Abstract
The invention relates to a soldering module (3) for the, in particular selective, soldering of components to a circuit board (14), having a soldering nozzle (32) for creating a solder wave. It is proposed that the soldering module (3) comprises a linear conveyor (8), in particular a belt conveyor or a chain conveyor, for applying solder to the circuit board (14) by moving the circuit board (14) in a conveying direction over the solder wave, and that the linear conveyor (8) is tiltable, in particular about a first tilting axis (23).
Claims
1. A soldering module for the, in particular selective, soldering of components to a circuit board having a soldering nozzle for creating a solder wave, the soldering module comprising a linear conveyor, in particular a belt conveyor or a chain conveyor, for applying solder to the circuit board by moving the circuit board in a conveying direction over the solder wave, and in that the linear conveyor is tiltable, in particular about a first tilting axis.
2. The soldering module as claimed in claim 1, wherein the first tilting axis is oriented substantially perpendicularly to a direction of gravitational force.
3. The soldering module as claimed in claim 1, wherein the linear conveyor is tiltable about the first tilting axis such that the normal of the circuit board encloses an angle of at least 4, preferably of at least 8, more preferably of at least 10, with the direction of gravitational force.
4. The soldering module as claimed in claim 2, wherein the first tilting axis is oriented substantially perpendicularly to a conveying direction or substantially parallel to the conveying direction.
5. The soldering module as claimed in claim 4, wherein the linear conveyor is tiltable about a second tilting axis, wherein the second tilting axis is oriented substantially normal to the direction of gravitational force.
6. The soldering module as claimed in claim 5, wherein the first tilting axis and/or the second tilting axis extends through the solder wave.
7. The soldering module as claimed in claim 1, wherein the linear conveyor is tiltable while the circuit board is being moved over the solder wave.
8. The soldering module as claimed in claim 1, wherein a soldering nozzle is movable in a plane oriented substantially normal to the direction of gravitational force.
9. The solder module as claimed in claim 8, the wherein a distance between the soldering nozzle and the circuit board is settable by moving the soldering nozzle.
10. The soldering module as claimed in claim 8, wherein the soldering nozzle is rotatable.
11. The soldering module as claimed in claim 8, wherein the soldering nozzle is wettable with solder, and in particular is manufactured from steel.
12. The soldering module as claimed in claim 8, wherein the soldering nozzle is not wettable with solder, and is manufactured in particular from a stainless, in particular coated, steel.
13. The soldering module as claimed in claim 1, wherein the soldering module has an inert gas device.
14. The soldering module as claimed in claim 1, wherein provision is made of a solder joint processing device, wherein the solder joint processing device comprises a gas nozzle.
15. The soldering module as claimed in claim 8, wherein the soldering module has a second soldering nozzle for creating a second solder wave.
16. A soldering plant having a first soldering module as claimed in claim 1 and a flux module.
17. The soldering plant as claimed in claim 16, wherein the soldering plant has a preheating module (10).
18. The soldering plant as claimed in either of claim 16, wherein the soldering plant has a second soldering module.
19. A method for soldering components to a circuit board , in particular using a soldering module as claimed in claim 1, wherein a populated circuit board is received on the linear conveyor wherein the linear conveyor is in a receiving position, in that the linear conveyor is tilted into a first processing position, in that the circuit board is moved over a first solder wave by means of the linear conveyor wherein a subregion of the circuit board is wetted with solder, in that the linear conveyor is tilted into a transfer position, and in that the circuit board is transferred in the transfer position of the linear conveyor.
Description
[0026] The invention is explained in the following text by way of figures. In the drawing, by way of example:
[0027] FIG. 1 shows a perspective view of a first embodiment of a soldering plant as proposed;
[0028] FIG. 2 shows a perspective view of a second embodiment of a soldering plant as proposed;
[0029] FIG. 3 shows a preparation module of a soldering plant as proposed;
[0030] FIG. 4 shows a soldering module of a soldering plant as proposed;
[0031] FIG. 5 shows the soldering module according to FIG. 4 in a first tilted position of the linear conveyor;
[0032] FIG. 6 shows the soldering module according to FIG. 4 in a second tilted position of the linear conveyor;
[0033] FIG. 7 shows the soldering module according to FIG. 4 in a first disassembled state, and
[0034] FIG. 8 shows the soldering module according to FIG. 4 in a second disassembled state.
[0035] The soldering plant 1 shown in FIG. 1 has a preparation module 2, a first soldering module 3 and a second soldering module 4. A circuit board 14 (not illustrated) that is already populated with components is first of all provided with flux in the preparation module 2. Subsequently, in the preparation module 3, the flux is activated by the action of heat on the circuit board 14 and at the same time sufficient thermal energy is introduced into the circuit board 14 and the components for a good soldering result. Subsequently, the circuit board 14 is transferred from the preparation module 2 to the first soldering module 3. By way of the first soldering module 3, for example a first group of components can be soldered to the circuit board 14. Following the first soldering module 3, a second soldering module 4 is provided.
[0036] By way of the second soldering module 4, a further group of components can be soldered to the circuit board 14. The second soldering module 4 can differ from the first soldering module for example by way of the type of solder used. It is likewise conceivable for a different soldering nozzle 37 to be used in the second soldering module 4, it being possible for said different soldering nozzle 37 to differ from the soldering nozzle of the first soldering module 4 for example in terms of its diameter or shape and thus to be more suitable for smaller (or larger) components. It is likewise conceivable to use two identical soldering modules 3 and 4 only in order to increase the number of cycles.
