Acoustic board having displaced and passably abutted multiple through holes

Abstract

An acoustic board having displaced and passably abutted multiple through-holes comprises an outer surface and an inner surface, in which the first through-holes formed from the outer surface toward the inner surface and the second through-holes formed from the inner surface toward the outer surface are displaced and passably abutted thereby conjunctively constituting acoustically absorptive micro-orifices. Herein at least some of the second through-holes have a cross-sectional area of greater than 1 mm.sup.2 and are displaced and passably abutted to at least some of the first through-holes, thereby collectively forming a plurality of acoustically absorptive micro-orifices having a cross-sectional area of smaller than 1 mm.sup.2, and, in comparison with the total area of the acoustic board, the opening rate for the sum of the cross-sectional areas of all such acoustically absorptive micro-orifices is less than 3%.

Claims

1. An acoustic board having displaced and passably abutted multiple through-holes, wherein the acoustic board has an outer surface and an inner surface opposite to the outer surface, characterized in that the acoustic board comprises: a plurality of first through-holes formed from the outer surface toward the inner surface; and a plurality of second through-holes formed from the inner surface toward the outer surface; and in which at least some of the second through-holes have a cross-sectional area of greater than 1 mm.sup.2 and are displaced and passably abutted to at least some of the first through-holes, thereby conjunctively forming a plurality of acoustically absorptive micro-orifices having a cross-sectional area of smaller than 1 mm.sup.2, and, in comparison with the total area of the acoustic board, the opening rate for the sum of the cross-sectional areas of all such acoustically absorptive micro-orifices is less than 3%, each first through-hole has a first conical shape with a first opening and a second opening, the first opening has a diameter greater than a diameter greater of the second opening, the first opening abutting the outer surface, each second through-hole has a second conical shape with a third opening and a fourth opening, the third opening has a diameter greater than a diameter greater of the fourth opening, the third opening abutting the inner surface, and the second opening of a first through-hole abuts partially the fourth opening of a second through-hole and results in a resulting through-hole with a diameter smaller than the diameter of the second opening and the diameter of the fourth opening.

2. The acoustic board having displaced and passably abutted multiple through-holes according to claim 1, characterized in that the acoustic board comprises a surface plate material and an auxiliary plate material, in which the surface plate material has the outer surface and the first through-holes, the auxiliary plate material has the inner surface and the second through-holes, and the surface plate material and the auxiliary plate material are mutually abutted for combination.

3. The acoustic board having displaced and passably abutted multiple through-holes according to claim 2, characterized in that the acoustic board further comprises at least a correspondence plate material, in which the correspondence plate materials respectively have a plurality of third through-holes and at least one of such correspondence plate materials is abutted and combined to the inner surface of the auxiliary plate material such that at least some of the third through-holes are displaced and passably abutted to the acoustically absorptive micro-orifices.

4. The acoustic board having displaced and passably abutted multiple through-holes according to claim 1, characterized in that the acoustic board further comprises an assembly part thereby enabling the mutual abutment and overlap of the surface plate material and the auxiliary plate material for assemblage.

5. The acoustic board having displaced and passably abutted multiple through-holes according to claim 4, characterized in that the assembly part further includes a plurality of slide grooves formed on the surface plate material and the auxiliary plate material, and a plurality of fixation bolts allowing penetration through the slide grooves, thereby enabling relative slide when the surface plate material is overlapped in combination to the first auxiliary plate material closely abutted to the surface plate material.

6. The acoustic board having displaced and passably abutted multiple through-holes according to claim 1, characterized in that the acoustic board comprises an injection-molded body, and the body is integrally formed with the first through-holes and the second through-holes.

7. The acoustic board having displaced and passably abutted multiple through-holes according to claim 1, characterized in that the first through-holes and the second through-holes have the same shape.

8. The acoustic board having displaced and passably abutted multiple through-holes according to claim 1, characterized in that the first through-holes and the second through-holes have different shape.

9. The acoustic board having displaced and passably abutted multiple through-holes according to claim 1, characterized in that the opening rate is less than 1%.

10. The acoustic board having displaced and passably abutted multiple through-holes according to claim 1, characterized in that the cross-sectional area of the acoustically absorptive micro-orifices is less than 0.04 mm.sup.2.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 shows an exploded view for a first preferred embodiment of the present invention, for illustrating the formation of acoustically absorptive micro-orifices by mutually displacing and passably abutting the first through-holes and the second through-holes;

(2) FIG. 2 shows a front view for the embodiment in FIG. 1 of the present invention, for illustrating the formation of acoustically absorptive micro-orifices by mutually displacing and passably abutting the first through-holes and the second through-holes;

(3) FIG. 3 shows a top view for the embodiment in FIG. 1 of the present invention, for illustrating the formation of acoustically absorptive micro-orifices by mutually displacing and passably abutting the first through-holes and the second through-holes;

(4) FIG. 4 shows a front view for the embodiment in FIG. 1 of the present invention, for illustrating the utilization of assembly parts to achieve close abutment between the plate materials;

