Resin composition, insulating matrix comprising the same and circuit board using the same

Abstract

A resin composition, an insulating matrix comprising the same and a circuit board using the same. The resin composition of the present invention comprises: a cross-linked polymer formed by a diamine unit containing an imide group, which is represented by the following formula (1), and an isocyanate unit represented by the following formula (2):

##STR00001## wherein, R.sub.1, R.sub.2, A, X and a are defined in the specification.

Claims

1. A resin composition, comprising: a cross-linked polymer formed by units represented by the following formulas (1) and (2): ##STR00005## wherein, each of R.sub.1 and R.sub.2 independently is a C.sub.1-60 aliphatic group, a C.sub.4-20 alicyclic group, a C.sub.6-60 aryl group, a C.sub.4-20 heterocyclic group, or a C.sub.4-60 heteroaryl group; A is a C.sub.6-60 aryl group, or a C.sub.4-60 heteroaryl group; X is a C.sub.1-60 aliphatic group, a C.sub.4-20 alicyclic group, or a C.sub.5-60 aryl group; and a is an integral between 1 and 100, wherein a molar ratio of the unit represented by the formula (1) to the unit represented by the formula (2) is ranged from 1:0.31 to 1:0.95.

2. The resin composition of claim 1, wherein A is selected from the group consisting of: ##STR00006## wherein, each of Ra and Rb independently is C.sub.1-10 alkyl, C.sub.1-5 carbalkoxy, halo, amino, C.sub.3-10 cycloalkyl, C.sub.6-10 aryl or C.sub.5-10 heteroaryl; each of m and n independently is an integral between 0 and 4; and * represents linking positions of A.

3. The resin composition of claim 1, wherein each of R.sub.1 and R.sub.2 independently is C.sub.1-12 alkylene, C.sub.1-12 alkenylene, C.sub.4-12 cycloalkylene, C.sub.4-12 cycloalkenylene, ##STR00007## wherein, Y is a direct bond, O, (CH.sub.2).sub.jO(CH.sub.2).sub.j, C.sub.1-6 alkylene, C(O)NH, C(O), or S(O).sub.2; each of Rc and Rd independently is C.sub.1-10 alkyl, C.sub.1-10 alkoxy, or C.sub.1-6 carbalkoxy; Re is carboxyl or C(O)O-Rf, in which Rf is tetrahydrofurfuryl, oxyethylene, or epoxypropyl; each of l and k independently is an integral between 0 and 4; each of i and j independently is 1 or 2; and * represents a position linking to N.

4. The resin composition of claim 1, wherein R.sub.1 and R.sub.2 are the same.

5. The resin composition of claim 1, wherein X is selected from the group consisting of C.sub.4-18 alkylene, C.sub.8-22 cycloalkylene, C.sub.8-22 cycloalkenylene, C.sub.6-18 arylene, and (C.sub.1-4 alkyl)-C.sub.5-18 arylene-(C.sub.1-4 alkyl)-.

6. The resin composition of claim 5, wherein the unit of the formula (2) is selected from the group consisting of toluene diisocyanate (TDI), 4,4-Methylenebis(phenyl isocyanate) (MDI), naphthyl diisocyanate (NDI), 3,3-dimethylbiphenyl-4,4-diisocyanate (TODI), o-xylylene diisocyanate, m-xylylene diisocyanate, p-xylylene diisocyanate, tetramethylene diisocyanate, pentamethylene diisocyanate, hexamethylene diisocyanate (HDI), 2,2,4-trimethyl-1,6-diisocyanatohexane, 2,4,4-trimethyl-1,6-diisocyanatohexane, lysine methyl ester diisocyanate (LDI), isophorone diisocyanate (IPDI), 1,4-diisocyanatohexane, 1,3-bis(methyl isocyanate)-hexane, 1,4-bis(methyl isocyanate)-hexane, 1,3-bis(2-propyl isocyanate-2-yl)-hexane, 4,4-dicyclohexyl diisocyanate, norbornene dimethyl ester diisocyanate, norbornene diisocyanate, tetramethyl xylyl diisocyanate, and xylylene diisocyanate.

7. The resin composition of claim 1, wherein the unit of the formula (1) is an oligomer or a polymer formed by a tetracarboxylic dianhydride monomer and a diamine monomer; and a molar ratio of the tetracarboxylic dianhydride monomer to the diamine monomer in the formula (1) is ranged from 1:1.05 to 1:2.

