OPTICAL DEVICE PROVIDED WITH A PLURALITY OF LENSES
20230082895 · 2023-03-16
Assignee
Inventors
Cpc classification
International classification
Abstract
Optical device, that is provided between optical output element and optical propagation element, includes: first lens circuit configured to include one or more lenses through which output light of the optical output element passes; and second lens circuit configured to include one or more lenses and guide output light of the first lens circuit to the optical propagation element. When F11 represents distance between the optical output element and the first lens circuit, F12 represents distance between the first lens circuit and first beam waist position of the first lens circuit, F21 represents distance between the first beam waist position and the second lens circuit, and F22 represents distance between the second lens circuit and second beam waist position of the second lens circuit, F11 and F22 are equal to each other and F12 and F21 are equal to each other.
Claims
1. An optical device provided between an optical output element and an optical propagation element, the optical device comprising: a first lens circuit configured to include one or more lenses through which output light of the optical output element passes; and a second lens circuit configured to include one or more lenses and guide output light of the first lens circuit to the optical propagation element, wherein when F11 represents a distance between the optical output element and the first lens circuit, F12 represents a distance between the first lens circuit and a first beam waist position indicative of a point at which the output light of the optical output element is condensed by the first lens circuit, F21 represents a distance between the first beam waist position and the second lens circuit, and F22 represents a distance between the second lens circuit and a second beam waist position indicative of a point at which the output light of the first lens circuit is condensed by the second lens circuit, F11 and F22 are equal to each other and F12 and F21 are equal to each other.
2. The optical device according to claim 1, wherein the first lens circuit is comprised of a first lens, and the second lens circuit is comprised of a second lens.
3. The optical device according to claim 2, wherein a shape and a material of the first lens are the same as a shape and a material of the second lens.
4. The optical device according to claim 3, wherein each of the first lens and the second lens is a ball lens or a planoconvex lens.
5. The optical device according to claim 2, wherein the first lens and the second lens are respectively held in grooves formed in a surface of a substrate on which the optical device is mounted.
6. The optical device according to claim 1, wherein the first lens circuit includes a first lens and a second lens, the second lens circuit includes a third lens and a fourth lens, the first lens guides the output light of the optical output element to the second lens, the second lens guides output light of the first lens to the third lens, the third lens guides output light of the second lens to the fourth lens, the fourth lens guides output light of the third lens to the optical propagation element, and when a focal distance of the first lens is f1, a focal distance of the second lens is f2, a focal distance of the third lens is f3, and a focal distance of the fourth lens is f4, F11=f1, F12+F21=f2+f3, F22=f4, f1=f4 and f2=f3 are satisfied.
7. The optical device according to claim 1, wherein the optical output element is a light source, an optical waveguide or an optical fiber, and the optical propagation element is an optical waveguide or an optical fiber.
8. The optical device according to claim 1, further comprising: an optical isolator provided between the optical output element and the optical propagation element.
9. The optical device according to claim 1, wherein a groove is formed along an optical path between the optical output element and the optical propagation element in a surface of a substrate on which the optical device is mounted.
Description
BRIEF DESCRIPTION OF DRAWINGS
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DESCRIPTION OF EMBODIMENTS
[0027]
[0028] In the case illustrated in
[0029] In the case illustrated in
[0030] The object focal distance indicates a distance between an emission point of light and the lens system. For example, in the case illustrated in
[0031]
[0032] The optical device 10 is provided with a first lens circuit 11 and a second lens circuit 12. The first lens circuit 11 includes one or a plurality of lenses, and guides output light of the optical output element 21 to the second lens circuit 12. The second lens circuit 12 includes one or a plurality of lenses, and guides output light of the first lens circuit 11 to the optical propagation element 22. In other words, the output light of the optical output element 21 is guided to the optical propagation element 22 by the first lens circuit 11 and the second lens circuit 12.
