Epitaxial Substrate for Semiconductor Device and Method for Manufacturing Same

Abstract

Provided is a group 13 nitride epitaxial substrate with which the HEMT device having superior characteristics can be manufactured. This epitaxial substrate is provided with: a base substrate composed of SiC and having a main surface with a (0001) plane orientation; a nucleation layer formed on one main surface of the base substrate and composed of AlN; an electron transit layer formed on the nucleation layer and composed of a group 13 nitride with the composition Al.sub.yGa.sub.1yN (0y<1); and a barrier layer formed on the electron transit layer and composed of a group 13 nitride with the composition In.sub.zAl.sub.1zN (0.13z0.23) or Al.sub.wGa.sub.1wN (0.15w0.35). The (0001) plane of the base substrate has an off angle of 0.1 or more and 0.5 or less, and an intermediate layer composed of a group 13 nitride with the composition Al.sub.xGa.sub.1xN (0.01x0.4) is further provided between the nucleation layer and the electron transit layer.

Claims

1. An epitaxial substrate for a semiconductor device, comprising: a base substrate composed of SiC and having a main surface with a (0001) plane orientation; a nucleation layer formed on one main surface of said base substrate and composed of AlN; an electron transit layer formed on said nucleation layer and composed of a group 13 nitride with a composition Al.sub.yGa.sub.1yN (0y<1); and a barrier layer formed on said electron transit layer and composed of a group 13 nitride with a composition In.sub.zAl.sub.1zN (0.13z0.23) or Al.sub.wGa.sub.1wN (0.15w0.35), wherein a (0001) plane of said base substrate has an off angle of 0.1 or more and 0.5 or less, and an intermediate layer composed of a group 13 nitride with a composition Al.sub.xGa.sub.1xN (0.01x0.4) is further provided between said nucleation layer and said electron transit layer.

2. The epitaxial substrate for a semiconductor device according to claim 1, wherein a spacer layer composed of AIN is further provided between said electron transit layer and said barrier layer.

3. The epitaxial substrate for a semiconductor device according to claim 1, wherein said electron transit layer is composed of GaN.

4. A method for manufacturing an epitaxial substrate for a semiconductor device, comprising steps of: a) epitaxially forming a nucleation layer composed of AlN on one main surface of a base substrate composed of SiC and having a main surface with a (0001) plane orientation; b) epitaxially forming an intermediate layer composed of a group 13 nitride with a composition Al.sub.xGa.sub.1xN (0.01x0.4) on said nucleation layer; c) epitaxially forming an electron transit layer composed of a group 13 nitride with a composition Al.sub.yGa.sub.1yN (0y<1) on said intermediate layer; and d) epitaxially forming a barrier layer composed of a group 13 nitride with a composition In.sub.zAl.sub.1zN (0.13z0.23) or Al.sub.wGa.sub.1wN (0.15w0.35) on said electron transit layer, wherein a substrate whose (0001) plane has an off angle of 0.1 or more and 0.5 or less is used as said base substrate.

5. The method for manufacturing an epitaxial substrate for a semiconductor device according to claim 4, further comprising a step of: e) epitaxially forming a spacer layer composed of AlN on said electron transit layer, wherein said barrier layer is formed on said spacer layer in said step d).

6. The method for manufacturing an epitaxial substrate for a semiconductor device according to claim 4, wherein said electron transit layer is formed of GaN in said step c).

7. The epitaxial substrate for a semiconductor device according to claim 2, wherein said electron transit layer is composed of GaN.

8. The method for manufacturing an epitaxial substrate for a semiconductor device according to claim 5, wherein said electron transit layer is formed of GaN in said step c).

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0014] FIG. 1 is a sectional view schematically illustrating a configuration of an epitaxial substrate 10;

[0015] FIG. 2 is a graph obtained by plotting an electron mobility against an off angle of a base substrate 1 for each of the samples having the same Al concentration of an intermediate layer 3 with respect to Example 1;

[0016] FIG. 3 is a graph obtained by plotting the electron mobility against the off angle of the base substrate 1 for each of the samples having the same Al concentration of the intermediate layer 3 with respect to Example 2;

[0017] FIG. 4 is a graph obtained by plotting the electron mobility against the off angle of the base substrate 1 for each of the samples having the same Al concentration of the intermediate layer 3 with respect to Example 3;

