Self-Cleaning System For a Light-Receiving Substrate

Abstract

A self-cleaning system for a light-receiving substrate is able to detect a particulate on a designated surface of the light-receiving substrate and is then able to clean off of the designated surface with contactless electrostatic waves. The self-cleaning system includes a plurality of conductive traces, a microcontroller, a pulsed electrostatic-field generator, and a direct current (DC) power source. The conductive traces are electrodes that use the electrostatic waves to levitate and move the particulate off of the designated surface. The pulsed electrostatic-field generator creates the pulsed electrostatic fields that accumulate into the electrostatic waves. The microcontroller instructs and manages the electronic parts of the self-cleaning system. The DC power source is used to power the electrical parts of the self-cleaning system.

Claims

1. A self-cleaning system for a light-receiving substrate comprises: a plurality of conductive traces; a microcontroller; a pulsed electrostatic-field generator; a direct current (DC) power source; the plurality of conductive traces being arranged onto and across a designated surface of the light-receiving substrate in a non-intersecting pattern; each of the plurality of conductive traces being electrically insulated from each other; the plurality of conductive traces being electrically connected to the DC power source through the microcontroller; the microcontroller being electronically connected to the pulsed electrostatic-field generator; and the DC power source being electrically connected to each of the plurality of conductive traces through the pulsed electrostatic-field generator.

2. The self-cleaning system for a light-receiving substrate as claimed in claim 1 comprises: a transparent insulative coating; the transparent insulative coating being superimposed onto the designated surface; and the plurality of conductive traces being positioned in between the transparent insulative coating and the designated surface.

3. The self-cleaning system for a light-receiving substrate as claimed in claim 1 comprises: the pulsed electrostatic-field generator comprises a plurality of independent-field generating outputs; each of the plurality of conductive traces being electrically connected to a corresponding output from the plurality of independent-field generating outputs; the DC power source being electrically connected to each of the plurality of conductive traces through the corresponding output; and the microcontroller being electronically connected to each of the plurality of conductive traces through the corresponding output.

4. The self-cleaning system for a light-receiving substrate as claimed in claim 1 comprises: a plurality of environmental sensors; the plurality of environmental sensors being mounted adjacent to the designated surface; and the microcontroller being electronically connected to the plurality of environmental sensors.

5. The self-cleaning system for a light-receiving substrate as claimed in claim 4 comprises: the plurality of environmental sensors comprises at least one temperature sensor; and the temperature sensor being in thermal communication with the designated surface.

6. The self-cleaning system for a light-receiving substrate as claimed in claim 4 comprises: the plurality of environmental sensors comprises at least one humidity sensor; and the humidity sensor being externally positioned to the light-receiving substrate.

7. The self-cleaning system for a light-receiving substrate as claimed in claim 4 comprises: the plurality of environmental sensors comprises at least one luminosity sensor; and the luminosity sensor being directionally aligned with the designated surface.

8. The self-cleaning system for a light-receiving substrate as claimed in claim 1 comprises: a wireless communication module; a remote computing device; the microcontroller being electronically connected to the wireless communication module; and the wireless communication module being communicably coupled to the remote computing device.

9. The self-cleaning system for a light-receiving substrate as claimed in claim 1 comprises: the plurality of conductive traces being transparent; the light-receiving substrate comprises a plurality of solar cells; the plurality of solar cells being distributed throughout the light-receiving substrate; and the plurality of solar cells electrically connected to the DC power source.

10. The self-cleaning system for a light-receiving substrate as claimed in claim 9 comprises: the light-receiving substrate further comprises a vacuum chamber; the plurality of solar cells being positioned within the vacuum chamber; and the plurality of solar cells being positioned adjacent to an opposing surface of the light-receiving substrate, wherein the designated surface and the opposing surface are opposite surfaces of the light-receiving substrate.

11. The self-cleaning system for a light-receiving substrate as claimed in claim 1 comprises: the plurality of conductive traces being transparent; and the light-receiving substrate being a thermal solar panel.

12. The self-cleaning system for a light-receiving substrate as claimed in claim 1 comprises: the plurality of conductive traces being transparent; and the light-receiving substrate being a transparent panel.

13. The self-cleaning system for a light-receiving substrate as claimed in claim 12 comprises: the light-receiving substrate comprises a first glass layer, a second glass layer, and a vacuum layer; and the vacuum layer being hermetically sealed in between the first glass layer and the second glass layer.

14. The self-cleaning system for a light-receiving substrate as claimed in claim 1 comprises: the plurality of conductive traces being reflective; and the light-receiving substrate being a reflector.