[0033] The optical device 10 is configured so as to satisfy “F11=F22” and “F12=F21”. F11 represents an object focal distance of the first lens circuit 11. Specifically, the object focal distance F11 indicates a distance between the optical output element 21 and the first lens circuit 11. F12 represents an image focal distance of the first lens circuit 11. Specifically, the image focal distance F12 indicates a distance between the first lens circuit 11 and a beam waist position BW1 indicative of a point in which the output light of the optical output element 21 is condensed by the first lens circuit 11. As explained with reference to
[0034] Laser light output from the first lens circuit 11 is condensed in the beam waist position BW1, and then, is input to the second lens circuit 12, while enlarging the mode field diameter. Accordingly, in the case where the second lens circuit 12 is the lens system illustrated in
First Embodiment
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[0036]
[0037] The optical device 10 is mounted on the surface of the substrate 110. The substrate 110 is not limited particularly, and for example, is a silicon substrate. The ball lens 1 and the ball lens 2 are mounted respectively using a groove 114 and a groove 115 formed in the surface of the substrate 110. For example, each of the grooves 114 and 115 is actualized by a V groove.
[0038] The semiconductor laser light source 111 is mounted on the surface of the substrate 110, and outputs laser light with a specified wavelength. The semiconductor laser light source 111 is one example of the optical output element 21 illustrated in
[0039] In the surface of the substrate 110, the optical device 10 is configured so as to guide laser light generated by the semiconductor laser light source 111 to the optical waveguide 113 by the ball lens 1 and the ball lens 2. Specifically, the laser light generated by the semiconductor laser light source 111 is input to the ball lens 1. Output light of the ball lens 1 is guided to the ball lens 2. Output light of the ball lens 2 is guided to the optical waveguide 113. Herein, it is assumed that heights of an emission end face of the semiconductor laser light source 111 and an end face of the optical waveguide 113 are the same with respect to the surface of the substrate 110. Further, it is designed that an optical axis of the laser light generated by the semiconductor laser light source 111 passes through the center of the ball lens 1 and the center of the ball lens 2.
[0040] The laser light generated by the semiconductor laser light source 111 propagates parallel with the surface of the substrate 110. In
[0041] Specifically, the groove 116 is formed between a region where the semiconductor laser light source 111 is mounted and a region where the ball lens 1 is mounted. The groove 117 is formed between the region where the ball lens 1 is mounted and a region where the ball lens 2 is mounted. The groove 118 is formed between the region where the ball lens 2 is mounted and the optical waveguide 113. Accordingly, scattering and/or absorption is suppressed in between the semiconductor light laser source 111 and the optical waveguide 113, and it is possible to suppress deterioration of the quality of the laser light.
[0042] As explained with reference to
[0043] F11 represents an object focal distance of the ball lens 1. The object focal distance indicates a distance between an emission point P of light and a lens. The emission point P (P1 and P2 in
[0044] F21 represents an object focal distance of the ball lens 2. Herein, light emitted from the beam waist position BW1 is input to the ball lens 2. In other words, an emission point P for the ball lens 2 is the beam waist position BW1. Accordingly, the object focal distance F21 indicates a distance between the beam waist position BW1 and the ball lens 2. F22 represents an image focal distance of the ball lens 2. The image focal distance F22 indicates a distance between the ball lens 2 and a beam waist position (hereinafter, beam waist position BW2) of the ball lens 2 for the output light of the ball lens 1. The beam waist position BW2 indicates the point at which the output light of the ball lens 1 is condensed by the ball lens 2. Note that, in this embodiment, on the surface of the substrate 110, the end face of the optical waveguide 113 is arranged at the beam waist position BW2.
[0045] Herein, definitions of the focal distance, object focal distance and image focal distance of a lens will be described. First,
[0046]
[0047] In the definition illustrated in
[0048] The object focal distance F11 indicates the distance between the emission end face of the semiconductor laser light source 111 and the center of the ball lens 1. The image focal distance F12 indicates the distance between the center of the ball lens 1 and the beam waist position BW1 indicative of the point at which the output light of the semiconductor laser light source 111 is condensed by the ball lens 1. The object focal distance F21 indicates the distance between the beam waist position BW1 and the center of the ball lens 2. The image focal distance F22 indicates the distance between the center of the ball lens 2 and the beam waist position BW2 indicative of the point at which the output light of the ball lens 1 is condensed by the ball lens 2.