[0018] FIG. 5 is a graph obtained by plotting a sheet carrier density against the off angle of the base substrate 1 for each of the samples having the same Al concentration of the intermediate layer 3 with respect to all of the samples in Examples 1 to 3;

[0019] FIG. 6 is a graph obtained by plotting a maximum drain current of an HEMT device against the electron mobility for all of the samples in Examples 1 to 3;

[0020] FIG. 7 is an AFM image of a surface of the epitaxial substrate 10 in which the off angle of the base substrate 1 is 0.1 and the Al concentration of the intermediate layer 3 is 0.3 in Example 1; and

[0021] FIG. 8 is an AFM image of a surface of an epitaxial substrate fabricated under the same conditions as in the epitaxial substrate 10 of FIG. 7 except that the intermediate layer 3 is not provided.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] The group numbers in the Periodic Table shown in the present specification are based on the group number representation from 1 to 18 according to the revised version of Inorganic Chemistry Nomenclature Rules by International Union of Pure and Applied Chemistry (IUPAC), 1989. The group 13 represents aluminum (Al), gallium (Ga), indium (In) and others. The group 14 represents silicon (Si), germanium (Ge), tin (Sn), lead (Pb) and others. The group 15 represents nitrogen (N), phosphorus (P), arsenic (As), antimony (Sb) and others.

[0023] FIG. 1 is a sectional view schematically illustrating a configuration of an epitaxial substrate 10 according to a preferred embodiment of the present invention. The epitaxial substrate 10 is a substrate for fabricating an HEMT (high electron mobility transistor) device which is one kind of a semiconductor device. In more detail, the epitaxial substrate 10 is a mother substrate for fabricating an HEMT device with which numerous HEMT devices can be obtained by forming a predetermined electrode pattern (not illustrated in the drawings) on the epitaxial substrate 10 and thereafter cutting and separating the epitaxial substrate 10 into a predetermined size to form individual pieces.

[0024] The epitaxial substrate 10 has a configuration in which a nucleation layer 2, an intermediate layer 3, an electron transit layer 4, a spacer layer 5 and a barrier layer 6, each composed of a group 13 nitride, are epitaxially formed in this order on a base substrate 1.

[0025] A semi-insulating SiC single crystal substrate is used as the base substrate 1. Specifically, a 6H-SiC substrate or a 4H-SiC substrate exhibiting an n-type conductivity, having a specific resistance of about 10.sup.4 cm to 10.sup.10 cm, having a (0001) plane orientation and having an off angle of 0.1 or more and 0.5 or less is used as the base substrate 1. Here, in the present preferred embodiment, the off angle refers to an angle formed by the normal direction of the main surface of the base substrate 1 and the normal direction of the (0001) plane.

[0026] The thickness of the base substrate 1 is not particularly limited in terms of material quality; however, for the sake of convenience in handling, a substrate having a thickness of several hundred m to several mm is suitable.

[0027] The nucleation layer 2 is a layer composed of AlN and formed to have a thickness of 1 nm to 500 nm. The nucleation layer 2 is a layer provided for improving the crystal quality of each layer formed thereon.

[0028] The intermediate layer 3 is a layer composed of a group 13 nitride with the composition Al.sub.xGa.sub.1xN (0.01x0.4) and formed to have a thickness of 1 nm to 500 nm.

[0029] The electron transit layer 4 is a layer composed of a group 13 nitride with the composition Al.sub.yGa.sub.1yN (0y<1) and formed to have a thickness of 50 nm to 5000 nm. Preferably, the electron transit layer 4 is formed of GaN.

[0030] The spacer layer 5 is a layer composed of AlN and formed to have a thickness of 0.5 nm to 1.5 nm. Providing the spacer layer 5 produces an effect of enhancing confinement of electrons in a two-dimensional electron gas region. However, the spacer layer 5 is not an essential constituent device and may be omitted.

[0031] The barrier layer 6 is a layer composed of a group 13 nitride with the composition In.sub.zAl.sub.1zN (0.13z0.23) and formed to have a thickness of 2 nm to 15 nm or a layer composed of a group 13 nitride with the composition Al.sub.wGa.sub.1wN (0.15w0.35) and formed to have a thickness of 10 nm to 40 nm. Here, in the case with z<0.13 or w>0.35, microcracks are generated in the barrier layer 6, and an extreme lowering of the electron mobility occurs in the epitaxial substrate 10, so that it is not preferable. In the case with z>0.23 or w<0.15, it is difficult to obtain a sufficient sheet carrier density in the epitaxial substrate 10, and lowering of the drain current amount occurs when an HEMT device is fabricated by using this epitaxial substrate 10, so that it is not preferable.