8. The resin composition of claim 7, wherein the tetracarboxylic dianhydride monomer is selected from the group consisting of: pyromellitic dianhydride, 3,3,4,4-benzophenone tetracarboxylic dianhydride, 3,3,4,4-diphenylsulfone tetracarboxylic dianhydride, 1,4,5,8-naphthalene tetracarboxylic dianhydride, 2,3,6,7-naphthalene tetracarboxylic dianhydride, 4,4-benzenedicarboxylic anhydride, 3,3,4,4-dimethyleter diphenylsilane tetracarboxylic dianhydride, 3,3,4,4-tetraphenylsilane tetracarboxylic dianhydride, 1,2,3,4-furan tetracarboxylic dianhydride, 4,4-bis(3,4-dicarboxy phenoxy)diphenyl propane dianhydride, 4,4-hexafluoro isopropylene benzenedicarboxylic anhydride, 3,3,4,4-biphenyltetracarboxylic dianhydride, 2,3,3,4-biphenyltetracarboxylic dianhydride, p-pheylene(trimellitic annydride) and p-phenylenediamine phthalic anhydride.

9. The resin composition of claim 7, wherein the diamine monomer is selected from the group consisting of: 3,3-aminodiphenyl ether, 4,4-diamino-3,3,5,5-tetramethyl diphenyl methane, 4,4-diamino-3,3-diethyl-5,5-dimethyl diphenyl methane, 4,4-diamino diphenyl-2,2-propane, 4,4-diamino diphenyl methane, 3,4-diamino benzoyl aniline, 4,4-diamino benzoyl aniline, 3,3-diamino benzophenone, 4,4-diamino benzophenone, 3,3-diethyl-4,4-diamino diphenylether, 3,3-diethoxy-4,4-diamino diphenyl methane, 3,3-dimethyl ester-4,4-diamino diphenyl methane, 3,3-dimethyl ester-4,4-diamino diphenyl propane, 3,3-diethyl-4,4-diamino diphenyl propane, 3,3-dimethyl ester-5,5-diethyl-4,4-diamino diphenyl methane, 3,3-dimethoxy-4,4-diamino diphenylether, 3,3-dimethxy-4,4-diamino diphenyl methane, 3,3-dimethoxy-4,4-diamino diphenylsulfone, 3,3-dimethoxy-4,4-diamino diphenyl propane, 3,3-diethoxy-4,4-diamino diphenyl propane, 3,3,5,5-tetraethyl-4,4-diamino diphenyl methane, polytetrahydrofuran-di-P-amino benzoic acid, poly(ethylene oxide)-di-p-amino benzoic acid, poly(propylene oxide)-di-p-amino benzoic acid, 4,4-bis(3-amino phenoxy)biphenyl, 4,4-bis(4-amino phenoxy)biphenyl, 1,3-bis(3-amino phenozy)benzene, 1,3-bis(4-amino phenoxy)benzene, 1,4-bis(4-amino phenoxy)benzene, 1,3-bis[3-(amino phenoxy)phenoxy]benzene, bis[4-(4-amino phenoxy)phenyl]ether, and 2,2-bis[4-(4-amino phenoxy)phenyl]propane.

10. The resin composition of claim 1, wherein a content of the unit of the formula (1) is 20-90 wt % based on a total molecular weight of the cross-linked polymer and a tensile modulus of the cross-linked polymer is 0.1-2.0 GPa at room temperature, when each of R.sub.1 and R.sub.2 independently is a C.sub.1-60 aliphatic group.

11. The resin composition of claim 1, wherein a content of the unit of the formula (1) is 10-80 wt % based on a total molecular weight of the cross-linked polymer and a tensile modulus of the cross-linked polymer is 0.1-2.0 GPa at room temperature, when each of R.sub.1 and R.sub.2 independently is a C.sub.6-60 aryl group.

12. The resin composition of claim 1, wherein the cross-linked polymer further comprises a repeated unit derived from dimer diamine.

13. The resin composition of claim 12, wherein the dimer diamine is selected from the group consisting of: polyoxyethylene bis(amine), polyoxypropylene bis(amine), polyoxybutylene bis(amine), a block copolymer of polyethylene glycol and polyoxyethylene bis(amine), a block copolymer of polyethylene glycol and poly(diamine tetramethylene glycol), a block copolymer of polypropylene glycol diamine and polybutylene glycol diamine, and a block copolymer of polyethylene glycol diamine, polypropylene glycol diamine and polybutylene glycol diamine.