[0049] In the definition illustrated in
[0050] The object focal distance F11 indicates the distance between the emission end face of the semiconductor laser light source 111 and the surface of the ball lens 1 to which the output light of the semiconductor light source 111 is input. The image focal distance F12 indicates the distance between the surface of the ball lens 1 for emitting light propagating from the semiconductor laser light source 111 toward the ball lens 2 and the beam waist position BW1 indicative of the point at which the output light of the semiconductor laser light source 111 is condensed by the ball lens 1. The object focal distance F21 indicates the distance between the beam waist position BW1 and the surface of the ball lens 2 to which the output light of the ball lens 1 is input. The image focal distance F22 indicates the distance between the surface of the ball lens 2 for emitting the light propagating from the ball lens 1 toward the optical waveguide 113 and the beam waist position BW2 indicative of the point at which the output light of the ball lens 1 is condensed by the ball lens 2.
[0051] The parameters F11, F12, F21 and F22 representing the configuration of the device 10 may be configured with the definition illustrated in
[0052] According to the above-mentioned configuration, the laser light generated by the semiconductor laser light source 111 is guided to the ball lens 2 by the ball lens 1. At this point, the laser light is once condensed in the beam waist position BW1, and subsequently, the mode field diameter is enlarged. Then, the ball lens 2 condenses the laser light to the end face of the optical waveguide 113.
[0053] Next, a design example of the optical device 10 will be described. In the following description, it is assumed that the object focal distance and image focal distance are configured with the surface of the ball lens as reference as illustrated in
[0054] The semiconductor laser light source 111 is mounted face-down on the surface of the substrate 110 so that heights of optical axes of the semiconductor laser light source 111 and the optical waveguide 113 are equal to each other. Specifically, for example, AuSn solder is provided in a specified position of the surface of the substrate 110, the semiconductor laser light source 111 provided with an Au electrode is fixed onto the AuSn solder by flip chip bonding, and the semiconductor laser light source 111 is thereby mounted on the substrate 110. A wavelength of the laser light generated by the semiconductor laser light source 111 is 1.3 μm. By providing a spot size converter on the output side of the semiconductor laser light source 111, a mode field diameter is enlarged to 3 μm. By this means, a mode mismatch is suppressed.
[0055] Materials of the ball lenses 1 and 2 are LASF35 having a refractive index of 1.98 with respect to the wavelength of 1.3 μm. Diameters of the ball lenses 1 and 2 are 500 μm. Anti-Reflection (AR) coating is applied to surfaces of the ball lenses 1 and 2.
[0056] The distance (i.e., the object focal distance F11 of the ball lens 1) between the emission end face of the semiconductor laser light source 111 and the ball lens 1 is 253 μm. Herein, in the first embodiment, F11=F22 holds. Accordingly, the distance (i.e., the image focal distance F22 of the ball lens 2) between the ball lens 2 and the end face of the optical waveguide 113 is also 253 μm. Further, a spacing (gap width between the lens surface of the ball lens 1 and the lens surface of the ball lens 2) between the ball lens 1 and the ball lens 2 is 506 μm. Herein, in the first embodiment, F12=F21 holds. Accordingly, each of the image focal distance F12 of the ball lens 1 and the object focal distance F21 of the ball lens 2 is 253 μm. When the object focal distance and image focal distance are configured with the center of the ball lens as reference as illustrated in
[0057] The ball lenses 1 and/or 2 may not be arranged at desired position on the surface of the substrate 110. For example, due to manufacturing variations, there is the case where depths of the grooves 114 and 115 to hold the ball lenses 1 and 2 deviate from design values. In this case, the optical path to propagate the laser light from the semiconductor laser light source 111 toward the optical waveguide 113 is changed.
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[0059] In the case illustrated in
[0060] In the case illustrated in
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[0062] In the case illustrated in
[0063] In the case illustrated in
[0064] When the position of the ball lens 1 shifts, an incident angle from the light source LD to the ball lens 1 is changed. Therefore, with respect to the case where the position displacement of the lens does not occur, the propagation direction changes in the laser light emitted from the ball lens 1. Thus, the incident angle to the ball lens 2 also changes. However, a direction of the change of the incident angle to the ball lens 1 is opposite to a direction of the change of the incident angle to the ball lens 2. Accordingly, the change in the propagation direction occurring when the laser light passes through the ball lens 1 and the change in the propagation direction occurring when the laser light passes through the ball lens 2 are cancelled. In other words, the error of the propagation direction occurring in the ball lens 1 is corrected in the ball lens 2. In addition, the optical device 10 is designed so as to satisfy F11=F22 and F12=F21. Accordingly, the laser light propagating via the ball lens 1 and the ball lens 2 is guided to the target point (i.e., center of the end face of the optical waveguide).