15. The self-cleaning system for a light-receiving substrate as claimed in claim 1 comprises: a first layer of transparent insulative resin; and the plurality of conductive traces being adhered to the designated surface by the first layer of transparent insulative resin.

16. The self-cleaning system for a light-receiving substrate as claimed in claim 1 comprises: a transparent protective sheet; a second layer of transparent insulative resin; and the transparent protective sheet being adhered onto and across the designated surface by the second layer of transparent insulative resin; and the plurality of conductive traces being positioned in between the transparent protective sheet and the designated surface.

17. The self-cleaning system for a light-receiving substrate as claimed in claim 1 comprises: a rigid sheet; a third layer of transparent insulative resin; and the rigid sheet being adhered onto and across an opposing surface of the light-receiving substrate by the third layer of transparent insulative resin, wherein the designated surface and the opposing surface are opposite surfaces of the light-receiving substrate.

18. The self-cleaning system for a light-receiving substrate as claimed in claim 1 comprises: a heat-dissipating fixture; a third layer of transparent insulative resin; and the heat-dissipating fixture being adhered onto and across an opposing surface of the light-receiving substrate by the third layer of transparent insulative resin, wherein the designated surface and the opposing surface are opposite surfaces of the light-receiving substrate.

19. The self-cleaning system for a light-receiving substrate as claimed in claim 18, wherein the heat-dissipating fixture is a honeycomb structure.

20. The self-cleaning system for a light-receiving substrate as claimed in claim 1 comprises: a plurality of piezoelectric devices; the plurality of piezoelectric devices being distributed onto and across the designated surface; the microcontroller being electronically connected to the plurality of piezoelectric devices; and the DC power source being electrically connected to the plurality of piezoelectric devices.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0005] FIG. 1 is a block diagram illustrating the present invention.

[0006] FIG. 2 is a block diagram illustrating the connection from the other components of the present invention to each conductive trace.

[0007] FIG. 3 is a block diagram illustrating the environmental sensors for the present invention.

[0008] FIG. 4 is a block diagram illustrating the light-receiving substrate with solar cells.

[0009] FIG. 5 is a block diagram illustrating the light-receiving substrate with solar cells and a vacuum chamber.

[0010] FIG. 6 is a block diagram illustrating the light-receiving substrate as a thermal solar panel.

[0011] FIG. 7 is a block diagram illustrating the light-receiving substrate as a reflector.

[0012] FIG. 8 is a block diagram illustrating the light-receiving substrate as a transparent panel.

[0013] FIG. 9 is a block diagram illustrating the light-receiving substrate as a transparent panel with a vacuum layer.

[0014] FIG. 10 is a block diagram illustrating the light-receiving substrate, the transparent protective sheet, and the rigid sheet being adhered together with transparent insulative resin.

[0015] FIG. 11 is a block diagram illustrating the light-receiving substrate, the transparent protective sheet, and the heat-dissipating fixture being adhered together with transparent insulative resin.

[0016] FIG. 12 is a block diagram illustrating the piezoelectric devices for the present invention.

[0017] FIG. 13 is a schematic illustrating one configuration of the conductive traces for the present invention.

[0018] FIG. 14 is a schematic illustrating one configuration of the conductive traces for the present invention.

[0019] FIG. 15 is a schematic illustrating another configuration of the conductive traces for the present invention.

[0020] FIG. 16 is a schematic illustrating another configuration of the conductive traces for the present invention.

[0021] FIG. 17 is a schematic illustrating another configuration of the conductive traces for the present invention.

[0022] FIG. 18 is a schematic illustrating another configuration of the conductive traces for the present invention.

[0023] FIG. 19 is a schematic illustrating another configuration of the conductive traces for the present invention.

DETAILED DESCRIPTION OF THE INVENTION

[0024] All illustrations of the drawings are for the purpose of describing selected versions of the present invention and are not intended to limit the scope of the present invention.

