SELF ALIGNED CONTACTS FOR SOLAR CELLS

Abstract

Fabrication methods for forming self aligned contacts for back contact solar cells are provided.

Claims

1. A back contact back junction thin solar cell, comprising: a deposited semiconductor layer, comprising: a light capturing frontside surface with a passivation layer, a doped base region, and a doped backside emitter region with a polarity opposite said doped base region; a backside passivation dielectric layer and patterned reflective layer on said backside emitter region; self aligned backside emitter contacts and backside base contacts connected to metal interconnects forming a first level interdigitated metallization pattern on the backside of said back contact back junction thin solar cell; and at least one permanent support reinforcement positioned on the backside of said back contact back junction thin solar cell; and a second metal layer which is separated from the first layer by said permanent backside support reinforcement structure, said second layer contacting to said first level metallization pattern locally through an interdigitated pattern of holes in said permanent backside support reinforcement structure.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0004] The features, natures, and advantages of the disclosed subject matter may become more apparent from the detailed description set forth below when taken in conjunction with the drawings in which like reference numerals indicate like features and wherein:

[0005] FIGS. 1A through ID are cross-sectional diagrams of solar cells with a self aligned contact structure;

[0006] FIGS. 2A through 2E are cross-sectional diagrams of solar cells at various steps during the fabrication of a abutted junction interdigitated back contact solar cell having self aligned contacts;

[0007] FIGS. 3A through 3G are cross-sectional diagrams of solar cells at various steps during the fabrication of a non abutted junction interdigitated back contact solar cell having self aligned contacts; and

[0008] FIGS. 4A through 4E are cross-sectional diagrams of solar cells at various steps during the fabrication of a non abutted junction interdigitated back contact solar cell having self aligned contacts.

BRIEF SUMMARY

[0009] Therefore, a need has arisen for fabrication methods for back contact solar cells. In accordance with the disclosed subject matter, methods for the fabrication of back contact solar cells are provided. These innovations substantially reduce or eliminate disadvantages and problems associated with previously developed back contact solar cell fabrication methods.

[0010] Related patent applications having partially common inventorship and providing structure and fabrication details in addition to those described herein include U.S. patent application Ser. No. 14/179,526 filed Feb. 2, 2014, U.S. patent application Ser. No. 14/072,759 filed Nov. 5, 2013 (Published as U.S. Pub. 20140326295 on Nov. 6, 2014), U.S. patent Ser. No. 13/869,928 filed Apr. 24, 2013 (Published as U.S. Pub. 20130228221 on Sep. 5, 2013), U.S. patent application Ser. No. 14/493,341 filed Sep. 22, 2014, and U.S. patent application Ser. No. 14/493,335 filed Sep. 22, 2014, all of which are hereby incorporated by reference in their entirety.

[0011] According to one aspect of the disclosed subject matter, self aligned contacts for a back contact back junction solar cell are provided. The solar cell comprises a semiconductor layer having a light receiving frontside and a backside opposite the frontside and attached to an electrically insulating backplane. A first metal layer having base and emitter electrodes self aligned to base and emitter regions is positioned on the semiconductor layer backside. A patterned second metal layer providing cell interconnection and connected to the first metal layer by via plugs is positioned on the backplane.

[0012] These and other advantages of the disclosed subject matter, as well as additional novel features, will be apparent from the description provided herein. The intent of this summary is not to be a comprehensive description of the subject matter, but rather to provide a short overview of some of the subject matter's functionality. Other systems, methods, features and advantages here provided will become apparent to one with skill in the art upon examination of the following FIGURES and detailed description. It is intended that all such additional systems, methods, features and advantages included within this description be within the scope of the claims.

[0013] The disclosed subject matter provides structures and methods for making self aligned contacts for back contact back junction solar cells. Specifically, the disclosed subject matter and corresponding figures provide low-damage, high-efficiency, and low-cost process flows for the formation of thin silicon solar cells using self aligned contacts for back contact back junction (e.g., interdigitated back contact IBC) solar cells. The novel self aligned contact structures described may achieve higher solar cell conversion efficiency. Additionally, solar cell fabrication methods having minimal or reduced process steps for the foniiation of solar cell structures with self aligned contacts are described.