(5) FIG. 5 shows a front view for a second preferred embodiment of the present invention, in which, using the sliding feature of slide grooves, the bodies of the plate materials are displaced, closely overlapped and passably abutted to form acoustically absorptive micro-orifices;

(6) FIG. 6 shows a front view for the embodiment in FIG. 5 of the present invention, for illustrating the formation of acoustically absorptive micro-orifices by mutually displacing and passably abutting the first through-holes, the second through-holes and the third through-holes of various shapes;

(7) FIG. 7 shows a lateral view for a third preferred embodiment of the present invention, for illustrating the injection-molded and integrally formed structure of the acoustic board having displaced and passably abutted multiple through-holes; and

(8) FIG. 8 shows a top view for the embodiment in FIG. 7 of the present invention, for illustrating the displacement and close abutment of two moulds thereby displacing and passably abutting the first through-holes and the second through-holes to form acoustically absorptive micro-orifices.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

(9) The aforementioned and other technical contents, aspects and effects in relation with the present invention can be clearly appreciated through the detailed descriptions concerning the preferred embodiments of the present invention in conjunction with the appended drawings; moreover, in each embodiment, the same components will be denoted with similar numbers.

(10) Initially, the structure of a first preferred embodiment for the acoustic board having displaced and passably abutted multiple through-holes according to the present invention is shown in FIG. 1. To facilitate better understanding, herein the plate material exposed on most exterior side is referred as the surface plate material 1, while the plate material right behind the surface plate material 1 referred as the auxiliary plate material 3; however, those skilled ones in the art may conveniently appreciate that, in implementation, the surface plate material 1 and the auxiliary plate material 3 may be exactly identical.

(11) In the present embodiment, the first through-holes 10 are formed on the surface plate material body 12 of the surface plate material 1 and the second through-holes 30 formed on the auxiliary plate material body 32 of the auxiliary plate material 3, respectively. As mentioned above, the shapes of the first through-holes 10 and the second through-holes 30 may be exactly the same, and also in the present embodiment, each of the first through-holes 10 and the second through-holes 30 is a square through-hole having a length of 1.2 mm on every side; that is, the cross-sectional area in each through-hole is 1.44 mm.sup.2.

(12) Next, refer to FIGS. 2 and 3, wherein, during assemblage, the surface plate material 1 and the auxiliary plate material 3 are mutually displaced and overlapped such that the multiple first through-holes 10 and corresponding second through-holes 30 conjunctively constitute multiple acoustically absorptive micro-orifices 5, each of which having a cross-sectional area less or equal to 0.04 mm.sup.2. No matter from beneath to look up or from above to look down, it can be seen that the first through-holes 10 and the second through-holes 30 are displaced with respect to each other in the present embodiment. To better understand, in the present invention, such a structural characteristic is defined as the first through-holes 10 and the second through-holes 30 being displaced and passably abutted thereby forming the acoustically absorptive micro-orifices 5, and the total cross-sectional area of all of such acoustically absorptive micro-orifices 5 takes up 1% of the entire acoustic board area.

(13) As set forth previously, with currently available technologies, there are usually multiple sharp tapered bodies on the mould; suppose the through-holes to be formed on the plate material are designed to be excessively tiny, then, on one hand, the mould applied for hole piercing may be easily worn off during intensive punch processes, and, on the other hand, after piercing, burr profiles may be generated on the lateral side of such holes so that the edge of through-holes may become irregular thus adversely affecting the acoustic absorption affect thereof. On the contrary, since the cross-sectional areas in each of the first through-holes 10 and the second through-holes 30 may be configured to be several times or even several tens of times of the acoustically absorptive micro-orifices 5, in fabrication, it is not required to be restricted to delicate moulds thus greatly reducing the manufacture costs of moulds and significantly decreasing the abrasions on the mould.

(14) The structure created through the machining operations can be shown in FIG. 4, wherein the present embodiment is assembled by means of displacement and overlap processes. First of all, a surface plate material 1 for assemblage as well as an auxiliary plate material 3 to be placed on the surface plate material 1 are provided, and an assembly part 9 is installed there between as the control device for the acoustically absorptive micro-orifices; in addition, the assembly part 9 is exemplified as a screw and a screw hole in the present embodiment. Moreover, the surface plate material 1 and the auxiliary plate material 3 are displaced and closely overlapped such that the first through-holes 10 and the second through-holes 30 respectively on such plate materials together can naturally create multiple acoustically absorptive micro-orifices 5. Of course, those skilled ones in the art can conveniently appreciate that, in addition to previously illustrated screw and screw hole, the assembly part may be magnets, latches, clips and grooves or the like.

(15) According to in-situ tests performed by the Applicants, it is known that, in case the diameter of hole for the aforementioned through-holes is not greater than 0.2 mm, the acoustic absorption effect may be further improved; additionally, since the square holes are exemplified in the present embodiment, the length and width of the diameter of hole are both 0.2 mm, and the total cross-sectional area of the hole is 0.04 mm.sup.2. However, even if the individual length and width of the first through-holes and second through-holes in the present embodiment are 0.5 mm, it is still possible to conveniently reduce the cross-sectional area of such acoustically absorptive micro-orifices down to 0.04 mm.sup.2 or less in accordance with actual demands thereby enhancing the sound isolation effect and ensuring living quality.