[0032] In the epitaxial substrate 10 having such a configuration, in the case that the spacer layer 5 is not provided, the interface between the electron transit layer 4 and the barrier layer 6 constitutes a heterointerface, whereas in the case that the spacer layer 5 is provided, a region including the spacer layer 5 between the electron transit layer 4 and the barrier layer 6 constitutes a heterointerface region. At the interface or in the interface region, more specifically, in a neighborhood of the interface of the electron transit layer 4 or in a neighborhood of the interface region, a two-dimensional electron gas region where a two-dimensional electron gas is present at a high concentration is formed by the spontaneous polarization effect and the piezoelectric polarization effect. However, the piezoelectric polarization effect is produced in the case that the barrier layer 6 is formed of Al.sub.wGa.sub.1wN. Here, the case in which the barrier layer 6 is formed of In.sub.zAl.sub.1zN gives a higher sheet carrier density of the epitaxial substrate 10 than the case in which the barrier layer 6 is formed of Al.sub.wGa.sub.1wN. This is because the spontaneous polarization of the former is considerably larger than a sum of the spontaneous polarization and the piezoelectric polarization of the latter. Here, the sheet carrier density of the epitaxial substrate for an HEMT device is in principle affected by the kind, composition, thickness and the like of the barrier layer.

[0033] It is suitable that each of the layers disposed on the base substrate 1 is epitaxially formed sequentially by using the MOCVD method (metal organic chemical vapor deposition method). Specifically, each layer can be epitaxially grown by using a known MOCVD furnace that is constituted so as to be capable of supplying an organic metal (MO) source material gas (TMI, TMA, TMG) for In, Al, Ga as well as an ammonia gas, a hydrogen gas and a nitrogen gas into a reactor.

[0034] In other words, the nucleation layer 2, the intermediate layer 3, the electron transit layer 4, the spacer layer 5 and the barrier layer 6 can be sequentially formed by placing the base substrate 1 on a susceptor provided in the reactor and supplying one or more kinds of gas selected in accordance with the composition of each layer from TMG, TMA, TMI, more specifically a gas obtained by bubbling these, and an ammonia gas respectively in a predetermined supplying ratio that accords to the composition of each layer, together with a carrier gas into the reactor in a state in which the temperature of the base substrate is sequentially kept at a temperature of forming that is determined in advance for each layer.

[0035] For example, it is suitable that each layer is grown under the following conditions. Here, in the present preferred embodiment, the group 15/group 13 gas ratio refers to a ratio of the supplying amount of the ammonia gas, which is a group 15 source material, relative to the supplying amount of the group 13 source material gas (TMI, TMA, TMG) as represented in a molar ratio. Also, in the following, the temperature of forming refers to the susceptor heating temperature.

Nucleation layer 2: [0036] Temperature of forming.fwdarw.1000 C. to 1200 C.; [0037] Pressure within reactor.fwdarw.3 kPa to 30 kPa; [0038] Source material carrier gas.fwdarw.hydrogen; [0039] Group 15/Group 13 gas ratio.fwdarw.5000 to 20000.
Intermediate layer 3: [0040] Temperature of forming.fwdarw.1000 C. to 1200 C.; [0041] Pressure within reactor.fwdarw.3 kPa to 30 kPa; [0042] Source material carrier gas.fwdarw.hydrogen; [0043] Group 15/Group 13 gas ratio.fwdarw.1000 to 5000.
Electron transit layer 4: [0044] Temperature of forming.fwdarw.1000 C. to 1200 C.; [0045] Pressure within reactor.fwdarw.30 kPa to 105 kPa; [0046] Source material carrier gas.fwdarw.hydrogen; [0047] Group 15/Group 13 gas ratio.fwdarw.1000 to 5000.
Spacer layer 5: [0048] Temperature of forming.fwdarw.1000 C. to 1200 C.; [0049] Pressure within reactor.fwdarw.3 kPa to 30 kPa; [0050] Source material carrier gas.fwdarw.hydrogen; [0051] Group 15/Group 13 gas ratio.fwdarw.10000 to 50000.
Barrier layerin the case of forming with In.sub.zAl.sub.1zN: [0052] Temperature of forming.fwdarw.700 C. to 900 C.; [0053] Pressure within reactor.fwdarw.3 kPa to 30 kPa; [0054] Source material carrier gas.fwdarw.nitrogen; [0055] Group 15/Group 13 gas ratio.fwdarw.5000 to 20000.
Barrier layer 6in the case of forming with Al.sub.wGa.sub.1wN: [0056] Temperature of forming.fwdarw.1000 C. to 1200 C.; [0057] Pressure within reactor.fwdarw.3 kPa to 30 kPa; [0058] Source material carrier gas.fwdarw.hydrogen; [0059] Group 15/Group 13 gas ratio.fwdarw.5000 to 20000.