[0014] The term self aligned describes cell structure such that the heavy doping of n+ and p+ areas under the base and emitter metal contacts are self-aligned with respect to the contact openingssuch as that shown in FIGS. 1A through ID. FIG. 1A is a cross-sectional diagram of a selective emitter solar cell with a self aligned contact structure having a dopant diffusion region with higher doping levels (e.g., greater than 1E18 cm-3) just below the metal to silicon absorber contact. Self aligned contact structures may provide higher solar cell efficiency by having heavily doped regions (n and p type) in silicon for improved metal/Si contact resistance and lower surface recombination velocity at metal/Si contact and by minimizing heavy doping areas (e.g., doping greater than IE 18 cm-2) in the solar cell thus reducing the overall saturation current density. Alternatively, self aligned contact structure disclosed herein may also be formed by using hetero/tunneling contacts through a barrier layer in between metal and Sisuch as that shown in Fig. IB. Fig. IB is a cross-sectional diagram of a solar cell with a self aligned contact structure formed using hetero/tunneling contacts through a barrier layer in between metal and Si.

[0015] An advantage of a self aligned structure is that heavy doping areas are limited to only under the contact where they are needed. If the contact open needs to be aligned to the heavy doping with non-self aligned contact structures, the heavy diffusions need to be much wider than the contact open to accommodate for alignment tolerances. As compared to non-self aligned contact structures, the self aligned contact structures provided may have higher efficiency because of two distinct reasons. First, heavy dopings may be deleterious when used under passivationin other words heavy dopings are more and in some instances only useful when used under poor passivation such as metal. Thus, a self-aligned structure eliminates the areas of heavy doping under high quality passivation. Second, for a non-self aligned structure two openings need to be made: first for doping and second for contact open. If these openings are made using methods which are prone to creating damage in silicon (e.g., in some instances laser processing) a self-aligned structure removes the outer nesting opening and minimizes and in some instances eliminates laser damage from this step. Further, in addition to efficiency advantages, the self-aligned structure may require less process steps and thus reduce cell cost.

[0016] Table 1 below shows a front-end process flow for the formation of a selective emitter solar cell having self aligned contacts and a field emittersuch as that shown in FIG. 1Ausing a dopant paste step.

TABLE-US-00001 TABLE 1 Selective emitter solar cell having self aligned contacts with dopant paste and a field emitter. 1 Saw Damage Removal 2 APCVD Boron Doped AI2D3 * Undoped SIG2 3 Laser ablation {ns UV and/or ps UV) 4 Dopant Paste (Plies Paste Prmt -Dry * Boron Paste Print Dry) 5 Diffusion Anneal 6 Wet Etch (eg, Dilue HF, SCI or dilute ICON based etc}

[0017] Table 1 shows a process flow where self-aligned contact is used for making high efficiency back contact back junction solar cell. Shown, Step 1 is a saw damage removal step to remove damage from a wafer (e.g., a CZ wafer); however, the flows provided are equally applicable to an epitaxially formed silicon substrate processed while on template in which case Step 1 Saw Damage Removal is replace with a porous silicon and epitaxial silicon deposition step as described in detail herein. Thus, in epitaxial embodiments, the front-end processing described occurs on the exposed surface of the template attached epitaxial substrate after which the epitaxial substrate may be released (e.g., mechanical or wet etch release) from the template in back end processing. Importantly, the exemplary process flows provided are described in the context of fabrication high efficiency back contact back junction solar cells for descriptive purposes and one skilled in the art may combine, add or remove, alter, or move within an overall process flow the various processing steps disclosed. In other words, elements from each of the process flows described in the table provided herein may be combined together or with other known solar cell manufacturing methods. For example, with reference to Table 1: the laser contact open shown in Step 3 in can be separated in two steps (for example as shown in Table 2) to form self aligned contacts only for base and emitter contacts separately; the dopant paste printing step shown in Step 4 may have additional third print of undoped paste on top of already printed dopant pastes (for example as shown in FIG. 8). Further, the wet etch step shown in Step 6 of Table 1 and which removes annealed dopant paste may be replaced by a dry HF vapor etch process or the removal Step 6 may be skipped (i.e., removed) entirely for an all-dry front-end process. Further, the laser contact open step shown in Step 6 of Table 1 may be replaced by an etch paste process comprising etch paste deposition, dry, and rinse for a laser free front-end process.