14. An insulating matrix, comprising a resin composition, wherein the resin composition comprises: a cross-linked polymer formed by units represented by the following formulas (1) and (2): ##STR00008## wherein, each of R.sub.1 and R.sub.2 independently is a C.sub.1-60 aliphatic group, a C.sub.4-20 alicyclic group, a C.sub.6-60 aryl group, a C.sub.4-20 heterocyclic group, or a C.sub.4-60 heteroaryl group; A is a C.sub.6-60 aryl group, or a C.sub.4-60 heteroaryl group; X is a C.sub.1-60 aliphatic group, a C.sub.4-20 alicyclic group, or a C.sub.5-60 aryl group; and a is an integral between 1 and 100, wherein a molar ratio of the unit represented by the formula (1) to the unit represented by the formula (2) is ranged from 1:0.31 to 1:0.95.

15. A circuit board, comprising: a substrate; and an insulating layer disposed on the substrate and comprising a resin composition, wherein the resin composition comprises: a cross-linked polymer formed by units represented by the following formulas (1) and (2): ##STR00009## wherein, each of R.sub.1 and R.sub.2 independently is a C.sub.1-60 aliphatic group, a C.sub.4-20 alicyclic group, a C.sub.6-60 aryl group, a C.sub.4-20 heterocyclic group, or a C.sub.4-60 heteroaryl group; A is a C.sub.6-60 aryl group, or a C.sub.4-60 heteroaryl group; X is a C.sub.1-60 aliphatic group, a C.sub.4-20 alicyclic group, or a C.sub.5-60 aryl group; and a is an integral between 1 and 100, wherein a molar ratio of the unit represented by the formula (1) to the unit represented by the formula (2) is ranged from 1:0.31 to 1:0.95.

16. The circuit board of claim 15, further comprising: a circuit layer disposed between the substrate and the insulating layer.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0051] FIGS. 1A to 1C are perspective views showing a preparing process for a circuit board according to Embodiment 6 of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0052] The present invention has been described in an illustrative manner, and it is to be understood that the terminology used is intended to be in the nature of description rather than of limitation. Many modifications and variations of the present invention are possible in light of the above teachings. Therefore, it is to be understood that within the scope of the appended claims, the invention may be practiced otherwise than as specifically described.

[0053] The materials used in the present invention are listed in the following Table 1. The components of the compositions in the following embodiments are listed in the following Table 2. The results are listed in the following Table 3.

[Method for Preparing Dry Film]

[0054] Thin films of resin compositions used in the following embodiments of the present invention were prepared by the following steps. First, a PET support film with A4 size was provided, a release treatment was performed on a surface thereof, and a thickness thereof was 50 m. Next, a formulated varnish with the components shown in Table 1 was applied onto the PET support film through a slit coating machine with 300 m slits, followed by placing in an ovan at 120 C. for 30 min, to obtain a thin film of the resin compositions with a thickness of 502 m.

[Dynamic Viscosity ()]

[0055] For the control group, dimethyl acetamide for diluting a polymer solution was placed into Ubbelohde viscometer (in which dynamic viscosity ranges between 2 cSt and 10 cSt (C=0.00982)) and between mark lines thereof. Then, the Ubbelohde viscometer was placed in the thermostatic bath at 35 C. for 10 min. Among the three glass tubes, the rubber tube and the string clip were mounted on the glass tube with medium diameter, and the adsorption means was mounted on the finest glass tube. The rubber tube mounted with the string clip was closed, and then the liquid was sucked by the adsorption means. When the liquid was sucked and reached the topmost reservoir, the adsorption means and the string clip were released. When the liquid traveled back and reach the mark line, the time that the liquid traveled between the mark lines was measured with the stopwatch. The aforesaid measurement was performed for three times; and an average value thereof was obtained.

[0056] For the experimental group, 0.49 g of 20 wt % polymer solution was placed into 50 mL flask equipped with a stir, and then 20 mL dimethyl acetamide was added therein. After stirring for 10 min, the time that the liquid traveled between the mark lines was measured by Ubbelohde viscometer for three times; and an average value thereof was obtained. The dynamic viscosity was calculated by the following equation.

