LIQUID METAL SUBSTRATE CLEANING METHOD AND CLEANING AND COATING INTEGRATED DEVICE

Abstract

Provided in the present disclosure is a liquid metal substrate cleaning method and cleaning and coating integrated device, belonging to the technical field of thermal interface materials construction. The above-mentioned method includes a substrate cleaning and a cleaning qualification inspection, wherein the substrate cleaning comprises a plasma cleaning, an inorganic cleaning reagent cleaning, and an organic reagent cleaning, and any combination of the plasma cleaning, the inorganic cleaning reagent cleaning and the organic reagent cleaning; and the cleaning qualification inspection is judged as qualified or not based on a diffusion area of the organic reagent on a surface of the liquid metal substrate, and when the diffusion area meets a predetermined requirement, the cleaning is finished; and when the diffusion area does not meet the predetermined requirement, the substrate cleaning step is repeated, and the steps are repeated in this way until the diffusion area meets the predetermined requirement.

Claims

1. A cleaning method for a liquid metal substrate, comprising a substrate cleaning and a cleaning qualification inspection, and the steps are as follows: the substrate cleaning comprises one or more of a plasma cleaning, an inorganic cleaning reagent cleaning, and an organic reagent cleaning, and any combination of the plasma cleaning, the inorganic cleaning reagent cleaning and the organic reagent cleaning; and the cleaning qualification inspection is judged as qualified or not based on a diffusion area of the organic reagent on a surface of the liquid metal substrate, and when the diffusion area meets a predetermined requirement, the cleaning is finished; and when the diffusion area does not meet the predetermined requirement, the substrate cleaning step is repeated, and the steps are repeated in this way until the diffusion area meets the predetermined requirement.

2. The cleaning method according to claim 1, wherein the inorganic cleaning reagent is selected from one of a sodium bicarbonate solution, a low-concentration strong acid solution, a high-concentration weak acid solution, a low-concentration strong alkali solution and a high-concentration weak alkali solution.

3. The cleaning method according to claim 2, wherein the strong acid solution is selected from one or more of dilute hydrochloric acid, dilute sulfuric acid, dilute nitric acid, hydrobromic acid, hydroiodic acid, phosphoric acid and permanganic acid; and/or, the weak acid solution is selected from hydrofluoric acid and/or acetic acid; and/or, the strong alkali solution is selected from one or more of sodium oxide, potassium hydroxide and barium hydroxide; and/or, the weak alkaline solution is selected from sodium bicarbonate and/or sodium carbonate.

4. The cleaning method according to claim 1, wherein the organic reagent is selected from one or more of alcohols, hydrocarbons, ethers, esters and ketones.

5. The cleaning method according to claim 1, wherein the organic reagent is selected from one or more of ethanol, methanol, dipropylene glycol butyl ether, diethylene glycol butyl ether, hydrocarbon, acetone, toluene, ethyl acetate and ethyl ether.

6. The cleaning method according to claim 1, wherein the substrate cleaning method comprising: method {circle around (1)}: the plasma cleaning; and/or, method {circle around (2)}: the inorganic cleaning reagent cleaning; and/or, method {circle around (3)}: the organic reagent cleaning; and/or, method {circle around (4)}: a combined cleaning, the plasma cleaning first, and then the inorganic cleaning reagent cleaning; and/or, method {circle around (5)}: a combined cleaning, the plasma cleaning first, and then the organic reagent cleaning; and/or, method {circle around (6)}: a combined cleaning, the inorganic cleaning reagent cleaning first, and then the plasma cleaning; and/or, method {circle around (7)}: a combined cleaning, the inorganic cleaning reagent cleaning first, and then the organic reagent cleaning; and/or, method {circle around (8)}: a combined cleaning, the organic reagent cleaning first, and then the plasma cleaning; and/or, method {circle around (9)}: a combined cleaning, the organic reagent cleaning first, and then the inorganic cleaning reagent cleaning; and/or, method {circle around (10)}: a combined cleaning, the plasma cleaning first, then the inorganic cleaning reagent cleaning, and finally the organic reagent cleaning; and/or, the method {circle around (11)}: a combined cleaning, the plasma cleaning first, then the organic reagent cleaning, and finally the inorganic cleaning reagent cleaning; and/or, the method {circle around (12)}: a combined cleaning, the inorganic cleaning reagent cleaning first, then the plasma cleaning, and finally the organic reagent cleaning; and/or, a method {circle around (13)}; a combined cleaning, the inorganic cleaning reagent cleaning first, then the organic reagent cleaning, and finally the plasma cleaning; and/or, the method {circle around (14)}: a combined cleaning, the organic reagent cleaning first, then the plasma cleaning, and finally the inorganic cleaning reagent cleaning; and/or, the method {circle around (15)}: a combined cleaning, the organic reagent cleaning first, then the inorganic cleaning reagent cleaning, and finally the plasma cleaning.