[0018] Table 2 below shows a front-end process flow for the formation of a selective emitter solar cell having self aligned contacts using dopant paste and using separate contact open steps.

TABLE-US-00002 TABLE 2 Selective emitter solar cell having self aligned contacts with dopant paste and separate contact open steps. 1 Saw Damage Removal 2 APCVD Boron Doped AJ203 + Undoped SiOl 3 Laser ablation (ns 0V and/or ps UV) 4 Dopant Paste (Phos Paste Print *Dry} 5 Laser ablation fos UV and/or ps UV} 6 Dopant Paste (Boron Paste Print -s-Dry} 7 Diffusion Anenal 8 Wet Etch HF Based/SKIP/HF Vapor

[0019] Table 3 below shows a front-end process flow for the formation of a selective emitter solar cell having self aligned contacts with dopant paste and the application of a diffusion barrier.

TABLE-US-00003 TABLE 3 Selective emitter solar cell having self aligned contacts with dopant paste and the application of a diffusion barrier. 1 Saw Damage Removal 2 APCVD Boron Doped AI2D3 * Undoped SID2 3 laser ablation (ns UV and/or ps UV} 4 Dopant Paste (Phos Paste Print +Dry + Boron Paste Print Dry| 5 APCVD USG dep 6 Diffusion Anneal 7 Wet Etch HF Based/SK1P/HF Vapor

[0020] Alternatively, the diffusion barrier deposition shown in Step 5 of Table 3 as an APCVD USG deposition may also be an undoped paste print.

[0021] The process flow embodiments of Tables 2 and 3 may be used to reduce autodoping from dopant pastes during diffusion anneal.

[0022] Table 4 below shows a front-end process flow for the formation of a non abutted junction solar cellsuch as that shown in FIG. 1Chaving self aligned contacts with diffusion barrier dopant paste print. FIG. 1C is a cross-sectional diagram of a non-abutted junction solar cell with a self aligned contact structure having a dopant diffusion region with higher doping levels (e.g., greater than 1E18 cm-3) just below the metal to silicon absorber contact.

TABLE-US-00004 TABLE 4 Non abutted junction solar cell having self aligned contacts with dopant paste print and non abutted junction with diffusion barrier paste print. 1 Saw Damage Removal 2 Undoped Paste Print * Dry 3 APCVD Boron Doped AI203 * Undoped SIG2 4 Laser ablation fns UV and/or ps UVf 5 Dopant Paste (Phos Paste Print: Dry f Boron Paste Print Dry} 6 Diffusion Anneal 7 Wei Etch HF Based/SKiP/HF Vapor

[0023] Alternatively with reference to the non abutted junction solar cell flow of Table 4, Steps 2, 3, and, 4 of Table 4 may be replaced with two steps of APCVD boron doped silicon oxide (BSG1) deposition followed by picosecond (ps) C02 laseran alternative embodiment referred to as self aligned contacts with dopant paste print and non abutted junction with boron doped silicon oxide by APCVD.

[0024] Table 5 below shows the fabrication process flow for a non selective emitter solar cell having self aligned contacts and using phosphorous dopant paste.

TABLE-US-00005 TABLE 5 Non selective emitter solar cell having self aligned contacts with dopant paste. 1 Saw Damage Removal 2 APCVD Boron Doped AI2Q3 + Undoped SID2 3 Laser a bis lion fns UV and/or ps 0 V) 4 Dopant Paste fPhos Paste Print *Dry) 5 Diffusion Anneal 6 Wet Etch HF Based/SKIP/HF Vapor 7 laser Abe If ion (ps UV)

[0025] Alternatively, Table 6 below shows the fabrication process flow for a non selective emitter solar cell having self aligned contacts and using phosphorus oxychloride POC13 (POC1).