[0060] The epitaxial substrate 10 according to the present preferred embodiment that is formed in such a manner is, as described above, characterized in that a substrate composed of (0001) plane SiC and having an off angle of 0.1 or more and 0.5 or less is used as the base substrate 1 and further that the intermediate layer 3 composed of a group 13 nitride with the composition Al.sub.xGa.sub.1xN (0.01x0.4) is provided between the nucleation layer 2 and the electron transit layer 4. By being provided with both of these requirements, the epitaxial substrate 10 has a high electron mobility of about 1300 cm.sup.2V.sup.1s.sup.1 or more. This is a value equal to or more than a double of the electron mobility that is realized in an epitaxial substrate that is not provided with an intermediate layer though using a base substrate having an off angle. Here, the value of the electron mobility of 1300 cm.sup.2V.sup.1s.sup.1 corresponds to an upper limit value of the electron mobility that is realized when various kinds of group 13 nitride epitaxial substrates for an HEMT device are fabricated using a (0001) plane sapphire substrate as the base substrate. Therefore, the fact that the electron mobility is 1300 cm.sup.2V.sup.1s.sup.1 or more means that the epitaxial substrate has an extremely superior electron mobility.

[0061] Thus, it is a knowledge found out for the first time by the inventors of the present invention that a combination of the requirement that the base substrate 1 has an off angle within the above-described range and the requirement that the intermediate layer 3 having a composition within the above-described range is provided between the nucleation layer 2 and the electron transit layer 4 produces an effect in realizing an extremely high electron mobility of 1300 cm.sup.2V.sup.1s.sup.1 or more.

[0062] Also, by using the epitaxial substrate 10 according to the present preferred embodiment having a superior electron mobility such as this, an HEMT device having superior characteristics, for example, an HEMT device having a high maximum drain current, can be fabricated.

[0063] As described above, according to the present preferred embodiment, an epitaxial substrate for fabricating an HEMT device having a superior electron mobility can be obtained, and further an HEMT device having superior characteristics can be obtained by using a (0001) plane SiC substrate having an off angle of 0.1 or more and 0.5 or less as the base substrate and providing an intermediate layer composed of a group 13 nitride with the composition Al.sub.xGa.sub.1xN (0.01x0.4) between the nucleation layer that are disposed immediately above the base substrate and the electron transit layer in the epitaxial substrate for fabricating the HEMT device in which the electron transit layer and the barrier layer form a heterojunction interface region on the base substrate.

EXAMPLES

[0064] As Examples 1 to 3, epitaxial substrates 10 having various configurations were fabricated by the MOCVD method, and the electron mobility and the sheet carrier density were evaluated for each of the epitaxial substrates 10. Also, HEMT devices were fabricated using the respective obtained epitaxial substrates 10, and the maximum drain current thereof was measured.

[0065] In Example 1, 30 kinds of epitaxial substrates 10 in all were fabricated by making the off angle of the base substrate 1 differ at 5 levels of 0.05, 0.1, 0.3, 0.5 and 0.7 and further by making the Al concentration, which is the value of x in Al.sub.xGa.sub.1xN in the intermediate layer 3, differ at 6 levels of 0.005, 0.01, 0.03, 0.3, 0.4 and 0.6 while fixing the composition, the thickness and the fabricating conditions of the base substrate 1, the nucleation layer 2, the intermediate layer 3, the electron transit layer 4, the spacer layer 5 and the barrier layer 6 in all of the samples in the following manner.

