METHOD FOR PREPARING HEAT DISSIPATION COMPONENT WITH HIGH FLEXIBILITY MADE OF GRAPHITE OR GRAPHENE MATERIAL

Abstract

The present disclosure disclose a method for preparing a heat dissipation component with high flexibility made of graphite or a graphene material, which includes that follow steps: 1) plasma cleaning a graphite or graphene raw material; 2) taking preparation materials of an activator; 3) continually cleaning the graphite or graphene raw material with the activator; 4) cleaning the graphite or graphene raw material with deionized water; 5) conducting a electroplating process on a surface of the graphite or graphene raw material to form a copper film layer; 6) continually cleaning the graphite or graphene raw material; 7) forming a protective film on the graphite or graphene raw material by soaking; 8) drying the graphite or graphene raw material electroplated with the copper film layer. The surface of graphite or graphene treated with the activator has a uniform copper film layer with good binding quality during electroplating.

Claims

1. A method for preparing a heat dissipation component with high flexibility made of a graphite or graphene material, comprising the following steps: 1) plasma cleaning a graphite or graphene raw material to obtain a first cleaned graphite or graphene raw material; 2) taking preparation materials of an activator comprising the following components in percentage by weight: 10-20% of sulfuric acid, 0.05-1% of an OP-10 surfactant, 0.05-1% of sodium dodecyl sulfate, and the balance of water; 3) mixing the aforementioned components of the activator to prepare the activator, and continually cleaning the first cleaned graphite or graphene raw material with the activator to obtain a second cleaned graphite or graphene raw material; 4) continually cleaning the graphite or graphene raw material with deionized water to obtain a third cleaned graphite or graphene raw material; 5) conducting an electroplating process on a surface of the third cleaned graphite or graphene raw material to form a copper film layer on the surface of the third cleaned graphite or graphene raw material to obtain an electroplated graphite or graphene raw material; 6) continually cleaning the electroplated graphite or graphene raw material with deionized water to obtain a fourth cleaned graphite or graphene raw material; 7) forming a protective film on the fourth cleaned graphite or graphene raw material by soaking to obtain a fifth graphite or graphene raw material covered by the protective film, wherein said forming the protective film on the fourth cleaned graphite or graphene raw material comprises: soaking the fourth cleaned graphite or graphene raw material in a 5 g/L methyl benzotriazole solution for 20-30 seconds to form a first layer of protective film, and putting the fourth cleaned graphite or graphene raw material with the first layer of protective film into a 0.5 g/L cetylpyridinium bromide solution for 20-30 seconds to form a second layer of protective film; and 8) drying the fifth graphite or graphene raw material.

2. The method for preparing a heat dissipation component with high flexibility made of a graphite or graphene material according to claim 1, wherein in the step 1), the graphite or graphene raw material is placed in a plasma cleaning machine for cleaning.

3. The method for preparing a heat dissipation component with high flexibility made of a graphite or graphene material according to claim 1, wherein in the step 2), the activator comprises the following components in percentage by weight: 12-16% of sulfuric acid, 0.05-0.5% of the OP-10 surfactant, 0.05-0.5% of sodium dodecyl sulfate, and the balance of water.

4. The method for preparing a heat dissipation component with high flexibility made of a graphite or graphene material according to claim 3, wherein in the step 2), the activator comprises the following components in percentage by weight: 15% sulfuric acid, 0.1% of the OP-10 surfactant, 0.1% of sodium dodecyl sulfate, and the balance of water.

5. The method for preparing a heat dissipation component with high flexibility made of a graphite or graphene material according to claim 1, wherein in the step 5), the third cleaned graphite or graphene raw material is subjected to the electroplating process twice with an electroplating potion, and the electroplating potion comprises the following components in percentage by weight: 5% of copper ions; 14% of sulfuric acid; 0.8% of a brightener; 0.06% of an adjuvant; 0.06% of a leveling agent; and the balance of water.

6. The method for preparing a heat dissipation component with high flexibility made of a graphite or graphene material according to claim 5, wherein in the step 5), when the third cleaned graphite or graphene raw material is electroplated with the electroplating potion for the first time, the temperature is 40 celsius degrees and the time is 20 minutes; and when the third cleaned graphite or graphene raw material is electroplated with the electroplating potion for the second time, the temperature is 40 celsius degrees and the time is 15 minutes.

7. (canceled)

Description

DETAILED DESCRIPTION OF THE EMBODIMENTS

[0030] Exemplary examples of the present disclosure will be described in more detail below. Although exemplary examples of the present disclosure are shown, it should be understood that the present disclosure may be implemented in various forms, and should not be limited by the examples set forth herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the disclosure to those skilled in the art.

Example 1

[0031] This example of the present disclosure provided a method for preparing a heat dissipation component with high flexibility made of a graphite or graphene material, including the following steps:

[0032] 1) placing a graphite or graphene raw material in a plasma cleaning machine for plasma cleaning, wherein the plasma cleaning machine had an air pressure of 2 MPa and a power of 550-600 W, and the time for the plasma cleaning was 30 min;

[0033] 2) taking preparation materials of an activator including the following components in percentage by weight: 15% of sulfuric acid, 0.1% of an OP-10 surfactant, 0.1% of sodium dodecyl sulfate, and the balance of water;

[0034] 3) mixing the aforementioned components of the activator to prepare the activator, and continually cleaning the graphite or graphene raw material with the activator;

[0035] 4) continually cleaning the graphite or graphene raw material with deionized water;

[0036] 5) conducting a electroplating process on a surface of the graphite or graphene raw material twice to form a copper film layer;

[0037] 6) continually cleaning the graphite or graphene raw material electroplated with the copper film layer on the surface thereof with deionized water;

[0038] 7) firstly, soaking the graphite or graphene raw material plated with the copper film layer in a 5 g/L methyl benzotriazole solution for 20-30 seconds to form a first layer of protective film on the copper film layer, and then putting into a 0.5 g/L cetylpyridinium bromide solution for 20-30 seconds to form a second layer of protective film on the copper film layer to effectively prevent the copper film from color changing;

[0039] 8) drying the graphite or graphene raw material electroplated with the copper film layer.