TABLE-US-00006 TABLE 6 Non selective emitter solar cell having self aligned contacts with POC1 based diffusion. 1 Saw Damage Removal 2 APCVD Boron Doped Ai203 + Undoped SIQ2 3 Laser ablation ins UV and/or ps UV| 4 Diffusion Anneal 5 FOCI Diffusion 6 Wet Efch HF Based/SXiP/HF Vapor 7 Laser Ahaltion (ps UV)

[0026] Table 7 below shows the fabrication process flow for a non selective emitter solar cell having self aligned passivated base contacts using dopant paste.

TABLE-US-00007 TABLE 7 Non selective emitter solar cell having self aligned passivated base contacts with dopant paste. I Saw Damage Removal 2 APCVD Boron Doped AJ2Q3 4 Undoped Si02 3 Laser ablation fns UV and/or ps UV) 4 Dopant Paste fPhos Paste Print *Dry} 5 Diffusion Anneal 6 Wet Etch HF Based/SKIF/HF Vapor 7 AID Dep |A1203, 1102, A1203 4-TI02) 8 Laser Abaition (ps yV)

[0027] Table 8 below shows the fabrication process flow for solar cells having self aligned base tunneling/hetero junction contactssuch as those shown in Fig. IB.

TABLE-US-00008 TABLE 8 Solar cell having self aligned tunneling/hetero junction contacts. 1 Saw Damage Removal 2 APCVD Boron Doped AI2G3 + Undoped SiQI 3 Laser ablation fns UV and/or ps UV} 4 Diffusion Anneal 5 Wet. Etch HF Based/SiCiP/HF Vapor 6 AID; Dep (A!2Ca.sub.f TI02, AI203 +TIG2} 7 Laser Abaition {ps UV}

[0028] Table 9 below shows the fabrication process flow for solar cells having self aligned contacts without a heavy diffusion region below the base contact.

TABLE-US-00009 TABLE 9 Solar cell having self aligned passivated base contacts. 1 Saw Damage Removal 2 APCVD Boron Doped A1203 3 Laser ablation fns UV) Base O{circumflex over ()}y 4 Wet Etch 5 Diffusion Anneal 5 Wet Etch feg Oiiue HF, SCI or dilute KOH based etc| 7 AID Al203 > H02 8 Laser Ablation (ps UV}

[0029] Alternatively, the self aligned contact structures and methods described herein may be applied to a

[0030] Table 10 below shows a front-end process flow for the formation of a solar cell having self aligned contacts with a field basesuch as that shown in Fig. ID. Fig. ID is a cross-sectional diagram of a solar cell with field base and a self aligned contact structure having a dopant diffusion region with higher doping levels (e.g., greater than 1E18 cm-3) just below the metal to silicon absorber contact. Alternatively, for example, the HF Vapor Step 6 in Table 10 and which removes annealed dopant paste may be replaced with a wet etch step.

TABLE-US-00010 TABLE 10 Solar cell having a field base and self aligned contacts with dopant paste. 1 Saw Damage Removal 2 APCVD Undoped AI2Q3 4-Undoped SI02 3 Laser ablation (ns UV and/or ps UV} 4 Dopant Paste (Phos Paste Print Dry * Boron Paste Print Dry) 5 Diffusion Anneal 6 HF Vapor

[0031] Alternatively, Table 11 below shows a front-end process flow for the formation of a solar cell having a field base self aligned contacts with etch paste and dopant paste printssuch as that shown in Fig. ID

TABLE-US-00011 TABLE 11 Solar cell having a field base and self aligned contacts with etch paste and dopant paste print. 1 Saw Damage Removal 2 APCVD Undoped AI203 + Undoped SI02 3 Etch Paste (Print Cure, Rinse} 4 Dopant Paste fPbos Paste Print Dry + Boron Paste Print Dry) 5 Diffusion Anneal 6 HF Vapor

[0032] FIGS. 2A through 2E is a process flow representation showing cross-sectional diagrams of solar cells at various steps during the fabrication of a abutted junction interdigitated back contact solar cell having self aligned contacts with dopant paste. FIG. 2A shows an aluminum oxide (Al203) layer deposited (e.g., by APCVD) on a silicon substrate/wafer. The aluminum oxide layer may also have an undoped silicate glass layer.