[dL/g]=(ln(Time of the experimental group)/(Time of the control group))/solid content(%)0.2

[Elasticity]

[0057] The film of the resin composition prepared by the aforementioned method was cut into 100100 mm.sup.2, placed in the hot air circulation oven at 180 C., and cured at 185 C. for 60 min. The cured film was cut into 10100 mm.sup.2, and then the PET support film was released to obtain a specimen. The tensile modulus of the specimen was measured by Autograph AG S-5kND (Shimadzu corporation) at 20 mm/min.

[Flexibility]

[0058] 100100 mm.sup.2 Copper-foiled laminated flexible board (the thickness of the Cu foil/the thickness of the insulating layer=12/12 m) was prepared; and then the insulating matrix of the dry film was laminated on the Cu foil of the Copper-foiled laminated flexible board to obtain a substrate for evaluating flexibility. Next, a lamination was performed under vacuum, at 80 C. and 0.5 MPa for 60 sec. Then, the PET support film was released. The obtained substrate was placed in the hot air circulation oven, and cured at 185 C. for 60 min. The cured substrate was cut into 1020 mm.sup.2 specimens. The specimen was bent 180 degree bend for one time, placed in the middle of 2 mm gap of a balance. The restoring force of the bent specimen was measured. The aforementioned process was performed for 5 times, and an average value thereof was obtained.

[Chemical Resistance]

[0059] The substrate laminated with the insulating matrix identical to the substrate for the flexibility measurement was prepared, and cut into 20 mm20 mm to obtain specimens. The specimens were placed in 1 mol % NaOH aqueous solution, 1 mol % HCl aqueous solution, 1 mol % H.sub.2SO.sub.4 aqueous solution, MEK and ethanol, and immersed at 30 C. for 7 days. Then, the specimens were washed with water, and dried with clean cloth. The appearance changes such as color changes and swelling of the specimens were observed with naked eyes. No appearance change was qualified and observing appearance change was unqualified.

[Adhesion]

[0060] 120100 mm.sup.2 Copper-foiled laminated flexible board (the thickness of the Cu foil/the thickness of the insulating layer=12/12 m) was prepared; and then the insulating matrix of the dry film was laminated on the Cu foil of the Copper-foiled laminated flexible board to obtain a substrate. Next, a lamination was performed under vacuum, at 80 C. and 0.5 MPa for 60 sec. Then, the PET support film was released. The obtained substrate was placed in the hot air circulation oven, and cured at 185 C. for 60 min. Next, 120100 mm.sup.2 Copper-foiled laminated flexible board (the thickness of the Cu foil/the thickness of the insulating layer=12/12 m) was further laminated on the insulating matrix of the substrate; and the obtained substrate was laminated under vacuum, at 80 C. and 0.5 MPa for 60 sec and then placed in the hot air circulation oven, and cured at 185 C. for 60 min. After the aforementioned process, a specimen was obtained. For evaluating the adhesion, the adhesion part of the specimen was peeled off with a blade, and the strength thereof was measured at 180 peeling angle and 50 mm/min peeling speed. The aforementioned test was performed for 5 times, and an average value thereof was obtained.

[Welding Thermal Resistance]

[0061] The substrate laminated with the insulating matrix identical to the substrate for the flexibility measurement was prepared, and cut into 20 mm20 mm to obtain specimens. The specimens were floated on the surface of the 260 C. soldering tank, and the insulating matrix thereof contacted the surface of the soldering tank. The appearance changes such as color changes and swelling of the specimens were observed with naked eyes. The aforementioned test was performed for 5 times. No appearance change among these 5 times was qualified and the rests were unqualified.

Preparation of Resin Composition

Embodiment 1

[0062] 880.4 g DMAc (dimethyl acetamide), 474.1 g xylene, 157.1 g (0.155 mol) RT-1000 and 95.5 g (0.232 mol) p-BAPP were weighted and added into 2000 ml 5-neck separately flask. After stirring for 10 min, 100.0 g (0.322 mol) ODPA was added therein. Molar ratio of the carboxylic dianhydride compound to the diamine compound was 1:1.2. Next, the temperature of the oil was raised to 180 C.; and water was condensed through Dean-Stark apparatus, evaporated and released out the reaction system. The condensation reaction was performed for about 5 hr, and stopped until no water was released. Finally, the reaction temperature was reduced to room temperature, and long chain diamine was obtained.