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[0067] In the case (i.e., case illustrated in
[0068] In contrast thereto, according to the configuration according to the first embodiment of the present invention, as illustrated by solid lines, even when the height positions of the ball lenses 1 and 2 shift from the target positions, the coupling loss is small. Specifically, the coupling loss is 0.1 dB, when the height positions of the ball lenses 1 and 2 shift from the target positions by 4 μm. Herein, in the case of forming the grooves 114 and 115 by anisotropic etching of the silicon substrate, it is sufficiently possible to control the error of the depth of the groove within 4 μm or less. Note that the diameters of the ball lenses 1 and 2 are 500 μm, and the refractive indexes of the ball lenses 1 and 2 are 1.98. Further, when the object focal distance and image focal distance are configured using the surface of the ball lens as reference, F11, F12, F21 and F22 are 253 μm.
[0069] As described above, the optical device 10 according to the first embodiment of the present invention is provided with two ball lenses 1 and 2 between the optical output element (semiconductor laser light source 111, in
[0070] In addition, even in the configuration where the optical device is provided with two ball lenses, in the case of not satisfying F11=F22 and F12=F21, the laser light is not condensed to the target point when the lens position is displaced. For example, in the configuration illustrated in
Variation of First Embodiment
[0071] In the above-mentioned embodiment, with respect to each of the ball lenses 1 and 2, the object focal distance and image focal distance are the same as each other, but the present invention is not limited to this configuration. For example, in the optical device 10 illustrated in
[0072] In the above-mentioned embodiment, the diameters of the ball lenses 1 and 2 are the same as each other, and the materials of the ball lenses 1 and 2 are the same as each other, but the present invention is not limited to this configuration. In other words, as long as F11, F12, F21 and F22 illustrated in
[0073] In the above-mentioned embodiment, the ball lens is mounted as each of the first lens circuit 11 and second lens circuit 12, but the present invention is not limited to this configuration. For example, as a substitute for the ball lens, a planoconvex lens may be mounted. In addition, the planoconvex lens may be held using a groove formed by DRIE (Deep Reactive Ion Etching) and the like. Further, in an optical device for coupling a plurality of light sources and a plurality of optical waveguides, by configuring each of the first lens circuit 11 and second lens circuit 12 with an array of planoconvex lenses, it is possible to decrease manufacturing process steps of the optical module.
[0074] In the example illustrated in
[0075] In addition, in the case where the optical device 10 guides laser light to an optical fiber, even when a position displacement of a lens occurs, the laser light is guided to the center of the core of the optical fiber with accuracy. Accordingly, without performing aligning of the optical fiber, it is possible to actualize optical transmission with a small coupling loss. As a result, the aligning process of the optical fiber is unnecessary, and manufacturing efficiency is improved in the optical module.
Second Embodiment
[0076] In the first embodiment, each of the first lens circuit 11 and the second lens circuit 12 is provided with one ball lens. In contrast thereto, in the second embodiment, each of the first lens circuit 11 and the second lens circuit 12 is provided with two ball lenses.
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[0079] The ball lenses 1A, 1B, 2A, and 2B are respectively held by grooves 114a, 114b, 115a, and 115b. Each of the grooves 114a, 114b, 115a, and 115b is a V groove formed in the surface of the substrate 110. As illustrated in
[0080] In the surface of the substrate 110 with the optical device 10 mounted, the grooves 116-120 are formed along an optical path between the semiconductor laser light source 111 and the optical waveguide 113. Accordingly, scattering and/or absorption is suppressed in between the semiconductor laser light source 111 and the optical waveguide 113, and it is possible to suppress deterioration of the quality of the laser light.