[0033] Next, as shown in FIG. 2B a nanosecond (ns or ps) laser opens base and emitter contacts . This step may also include a wet etch to remove any oxide residue (e.g., aluminum silicon oxide residue). Next, as shown in FIG. 2C dopant pastes are paste print in emitter and base regions followed by a diffusion anneal to drive-in/diffuse the dopants and form base and emitter regions. Next as shown in FIG. 2D dopant pastes are stripped (e.g., by wet etch).

[0034] Next as shown in FIG. 2E metal is printed on the base and emitter regions and annealed resulting in minimal shunt risk.

[0035] FIGS. 3A through 3G is a process flow representation showing cross-sectional diagrams of solar cells at various steps during the fabrication of a non abutted junction interdigitated back contact solar cell having self aligned contacts with dopant paste. FIG. 3A shows an aluminum oxide (Al203) layer deposited (e.g., by APCVD) on a silicon substrate/wafer. The aluminum oxide layer may also have an undoped silicate glass layer. Next, as shown in FIG. 3B a nanosecond (ns) laser opens base contacts. This step may also include a wet etch to remove any oxide residue (e.g., aluminum silicon oxide residue). Next, as shown in FIG. 3C a undoped silicate glass layer is deposited (e.g., by APCVD). Next as shown in FIG. 3D a pico second (ps) laser ablates base and emitter contact openings. Next, as shown in FIG. 3E dopant pastes are paste print in emitter and base regions followed by a diffusion anneal to drive-in/diffuse the dopants and form base and emitter regions. Next as shown in FIG. 3F dopant pastes are stripped (e.g., by wet etch). Next as shown in FIG. 3G metal is printed on the base and emitter regions and annealed resulting in minimal shunt risk.

[0036] FIGS. 4A through 4E is a process flow representation showing cross-sectional diagrams of solar cells at various steps during the fabrication of a non abutted junction interdigitated back contact solar cell having self aligned contacts with dopant paste using an undoped paste first. FIG. 4A shows a undoped silicon oxide (Si02) paste printed on the desired based regions of a silicon substrate/wafer only. Next, as shown in FIG. 4B a doped layer (e.g., doped aluminum oxide layer Al203 or doped borosilicate glass layer BSG1) and undoped silicate glass (USG) layer is deposited (e.g., by APCVD). The undoped silicate glass layer may have a thickness three to four times thicker as compared to the undoped layer. Next as shown in FIG. 4C a pico second (ps) laser ablates base and emitter contact openings. Next, as shown in FIG. 4D dopant pastes are paste print in emitter and base regions followed by a diffusion anneal to drive-in/diffuse the dopants and form base and emitter regions. Next dopant pastes are stripped (e.g., by wet etch). Next as shown in FIG. 4E metal is printed on the base and emitter regions and annealed resulting in minimal shunt risk.

[0037] While the methods to manufacture self-aligned back contact back junction solar cells are described in general context of CZ wafers, these methods are also equally applicable in context of epitaxially grown back contact back junction solar cells. In addition, the methods are applicable to both thick crystalline silicon (e.g., having an absorber thickness in the range of approximately 100 um to 200 um) as well as thin crystalline silicon back contact back junction solar cells (e.g., having an absorber thickness in the range of approximately 5 um to 100 um).

[0038] Generally and particularly applicable to the process flows represented in the tables below, emitter or base contacts are opened sequentially (in either order) or simultaneously using various field dielectric removal techniques such as using lasers or wet etch or etch paste. And subsequently, depositing the dopant source in the opened contact, driving the dopant into silicon at high temperature, and selectively removing/etching the dopant source while keeping the field dielectric unharmed from the etchant. This leaves the dopant driven into silicon only in the area under where the contact was opened leaving a self-aligned structure.