[0063] Next, 5.7 g MDI (0.023 mol, the molar ratio of NCO to NH was 0.7) was dissolved in MEK, wherein the weight of MEK was 5 times of MDI. At room temperature, the solution of the long chain diamine was slowly added therein within 1 hr. The resulted solution was heated to 100 C. and the reaction was performed for 5 hr. The dynamic viscosity () of the obtained cross-linked polymer was 0.82. 35.8 g N-695DMAc solution (50%) and 17.9 g of 828, 5.0 g cyano amine, 15.0 g FPB-100 and 75.0 g H-42ST was added into the cross-linked polymer. The mixture was mixed with the muller, and finely dispersed by the sander provided by Weblande Corp. Fineness gauge was used to confirm no particle with diameters of 10 l or more present. Then, 5.0 g HXA-4922HP and 4.5 g KBM-403 were added therein and mixed, to obtain the varnish for forming the dry film.

Embodiment 2

[0064] 903.7 g N-methylpyrrolidone (NMP), 602.5 g mesitylene, 97.7 g (0.096 mol) RT-1000, 51.5 g (0.100 mol) dimer diamine P-1074 and 147.1 g (0.358 mol) p-BAPP were weighted and added into 2000 ml 5-neck separately flask. After stirring for 10 min, 100.0 g (0.4585 mol) PMDA was added therein. Molar ratio of the carboxylic dianhydride compound to the diamine compound was 1:1.2. The imidization reaction identical to that of Embodiment 1 was performed to obtain long chain diamine. Next, similar to Embodiment 1, 8.0 g MDI (0.032 mol, the molar ratio of NCO to NH was 0.7) was dissolved in MEK, wherein the weight of MEK was 5 times of MDI; and the obtained cross-linked polymer has of 0.92. Finally, 4.0 g KBM-403 was added into the cross-linked polymer; and then the varnish for forming the dry film was obtained after stirring.

Embodiment 3

[0065] 1037.9 g DMAc, 558.9 g xylene, 181.2 g (0.179 mol) RT-1000 and 136.4 g (0.332 mol) p-BAPP were weighted and added into 2000 ml 5-neck separately flask. After stirring for 10 min, 100.0 g (0.340 mol) BPDA was added therein. Molar ratio of the carboxylic dianhydride compound to the diamine compound was 1:1.5. The imidization reaction identical to that of Embodiment 1 was performed to obtain long chain diamine. Next, similar to Embodiment 1, 10.6 g MDI (0.043 mol, the molar ratio of NCO to NH was 0.5) was dissolved in MEK, wherein the weight of MEK was 5 times of MDI; and the obtained cross-linked polymer has of 1.01. Finally, 4.3 g KBM-403 was added into the cross-linked polymer; and then the varnish for forming the dry film was obtained after stirring.

Embodiment 4

[0066] 1271.9 g DMAc, 684.8 g xylene, 307.1 g (0.303 mol) RT-1000 and 101.8 g (0.248 mol) p-BAPP were weighted and added into 2000 ml 5-neck separately flask. After stirring for 10 min, 100.0 g (0.459 mol) PMDA was added therein. Molar ratio of the carboxylic dianhydride compound to the diamine compound was 1:1.2. The imidization reaction identical to that of Embodiment 1 was performed to obtain long chain diamine. Next, similar to Embodiment 1, 8.0 g MDI (0.032 mol, the molar ratio of NCO to NH was 0.7) was dissolved in MEK, wherein the weight of MEK was 5 times of MDI; and the obtained cross-linked polymer has of 1.10. 5.2 g KBM-403 was added into the cross-linked polymer; and then the varnish for forming the dry film was obtained after stirring.

Embodiment 5

[0067] 726.8 g NMP, 484.6 g mesitylene, 160.3 g (0.158 mol) RT-1000 and 58.7 g (0.293 mol) ODA were weighted and added into 2000 ml 5-neck separately flask. After stirring for 10 min, 100.0 g (0.322 mol) ODPA was added therein. Molar ratio of the carboxylic dianhydride compound to the diamine compound was 1:1.4. The imidization reaction identical to that of Embodiment 1 was performed to obtain long chain diamine. Next, similar to Embodiment 1, 9.7 g MDI (0.039 mol, the molar ratio of NCO to NH was 0.6) was dissolved in MEK, wherein the weight of MEK was 5 times of MDI; and the obtained cross-linked polymer has of 0.91. 3.3 g KBM-403 was added into the cross-linked polymer; and then the varnish for forming the dry film was obtained after stirring.