[0025] As can be seen in FIG. 1, the present invention is a self-cleaning system for a light-receiving substrate 1 that is able to intelligent detect and automatically clean off dust, sand, dirt, or other kinds of particulates from the light-receiving substrate 1. In the preferred embodiment of the present invention, the light-receiving substrate 1 is a kind of solar panel and needs to be constantly cleaned in order to collect the most amount of power from the Sun. The present invention can also detect and melt off snow or ice deposits that may have accumulated on the light-receiving substrate 1. The present invention comprises a plurality of conductive traces 2, a microcontroller 3, a pulsed electrostatic-field generator 4, and a direct current (DC) power source 5. The plurality of conductive traces 2 is a group of electrodes that generates electrostatic waves. These electrostatic waves act as a contactless conveyor to levitate and move particulate off of the light-receiving substrate 1, which prevents any scratches or other kinds of damage to the light-receiving substrate 1. Each of the plurality of conductive traces 2 outputs a pulsed electrostatic field that is created and managed by the pulsed electrostatic-field generator 4. The microprocessor provides the other components of the present invention with the necessary instructions to enable the intelligent features of the present invention, such as when the present invention should activate its cleaning and/or snow-melting process. The DC power source 5 is used to electrically power the other components of the present invention. The DC power source 5 is preferably a high-voltage power source and can be, but is not limited to, a battery, a thermal power generator, a wind power generator, a utility grid, or a combination thereof.

[0026] The general configuration for the aforementioned components allows the present invention to effectively and efficiently generate electrostatic waves from independently-functioning conductive traces. Thus, the plurality of conductive traces 2 is arranged onto and across a designated surface 101 of the light-receiving substrate 1 in a non-intersecting pattern. The present invention has preferably four conductive traces. Examples of the non-intersecting pattern for the plurality of conductive traces 2 are shown in FIG. 13 through 19. The designated surface 101 is the surface that requires cleanliness in order to optimally operate the light-receiving substrate 1. The non-intersecting pattern allows the plurality of conductive traces 2 to be arranged on designated surface 101 so that electrostatic waves are generated to move particulate off of the designated surface 101 in a unidirectional manner. Conversely, the non-intersecting pattern also allows the plurality of conductive traces 2 to be arranged on designated surface 101 so that electrostatic waves are generated to move particulate off of the designated surface 101 in an omnidirectional manner. In addition, the DC power source 5 is electrically connected to each of the plurality of conductive traces 2 through the pulsed electrostatic-field generator 4, which allows the each of the plurality of conductive traces 2 to be electrically powered by the DC power source 5. The microcontroller 3 is electronically connected to the pulsed electrostatic-field generator 4 so that the microcontroller 3 is able to adjust various aspects of the pulsed electrostatic field that is outputted by each of the plurality of conductive traces 2.

[0027] Also for the general configuration, each of the plurality of conductive traces 2 needs to electrically insulated from each other in order to prevent electrical arcing between two or more conductive traces. In one embodiment, the present invention further comprises a transparent insulative coating 6 that is superimposed onto the designated surface 101. The transparent insulative coating 6 is used to increase the breakdown voltage between the plurality of conductive traces 2, which are resultantly positioned in between the transparent insulative coating 6 and the designated surface 101.

[0028] The pulsed electrostatic-field generator 4 is able to independently generate and control the pulsed electrostatic field that is outputted by each of the plurality of conductive traces 2. Thus, the pulsed electrostatic-field generator 4 needs to comprise a plurality of independent-field generating outputs 401, which are shown in FIG. 2. The plurality of independent-field generating outputs 401 allows the pulsed electrostatic-field generator 4 to separately configure each pulsed electrostatic field so that the combination of each pulsed electrostatic field forms electrostatic waves that efficiently and effectively move particulates off of the designated surface 101. Consequently, each of the plurality of conductive traces 2 is electrically connected to a corresponding output from the plurality of independent-field generating outputs 401. This configuration allows the DC power source 5 to be electrically connected to each of the plurality of conductive traces 2 through the corresponding output so that the DC power source 5 is able to independently power each of the plurality of conductive traces 2. This configuration also allows the microcontroller 3 to be electronically connected to each of the plurality of conductive traces 2 through the corresponding output so that the microcontroller 3 is able to independently control and manage each of the plurality of conductive traces 2.

[0029] In order to monitor the surroundings of the light-receiving substrate 1, the present invention further comprises a plurality of environmental sensors 7, which are used to detect situations that require cleaning of the designated surface 101. As can be seen in FIG. 3, the plurality of environmental sensors 7 is mounted adjacent to the designated surface 101 so that the plurality of environment sensors is able to immediately detect any obstructions that adversely affect the designated surface 101. Some examples of such obstructions include, but are not limited to, rain and snow. The microcontroller 3 is electronically connected to each of the plurality of environmental sensors 7, which allows the microcontroller 3 to retrieve data from the plurality of environmental sensors 7. This data can then be processed by the microcontroller 3 in order to determine whether or not the designated surface 101 needs to be cleaned off by the present invention.