Ground substrate 1: [0066] Composition.fwdarw.semi-insulating (0001) plane 4H-SiC; [0067] Thickness.fwdarw.350 m.
Nucleation layer 2: [0068] Composition.fwdarw.AlN; [0069] Thickness.fwdarw.200 nm; [0070] Temperature of forming.fwdarw.1100 C.; [0071] Pressure within reactor.fwdarw.10 kPa; [0072] Source material carrier gas.fwdarw.hydrogen; [0073] Group 15/Group 13 gas ratio.fwdarw.10000.
Intermediate layer 3: [0074] Composition.fwdarw.AlGaN; [0075] Thickness.fwdarw.10 nm; [0076] Temperature of forming.fwdarw.1100 C.; [0077] Pressure within reactor.fwdarw.10 kPa; [0078] Source material carrier gas.fwdarw.hydrogen; [0079] Group 15/Group 13 gas ratio.fwdarw.2000; [0080] TMA/(TMA+TMG) gas ratio.fwdarw.0.005, 0.01, 0.03, 0.3, 0.4, 0.6 in the order of increasing x.
Electron transit layer 4: [0081] Composition.fwdarw.GaN; [0082] Thickness.fwdarw.1000 nm; [0083] Temperature of forming.fwdarw.1100 C.; [0084] Pressure within reactor.fwdarw.100 kPa; [0085] Source material carrier gas.fwdarw.hydrogen; [0086] Group 15/Group 13 gas ratio.fwdarw.2000.
Spacer layer 5: [0087] Composition.fwdarw.AlN; [0088] Thickness.fwdarw.1 nm; [0089] Temperature of forming.fwdarw.1100 C.; [0090] Pressure within reactor.fwdarw.10 kPa; [0091] Source material carrier gas.fwdarw.hydrogen; [0092] Group 15/Group 13 gas ratio.fwdarw.30000.
Barrier layer 6: [0093] Composition.fwdarw.In.sub.0.18Al.sub.0.82N; [0094] Thickness.fwdarw.10 nm; [0095] Temperature of forming.fwdarw.800 C.; [0096] Pressure within reactor.fwdarw.10 kPa; [0097] Source material carrier gas.fwdarw.nitrogen; [0098] Group 15/Group 13 gas ratio.fwdarw.10000.

[0099] Also, in Example 2, 30 kinds of epitaxial substrates 10 in all were fabricated by setting the off angle of the base substrate 1 and the Al concentration of the intermediate layer 3 in the same manner as in Example 1 while fixing the composition, the thickness and the fabricating conditions of the base substrate 1, the nucleation layer 2, the intermediate layer 3, the electron transit layer 4, the spacer layer 5 and the barrier layer 6 in all of the samples in the following manner.

Ground substrate 1: [0100] Composition.fwdarw.semi-insulating (0001) plane 6H-SiC; [0101] Thickness.fwdarw.400 m.
Nucleation layer 2: [0102] Composition.fwdarw.AlN; [0103] Thickness.fwdarw.10 nm; [0104] Temperature of forming.fwdarw.1050 C.; [0105] Pressure within reactor.fwdarw.5 kPa; [0106] Source material carrier gas.fwdarw.hydrogen; [0107] Group 15/Group 13 gas ratio.fwdarw.7500.
Intermediate layer 3: [0108] Composition.fwdarw.Al.sub.xGa.sub.1xN; [0109] Thickness.fwdarw.100 nm; [0110] Temperature of forming.fwdarw.1050 C.; [0111] Pressure within reactor.fwdarw.5 kPa; [0112] Source material carrier gas.fwdarw.hydrogen; [0113] Group 15/Group 13 gas ratio.fwdarw.1500; [0114] TMA/(TMA+TMG) gas ratio.fwdarw.0.005, 0.01, 0.03, 0.3, 0.4, 0.6 in the order of increasing x.
Electron transit layer 4: [0115] Composition.fwdarw.GaN; [0116] Thickness.fwdarw.2000 nm; [0117] Temperature of forming.fwdarw.1050 C.; [0118] Pressure within reactor.fwdarw.50 kPa; [0119] Source material carrier gas.fwdarw.hydrogen; [0120] Group 15/Group 13 gas ratio.fwdarw.4000.
Spacer layer 5: [0121] Composition.fwdarw.AlN; [0122] Thickness.fwdarw.1 nm; [0123] Temperature of forming.fwdarw.1050 C.; [0124] Pressure within reactor.fwdarw.5 kPa; [0125] Source material carrier gas.fwdarw.hydrogen; [0126] Group 15/Group 13 gas ratio.fwdarw.10000. [0127] Barrier layer 6: [0128] Composition.fwdarw.In.sub.0.15Al.sub.0.85N; [0129] Thickness.fwdarw.8 nm; [0130] Temperature of forming.fwdarw.810 C.; [0131] Pressure within reactor.fwdarw.5 kPa; [0132] Source material carrier gas.fwdarw.nitrogen; [0133] Group 15/Group 13 gas ratio.fwdarw.5000.