(16) Furthermore, such plate materials having through-holes need only displacement and overlap operations to create the intended acoustically absorptive micro-orifices. In comparison with prior art, the method according to the present invention may largely decrease the difficulty in the fabrication of acoustically absorptive micro-orifices, thus improving the product yield to a significant extent. Besides, since the cross-sectional area of the plate material having through-holes is greater, it is more convenient to modify after piercing operations with less burr structures left thereon, thus further ameliorating its acoustic absorption effect. Meanwhile, during the assemblage of the plate materials having through-holes, it is also possible to adjust the diameters of hole and opening rates based on user's and environmental requirements such that, in comparison with the total area of the entire acoustic board, the opening rate for the sum of the cross-sectional areas of all acoustically absorptive micro-orifices may be less than 3%, thereby increasing the flexibility in use and maintaining good acoustic absorption effect. At the same time, those skilled ones in the art can also consider to form the acoustic board having acoustically absorptive micro-orifices through an approach of three-layered or multi-layered through-hole plate material displacement and passable abutment, or else optionally with thicker or harder decorative materials, such that the acoustic board structure disclosed according to the present invention may be more flexible in application.

(17) Next, a second preferred embodiment of the present invention will be described, in which the aforementioned structure can be utilized from the above-said fixed mode to a slide mode. As shown in FIG. 5, in the second preferred embodiment of the present invention, on the adjacent surface plate material body 12 and the auxiliary plate material body 32, or further on the adjacent corresponding plate material body 42, there respectively form mutually vertical slide grooves and the fixation bolts exemplified as screw bolts which sequentially penetrate through the first through-hole 10 on the surface plate material body 12, second through-hole 30 on the auxiliary plate material body 32 and third through-hole 40 on the corresponding plate material body 42, such that the through-holes on the plate materials are passably abutted thereby forming acoustically absorptive micro-orifices 5 having a suitable size, and that these plate materials are displaced and closely abutted in order to prevent possible slits between them due to slide and assemblage operations. Certainly, those skilled ones in the art can conveniently appreciate that, even if the aforementioned slide groove structure is not employed, other appropriate structures may still fall within the scope of implementation in accordance with the present invention. Besides, it should be noticed that, the surface plate material body 12, the auxiliary plate material body 32 and the corresponding plate material body 42 set forth earlier do not follow any fixed installation sequence or order, but may be freely customized based on actual demands.

(18) Moreover, the shapes between such plate materials may vary according to various requirements, as illustrated in FIG. 6. In the present instance, the shapes of the first through-holes 10 on the surface plate material 1, the second through-holes 30 on the auxiliary plate material 3 and the third through-holes 40 on the corresponding plate material 4 may respectively differ, so long as the cross-sectional area of the acoustically absorptive micro-orifice formed by displacement and passable abutment of the through-holes there between is smaller or equal to 0.04 mm.sup.2, it is then possible to create suitable acoustically absorptive micro-orifices 5 and achieve the same effect.

(19) In addition, by applying plastic injection technologies, it is possible to further lessen abrasion on the pressing mould and reduce the complexity in plate material assemblage processes. As such, a third preferred embodiment of the present invention is provided, as referred to FIGS. 7 and 8. In the present embodiment, a body 2 formed by means of the plastic injection molding technology is provides, in which the body 2 is fabricated by first displacing and closely abutting two moulds 6, pressing and injecting melted plastic into a pre-configured machine, and then, after cooling, opening the moulds and taking out the finished plastic product. To facilitate better understanding, herein the most exterior side is referred as the outer surface 21, while the other side with respect to the outer surface 21 referred as the inner surface 23; additionally, the first through-holes 10 are formed from the outer surface 21 toward the inner surface 23, and the second through-holes 30 formed from the inner surface 23 toward the outer surface 21. Herein the first through-holes 10, second through-holes 30 as well as acoustically absorptive micro-orifices 5 created by displacement and passable abutment processes are integrally formed; also, the radii of the aforementioned first through-holes 10 and second through-holes 30 are all 1 mm, meaning the minimum cross-sectional area in each of the through-holes is approximately 3.14 mm.sup.2, but, after displacement and passable abutment, it is still very easy to restrict the cross-sectional areas of such acoustically absorptive micro-orifices 5 to 1 mm.sup.2, and the opening rate of the total cross-sectional area thereof with respect to the area of the above-said acoustic board will not be greater than 3%.

(20) However, it should be appreciated that the descriptions set forth as above all illustrate simply the preferred embodiments of the present invention, rather than restricting the implementation scope of the present invention thereto. That is, all convenient and equivalently effective changes and modifications made in accordance with the following claims and the contents in the aforementioned specification of the present invention, such as adding certain decorative holes having a cross-sectional area of greater than 1 mm.sup.2 or of various sizes or shapes on the acoustic board, should be all considered to be within the coverage of the present invention.