ETCHING OF SOLAR CELL MATERIALS

Abstract

A solar cell is fabricated by etching one or more of its layers without substantially etching another layer of the solar cell. In one embodiment, a copper layer in the solar cell is etched without substantially etching a topmost metallic layer comprising tin. For example, an etchant comprising sulfuric acid and hydrogen peroxide may be employed to etch the copper layer selective to the tin layer. A particular example of the aforementioned etchant is a Co-Bra Etch etchant modified to comprise about 1% by volume of sulfuric acid, about 4% by volume of phosphoric acid, and about 2% by volume of stabilized hydrogen peroxide. In one embodiment, an aluminum layer in the solar cell is etched without substantially etching the tin layer. For example, an etchant comprising potassium hydroxide may be employed to etch the aluminum layer without substantially etching the tin layer.

Claims

1-20. (canceled)

21. A solar cell, comprising: a silicon dioxide layer disposed on a silicon substrate, wherein the silicon dioxide layer includes a vias; an aluminum layer disposed over the a silicon dioxide layer, wherein the vias allows for the aluminum layer to contact a doped region of the silicon substrate; a titanium-tungsten (TiW) layer disposed over the aluminum layer; a first copper layer disposed over the titanium-tungsten (TiW) layer; a second copper layer disposed on the first copper layer; and a solderable metallic layer comprising tin disposed on the first copper layer.

22. The solar cell of claim 21, wherein the solderable metallic layer comprises an electroplated tin layer.

23. The solar cell of claim 21, wherein the silicon dioxide layer has a thickness of 950 Angstroms.

24. The solar cell of claim 21, further comprising an interconnect lead soldered on the solderable metallic layer.

25. The solar cell of claim 21, wherein the solderable metallic layer has a thickens of 5 microns.

26. The solar cell of claim 21, wherein the first copper layer has a thickness of 1600 Angstroms.

27. The solar cell of claim 21, wherein the second copper layer has a thickness of 20 microns.

28. The solar cell of claim 21, wherein the titanium-tungsten (TiW) layer has a thickness of 1000 Angstroms

29. The solar cell of claim 21, wherein the aluminum layer comprises aluminum having 1% silicon alloy.

30. A solar cell, comprising: a silicon dioxide layer disposed on a silicon substrate, wherein the silicon dioxide layer includes a vias; a sputtered aluminum layer disposed over the a silicon dioxide layer, wherein the vias allows for the sputtered aluminum layer to contact a doped region of the silicon substrate; a sputtered titanium-tungsten (TiW) layer disposed over the sputtered aluminum layer; a copper seed layer disposed over the sputtered titanium-tungsten (TiW) layer; an electroplated copper layer disposed on the copper seed layer; and a solderable metallic layer disposed on the electroplated copper layer, wherein the solderable metallic layer comprises an electroplated tin layer.

31. The solar cell of claim 30, wherein the solderable metallic layer has a thickens of 5 microns.

32. The solar cell of claim 30, wherein the electroplated copper layer has a thickness of 20 microns.

33. The solar cell of claim 30, wherein the copper seed layer has a thickness of 1600 Angstroms.

34. The solar cell of claim 30, wherein the sputtered titanium-tungsten (TiW) layer has a thickness of 1000 Angstroms

35. The solar cell of claim 30, wherein the sputtered aluminum layer comprises aluminum with having 1% silicon alloy.

36. A solar cell, comprising: a silicon dioxide layer disposed on a silicon substrate, wherein the silicon dioxide layer includes a vias; a metal stack disposed over a portion of the a silicon dioxide layer, wherein the vias allows for the metal stack to contact a doped region of the silicon substrate; an electroplated copper layer disposed on the metal stack, wherein the metal stack allows for electrical connection between electroplated copper layer and the doped region of the silicon substrate; and a solderable metallic layer disposed over the electroplated copper layer, wherein the solderable metallic layer comprises an electroplated tin layer.