[0081] In the optical device 10 with the above-mentioned configuration, the laser light generated by the semiconductor laser light source 111 passes through the ball lens 1A, the ball lens 1B, the ball lens 2A and the ball lens 2B, and is guided to the optical waveguide 113. Specifically, the ball lens 1A guides the laser light generated by the semiconductor laser light source 111 to the ball lens 1B. The ball lens 1B guides output light of the ball lens 1A to the ball lens 2A. The ball lens 2A guides output light of the ball lens 1B to the ball lens 2B. The ball lens 2B guides output light of the ball lens 2A to the optical waveguide 113. Herein, the optical device 10 is designed so that the optical axis of the laser light propagating from the semiconductor laser light source 111 to the optical waveguide 113 passes through the center of each of the ball lenses 1A, 1B, 2A, and 2B. In addition, due to manufacturing errors and the like, it sometimes occurs that positions of the ball lenses 1A, 1B, 2A, and 2B are displaced from target positions in the direction perpendicular to the surface of the substrate 110.
[0082] Shapes and materials of the ball lenses 1A, 1B, 2A, and 2B are mutually the same. In other words, focal distances f of the ball lenses 1A, 1B, 2A, and 2B are the same as each other. For example, the focal distance f of each of the ball lenses 1A, 1B, 2A, and 2B is 2.7 μm. In this example, as illustrated in
[0083] In the second embodiment, as illustrated in
[0084] The optical device 10 is designed so as to satisfy F11=F22 and F12=F21. Specifically, when the focal distance of the ball lens 1A is f1a, the focal distance of the ball lens 1B is f1b, the focal distance of the ball lens 2A is f2a, and the focal distance of the ball lens 2B is f2b, the optical device 10 is designed so as to satisfy F11=f1a, F12+F21=f1b+f2a, F22=f2b, f1a=f2b and f1b=f2a. In this embodiment, the focal distances (f1a, f1b, f2a, and f2b) of the ball lenses 1A, 1B, 2A, and 2B are the same as each other, and the above-mentioned condition is satisfied.
[0085] In this case, the laser light generated by the semiconductor laser light source 111 is collimated by the ball lens 1A. In other words, the collimated light propagates from the ball lens 1A to the ball lens 1B. A spacing between the ball lenses 1A and 1B is not limited particularly, and may be 100 μm. Then, the ball lens 1B guides input light to the ball lens 2A.
[0086] A spacing between the ball lenses 1B and 2A is F12+F21, and is the sum of the focal distance of the ball lens 1B and the focal distance of the ball lens 2A. In other words, the spacing between the ball lenses 1B and 2A is 5.4 μm. Then, output light of the ball lens 1B is condensed in the beam waist position BW1, and then, is input to the ball lens 2A, while enlarging the mode field diameter. Accordingly, the collimated light propagates from the ball lens 2A to the ball lens 2B. A spacing between the ball lenses 2A and 2B is not limited particularly, and may be 100 μm. Then, the ball lens 2B guides input light to the optical waveguide 113.
[0087] In the above-mentioned configuration, when the positions of the ball lenses 1A, 1B, 2A, and 2B deviate from the target positions in the direction perpendicular to the surface of the substrate 110, the propagation path of the laser light generated by the semiconductor laser light source 111 is changed. However, an error of the propagating path occurring in the first lens circuit 11 is corrected in the second lens circuit 12. Accordingly, even when the positions of the ball lenses 1A, 1B, 2A, and 2B deviate from the target positions, the laser light is condensed in the target point in the end face of the optical waveguide 113.
[0088]
[0089] According to the configuration according to the second embodiment of the present invention, as illustrated by solid lines, even when height positions of the ball lenses 1A, 1B, 2A, and 2B shift from the target positions, the coupling loss is small. Specifically, the coupling loss is 0.2 dB when the height positions of the ball lenses shift from the target positions by 10 μm. In other words, according to the configuration of the second embodiment, as compared with the first embodiment, tolerance to misalignment of lenses is further increased.
Third Embodiment
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Fourth Embodiment
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[0092] All examples and conditional language provided herein are intended for the pedagogical purposes of aiding the reader in understanding the invention and the concepts contributed by the inventor to further the art, and are not to be construed as limitations to such specifically recited examples and conditions, nor does the organization of such examples in the specification relate to a showing of the superiority and inferiority of the invention. Although one or more embodiments of the present inventions have been described in detail, it should be understood that the various changes, substitutions, and alterations could be made hereto without departing from the spirit and scope of the invention.