Component Carrier With Different Surface Finishes

Abstract

A component carrier being less prone to deterioration by oxidation and a method for manufacturing the same are disclosed. The component carrier includes a laminated stack with a first surface finish covering a first part of an exposed surface of the laminated stack and a second surface finish covering a second part of an exposed surface of the laminated stack. The first surface finish and the second surface finish are arranged in direct contact with one another so as to at least partially overlap.

Claims

1. A component carrier, comprising: a laminated stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure; a first surface finish covering a first part of an exposed surface of the laminated stack; and a second surface finish covering a second part of an exposed surface of the laminated stack; wherein the first surface finish and the second surface finish are arranged in direct contact with one another so as to at least partially overlap with each other.

2. The component carrier according to claim 1, wherein the overlap of the first surface finish and the second surface finish is such that the second surface finish is placed on top of the first surface finish.

3. The component carrier according to claim 1, wherein the first surface finish and the second surface finish overlap at least to an extent which exceeds an inaccuracy of plating of the first surface finish and second surface finish.

4. The component carrier according to claim 1, wherein the first surface finish and the second surface finish overlap by at least 20 m.

5. The component carrier according to claim 4, wherein the first surface finish and the second surface finish overlap by at least 100 m.

6. The component carrier according to claim 1, wherein the exposed surface of the laminated stack is a structured copper surface.

7. The component carrier according to claim 1, wherein the first surface finish and the second surface finish each comprises at least one metal layer structure.

8. The component carrier according to claim 7, wherein the at least one metal layer structure comprises at least one of the group consisting of nickel, platinum and gold.

9. The component carrier according to claim 1, wherein the second surface finish comprises a first electroplated nickel layer structure and a second gold layer structure.

10. The component carrier according to claim 1, wherein the second surface finish comprises a first electroless-plated nickel layer structure and a second immersion-gold layer structure.

11. The component carrier according to claim 1, wherein the first surface finish comprises a gold layer structure.

12. The component carrier according to claim 1, wherein the first surface finish comprises a first electroless-plated nickel layer structure and a second immersion-gold layer structure.

13. The component carrier according to claim 1, wherein at least one surface finish comprises at least three plated metal layer structures.

14. The component carrier according to claim 12, wherein at least one surface finish comprises a first nickel layer structure, a second platinum layer structure and a third gold layer structure.

15. The component carrier according to claim 1, wherein the first surface finish and the second surface finish each has a thickness in a range of 10 nm to 100 m.

16. The component carrier according to claim 15, wherein the first surface finish and the second surface finish each has a thickness in a range of 500 nm to 1 m.

17. The component carrier according to claim 15, wherein the first surface finish and the second surface finish each has a thickness in a range of 100 nm to 10 m.

18. The component carrier according to claim 1, wherein the component carrier is a printed circuit board.

19. The component carrier according to claim 1, wherein the component carrier is a substrate.

20. An electronic device, comprising: a laminated stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure; a first surface finish covering a first part of an exposed surface of the laminated stack; and a second surface finish covering a second part of an exposed surface of the laminated stack; wherein the first surface finish and the second surface finish are arranged in direct contact with one another so as to at least partially overlap with each other.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0067] FIG. 1 shows a cross-sectional view of a conventional component carrier known from the state of the art.

[0068] FIG. 2a and FIG. 2b illustrate a known method for manufacturing of a component carrier and the final component carrier, respectively, wherein the combined inaccuracies of plating of a first mask and a second mask result in a gap between a first and a second surface finish.

[0069] FIG. 3 shows a cross-sectional view of an inventive embodiment of the component carrier according to FIG. 2 with a first and a second surface finish, wherein the first and the second surface finishes partly overlap.

[0070] FIG. 4, FIG. 5 and FIG. 6 show cross-sectional views of further embodiments of the inventive component carrier according to FIG. 3.

[0071] FIG. 7 shows a cross-sectional view of a method for manufacturing of a component carrier according to FIG. 3.

DETAILED DESCRIPTION OF ILLUSTRATED EMBODIMENTS

[0072] The conventional component carrier 1 known from the state of the art and shown in FIG. 1 comprises a laminated stack 8. The laminated stack 8 comprises an electrically insulating layer structure 10 and an electrically conductive layer structure 20a, 20b inside the laminated stack 8 as well as an electrically conductive layer structure 12 on or over the surface of the laminated stack 8 forming an exposed structured copper surface 12. The electrically conductive layer structures 20a, 20b, 12 are preferably made of copper. The electrically conductive layer structure 20a, 20b inside the laminated stack 8 is connected to the electrically conductive layer structure 12 by way of microvias or plated-through holes 25a, 25b. A single surface finish 14 completely covers the electrically conductive layer structure 12.