37. The solar cell of claim 36, wherein the metal stack comprises: a sputtered aluminum layer disposed over a portion of the a silicon dioxide layer, wherein the vias allows for the sputtered aluminum layer to contact a doped region of the silicon substrate; a sputtered titanium-tungsten (TiW) layer disposed over the sputtered aluminum layer; and a copper seed layer disposed over the sputtered titanium-tungsten (TiW) layer.

38. The solar cell of claim 36, wherein the solderable metallic layer has a thickens of 5 microns.

39. The solar cell of claim 36, wherein the copper seed layer has a thickness of 1600 Angstroms.

40. The solar cell of claim 46, wherein the electroplated copper layer has a thickness of 20 microns.

Description

DESCRIPTION OF THE DRAWINGS

[0008] FIGS. 1-4 show sectional views schematically illustrating the fabrication of a solar cell in accordance with an embodiment of the present invention.

[0009] FIG. 5 shows a flow diagram of a method of etching one or more materials in a solar cell in accordance with an embodiment of the present invention.

[0010] The use of the same reference label in different drawings indicates the same or like components.

DETAILED DESCRIPTION

[0011] In the present disclosure, numerous specific details are provided such as examples of process parameters, materials, process steps, and structures to provide a thorough understanding of embodiments of the invention. Persons of ordinary skill in the art will recognize, however, that the invention can be practiced without one or more of the specific details. In other instances, well-known details are not shown or described to avoid obscuring aspects of the invention.

[0012] FIGS. 1-4 show sectional views schematically illustrating the fabrication of a solar cell in accordance with an embodiment of the present invention. FIGS. 1-4, which are not drawn to scale, show the solar cell in the middle of the fabrication process. Masking steps are not shown or described in the interest of clarity.

[0013] In FIG. 1, the solar cell is shown as having a tin (Sn) layer 112, a copper (Cu) layer 110, a copper layer 108, a titanium-tungsten (TiW) layer 106, an aluminum (Al) layer 104, a silicon dioxide (SiO.sub.2) layer 102, and a silicon (Si) substrate 100. Tin layer 112 is on the backside of the solar cell, while silicon substrate 100 is towards the front or sun side. The solar cell being fabricated is a so-called backside-contact solar cell in that all electrical connections to the doped regions (not shown) in silicon substrate 100 are made from the backside of the solar cell by way of tin layer 112. However, it is to be noted that the present invention is not limited to backside-contact solar cells. The teachings of the present disclosure may be employed in the fabrication of solar cells in general.

[0014] In the example of FIG. 1, tin layer 112 is the topmost metallic layer and provides a solderable metallic surface on which electrical connections may be made. For example, interconnect leads coupled to an external electrical circuit or other solar cells may be soldered on tin layer 112. Tin layer 112 also protects underlying layers of materials. For example, tin layer 112 helps prevent copper layer 110 from corroding. In one embodiment, tin layer 112 is electroplated to a thickness of about 5 microns on copper layer 110.

[0015] Copper layer 110, copper layer 108, titanium-tungsten layer 106, and aluminum layer 104 form a Cu/TiW/Al metal stack that provides electrical connectivity to doped regions in silicon substrate 100. In one embodiment, copper layer 110 is electroplated to a thickness of about 20 microns on copper layer 108. Masks (not shown) may be formed between individual structures of copper layer 110 in gaps 113 before the electroplating process. The masks are removed after the electroplating process to obtain the structure shown in FIG. 1.

[0016] Copper layer 108 serves as a seed layer for the electroplating of copper layer 110. Copper layer 108 may be formed to a thickness of about 1600 Angstroms by sputtering. Titanium-tungsten layer 106 and aluminum layer 104 may also be formed by sputtering. In one embodiment, titanium-tungsten layer 106 and aluminum layer 104 are each formed to a thickness of about 1000 Angstroms. Aluminum layer 104 may comprise aluminum with 1% silicon alloy.