Comparative Embodiment 1

[0068] 1054.5 g NMP, 703.0 g mesitylene, 223.4 g (0.220 mol) RT-1000 and 135.8 g (0.330 mol) p-BAPP were weighted and added into 2000 ml 5-neck separately flask. After stirring for 10 min, 100.0 g (0.459 mol) PMDA was added therein. Molar ratio of the carboxylic dianhydride compound to the diamine compound was 1:1.2. The imidization reaction identical to that of Embodiment 1 was performed to obtain long chain diamine. Next, similar to Embodiment 1, 2.3 g MDI (0.009 mol, the molar ratio of NCO to NH was 0.2) was dissolved in MEK, wherein the weight of MEK was 5 times of MDI; and the obtained cross-linked polymer has of 0.55. 4.6 g KBM-403 was added into the cross-linked polymer; and then the varnish for forming the dry film was obtained after stirring.

Comparative Embodiment 2

[0069] 1125.5 g NMP, 750.4 g mesitylene, 204.8 g (0.096 mol) RT-1000, 107.9 g (0.100 mol) dimer diamine 1074 and 248.9 g (0.358 mol) p-BAPP were weighted and added into 2000 ml 5-neck separately flask. After stirring for 10 min, 100.0 g (0.4585 mol) PMDA was added therein. Molar ratio of the carboxylic dianhydride compound to the diamine compound was 1:2.2. The imidization reaction identical to that of Embodiment 1 was performed to obtain long chain diamine. Next, similar to Embodiment 1, 41.3 g MDI (0.032 mol, the molar ratio of NCO to NH was 0.6) was dissolved in MEK, wherein the weight of MEK was 5 times of MDI. Unsoluable gel product was obtained, and the target cross-linked polymer cannot be obtained.

Comparative Embodiment 3

[0070] 1238.1 g DMAc, 6.6 g xylene, 382.9 g (0.155 mol) RT-1000 and 8.4 g (0.232 mol) ODA were weighted and added into 2000 ml 5-neck separately flask. After stirring for 10 min, 100.0 g (0.322 mol) ODPA was added therein. Molar ratio of the carboxylic dianhydride compound to the diamine compound was 1:1.3. The imidization reaction identical to that of Embodiment 1 was performed to obtain long chain diamine. Next, similar to Embodiment 1, 7.3 g MDI (0.023 mol, the molar ratio of NCO to NH was 0.6) was dissolved in MEK, wherein the weight of MEK was 5 times of MDI; and the obtained cross-linked polymer has of 0.41. 49.9 g N-695DMAc (50%) solution, 24.9 g of 828, 5.0 g cyano amine, 15.0 g FPB-100 and 75.0 g H-42ST was added into the cross-linked polymer. Similar to Embodiment 1, the mixture was finely dispersed by the sander; and 5.0 g HXA-4922HP and 4.5 g KBM-403 were added therein and mixed, to obtain the varnish for forming the dry film.

TABLE-US-00001 TABLE 1 Listing of the used starting material Manufacturer and function 50 m PET FUJICO, support film DMAc DuPont, solvent xylene COSMO BIO, solvent NMP SANKYO CHEMICAL CO., LTD., solvent mesitylene Mitsubishi gas chemical company, Inc., solvent ODPA CHINATECH (Tianjin) CHEMICAL CO., LTD., carboxylic dianhydride 4,4-Oxydiphthalic anhydride BPDA CHINATECH (Tianjin) CHEMICAL CO., LTD., carboxylic dianhydride 3,3,4,4-Biphenyltetracarboxylic dianhydride PMDA DAICEL, carboxylic dianhydride Pyromellitic anhydride RT-1000 ELASTAMINE RT-1000 (Huntsuman), aliphatic polyalkylene diamine [poly(tetramethylene ether glycol)]/PPG (polypropylene glycol) copolymer P-1074 Priamine 1074 (CRODA), aliphatic dimer diamine p-BAPP JinXiang Chemical, aryl diamine 2,2-Bis [4-(4-aminophenoxy)phenyl] propane ODA Changzhou Sunchem Pharmaceutical Chemical Material Co., Ltd., aryl diamine 4,4-Oxydianiline N-695 DIC, novolac epoxy resin 828 Mitsubishi Chemical Corp., biphenol A epoxy resin HXA4922HP Asahi Kasei E-materials, hardener and hardening accelarator cyandiamide DOW Chemical, cross-linker FPB-100 Otsuka Chemical Co., Ltd., hexa(phenoxy) cyclotriphosphazene, retardant H-42ST Marutou CO., LTD. Al(OH).sub.3, retardant KBM-403 Shin-Etsu Chemical Co., Ltd, coupling agent (3-Glycidoxypropyl) trimethoxysilane