[0037] In contrast to the soldering plant 1 according to FIG. 1, in the case of the soldering plant 1 illustrated in FIG. 2, only a soldering module 3 is provided after the preparation module 2. The soldering plant 1 can be made available more conveniently as a result. By way of the modular construction, further soldering modules can be added with little effort. The soldering plant 1 can thus be adapted cost-effectively to the particular manufacturing requirements and does not have to be replaced in its entirety.
[0038] FIG. 3 illustrates a preparation module 2 as can be used in a soldering plant according to FIG. 1 or FIG. 2. The preparation module 2 comprises a linear conveyor 8 by way of which a circuit board 14 can be transported through the preparation module. Also provided is a flux module 9 by way of which flux can be applied to those points of the populated circuit board that are to be wetted with solder. The flux module 9 is followed by a preheating module 10. By means of the preheating module 10, the flux applied to the populated circuit board 14 can be activated. In addition, the circuit board 14 and the components can be brought to a temperature which allows a particularly good mechanical and electrical connection to the solder to be applied. The preparation module can also comprise a control unit 11 by way of which the linear conveyor 8, the flux module 9 and the preheating module can be controlled. Provision can also be made for the control unit 11 also to control further modules to be connected to the preparation module 10, in particular soldering modules.
[0039] The soldering module 3 illustrated in FIG. 4 has a soldering module frame 12, in which a soldering unit 13 and a linear conveyor 8 are fastened. By way of the linear conveyor 8, a circuit board 14 can be moved over a solder wave that is generated by a soldering nozzle 37 (not visible in FIG. 4) which is covered by the soldering module frame 12 and which is part of the soldering unit 13. The linear conveyor 8 has two guides 15 and 16 by way of which the circuit board 14 is laterally guided. In order to move the circuit board 14, provision is also made of two drives 27 and 28. The distance 17 between the two guides 15 and 16 can be changed by means of a motor 18 in order to take into account different circuit board sizes. The linear conveyor 8 is suspended in a gimbaled manner via two linear conveyor frames 19 and 20 in the soldering module frame 12 and via bearings 21 and 22.
[0040] Via motors (not illustrated in FIG. 4), the linear conveyor can be tilted about a first tilting axis 23 and a second tilting axis 24. The first tilting axis 23 and the second tilting axis 24 are each oriented perpendicularly to the direction of gravitational force. In addition, the first tilting axis 23 is arranged parallel to the conveying direction 26 and the second tilting axis 24 perpendicularly to the conveying direction 26 in which the circuit board 14 is moved.
[0041] FIG. 5 likewise illustrates the soldering module 3 according to FIG. 4. As in FIG. 4, the soldering module 3 comprises a soldering module frame 12, a soldering unit 13 and a linear conveyor 8. In contrast to the soldering module 3 depicted in FIG. 4, the linear conveyor 8 has been tilted through an angle 29 about a first tilting axis 23 such that the normal of the circuit board 14 and the direction of gravitational force enclose an angle of 7. The first tilting axis is in this case oriented perpendicularly to the direction of gravitational force 25 and parallel to the conveying direction 26.
[0042] In contrast to the soldering module 3 depicted in FIG. 5, in the case of the soldering module 3 shown in FIG. 6, the linear conveyor has been tilted about a second tilting axis 24. The second tilting axis 24 extends in this case perpendicularly to the direction of gravitational force 25 and the conveying direction 26. On account of the tilting, the normal of the circuit board 14 encloses an angle of 11 with the direction of gravitational force.
[0043] FIG. 7 shows a soldering unit 13 of the soldering module 3 according to FIG. 4. The soldering unit 13 has a table 29. The table 29 is displaceable in a plane perpendicular to the direction of gravitational force 25 by rails 30, 31 and 32, 33, respectively, and motors 34, 35. Provided on the table 29 is a solder container 36 having a soldering nozzle 37.
[0044] FIG. 8 shows merely the table 29 with the solder container 36 of the soldering module 3. Arranged in the middle of the solder container 65 is a soldering nozzle 37. The solder liquefied in the solder container 36 can be pumped through the soldering nozzle 66 by means of a pump 38 such that a solder wave forms at the tip thereof. Also provided is a motor 39, by way of which the solder container 65 (and the soldering nozzle 66) can be rotated about an axis oriented parallel to the direction of gravitational force 25. By way of three spindles, of which only two spindles 40, 41 are visible, the solder container 65 (and the soldering nozzle 66) can be raised or lowered in the direction of gravitational force 25. In this case, the solder container 65 can be guided by way of two guides 42, 43. Provided above the solder container 65 is a heating element 44, which covers the solder container 65 in the manner of a lid, wherein an opening for the soldering nozzle 66 remains in the middle. The heating element 44 has two power connections 45. Also provided is a solder joint processing device having a gas nozzle 46. Via a connection 47, an inert gas, in particular nitrogen, can be supplied. By way of the heating element 44, the inert gas can be heated and blown onto the solder joint via the gas nozzle 46 so that more selective application of solder as possible. Likewise, it is possible by way of the gas nozzle 46 to ensure that the solder passed through the soldering nozzle runs off in a deliberate manner on the side opposite the gas nozzle 46. Preferably, the gas nozzle 46 is oriented counter to the conveying direction of a linear conveyor for a circuit board.