[0017] Silicon dioxide layer 102 serves as a dielectric layer providing electrical isolation between the overlying Cu/TiW/Al metal stack and silicon substrate 100. Vias are formed through silicon dioxide layer 102 in sections where the Cu/TiW/Al metal stack makes contact with the doped regions in silicon substrate 100. In one embodiment, silicon dioxide layer 102 is formed to a thickness of about 950 Angstroms.

[0018] There may be steps in the fabrication of a solar cell where an etch is performed through a stack of materials comprising copper, titanium-tungsten, and aluminum. To prevent damaging the solar cell, each layer in the material stack may need to be etched without attacking (i.e., excessively etching) other layers of the solar cell. In the example of FIG. 1, copper layer 108, titanium-tungsten layer 106, and aluminum layer 104 need to be etched without attacking tin layer 112. Excessive etching of tin layer 112 may compromise its ability to protect the underlying metal stack.

[0019] One way of etching through copper layer 108, titanium-tungsten layer 106, and aluminum layer 104 is to use a so-called PAWN (phosphoric, acetic, water, nitric) solution to etch copper layer 108 and aluminum layer 104. For example, the sample of FIG. 1 may be wet etched in a PAWN bath to etch copper layer 108, in a hydrogen peroxide bath to etch titanium-tungsten layer 106, and in a PAWN bath to etch aluminum layer 104. PAWN is commonly used to etch aluminum in the electronics industry, which does not require selectivity to copper, tin, and other materials employed in solar cells. The inventors found that PAWN has a tendency to attack tin layer 112 during the etching of copper layer 108 and aluminum layer 104. The present disclosure provides improved techniques for etching a copper layer, a titanium-tungsten layer, and/or aluminum layer without substantially etching a tin layer in a solar cell or similar device. The techniques may be employed to etch several layers of a material stack or a single layer.

[0020] Continuing in FIG. 2, copper layer 108 is etched selective to tin layer 112 and titanium-tungsten layer 106. Copper layer 108 may be wet etched in a solution comprising sulfuric acid and hydrogen peroxide. For example, copper layer 108 may be wet etched using a Co-Bra Etch etchant modified to comprise about 1% by volume of sulfuric acid, about 4% by volume of phosphoric acid, and about 2% by volume of stabilized hydrogen peroxide. A Perma-Etch etchant may also be employed to etch copper layer 108. Co-Bra Etch and Perma-Etch etchants are both commercially available from Electrochemicals, Inc. of Maple Plain, Minn. In one experiment, a sample similar to that shown in FIG. 1 was dipped in a bath of the aforementioned modified Co-Bra Etch etchant for about 1 minute at 40 C. About 1600 Angstroms of copper layer 108 were removed without excessively etching tin layer 112 or titanium-tungsten layer 106.

[0021] In FIG. 3, titanium-tungsten layer 106 is etched selective to tin layer 112, copper layers 110 and 108, and aluminum layer 104. Titanium-tungsten layer 106 may be wet etched in a bath of hydrogen peroxide, for example. The hydrogen peroxide may be 30% by weight (balance is water).

[0022] In FIG. 4, aluminum layer 104 is etched selective to tin layer 112, copper layers 110 and 108, titanium-tungsten layer 106, and silicon dioxide layer 102. Aluminum layer 104 may be wet etched in a bath of potassium hydroxide. In one embodiment, aluminum layer 104 is wet etched using an etchant comprising about 1% by volume of potassium hydroxide in water. Other concentrations of potassium hydroxide may also be employed depending on the application. In one experiment, a sample similar to that shown in FIG. 3 was dipped in a bath comprising about 1% by volume of potassium hydroxide in water for about 1.5 minutes at 40 C. About 1000 Angstroms of aluminum layer 104 were removed without excessively etching tin layer 112, copper layers 110 and 108, titanium-tungsten layer 106, and silicon dioxide layer 102.