[0039] The methods of manufacturing described may be further categorized by the source of the under-contact dopants. These can be from a dopant paste (for example phosphorous for n-type and Boron for p-type) or deposited films which incorporate dopants in them, for example APCVD deposited Boron or phosphorous doped Si02 films. Finally, a hybrid source where N+ and p+ dopant sources come from APCVD for one type and dopant paste for the other type of dopant. A further subcategory is defined by the technique to etch away/remove the dopant source which is applicable to both wafer and epitaxial based absorbers as well as dopant source categories (dopant paste, APCVC film, and hybrid dopant source). As an example, for oxide based dopant sources such as doped Si02, either a wet process with HF can be used or a dry process using HF vapor phase etching may be deployed. If the field area is also Si02 then the wet HF selectivity is obtained as a heavily doped SiOx film may etched much faster than an undoped film. Alternatively the field area stack may contain an Al203 (e.g., deposited using APCVD as well). This film, once treated at high temperatures for example greater than 900 C., may have high selectivity to HF solution. Alternatively, HP vapor also very selectively etch the dopant source.

[0040] Generally, if the contacts are opened simultaneously, then both dopant sources may be screen printed dopant paste. If the contacts are open sequentially, then a deposited film for both contacts or hybrid sources can be utilized.

[0041] Table 12 shows a front-end self aligned contact fabrication flow which yields a separated junction and is accomplished using dopant pastes (for example, screen printed dopant pastes). In the separated junction the emitter doping is not abutting the base contact doping and is separated by the background bulk doping of the base. Step 2 shows the deposition of the emitter followed by a cap. And although the emitter source is shown to be an APCVD deposited boron doped Al203, it may also be a boron doped Si02 layer or another dopant source layer deposited using different means. The first laser ablation (Step 3) is to open up the separation between emitter and base doping such that upon anneal, there is a separation between the junctions. The flow suggests using laser ns UV and ps UV. Pico second green laser, a femto second laser, or etch paste or lithography techniques may also be used to create this base window. If pico second laser is used, it may be followed by a small wet etch of silicon to remove laser damage in silicon. Step 5 of Table 12 may also be done using pico second green laser or a femto second laser. Step 5 is a contact open within the base window for base contact as well as a contact open for the emitter. Both contacts are opened up in the same stephence the method of printing the dopant source should be a selective print on top of these contacts such as screen printing of the dopant paste (as compared to a blanket deposition of a thin dopant sourced film). Subsequent to anneal to drive the dopants in both contacts in Step 7, the dopant source is either wet etched or etched selectively using HF vapor. In a separate embodiment if the source of the dopant is conductive as with silicon based dopant source, the etching step may be skipped (Step # 8).

TABLE-US-00012 TABLE 12 Self aligned contact fabrication flow yielding a separated junction using dopant pastes. 1 Saw Damage Removal 2 APCVD Boron Doped AI203 + Undoped Si02 3 Laser ablation (ns UV and/or ps UV) 4 APCVD Undoped Oxide (AI203 or Si02) 5 Laser ablation (ns UV and/or ps UV) 6 Dopant Paste (Phos Paste Print Dry + Boron Paste Print Dry 7 Diffusion Anneal 8 Wet Etch HF Based/SKIP/HF Vapor

[0042] In another embodiment, if there is risk of co-diffusion during drying or dopant driving the contacts can be opened sequentially. In this scenario, either base or emitter contact is opened first and the corresponding paste is printed and dried. Next, the other contact is opened and the corresponding paste is printed and dried. Finally, both pastes are driven in at the same time. This alternative may avoid cross contamination in the contact during drying and burn. And although the emitter source is shown to be an APCVD deposited boron doped Al203, it may also be a boron doped Si02 layer or another dopant source layer deposited using different means. The first laser ablation (Step 3) is to open up the separation between emitter and base doping such that upon anneal, there is a separation between the junctions. The flow suggests using laser ns UV and ps UV. Pico second green laser, a femto second laser, or etch paste or lithography techniques may also be used to create this base window. If pico second laser is used, it may be followed by a small wet etch of silicon to remove laser damage in silicon. Step 5 of Table 12 may also be done using pico second green laser or a femto second laser. Step 5 is a contact open within the base window for base contact as well as a contact open for the emitter. Both contacts are opened up in the same stephence the method of printing the dopant source should be a selective print on top of these contacts such as screen printing of the dopant paste (as compared to a blanket deposition of a thin dopant sourced film). Subsequent to anneal to drive the dopants in both contacts in Step 7, the dopant source is either wet etched or etched selectively using HF vapor. In a separate embodiment if the source of the dopant is conductive as with silicon based dopant source, the etching step may be skipped (Step # 8).