[0134] Further, in Example 3, 30 kinds of epitaxial substrates 10 in all were fabricated without providing the spacer layer 5 and by setting the off angle of the base substrate 1 and the Al concentration of the intermediate layer 3 in the same manner as in Example 1 while fixing the composition, the thickness and the fabricating conditions of the base substrate 1, the nucleation layer 2, the intermediate layer 3, the electron transit layer 4 and the barrier layer 6 in all of the samples in the following manner.

Ground substrate 1: [0135] Composition.fwdarw.semi-insulating (0001) plane 4H-SiC; [0136] Thickness.fwdarw.350 m.
Nucleation layer 2: [0137] Composition.fwdarw.AlN; [0138] Thickness.fwdarw.100 nm; [0139] Temperature of forming.fwdarw.1150 C.; [0140] Pressure within reactor.fwdarw.15 kPa; [0141] Source material carrier gas.fwdarw.hydrogen; [0142] Group 15/Group 13 gas ratio.fwdarw.15000.
Intermediate layer 3: [0143] Composition.fwdarw.Al.sub.xGa.sub.1xN; [0144] Thickness.fwdarw.1 nm; [0145] Temperature of forming.fwdarw.1150 C.; [0146] Pressure within reactor.fwdarw.15 kPa; [0147] Source material carrier gas.fwdarw.hydrogen; [0148] Group 15/Group 13 gas ratio.fwdarw.3000; [0149] TMA/(TMA+TMG) gas ratio.fwdarw.0.005, 0.01, 0.03, 0.3, 0.4, 0.6 in the order of increasing x.
Electron transit layer 4: [0150] Composition.fwdarw.GaN; [0151] Thickness.fwdarw.3000 nm; [0152] Temperature of forming.fwdarw.1150 C.; [0153] Pressure within reactor.fwdarw.100 kPa; [0154] Source material carrier gas.fwdarw.hydrogen; [0155] Group 15/Group 13 gas ratio.fwdarw.1000.
Barrier layer 6: [0156] Composition.fwdarw.Al.sub.0.2Ga.sub.0.8N; [0157] Thickness.fwdarw.20 nm; [0158] Temperature of forming.fwdarw.1150 C.; [0159] Pressure within reactor.fwdarw.15 kPa; [0160] Source material carrier gas.fwdarw.hydrogen; [0161] Group 15/Group 13 gas ratio.fwdarw.10000.

[0162] With respect to the obtained 90 kinds of epitaxial substrates 10 in all in Examples 1 to 3, the electron mobility and the sheet carrier density were measured by Hall measurement according to the van der Pauw method.

[0163] Further, an HEMT device was fabricated experimentally by using each epitaxial substrate. Specifically, a Ti/Al/Ni/Au multilayer film was formed by vapor deposition as an ohmic electrode on each epitaxial substrate, and a Pd/Ti/Au multilayer film was formed by vapor deposition as a Schottky electrode. The thickness of the layers in the Ti/Al/Ni/Au multilayer film was set to be 15/75/15/40 nm sequentially in this order. Also, the thickness of the layers in the Pd/Ti/Au multilayer film was set to be 40/20/60 nm sequentially in this order. Also, the gate length was set to be 2 m, and the gate width was set to be 15 m. Device separation between the respective HEMT devices was carried out by RIE (reactive ion etching) using a chlorine-based gas, and a SiO.sub.2 film serving as a protective film was formed by sputtering on each device surface.