[0030] More specifically, the plurality of environmental sensors 7 comprises at least one temperature sensor 701, at least one humidity sensor 702, and at least one luminosity sensor 703. The temperature sensor 701 is in thermal communication with the designated surface 101 so that the microcontroller 3 is able to receive temperature data for the designated surface 101. For example, the microcontroller 3 can determine if snow has fallen onto the designated surface 101 via the temperature sensor 701. The humidity sensor 702 is externally positioned to the light-receiving substrate 1 so that the microcontroller 3 is able to receive ambient-humidity data for the light-receiving substrate 1. The luminosity sensor 703 is directionally aligned with the designated surface 101 so that the luminosity sensor 703 is able to receive light in same direction and magnitude as the designated surface 101. For example, the microcontroller 3 can determine if heavy cloud cover is reducing the light received by the designated surface 101 because the humidity sensor 702 would detect a change in the ambient-humidity data and because the luminosity sensor 703 would detect a reduction in the light received by the designated surface 101. In this example, the microcontroller 3 would not activate the present invention to clean off the designated surface 101. In another example, the microcontroller 3 can determine if accumulated particulate is reducing the light received by the designated surface 101 because the humidity sensor 702 would not detect a change in the ambient-humidity data and because the luminosity sensor 703 would detect a reduction in the light received by the designated surface 101. In this example, the microcontroller 3 would activate the present invention to clean the designated surface 101.

[0031] The present invention can also be remotely activated to clean the designated surface 101. Thus, the present invention needs to further comprise a wireless communication module 8 and a remote computing device 9, which are shown in FIG. 1. The wireless communication module 8 is proximally located with the other components of the present invention and is used to send and receive communications for the microcontroller 3. Consequently, the microcontroller 3 is electronically connected to the wireless communication module 8. The remote computing device 9 is distally located from the other components of the present invention and is used to remotely communicate the microcontroller 3 or to remotely monitor the light-receiving substrate 1. Consequently, the remote computing device 9 is communicably coupled with the wireless communication module 8 8. For example, if the light-receiving substrate 1 is a solar panel located in the desert, then a user of the present invention would need the remote computing device 9 in order to communicate with the microcontroller 3 and/or to run diagnostics on certain components of the present invention.

[0032] The present invention can have various implementations of the light-receiving substrate 1. The light-receiving substrate 1 is typically made of glass or polymer and can be, but is not limited to, a photovoltaic solar panel, a thermal solar panel, a vacuum solar panel, a mirror, a piece of glass, a windshield, an optical device, or a faade. However, these various implementations of the light-receiving substrate 1 can alter the components and/or the arrangement of those components for the present invention. As can be seen in FIG. 4, one implementation of the light-receiving substrate 1 comprises a plurality of solar cells 103, which are used to capture solar energy and to convert solar energy into electrical energy. The plurality of solar cells 103 can typically be photovoltaic (that is made of Polycrystalline Silicon) or thin film. In order to collect the maximum amount of solar energy with the plurality of solar cells 103, the plurality of conductive traces 2 needs to be transparent, and the plurality of solar cells 103 needs to be distributed throughout the light-receiving substrate 1. The plurality of solar cells 103 is also electrically connected to the DC power source 5 so that the plurality of solar cells 103 recharges the DC power source 5 as the DC power source 5 expends energy to electrically power the plurality of conductive traces 2. More specifically, the light-receiving substrate 1 further comprises a vacuum chamber 104, which is shown in FIG. 5. The plurality of solar cells 103 is positioned within the vacuum chamber 104 and is positioned adjacent to an opposing surface 102 of the light-receiving substrate 1. The designated surface 101 and the opposing surface 102 are opposite surfaces of the light-receiving substrate 1. Consequently, this configuration for the plurality of solar cells 103 and the vacuum chamber 104 allows the plurality of solar cells 103 to be more thermally insulated within the light-receiving substrate 1. The plurality of solar cells 103 is able to better execute the photovoltaic process at lower temperatures.

[0033] As can be seen in FIG. 6, another implementation of the light-receiving substrate 1 is a thermal solar panel, which typically is a set of transparent tubes that retain some kind of fluid. These transparent tubes are then mounted within a transparent hollow enclosure. For this implementation of the light-receiving substrate 1, the plurality of conductive traces 2 also needs to be transparent so that the thermal solar panel is able to collect the maximum amount of solar energy and is able to convert that solar energy into thermal energy.

