Hot Melt Adhesive

20170204307 ยท 2017-07-20

    Inventors

    Cpc classification

    International classification

    Abstract

    A hot melt adhesive material and articles made using the hot melt adhesive to assemble structures in an article. The adhesive material typically is manufactured by blending amorphous polymer with a heterophase polymer having crystallinity into an adhesive composition.

    Claims

    1. A hot melt adhesive composition comprising: (i) an amorphous polyolefin 1-butene copolymer composition; (ii) a heterophase polyolefin propylene copolymer composition comprising amorphous character in amorphous blocks and crystalline character in crystalline blocks.

    Description

    EXAMPLES 1-4

    [0064] Hot melt adhesive compositions were formulated by melt blending as described below, wherein specific components and amounts of the components are shown in the following table 2.

    TABLE-US-00002 TABLE 2 Exemplary Adhesive Formulations Ex. 1 Ex. 2 Ex. 3 Ex. 4 Ex. 5 Ex. 6 Ex. 7 Ex. 8 Source Component wt. % wt. % wt. % wt. % wt. % wt. % wt. % wt. % ExxonMobil Vistamaxx 8816 20 35 35 35 15 15 15 10 Chemical, Houston, TX Huntsman Rextac E-65 59.5 60 55 50 64.5 59.5 59.5 59.5 Chemicals Amoco Indapol H-300 20 4.5 9.5 14.5 20 24.99 0 0 Chemicals (Polyisobutylene) Amoco Indapol H-1900 0 0 0 0 0 0.5 29.99 29.99 Chemicals (Polyisobutylene) Ciba Geigy Irganox 1010 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 Ltd., Basel, (Hindered Switzerland Phenol) Mayzo, Inc. Benetex OB 0 0 0 0 0 0.01 0.01 0.01 Fluorescent Optical Brightener

    TABLE-US-00003 TABLE 3 EXEMPLARY ADHESIVE VISCOSITY DATA Brookfield Viscosity @ Ex. 1 Ex. 2 Ex. 3 Ex. 4 Ex. 5 Ex. 6 Ex. 7 Ex. 8 121.1 C. (250 F.) 26200 29750 16600 39000 135 C. (275 F.) 7710 12125 9725 7500 8425 7100 9100 8750 148.9 C. (300 F.) 4675 6350 5325 4525 5150 4200 5325 5375 162.8 C. (325 F.) 3075 4190 3500 2980 3475 2800 3550 3375 176.7 C. (350 F.) 2220 2945 2450 2080 2315 1920 2385 2275 Mettler Softening 121 C. 125 C. 125 C. 124 C. 120 C. 118 C. 118 C. 115 C. Point

    [0065] These data indicates that the materials will provide excellent construction bonding in disposable absorbent articles. Note viscosity relates to the resistance to flow of the material under certain conditions. This distinctive property determines the flowability, degree of wetting, and penetration of the substrate by the molten polymer. It provides an indication of its processability and utility as a hot melt adhesive material. Melt viscosity is generally directly related to a polymer molecular weight and is reported in Millipascal-second's or centipoise (cP) using a Brookfield thermosel RVT viscometer using a rotor number 27 at the stated temperature.

    [0066] Mettler softening point in degrees Centigrade or degrees Fahrenheit is typically measured using ASTM D3104. The amorphous nature of the poly olefin materials results in a melting point, which is not sharp or definite. Rather as the temperature increases, amorphous polymers gradually change from a solid to a soft and then to a liquid material. No clearly defined glass transition or melting temperature is often noted. This temperature testament that generally measures the precise temperature at which a disc of polymer sample, heated at a rate of 2 C. per minute or 10 F. per minute becomes soft enough to allow the test object, a steel ball (grams) drops through the sample. The softening point of a polymer reported in degrees Centigrade or degrees Fahrenheit is important because it typically indicates the polymer's heat resistance, useful application temperatures and solidification points.

    [0067] The claims may suitably comprise, consist of, or consist essentially of, or be substantially free of any of the disclosed or recited elements. The invention illustratively disclosed herein can also be suitably practiced in the absence of any element which is not specifically disclosed herein. The various embodiments described above are provided by way of illustration only and should not be construed to limit the claims attached hereto. Various modifications and changes may be made without following the example embodiments and applications illustrated and described herein, and without departing from the true spirit and scope of the following claims.