[0164] FIGS. 2, 3, and 4 each show a graph obtained by plotting the electron mobility against the off angle of the base substrate 1 for each of the samples having the same Al concentration of the intermediate layer 3 with respect to Examples 1, 2, and 3, respectively. However, in each of FIGS. 2, 3, and 4, the off angle in the base substrate 1 is denoted as SiC substrate off angle. Also, a broken line is drawn at the level at which the electron mobility is 1300 cm.sup.2V.sup.1s.sup.1.

[0165] From FIGS. 2, 3, and 4, it will be understood that a high electron mobility of 1300 cm.sup.2V.sup.1s.sup.1 or more is obtained when the off angle of the base substrate 1 is set to be 0.1 or more and 0.5 or less and the Al concentration in the intermediate layer 3 is set to be 0.1 or more and 0.4 or less, though the other layer configurations are made to differ. This means that setting the off angle of the base substrate 1 to be 0.1 or more and 0.5 or less and setting the Al concentration in the intermediate layer 3 to be 0.1 or more and 0.4 or less produces an effect of increasing the electron mobility in the epitaxial substrate 10.

[0166] Also, FIG. 5 is a graph obtained by plotting the sheet carrier density against the off angle of the base substrate 1 for each of the samples having the same Al concentration of the intermediate layer 3 with respect to all of the samples in Examples 1 to 3. However, in FIG. 5 as well, the off angle in the base substrate 1 is denoted as SiC substrate off angle. Further, FIG. 6 is a graph obtained by plotting the maximum drain current of the HEMT device against the electron mobility for all of the samples in Examples 1 to 3. In FIG. 6, a broken line is drawn at the level at which the electron mobility is 1300 cm.sup.2V.sup.1s.sup.1.

[0167] Referring to FIG. 5, in Examples 1 and 2, the sheet carrier density had an approximately constant value of around 210.sup.13 cm.sup.2 irrespective of the off angle of the base substrate 1 and the Al concentration of the intermediate layer 3. Also, in Example 3, the sheet carrier density had an approximately constant value of around 110.sup.13 cm.sup.2. In other words, though the sheet carrier density was varied among the examples, there was no dependency of the sheet carrier density on the off angle of the base substrate 1 and the Al concentration of the intermediate layer 3.

[0168] In the meantime, from FIG. 6, it is confirmed that, in all of the Examples, the maximum drain current is positively correlated to the electron mobility and that Examples 1 and 2 obtained by forming the barrier layer 6 with In.sub.zAl.sub.1z and providing the spacer layer 5 tend to give a higher maximum drain current than Example 3 obtained by forming the barrier layer 6 with Al.sub.wGa.sub.1wN.

[0169] Specifically, when the electron mobility is 1300 cm.sup.2V.sup.1s.sup.1 or more, a maximum drain current of 600 mA/mm or more is realized in the HEMT device that is not provided with the spacer layer 5, whereas a maximum drain current of 750 mA/mm or more is realized in the HEMT device that is provided with the spacer layer 5.

[0170] Also, FIG. 7 is an AFM image of a surface of the epitaxial substrate 10, more specifically a surface of the barrier layer 6, in which the off angle of the base substrate 1 is 0.1 and the Al concentration of the intermediate layer 3 is 0.3 in Example 1. On the other hand, FIG. 8 is an AFM image of a surface of an epitaxial substrate fabricated under the same conditions as in the epitaxial substrate 10 of FIG. 7 except that the intermediate layer 3 is not provided, for the sake of comparison.

[0171] In the AFM image of FIG. 8, numerous pits are confirmed on the substrate surface. The pits are recognized as black points on the drawing. In contrast, such pits are not seen in the AFM image of FIG. 7, and it has been confirmed that the substrate surface has a good flatness. Such a difference shows that providing the intermediate layer 3 produces an effect of improving the flatness on the surface of the epitaxial substrate 10, more specifically on the surface of the barrier layer 6. Further, by considering the results shown in FIG. 2 and others in combination, it seems that providing the intermediate layer 3 in order to realize a surface having a high flatness without generation of pits produces an effect in improving the electron mobility of the epitaxial substrate 10.

[0172] While the invention has been shown and described in detail, the foregoing description is in all aspects illustrative and not restrictive. It is therefore understood that numerous modifications and variations can be devised without departing from the scope of the invention.