[0073] The manufacturing of a known component carrier 1 as shown in FIG. 2a comprises applying a first mask 19 above the electrically conductive layer structure 12, applying a first surface finish 11 in a region not protected by the first mask 19 and then applying a second mask 29 above the first mask 19 and the first surface finish 11. Thereafter, the method continues with the application of a second surface finish 21 in a region unprotected by the second mask 29. The area which is not covered by the mask material corresponds to the image of the mask, enabling the surface finish coming into contact with the exposed surface of the component carrier during plating. The problem arises that the inaccuracy region of plating 39a, 39b of the first surface finish 11 and second surface finish 21, respectively, may result in a non-covered gap or region 35 between the first surface finish 11 and the second surface finish 21 as shown in FIG. 2b. The electrically conductive layer structure 12 (which can be made from copper) is prone to oxidation over the area in registration with non-covered gap or region 35 which may result in damage to the exposed surface.

[0074] An improved component carrier 100 according to an embodiment of the invention is shown in FIG. 3. As illustrated, the first surface finish 110 and the second surface finish 210 partly overlap. A region 300 where the first surface finish 110 and the second surface finish 210 overlap each other is such that the second surface finish 210 is partly placed on top of the first surface finish 110. Preferably, the first surface finish 110 and the second surface finish 210 overlap each other at least to an extent which exceeds the inaccuracy region (See, e.g. 39a, 39b in FIG. 2a) of plating of the first surface finish 110 and second surface finish 210, in particular by at least 20 m.

[0075] An improved component carrier 200 according to an alternative embodiment of the invention is shown in FIG. 4. As illustrated, the first surface finish 110 comprises a first layer structure 150 and a second layer structure 120, with the first layer structure 150 being for instance an electroless-plated nickel layer structure and the second layer structure 120 being for instance an immersion-gold layer structure.

[0076] An improved component carrier 400 according to another alternative embodiment of the invention is shown in FIG. 5. As illustrated, the second surface finish 210 comprises a first layer structure 250 and a second layer structure 220, with the first layer structure 250 being for instance an electroplated nickel layer structure and the second layer structure 220 being for instance a gold layer structure. Only the second layer structure 220 of the second surface finish 210 overlaps the first surface finish 110 over the region 300 thereby covering the gap 350 between the first surface finish 110 and the first layer structure 250 and providing protection of the electrically conductive layer structure 12 from oxidation.

[0077] An improved component carrier 500 according to still another alternative embodiment of the invention is shown in FIG. 6. As illustrated, the second surface finish 210 comprises a first layer structure 250 and a second layer structure 220, with the first layer structure 250 being for instance an electroplated nickel layer structure and the second layer structure 220 being for instance a gold layer structure. The first layer structure 250 of the second surface finish 210 as well as the second layer structure 220 of the second surface finish 210 overlap each other and a portion of the first surface finish 110 over the region 300 thereby entirely avoiding gap formation between the first surface finish 110 and the second surface finish 210.

[0078] FIG. 7 illustrates a method for manufacturing an improved component carrier according to an embodiment of the invention depicted as for instance in FIG. 3. The method comprises using a first mask 190 for subsequently applying a first surface finish 110 and then using a second mask 290 for subsequently applying a second surface finish 210. The first surface finish 110 and the second surface finish 210 are provided in such a way as to partly overlap each other over the region 300 with the second surface finish 210 being partly placed on top of the first surface finish 110 thereby avoiding oxidation issues of the underlying electrically conductive layer structure 12 due to gap-formation between the first surface finish 110 and the second surface finish 210.

[0079] It should be noted that the term comprising does not exclude other elements or steps and the indefinite article a or an does not exclude a plurality of the corresponding features. Elements described in association with different embodiments may be combined.

[0080] The invention is not limited to the preferred embodiments shown in the figures and given in the description. Instead, multiplicities of variants are possible which use the solutions shown and the principles according to the invention even in the case of fundamentally different embodiments.

REFERENCES APPLIED IN THE ILLUSTRATED EMBODIMENTS

[0081] 1 component carrier [0082] 8 laminated stack [0083] 10 electrically insulating layer structure [0084] 11 first surface finish [0085] 12 electrically conductive layer structure [0086] 14 surface finish [0087] 19 first mask [0088] 20 electrically conductive layer structure [0089] 21 second surface finish [0090] 25 microvias or plated-through holes [0091] 29 second mask [0092] 35 gap [0093] 39 plating [0094] 100 improved component carrier [0095] 110 first surface finish [0096] 120 second layer structure [0097] 150 first layer structure [0098] 190 first mask [0099] 200 improved component carrier [0100] 210 second surface finish [0101] 220 second layer structure [0102] 250 first layer structure [0103] 290 second mask [0104] 300 region [0105] 350 gap [0106] 400 improved component carrier [0107] 500 improved component carrier