TABLE-US-00013 TABLE 12 Self aligned contact fabrication flow yielding a separated junction using dopant pastes. 1 Saw Damage Removal 2 APCVD Boron Doped AI203 + Undoped Si02 3 Laser ablation (ns UV and/or ps UV) 4 APCVD Undoped Oxide (AI203 or Si02) 5 Laser ablation (ns UV and/or ps UV) 6 Dopant Paste (Phos Paste Print Dry + Boron Paste Print Dry 7 Diffusion Anneal 8 Wet Etch HF Based/SKIP/HF Vapor

[0043] In another embodiment, if there is risk of co-diffusion during drying or dopant driving the contacts can be opened sequentially. In this scenario, either base or emitter contact is opened first and the corresponding paste is printed and dried. Next, the other contact is opened and the corresponding paste is printed and dried. Finally, both pastes are driven in at the same time. This alternative may avoid cross contamination in the contact during drying and burn.

[0044] Table 14 below shows a front end separated junction self-aligned process flow using a hybrid approach. In this approach one of the dopant source is a deposited APCVD film while the other type of dopant source is a printed dopant paste.

TABLE-US-00014 TABLE 14 Self aligned contact fabrication flow yielding a separated junction using a hybrid APCVD doped dielectric film and phosphorous based dopant paste. 1 Saw Damage Removal 2 APCVD Boron Doped AI203 with/out Undoped Si02 3 Laser ablation (ns UV and/or ps UV) 4 APCVD Undoped AI203 or Undoped Si02 5 ps Laser Contact Open 6 APCVD-Boron doped Si02 7 ps Laser Contact Open 8 Dopant Paste Print + Dry 9 Diffusion anneal 10 Wet Etch HF Based/HF Vapor

[0045] The flow of Table 14 shares the first four steps (along with its variations) with Table 13. In Step 5 of Table 14, the emitter contact is opened. BSG is deposited in Step 6 and Step 7 opens base contact with a laser (note, although, the flow suggests using ps lasers, nano or femto second lasers with different wavelengths are not precluded as long as they meet the contact open requirements). Subsequently, phosphorous based dopant paste is printed, dried in Step 8. Step 9 is an anneal step to drive the dopants from the BSG and from the phosphorous paste to create under-contact doped areas, while step 10 removes the dopant sources based on either wet or HF vapor technique. An abutted version of the separated junction flow described in Table 14 skips/removes Steps 3 and 4 to create abutted junctions.

[0046] In a variation the flow of Table 14 the sequence of BSG2 (Step 6) and phosphorous dopant paste (Step 8) is reversed. Base contact is opened first, followed by phosphorous paste. This is in turn followed emitter contact and BSG2 deposition and the remaining flow is similar.

[0047] In another variation, the hybrid dopant sources are based on APCVD PSG and dopant paste boron such that the base contact is made with the APCVD deposited doped Si02 film while the emitter contact is made using boron based dopant paste. This variation has further

[0048] Table 14 below shows a front end separated junction self-aligned process flow using a hybrid approach. In this approach one of the dopant source is a deposited APCVD film while the other type of dopant source is a printed dopant paste.

TABLE-US-00015 TABLE 14 Self aligned contact fabrication flow yielding a separated junction using a hybrid APCVD doped dielectric film and phosphorous based dopant paste. 1 Saw Damage Removal 2 APCVD Boron Doped AI203 with/out Undoped Si02 3 Laser ablation (us UV and/or ps UV) 4 APCVD Undoped AI203 or Undoped Si02 5 ps Laser Contact Open 6 APCVD-Boron doped Si02 7 ps Laser Contact Open 8 Dopant Paste Print + Dry 9 Diffusion anneal 10 Wet Etch HF Based/HF Vapor

[0049] The flow of Table 14 shares the first four steps (along with its variations) with Table 13. In Step 5 of Table 14, the emitter contact is opened. BSG is deposited in Step 6 and Step 7 opens base contact with a laser (note, although, the flow suggests using ps lasers, nano or femto second lasers with different wavelengths are not precluded as long as they meet the contact open requirements). Subsequently, phosphorous based dopant paste is printed, dried in Step 8. Step 9 is an anneal step to drive the dopants from the BSG and from the phosphorous paste to create under-contact doped areas, while step 10 removes the dopant sources based on either wet or HF vapor technique. An abutted version of the separated junction flow described in Table 14 skips/removes Steps 3 and 4 to create abutted junctions.

