Electronic Module

Abstract

Production method for an electronic module, comprising a housing and at least one electronic assembly, wherein the electronic assembly is arranged, in particular at least partially, in an interior chamber of the housing, wherein, however, electrical contacts are guided through the housing wall, out of the interior chamber of the housing, to an outer face of the housing, wherein the interior chamber of the housing is filled with a casting compound at least in such a way that the casting compound covers passage points in the housing wall at which the electrical contacts are guided through the housing wall, wherein a layer of the at least one assembly is removed at least in the region of the passage points in the housing wall.

Claims

1. A production method for an electronic module, comprising a housing and at least one electronic assembly, wherein the electronic assembly is arranged, in particular at least partially, in an interior space in the housing, wherein however electrical contacts are routed through the housing wall, out of the interior space in the housing, to an outer face of the housing, wherein the interior space in the housing is filled with a casting compound at least in such a way that the casting compound covers passage points in the housing wall at which the electrical contacts are routed through the housing wall, characterized in that one layer of the at least one assembly is removed at least in the region of the passage points in the housing wall.

2. The method as claimed in claim 1, characterized in that the layer, which is removed, of the at least one assembly is a protective layer.

3. The method as claimed in claim 1, characterized in that the assembly comprises an electrical conductor, in particular in the form of a shunt, from which the layer is removed.

4. The method as claimed in claim 3, characterized in that the electrical conductor, in particular in the form of a shunt, comprises the electrical contacts which are routed through the housing wall.

5. The method as claimed in claim 1, characterized in that the layer is removed by ablation.

6. The method as claimed in claim 5, characterized in that the ablation is performed by laser light and/or electrical energy, in particular electric current.

7. The method as claimed in claim 3, characterized in that the layer of the at least one assembly is removed from the conductor in the region of press-in pins which connect the conductor of the assembly to at least one assembly element.

8. The method as claimed in claim 3, characterized in that the layer of the at least one assembly is removed, in particular, from the conductor which comprises the electrical contacts, which are routed through the housing wall, in the region of said electrical contacts outside the housing.

9. An electronic module, comprising a housing and at least one electronic assembly, wherein the electronic assembly is arranged, in particular at least partially, in an interior space in the housing, wherein however electrical contacts are routed through a housing wall of the housing, out of an interior space in the housing, to an outer face of the housing, wherein the interior space in the housing is filled with a casting compound at least in such a way that the casting compound covers passage points in the housing wall at which the electrical contacts are routed through the housing wall, characterized in that one layer of the at least one assembly is removed at least in the region of the passage points in the housing wall.

10. The module as claimed in claim 9, characterized in that the assembly comprises at least one electrical conductor and at least one assembly element, wherein the layer which is removed is removed from the conductor.

11. The module as claimed in claim 9, characterized in that the layer, which is removed, of the at least one assembly is a protective layer.

12. The module as claimed in claim 10, characterized in that the electrical conductor, in particular in the form of a shunt, comprises the electrical contacts which are routed through the housing wall.

13. The module as claimed in claim 10, characterized in that the casting compound covers the at least one conductor, at least within the housing.

14. The module as claimed in claim 10, characterized in that the at least one assembly element is arranged in the housing outside the casting compound.

15. The module as claimed in claim 10, characterized in that the layer of the at least one assembly is removed from the conductor in the region of press-in pins.

16. The module as claimed in claim 10, characterized in that the layer of the at least one assembly is removed from the conductor in the region of the electrical contacts outside the housing.

Description

[0034] Further preferred embodiments can be found in the dependent claims and the following description of an exemplary embodiment with reference to figures, in which

[0035] FIG. 1 shows, schematically and by way of example, an electronic assembly which is surrounded by a housing,

[0036] FIG. 2 shows, schematically and by way of example, an electronic assembly which is surrounded by a housing and has diffusion channels for contamination, and

[0037] FIG. 3 shows, schematically and by way of example, an electronic assembly which is surrounded by a housing and has diffusion channels which are interrupted according to the invention.

[0038] FIG. 1 shows an electronic assembly which is surrounded by housing 10 and comprises conductor 11 and assembly element 12. FIG. 1a shows an illustration from above, whereas FIG. 1b shows a side view. Conductor 11 and assembly element 12 are electrically and mechanically connected to one another by means of press-in pins 13. Conductor 11 is also held by protective layer 14 and encapsulated by casting compound 15. Casting compound 15 covers conductor 11 in housing 10 in such a way that only press-in pins 13 project out of casting compound 15. Casting compound 15 is directly connected to conductor 11 at points 16, this however leading to an only weak and unreliable connection owing to the material properties of casting compound 15 and conductor 11 according to the example. At points 17 however, protective layer 14 has been removed from conductor 11, so that the metallic material of conductor 11 is revealed at points 17. There is therefore a tight and reliable connection between casting compound 15 and conductor 11 at points for example. A good and reliable connection is likewise produced at point 18, in this case between housing 10 and casting compound 18.

[0039] FIG. 2 shows an electronic assembly which is surrounded by housing 20 and has diffusion channels 21 through which different types of contamination can enter housing 20 and can damage or destroy the assembly. Examples of contamination which can enter through diffusion channels 21 include water and salts. In this case, diffusion channels 21 are produced, for example, by conductor 22, which is surrounded by protective layer 23, not sealing tight to housing 20 and furthermore protective layer 23 not sealing tight to casting compound 24. Therefore, contamination can penetrate as far as press-in pins 27 and further along said press-in pins as far as assembly element 28 which can be damaged or destroyed by said contamination.

[0040] FIG. 3 shows an electronic assembly which is surrounded by housing 20 and has diffusion channels 21 which are interrupted according to the invention. Since conductor 22 at points 25 does not have a protective layer 23, a tight and reliable connection between conductor 22 and casting compound 24 is produced at points 25 according to the example. Therefore, points form interruptions in diffusion channels 21 and prevent contamination, such as water or salts for example, from reaching press-in pins 27 and corroding said pins. There is a likewise tight and reliable connection between housing 20 and casting compound 24 at points 26, so that no contamination can reach assembly element 28 here either.