7. A liquid metal substrate cleaning and a coating integrated device based on the cleaning method according to claim 1, comprising an integration platform, a cleaning unit, an erasing unit, a coating unit and an image sensor are installed on the integration platform, and the integration platform is installed on a moving mechanism.

8. The integrated device according to claim 7, wherein the cleaning unit comprises a plurality of cleaning devices, the erasing unit is provided with at least one erasing device, and the coating unit is provided with at least one coating device; preferably, the cleaning device comprises a plasma cleaning machine, a first wiping head and a second wiping head, wherein the first wiping head is filled with the inorganic reagent according to claim 1, and the second wiping head is filled with the organic reagent according to claim 1.

9. The working method of the integrated device according to claim 8, wherein the moving mechanism comprises an X-direction sliding table and a Z-direction sliding table, and the integration platform is arranged to move left or right relative to the X-direction sliding table, and is arranged to move up or down relative to the Z-direction sliding table, respectively.

10. The working method of the integrated device according to claim 8, comprising the following steps: substrate cleaning: the surface of the liquid metal substrate is cleaned via one or any combination of the plasma cleaning machine, the first wiping head and the second wiping head, and the surface of the liquid metal substrate is dried via the erasing device after each cleaning; substrate detection: the organic cleaning reagent in the second wiping head is dropped onto the surface of the liquid metal substrate, the substrate detection is judged as qualified or not based on a diffusion area of the organic reagent on the surface of the liquid metal substrate, and when the diffusion area meets a predetermined requirement, the cleaning is finished; and when the diffusion area does not meet the predetermined requirement, the substrate cleaning step is repeated, and the steps are repeated in this way until the diffusion area meets the predetermined requirement; and coating liquid metal: a liquid metal coating device is controlled via a control unit to apply liquid metal coating to the liquid metal substrate.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0052] FIG. 1 is a structural schematic diagram or the present disclosure;

[0053] FIG. 2 is a structural schematic diagram of a first supporting frame and a second supporting frame;

[0054] FIG. 3 is a photo of a test result of Experiment 1;

[0055] FIG. 4 is a photo of a test result of Experiment 2;

[0056] FIG. 5 is a photo of a test result of Experiment 3;

[0057] In the figures: [0058] 1integration platform; 21plasma cleaning machine; 22the first wiping head; 23the second wiping head; 3erasing unit; 4coating unit; 5image sensor; 6moving mechanism; 61X-direction sliding table; 62Z-direction sliding table; 63Y-direction sliding table; 71first supporting frame; 711first groove; 72second supporting frame; 721second groove; 8connector; 9production line platform; and 10substrate sample.

DETAILED DESCRIPTION OF THE EMBODIMENTS

[0059] In the following, the technical scheme of the present disclosure will be explained through specific embodiments with the accompanying drawings. It should be understood that one or more steps mentioned in the present disclosure do not exclude the existence of other methods and steps before and after the combination step, or other methods and steps can be inserted between these explicitly mentioned steps. It should also be understood that these examples are only used to illustrate the present disclosure and are not used to limit the scope of the present disclosure. Unless otherwise specified, the numbering of each method step is only for the purpose of identifying each method step, and does not limit the arrangement order of each method or limit the scope of implementation of the present disclosure. The change or adjustment of its relative relationship can also be regarded as the scope of implementation of the present disclosure without changing the substantive technical content.

