3D PRINTING METHOD USING SLIP
20170157852 · 2017-06-08
Inventors
Cpc classification
B33Y10/00
PERFORMING OPERATIONS; TRANSPORTING
B28B7/465
PERFORMING OPERATIONS; TRANSPORTING
B33Y70/00
PERFORMING OPERATIONS; TRANSPORTING
B33Y30/00
PERFORMING OPERATIONS; TRANSPORTING
B28B1/001
PERFORMING OPERATIONS; TRANSPORTING
B22F12/41
PERFORMING OPERATIONS; TRANSPORTING
Y02P10/25
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
B22F10/14
PERFORMING OPERATIONS; TRANSPORTING
B29C64/165
PERFORMING OPERATIONS; TRANSPORTING
International classification
B29C67/00
PERFORMING OPERATIONS; TRANSPORTING
B33Y10/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
The invention relates to a 3D printing method, a device and molded parts produced with the aid of this method.
Claims
1. A method for producing one or more three-dimensional molded parts in a device, comprising the following steps of: a. producing a material layer by applying a slip to a build plane with the aid of an application means; b. applying a liquid binder material to selected areas of the material layer; c. applying energy; d. lowering the build plane by a desired layer thickness or raising the application means by a desired layer thickness; e. repeating steps a.) through d), the liquid binder material containing or comprising an energy-absorbing material; and f. removing a residual build material surrounding the one or more molded parts to obtain the one or more molded parts.
2. The method according to claim 1, wherein the slip includes a carrier fluid and particulate material, the particulate material being or including an at least partially meltable material.
3. The method of claim 11, wherein the device includes a building platform, wherein the building platform and/or the build space is/are temperature-regulated; the building platform and/or the build space being temperature-regulated to a temperature of 40 C. to 200 C., the energy being applied in the form of electromagnetic energy, with the aid of a radiant heater in the IR-A and/or IR-B range or with the aid of an IR emitter or with the aid of a laser; and a temperature in the material layer is brought to 190 C. to 210 C.
4. The method according to claim 1, wherein the one or more molded parts is unpacked in a liquid bath by the addition or spraying of the material block with an aqueous liquid; and/or the binder material is applied with the aid of a printing device; and/or the slip is mixed together from particulate material and a carrier fluid before the application; and/or the material layer results from the removal of the carrier fluid.
5. The method according to claim 11, wherein the particulate material has an average diameter of 1 to 250 m; and/or the layer thickness of the material layer is preferably 1 to 500 m; and/or the proportion of the binder material is less than 20 vol. %; and/or the particle layer is approximately 50% to 80% of the solid density of the particulate material after the liquid is removed.
6. the method according to claim 1, wherein the step of applying energy includes heat treating or sintering.
7. The method of claim 1, wherein the method is carried out in a removable build container in a batch process or in a continuous process.
8. The method of claim 1, wherein the slip is applied horizontally or at an angle of less than 90 to the horizontal building platform.
9. A device for producing three-dimensional molded parts using the method of claim 1.
10. A molded part produced according to the method of claim 1.
11. The method of claim 1, wherein the step of producing a material layer is in a build space, and the material layer has a predetermined layer thickness.
12. The method of claim 2, wherein the process conditions being selected in such a way that the molded part results by at least partially selectively melting the meltable material in the slip during the process.
13. The method of claim 12, wherein the carrier fluid includes water or an organic solvent, and the particulate material is a sinterable material; the energy-absorbing material includes graphite or carbon black; and the application means is a coater device.
14. The method of claim 13, wherein the carrier fluid includes an alcohol; the particulate material includes a thermoplastic, a polycondensate, metallic and/or ceramic particles, or a mixture thereof.
15. The method of claim 14, wherein the material layer has a predetermined thickness, wherein the predetermined thickness remains constant for each material layer during the method.
16. The method of claim 14, wherein the material layer has a predetermined thickness, wherein the predetermined thickness is variable and is reselected with each application of the slip.
17. The method of claim 3, wherein the material layer is heated or irradiated with IR; and the building platform and/or the build space is temperature-regulated to a temperature 150 C. to 190 C., more preferably to 160 C. to 170 C.
18. The method of claim 3, wherein the energy is applied after every material layering step.
19. The method of claim 3, wherein the energy is applied every second to twelfth material layering step.
20. The method of claim 3, wherein the slip includes an alcohol; the particulate material includes a polyamide; the particulate material has an average diameter of 10 to 150 m, the layer thickness of the material layer is 30 to 300 m, the proportion of the binder material is less than 10 vol. %, and the particle layer is approximately 50% to 80% of the solid density of the particulate material after the liquid is removed.
Description
BRIEF DESCRIPTION OF THE FIGURES
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REFERENCE NUMERALS
[0070] 100 Print head
101 Slip application unit
102 Component
103 Energy
[0071] 104 Lowered layer
105 Building platform
200 Dispersion medium
201 Sinterable and unsinterable particles
202 Binder particles
203 Sintering bridges
204 Adhesive bridges
300 Stirrer
301 Pump
400 Fan
[0072] 401 Radiation source
402 Positioning unit
500 Rinsing nozzle
501 Solvent jet
[0073] 502 Particulate material cake