TABLE-US-00002 TABLE 2 Listing of the components used in Embodiments and Comparative embodiments Embodiment Comparative embodiment Components Unit 1 2 3 4 5 1 2 3 ODPA g 100.0 100.0 100 BPDA g 100.0 PMDA g 100.0 100.0 100.0 100.0 RT-1000 g 157.1 97.7 207.1 335.1 229.1 223.4 232.7 382.9 1074 51.5 122.7 p-BAPP g 95.5 147.1 125.9 90.5 135.8 282.9 ODA g 45.2 8.4 MDI g 5.7 8.0 10.6 1.8 9.7 2.3 51.6 7.3 mesitylene 602.4 708.0 572.8 618.5 836.3 NMP 903.7 1315.0 859.2 927.7 1254.5 DMAC g 880.4 1077.9 1238.1 Xylene g 474.1 580.4 666.6 Total g 1712.8 1910.4 2101.9 2550.4 1816.0 2007.7 2880.7 2403.3 NH/NCO 0.7 0.7 0.5 0.7 0.6 0.2 0.6 0.6 NH/COOH 1.2 1.2 1.5 1.2 1.4 1.2 2.5 1.3 50% N-695 g 35.8 49.9 828 g 17.9 24.9 Cyano amine g 5.0 5.0 HXA4922HP g 5.0 5.0 FPB-100 g 15.0 15.0 H-42ST g 75.0 75.0 KBM-403 g 4.5 4.0 4.4 5.3 3.8 4.6 5.9

TABLE-US-00003 TABLE 3 Listing of the evaluation results Embodiment Comparative embodiment Unit 1 2 3 4 5 1 2 3 Dynamic 0.82 0.92 1.01 1.10 0.91 0.55 ND 0.41 viscosity Tensile Mpa 63.6 40.1 34.8 38.6 33.3 23.7 ND 83.5 modulus Flexibility g 13.0 7.0 6.0 7.0 8.0 7.0 ND 11.0 Chemical O O O O O X ND X resistance Adhesion KN/m 1.21 0.96 0.91 1.02 0.95 1.24 ND 1.84 Welding O O O O O X ND X thermal resistance O: Qualified; X: Unqulified; ND: Cannot be detected

[0071] From the results shown in Table 3, when the resin compositions provided by Embodiments 1-5 of the present invention were used as insulating matrix, excellent tensile modulus, flexibility, chemical resistance, adhesion and thermal stability can be obtained. Hence, the resin compositions of the present invention are suitable for flexible thin circuit boards or multi-layered circuit boards.

Embodiment 6

[0072] FIGS. 1A to 1C are perspective views showing a preparing process for a circuit board according to the present embodiment. As shown in FIG. 1A, a substrate 11 with a circuit layer 12 formed thereon is provided; and a support 21 with an insulating layer 22 formed thereon is also provided. Herein, the insulating layer 22 comprises one of the resin composition illustrated in the aforementioned Embodiments 1-5. Then, as shown in FIG. 1B, the support 21 is laminated on the substrate 11, and the circuit layer 12 is embedded into the insulating layer 22. Finally, as shown in FIG. 1C, the support 21 is released to obtain the circuit board of the present embodiment.

[0073] Hence, as shown in FIG. 1C, the circuit board of the present embodiment comprises: a substrate 11; and an insulating layer 22 disposed on the substrate 11 and comprising one of the resin composition illustrated in the aforementioned Embodiments 1-5. Meanwhile, the circuit board of the present embodiment further comprises: a circuit layer 12 disposed between the substrate 11 and the insulating layer 22.

[0074] In the present invention, only one possible aspect of the circuit board is provided. However, the present invention is not limited thereto; the aspects that the protection layers, the adhesion layers, the insulating layers or other layers of the circuit boards comprise the resin compositions of the present invention are within the scopes of the present invention.

[0075] Although the present invention has been explained in relation to its preferred embodiment, it is to be understood that many other possible modifications and variations can be made without departing from the spirit and scope of the invention as hereinafter claimed.