[0060] The raw materials and instruments used in the embodiments have no specific restrictions on their sources, and can be purchased in the market or prepared by conventional methods familiar to those skilled in the art.

[0061] As shown in FIG. 1-FIG. 2, a liquid metal substrate cleaning and a coating integrated device, comprising an integration platform 1, wherein a cleaning unit, an erasing unit 3 and a coating unit 4 are installed on the integration platform 1, the integration platform 1 is installed on a moving mechanism 6, and the integrated device further comprises an image sensor 5 for capturing image information.

[0062] The cleaning unit comprises a plasma cleaning machine 21, a first wiping head 22 and a second wiping head 23, wherein the first wiping head 22 is a sodium bicarbonate solution wiping head and the second wiping head 23 is an anhydrous alcohol wiping head; the erasing unit 3 is provided with an erasing device; and the coating unit 4 is provided with a coating device; each device is arranged in turn in the transverse direction, and the working units of each device are exposed outside the integration platform 1, perpendicular to a substrate sample 10; and each cleaning device is respectively provided with an accommodating cavity for holding a cleaning reagent, and the coating device is provided with an accommodating cavity for holding liquid metal.

[0063] The moving mechanism 6 comprises an X-direction sliding table 61 and a Z-direction sliding table 62, and the integration platform 1 can move left or right relative to the X-direction sliding table 61, and can move up or down relative to the Z-direction sliding table 62, respectively, and also comprises a Y-direction sliding table 63, and the integration platform 1 can move back and forth relative to the Y-direction sliding table 63.

[0064] The moving mechanism 6 is any device in the prior art that can realize two-dimensional or three-dimensional space movement. In this embodiment, the integration platform 1 is fixedly connected with a fixing piece, and the fixing piece is slid and installed on the Z-direction sliding table 62; two ends of the X-direction sliding table 61 are respectively fixed on a first supporting frame 71 and a second supporting frame 72. Specifically, a first groove 711 is arranged on the first supporting frame 71, a second groove 721 is arranged on the second supporting frame, one end of the X-direction sliding table 61 is installed on the first groove 711, and the other end is installed on the second groove 721. The Z-direction sliding table 62 is slid and installed on the X-direction sliding table 61, and the Z-direction sliding table 62 can drive the integration platform 1 and its devices to move left or right along the X-direction sliding table; and in order to increase the function of forward or backward movement of the integration platform 1, both ends of the X-direction sliding table 61 slide the Y-direction sliding table 62 respectively, thus realizing the forward or backward movement of the integration platform 1 along the Y-axis direction.

[0065] The bottom of the first supporting frame 71 and the second supporting frame 72 are respectively provided with connectors 8, which are integrated devices and fixed on both sides of the production line platform 9.

[0066] In this embodiment, each cleaning device, erasing device, coating device and image sensor 5 are connected with the Programmable Logic Controller (PLC) control system, and automation is realized through PLC control.