[0050] In a variation the flow of Table 14 the sequence of BSG2 (Step 6) and phosphorous dopant paste (Step 8) is reversed. Base contact is opened first, followed by phosphorous paste. This is in turn followed emitter contact and BSG2 deposition and the remaining flow is similar.

[0051] In another variation, the hybrid dopant sources are based on APCVD PSG and dopant paste boron such that the base contact is made with the APCVD deposited doped Si02 film while the emitter contact is made using boron based dopant paste. This variation has further A variation of the Table 15 process flow forms abutted junctions by skipping Steps 3 and 4 as shown in Table 16 below. As throughout this disclosure, the variations described in conjunction with Table 15 are equally applicable with the abutted junction flow.

TABLE-US-00016 TABLE 16 Self aligned contact fabrication flow yielding a abutted junction using a hybrid APCVD doped dielectric film and phosphorous based dopant paste with separated contact open by diffusion anneal which takes out dopant co-diffusion risk. 1 Saw Damage Removal 2 APCVD Boron Doped A1203 with/out Undoped Si02 3 Laser ablation (ns UV and/or ps UV) 4 Dopant Paste (Phos Paste Print Dry) 5 APCVD-Phos doped Si02 6 Diffusion Anneal 7 Laser ablation (ns UV and/or ps UV) 8 APCVD-Boron doped Si02 9 Diffusion Anneal 10 Wet Etch HF Based/SKIP/HFVapor

[0052] In the variation of Table 15 and 16, the co-diffusion risk may be avoided by eliminating either APCVD-PSG or eliminating diffusion anneal.

[0053] Note, all the self-aligned process flows with their variations described so far are equally valid with an epitaxially grown thin film solar cell. A representative process flow which corresponds to the approach outlined in Table 12 (separated junction with dopant paste) is shown in Table 17 for an epitaxial thin film solar cell. Epitaxial flow may use the HE vapor approach to keep the flow mostly dry while the epitaxial absorber is still on the template. All the other embodiments with abutted and separate junctions with hybrid dopant sources or all APCVD dopant sources (shown for CZ wafers) are equally valid for epitaxial solar cells with the modified flow based on Table 16. The present application provides more detailed flows around other aspects of epitaxial formation. The self aligned attribute along with its manufacturing methods can be combined with any of the previously discussed variations of the epitaxial and CZ wafer based process flows.

TABLE-US-00017 TABLE 17 Self aligned contact fabrication flow yielding a separated junction using dopant pastes based on an epitaxially formed substrate. 1 Porous silicon on a thicker template 2 Epitaxial Thin Silicon growth on a template 3 APCVD Boron doped A1203 + undoped Si02 4 Laser Ablation (ns UV and or ps UV/green) 5 APCVD Undoped Oxide (A1203 or Si02) 6 Laser Ablation base and emitter contact open (ns UV and or ps UV/green) 7 Dopant paste screen print (Phos paste print/dry + Boron paste print/dry) 8 Diffusion Anneal 9 HF Vapor Etch (can also be dry etch or wet etch which selectively removes dopant source) 10 A1 Paste Print/dry 11 Anneal 12 Lamination using a backplane 13 Mechanical release of thin epi sbsorber (Template is separated from absorber and goes for a clean and next reuse) 14 icell cut 15 Texture and clean porous silicon layer 16 Front passivation and ARC (Example A1203 + SiN) 17 Via drill on the backplane 18 PVD 19 M2 Isolation 20 Anneal

[0054] The foregoing description of the exemplary embodiments is provided to enable any person skilled in the art to make or use the claimed subject matter. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without the use of the innovative faculty. Thus, the claimed subject matter is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0055] It is intended that all such additional systems, methods, features, and advantages that are included within this description be within the scope of the claims.