 g/eq, viscosity 250 cPs, hereinafter, C2021P), monofunctional acrylate (SR420) and 1,6-hexanediol diacrylate (HDDA) were used. As the inorganic filler, fumed silica (Aerosil, Evonik, R805, particle size 10 to 20 nm, BET=150 m.sup.2/g) was used and as the moisture adsorbent, calcium oxide (CaO, average particle diameter 8 μm, Aldrich) was used. As the photoinitiator, a photo-cationic initiator (San-apro, CPI-101A) and a radical initiator (TPO) were used.

Examples 1 to 4 and Comparative Examples 1 to 4

(5) For the above composition, components were compounded in the weight ratios as shown in Table 1 below and introduced into a mixing vessel. The unit is parts by weight. In the mixing vessel, uniform composition solutions were prepared using a planetary mixer (Kurabo, KK-250s).

(6) TABLE-US-00001 TABLE 1 Example Comparative Example 1 2 3 4 1 2 3 4 PIBSA 65 65 65 65 60 67 40 40 EXA4816  5 5 8 5 CN9021 15 25 20 15 15 5 35 40 CN110 — 15 HDDA  5 5 10 5 10 10 C2021P 10 5 5 10 15 10 10 SR420 — 5 10 R805 10 10 10 10 10 10 10 10 CaO 50 50 50 20 50 50 50 50 CPI-101A  2 2 2 2 2 2 2 TPO  5 5 5 5 5 5 5 5

(7) Hereinafter, the properties of the encapsulating compositions prepared in Examples and Comparative Examples were evaluated in the following manner.

1. Elastic Modulus Measurement

(8) The encapsulating compositions prepared in Examples or Comparative Examples are each formed into a rectangular shape (thickness 10 to 400 μm) of 10×30 mm, a specimen cured at 100° C. for 1 hour after UV irradiation (metal halide lamp 3 J/cm.sup.2) is made, and the upper and lower parts of the specimen are attached with a 3M tape so that the center portion becomes 10×10 mm.

(9) The upper and lower tape parts of the manufactured specimen are fixed to a tensile machine, and the length and width of the fixed specimen are loaded so as to be 10×10 mm, and the force applied upon tension in the y-axis direction at a rate of 5 mm/min at 25° C. is measured.

(10) The elastic modulus is measured by substituting the slope in the initial tensile range within 5 mm of the measured graph (X-axis: specimen long axis length, and Y-axis: force applied at the time of tensioning) into the following equation (slope, specimen long axis/short axis length and specimen thickness substitution).

(11) The measurement was performed using a TA (Texture Analyzer)-XT2 plus instrument, and the measurement time was stopped when the specimen was broken.

(12) The elastic modulus was calculated by substituting the slope of the measured graph into the following equation.
E=Slope×(length/(width×thickness))  [Equation 1]

2. Elongation Measurement

(13) In the graph in which the elastic modulus measurement is completed, the ratio of the elongated length to the initial length of the specimen at the time of fracture is calculated.
Elongation (%)=ΔL/L.sub.0×100

(14) ΔL means the elongated length of the long axis of the specimen until fracture of the specimen, and L.sub.0 means the initial long axis direction length of the specimen.

3. Heat Resistance and Moisture Resistance

(15) The encapsulating composition solutions prepared in Examples or Comparative Examples were each applied on a 0.7 T soda-lime glass to a layer of 200 μm using a coating bar. Then, a sample was prepared by laminating it with the same glass, the encapsulating composition was irradiated with light (metal halide lamp) having a wavelength range of the UV-A region band at a light quantity of 3 J/cm.sup.2 and then, heat was applied thereto in an oven at 100° C. for 1 hour. Then, the sample was held in a constant temperature and humidity chamber at 85° C. and 85% relative humidity for about 1000 hours.

(16) The measurement of heat resistance was indicated as O in the case where there was no change in the inside and the side of the coating region and X in the case where voids occurred inside the coating region.

(17) The measurement of moisture resistance was indicated as O in the case where there was no lifting of the region penetrated with moisture and X in the case where the moisture penetration site was lifted from the glass.

4. Moisture Barrier Property

(18) Calcium was deposited to a size of 5 mm×5 mm and a thickness of 100 nm on a glass substrate having a size of 100 mm×100 mm and the encapsulating compositions of Examples and Comparative Examples were each applied to the edge part excluding the calcium. After it was laminated with a cover glass having a size of 100 mm×100 mm in the coated state, UV irradiation was performed at a light quantity of 3 J/cm.sup.2 using a metal halide light source, and then heat was applied thereto in an oven at 100° C. for 1 hour. The obtained specimens are observed in a constant temperature and humidity chamber at 85° C. and 85% relative humidity to observe the time when calcium begins to become transparent by oxidation reaction due to moisture penetration.

(19) TABLE-US-00002 TABLE 2 Heat Moisture Elastic Resistance/ Barrier Modulus Elongation Moisture Property (Pa = N/m.sup.2) (%) Resistance (hour) Example 1 0.40 78 ◯/◯ 1500 2 0.78 92 ◯/◯ 1200 3 0.11 160 ◯/◯ 1100 4 0.50 74 ◯/◯ 320 Comparative 1 53.4 61 ◯/X  850 Example 2 34.2 59  X/◯ 920 3 2.42 86 ◯/X  690 4 2.82 108 ◯/X  520