[0034] Another implementation of the light-receiving substrate 1 is a transparent panel depicted in FIG. 8, such as the piece of glass or the windshield. For this implementation of the light-receiving substrate 1, the plurality of conductive traces 2 also needs to be transparent so that the transparent panel is able to provide the maximum amount of visibility through the present invention. More specifically, this implementation of the light-receiving substrate 1 depicted in FIG. 9 comprises a first glass layer 105, a second glass layer 106, and a vacuum layer 107, which are used to increase the thermal insulative properties of the transparent panel. Thus, the vacuum layer 107 needs to be hermetically sealed in between the first glass layer 105 and the second glass layer 106, which allows the transparent panel to maintain the vacuum layer 107.

[0035] As can be seen in FIG. 7, another implementation of the light-receiving substrate 1 is as a reflector, which is used reflect the light received by the designated surface 101. In order to maximize the functionality of this implementation of the light-receiving substrate 1, the plurality of conductive traces 2 needs to be reflective. This implementation of the light-receiving substrate 1 can be used as a solar reflector to concentrate and collect solar energy. This implementation of light-receiving substrate 1 also allows the light-receiving substrate 1 to be configured into either a flat, semi-cylindrical, or parabolic shape.

[0036] As can be seen in FIGS. 10 and 11, transparent insulative resin is used in various instances to structurally affix certain components of the present invention to the light-receiving substrate 1. In one such instance, the plurality of conductive traces 2 is adhered to the designated surface 101 by a first layer of transparent insulative resin 10. The first layer of transparent insulative resin 10 allows light to travel past the plurality of conductive traces 2 and to travel into the light-receiving substrate 1 with minimal obstruction. In another such instance, a transparent protective sheet 13 is adhered onto and across the designated surface 101 by a second layer of transparent insulative resin 11. The transparent protective sheet 13 is typically made of polymer or another equivalent material. The transparent protective sheet 13 is a durable shield that protects the plurality of conductive traces 2 from physical damage, and, thus, the plurality of conductive traces 2 is positioned in between the transparent protective sheet 13 and the designated surface 101. The second layer of transparent insulative resin allows light to travel past the transparent protective sheet 13 and the plurality of conductive traces 2 and to travel into the light-receiving substrate 1 with minimal obstruction. In both of the aforementioned instances, the first layer of transparent insulative resin 10, the second layer of transparent insulative resin 11, and the transparent protective sheet 13 is also used to further prevent electrical arcing between two or more conductive traces.

[0037] A third layer of transparent insulative resin 12 can be used to adhere certain components to the opposing surface 102 of the light-receiving substrate 1. As described before, the designated surface 101 and the opposing surface 102 are opposite surfaces of the light-receiving substrate 1. In reference to FIG. 10, one component of the present invention that can be adhered to the opposing surface 102 by the third layer of transparent insulative resin 12 is a rigid sheet 14, which provides a structural base for the light-receiving substrate 1. The rigid sheet 14 is typically made of a compound material that is capable of withstanding structural stress and strain. In reference to FIG. 11, another component of the present invention that can be adhered to the opposing surface 102 by the third layer of transparent insulative resin 12 is a heat-dissipating fixture 15, which is used to transfer heat out of the light-receiving substrate 1. The heat-dissipating fixture 15 is typically made of rigid, lightweight metals that are used in heat sinks. The heat-dissipating fixture 15 is particularly useful when the light-receiving substrate 1 comprises the plurality of solar cells 103 because the plurality of solar cells 103 is able to optimally function at lower temperatures. The heat-dissipating fixture 15 is preferably a honeycomb structure. The heat-dissipating fixture 15 is also adhered onto and across the opposing surface 102 so that the heat-dissipating fixture 15 is able to transfer heat out of any portion of the light-receiving substrate 1.

[0038] In order to enhance the ability to clean particulate off of the designated surface 101, the present invention further comprises a plurality of piezoelectric devices 16 depicted in FIG. 12, which allow electrical power to be converted into mechanical stress and vice versa. In addition to the electrostatic waves generated by the present invention, the plurality of piezoelectric devices 16 is used to generate ultrasonic waves and to physically vibrate particulate off of the designated surface 101. Thus, the plurality of piezoelectric devices 16 is distributed onto and across the designated surface 101 in order to generate ultrasonic waves for every portion of the designated surface 101. The microcontroller 3 is electronically connected to the plurality of piezoelectric devices 16 so that the microcontroller 3 is able to simultaneously activate the plurality of conductive traces 2 and the plurality of piezoelectric devices 16. The DC power source 5 is also electrically connected to the plurality of piezoelectric devices 16, which allows the DC power source 5 to electrically power the plurality of piezoelectric devices 16 as well as the plurality of conductive traces 2.

[0039] Although the invention has been explained in relation to its preferred embodiment, it is to be understood that many other possible modifications and variations can be made without departing from the spirit and scope of the invention as hereinafter claimed.