[0023] The teachings of the present disclosure may be generally employed to etch one or more layers of materials in a solar cell being fabricated. For example, the etching techniques disclosed herein may be employed in the fabrication of solar cells disclosed in the following commonly-assigned disclosures, which are incorporated herein by reference in their entirety: U.S. application Ser. No. 10/412,638, entitled Improved Solar Cell and Method of Manufacture, filed on Apr. 10, 2003 by William P. Mulligan, Michael J. Cudzinovic, Thomas Pass, David Smith, Neil Kaminar, Keith McIntosh, and Richard M. Swanson; and U.S. application Ser. No. 10/412,711, entitled Metal Contact Structure For Solar Cell And Method Of Manufacture, filed on Apr. 10, 2003 by William P. Mulligan, Michael J. Cudzinovic, Thomas Pass, David Smith, and Richard M. Swanson. It is to be noted, however, that the aforementioned disclosures are referenced herein only as examples.

[0024] The etch chemistries provided herein not only allow selectivity to materials found in solar cells, but also have relatively high etch capacity, are cost-effective, and are easily replenished and controlled. Embodiments of the present invention may thus be advantageously employed to etch a single layer of material or a stack of materials in solar cell fabrication processes in general.

[0025] Referring now to FIG. 5, there is shown a flow diagram of a method 500 of etching one or more materials in a solar cell in accordance with an embodiment of the present invention. Among its other uses, method 500 may be employed to etch through a material stack comprising copper, titanium-tungsten, and aluminum in a solar cell. Method 500 will be described using FIGS. 1-4 as an example.

[0026] In step 502 and with reference to FIG. 1, a plating mask, if any, that may have been employed in the electroplating of copper layer 110 is removed. Step 502 may be performed by placing the sample of FIG. 1 in about 2% to 3% potassium hydroxide bath at 40 C. for about 5 minutes.

[0027] In step 504, the sample of FIG. 1 is rinsed. For example, the sample of FIG. 1 may be placed in a bath of deionized water, spray-rinsed with deionized water, and then dumped-rinsed in deionized water.

[0028] In step 506, copper layer 108 is etched as shown in FIG. 2. Step 506 may be performed by placing the sample of FIG. 1 in a bath of a Co-Bra Etch etchant modified to comprise about 1% by volume of sulfuric acid, about 4% by volume of phosphoric acid, and about 2% by volume of stabilized hydrogen peroxide at 43 C. with robotic agitation for about 2 minutes and 10 seconds.

[0029] In step 508, the sample of FIG. 2 is rinsed. Step 508 may be performed by dump-rinsing the sample of FIG. 2 in deionized water.

[0030] In step 510, titanium-tungsten layer 106 is etched as shown in FIG. 3. Step 510 may be performed by placing the sample of FIG. 3 in a bath of about 30% by weight hydrogen peroxide at 40 C. with robotic agitation for about 2 minutes and 15 seconds.

[0031] In step 512, the sample of FIG. 3 is rinsed. Step 512 may be performed by dump-rinsing the sample of FIG. 3 in deionized water.

[0032] In step 514, aluminum layer 104 is etched as shown in FIG. 4. Step 514 may be performed by placing the sample of FIG. 3 in a bath of about 1% by volume potassium hydroxide at 40 C. for about 2 minutes and 15 seconds.

[0033] In step 516, the sample of FIG. 4 is rinsed. Step 516 may be performed by dump-rinsing the sample of FIG. 4 in deionized water.

[0034] In step 518, the sample of FIG. 4 is dried. Step 518 may be performed by spin-rinse drying. Air-knife and meniscus drying techniques may also be employed to dry the sample of FIG. 4.

[0035] While specific embodiments of the present invention have been provided, it is to be understood that these embodiments are for illustration purposes and not limiting. For example, the above described etchants may also be applied using in-line drag-through and in-line spray systems. Many additional embodiments will be apparent to persons of ordinary skill in the art reading this disclosure.