[0040] In the step 5), it included two electroplating procedures: firstly, the graphite or graphene raw material was subjected to primary electroplating with an electroplating potion; and secondly, the graphite or graphene raw material was subjected to secondary electroplating with the electroplating potion. The electroplating potion included the following components in percentage by weight: 5% of copper ions; 14% of sulfuric acid; 0.8% of a brightener; 0.06% of an adjuvant; 0.06% of a leveling agent; and the balance of water. During the electroplating process, pickling could be carried out at the same time, so that the flatness of the heat dissipation component was good.

[0041] Various process parameters of Example 1 were shown in the table below:

TABLE-US-00001 Potion Electroplating Component concen- process name tration Temperature Time Activation sulfuric acid  15% 25° C.  3 minutes Surfactant A 0.10% (OP-10) sodium dodecyl 0.10% sulfate Washing with deionized water 25° C. 20 seconds pure water Pre-plating of Copper ions  50 g/l 40° C. 20 minutes copper sulfuric acid   14% Additive A 0.80% (brightener) Additive B 0.06% (adjuvant) Additive C 0.06% (leveling agent) Electroplating Copper ions  50 g/l 40° C. 15 minutes of sulfuric acid   14% copper Additive A 0.80% (brightener) Additive B 0.06% (adjuvant) Additive C 0.06% (leveling agent) Cleaning with deionized water 25° C. 20 seconds pure water Protection 1 methyl   5 g/l 25° C. 20 seconds benzotriazole Protection 2 cetylpyridinium 0.5 g/l 25° C. 20 seconds bromide Drying drying oven 80° C.  2 minutes

Example 2

[0042] This example of the present disclosure provided a method for preparing a heat dissipation component with high flexibility made of a graphite or graphene material, including the following steps:

[0043] 1) placing a graphite or graphene raw material in a plasma cleaning machine for plasma cleaning, wherein the plasma cleaning machine had an air pressure of 2 MPa and a power of 550-600 W, and the time for the plasma cleaning was 30 min;

[0044] 2) taking preparation materials of an activator including the following components in percentage by weight: 16% of sulfuric acid, 0.2% of an OP-10 surfactant, 0.2% of sodium dodecyl sulfate, and the balance of water;

[0045] 3) mixing the aforementioned components of the activator to prepare the activator, and continually cleaning the graphite or graphene raw material with the activator;

[0046] 4) continually cleaning the graphite or graphene raw material with deionized water;

[0047] 5) conducting a electroplating process on a surface of the graphite or graphene raw material twice to form a copper film layer;

[0048] 6) continually cleaning the graphite or graphene raw material electroplated with the copper film layer on the surface thereof with deionized water;

[0049] 7) firstly, soaking the graphite or graphene raw material plated with the copper film layer in a 5 g/L methyl benzotriazole solution for 20-30 seconds to form a first layer of protective film on the copper film layer, and then putting into a 0.5 g/L cetylpyridinium bromide solution for 20-30 seconds to form a second layer of protective film on the copper film layer to effectively prevent the copper film from color changing;

[0050] 8) drying the graphite or graphene raw material electroplated with the copper film layer.

[0051] In view of the above, compared with the prior art, the method for preparing a heat dissipation component with high flexibility made of a graphite or graphene material as provided by the aforementioned examples has the following advantages. The graphite or graphene raw material is firstly placed in a plasma cleaning machine for plasma cleaning, and then the surface of graphite or graphene is treated with an activator compounded by sulfuric acid, the OP-10 surfactant and sodium dodecyl sulfate. Sulphuric acid can wash away oil stains from the graphite or graphene raw material, the OP-10 surfactant improves the smoothness of the surface of the graphite or graphene raw material, and sodium dodecyl sulfate increases the dispersibility of graphite or graphene and further increases the smoothness of the surface of the graphite or graphene raw material, so that the electroplated copper film layer has good binding quality and is uniform, which enhances the flexibility of the prepared heat dissipation component, and the surface of the heat dissipation component is not easy to generate creases, and the heat dissipation and acid and alkali resistance performances of the heat dissipation component are improved. After the copper film layer is formed on the graphite or graphene raw material by electroplating, the graphite or graphene raw material electroplated with the copper film layer is first soaked in a 5 g/L methyl benzotriazole solution for 20-30 seconds to form a first layer of protective film on the copper film layer, and then put into a 0.5 g/L cetylpyridinium bromide solution for 20-30 seconds to form a second layer of protective film on the copper film layer, which effectively prevents the copper film layer from color changing.

[0052] The aforementioned description is only preferred specific embodiments of the present disclosure, and the claimed scope of the present disclosure is not limited thereto. Equivalent substitutions or modifications can be made by those of skills in the art according to the technical solution and inventive concept of the present disclosure, without departing from the technical scope disclosed by the present disclosure. These substitutions or modifications all fall within the claimed scope of the present disclosure.