HEAT-DISSIPATION DEVICE OF LED

Abstract

Disclosed is a heat-dissipation device of an LED. The device comprises one or a plurality of heat conducting material silks; a heat-dissipation housing of an LED chip is contacted with one end of the heat conducting material silks through heat conducting materials or in a direct manner, in order to transmit the heat to the heat conducting material silks and heat the surrounding air through the heat conducting material silks; the heat conducting material silks are arranged in an air flowing pipeline, and the heat is taken away by the flowing air; the pipeline is made of insulation materials. The weight and size of the heat-dissipation device of the LED can be reduced exponentially under the condition that a proper working temperature for the LED chip is ensured, and the ground insulation of the whole heat-dissipation device can be ensured.

Claims

1. A heat-dissipation device of an LED, wherein the device comprises a large number of cylinders made of a heat conducting material, the diameters of the cylinders of the heat conducting material are more than 0.01 mm and less than 2 mm, a heat-dissipation housing of an LED chip is contacted with one end of the cylinders made of the heat conducting material through the heat conducting material or in a direct manner, in order to heat the air around the cylinders, and the heat is taken away by the flowing air.

2. The heat-dissipation device of the LED of claim 1, wherein the diameters of the cylinders of the heat conducting material are less than 0.3 mm, so that the cylinders made of the heat conducting material form one or a plurality of heat conducting material wires; the heat-dissipation housing of the LED chip is contacted with one end of the heat conducting material wires through the heat conducting material or in a direct manner, in order to transmit the heat to the heat conducting material wires and heat the air around the heat conducting material wires; and the heat is taken away by the flowing air.

3. The heat-dissipation device of the LED of claim 2, wherein the heat-dissipation housing of the LED chip is directly fused with one end of the heat conducting material wires into a whole; the LED chip directly heats the air around the heat conducting material wires through the heat conducting material wires on the heat-dissipation housing thereof, and the heat is taken away by the flowing air.

4. The heat-dissipation device of the LED of claim 1, wherein the heat conducting material is copper; the cylinders of the heat conducting material are copper cylinders, and the heat conducting material wires are copper wires.

5. The heat-dissipation device of the LED of claim 1, wherein the surfaces of the cylinders of the heat conducting material or the heat conducting material wires are covered by a protective layer for preventing the cylinders of the heat conducting material or the heat conducting material wires from being oxidized, corroded or polluted.

6. The heat-dissipation device of the LED of claim 5, wherein the protective layer covering the surfaces is a silver plating, the cylinders of the heat conducting material, covered by the protective layer on the surfaces, are silvered copper cylinders, and the heat conducting material wires covered by the protective layer on the surfaces are silvered copper wires.

7. The heat-dissipation device of the LED of claim 1, wherein the cylinders of the heat conducting material or the heat conducting material wires are arranged in an air-flowing pipeline; a blower is connected into the pipeline, and air is circulated by means of the blower to take away heat.

8. The heat-dissipation device of the LED of claim 1, wherein the cylinders of the heat conducting material or the heat conducting material wires are arranged in an air-flowing pipeline; the outlet and the inlet of the pipeline have a certain height difference, air becomes light by means of heating expansion to form a pressure difference between the outlet and the inlet, and air circulation is promoted to take away heat.

9. The heat-dissipation device of the LED of claim 8, wherein the device further comprises a special air-flowing pipeline for storing the heated air; the outlet and the inlet of the special air flowing pipeline have a certain height difference, air becomes light by means of heating expansion to form a pressure difference, and air circulation is accelerated to take away heat.

10. The heat-dissipation device of the LED of claim 7, wherein the pipeline is made of an insulation material, in order to ensure the ground insulation of the whole heat-dissipation device.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0020] FIG. 1 shows an LED chip and a plurality of copper wires welded on a heat-dissipation housing of the LED chip in the present invention.

[0021] FIG. 2 is a schematic diagram of a heat-dissipation device of an LED.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0022] As shown in FIG. 1, as a beam of heat conducting material wires, a plurality of copper wires are directly welded on a heat-dissipation housing of an LED chip. The heat-dissipation housing transmits heat to the copper wires, in order to heat the air around the copper wires; and the heat is taken away by the flowing air.

[0023] The surfaces of the copper wires are covered by a protective layer for preventing the cylinders of the heat conducting material from being oxidized, corroded or polluted.

[0024] The heat-dissipation housing of the LED chip can be directly fused with one end of the copper wires into a whole.

[0025] As shown in FIG. 2, a plurality of LED chips welded with a plurality of copper wires are integrated together, and are properly arranged in an air-flowing plastic pipeline.

[0026] The outlet and the inlet of the plastic pipeline have a certain height difference, air becomes light by means of heating expansion to further form a pressure difference, and air circulation is promoted to take away heat.

[0027] The pipeline is made of an insulation material, in order to ensure the ground insulation of the whole heat-dissipation device.

[0028] The LED chips are properly connected with each other and are connected to a proper driving power supply to form an LED lamp as we need.

[0029] In the heat-dissipation device of the LED provided by the present invention, aluminum profiles which are usually large and heavy are changed into some metal wires arranged in the plastic pipeline, so that the weight and size of the heat-dissipation device of the LED can be reduced exponentially under the condition that a proper working temperature of the LED chip is ensured, and the ground insulation of the whole heat-dissipation device can also be ensured.