[0067] The working process of the liquid metal substrate cleaning and coating integrated device is as follows: [0068] Step 1: the image sensor 5 transmits the image of the construction area to the computer, the builder marks the work piece area on the image, checks the required cleaning program, and the computer works according to the set program. [0069] Step 2: classification of cleaning procedures [0070] procedure {circle around (1)}: controlling the plasma cleaning machine 21 to perform plasma cleaning on the target area; [0071] procedure {circle around (2)}: controlling the sodium bicarbonate solution spray nozzle to spray sodium bicarbonate solution on the target area, and controlling the erasing device to clean and dry the target area; [0072] procedure {circle around (3)}: controlling the anhydrous alcohol wiping head to spray anhydrous alcohol on the target area, and controlling the erasing device to clean and dry the target area; [0073] procedure {circle around (4)}: proceeding with procedure {circle around (1)}first, and then proceeding with procedure {circle around (2)}; [0074] procedure {circle around (5)}: proceeding with procedure {circle around (2)}first, and then proceeding with procedure {circle around (3)}; [0075] procedure {circle around (6)}: proceeding with procedure {circle around (2)}first, and then proceeding with procedure {circle around (1)}; [0076] procedure {circle around (7)}: proceeding with procedure {circle around (2)}first, and then proceeding with procedure {circle around (3)}; [0077] procedure {circle around (8)}: proceeding with procedure {circle around (3)}first, and then proceeding with procedure {circle around (1)}; [0078] procedure {circle around (9)}D: proceeding with procedure {circle around (3)}first, and then proceeding with procedure {circle around (2)}; [0079] procedure {circle around (10)}: proceeding with procedure {circle around (1)}first, then proceeding with procedure {circle around (2)}, and finally proceeding with procedure {circle around (3)}; [0080] procedure {circle around (11)}: proceeding with procedure {circle around (1)}first, then proceeding with procedure {circle around (3)}, and finally proceeding with procedure {circle around (2)}; [0081] procedure {circle around (12)}: proceeding with procedure {circle around (2)}first, then proceeding with procedure {circle around (1)}, and finally proceeding with procedure {circle around (3)}; [0082] procedures {circle around (13)}: proceeding with procedure {circle around (2)}first, then proceeding with procedure {circle around (3)}, and finally proceeding with procedure {circle around (1)}; [0083] procedure {circle around (14)}: proceeding with procedure {circle around (3)}first, then proceeding with procedure {circle around (1)}, and finally proceeding with procedure {circle around (2)}; and [0084] procedure {circle around (15)}: proceeding with procedure {circle around (3)}first, then proceeding with procedure [0085] {circle around (2)}, and finally proceeding with procedure {circle around (1)}; [0086] Step 3: detection of cleaning effect

[0087] After the cleaning step is completed, the cleaning is detected qualified or not based on the diffusion area of the organic reagent, and the larger the diffusion area, the cleaner the substrate is. Specifically, the computer controls the anhydrous ethanol wiping head to drop a drop of anhydrous ethanol on the work piece, and then controls the image sensor 5 to collect images and upload the images to the computer, and the computer calculates that the maximum area of anhydrous ethanol after diffusion is not less than 6.5 times of the area just dropped, and if it is less than the set value, it will enter the cleaning step again, and if it is greater than or equal to the set value, it will enter the next step; [0088] Step 4: spraying liquid metal

[0089] The computer controls the liquid metal coating device to coat the work piece with liquid metal.

[0090] Comparative experiment: [0091] Experiment 1: a nickel-plated copper block used to simulate the radiator was taken out, cleaned with sodium bicarbonate solution, and a drop of anhydrous ethanol was dropped for inspection. The inspection result is shown in FIG. 3; [0092] Experiment 2: a nickel-plated copper block used to simulate the radiator was taken out, cleaned with anhydrous alcohol, and a drop of alcohol was dropped for inspection. The inspection result is shown in FIG. 4; and [0093] Experiment 3: a nickel-plated copper block used to simulate the radiator was taken out, cleaned with plasma cleaning agent and sodium bicarbonate solution, followed by ethanol, and a drop of alcohol was dropped for inspection. The inspection result is shown in FIG. 5.

[0094] Comparing FIG. 3 to FIG. 5, it can be seen that the liquid metal diffuses well on the surface of nickel-plated copper blocks cleaned with sodium bicarbonate and ethanol respectively, indicating that the liquid metal exhibits good wettability on the nickel-plated copper block after cleaning.

[0095] Obviously, the problem that liquid metal and the substrate are not wetted can be fundamentally solved by repeatedly cleaning nickel-plated copper blocks using the integrated device of the present disclosure.

[0096] The sodium bicarbonate solution used in the present disclosure can be replaced by aqueous solutions of dilute hydrochloric acid, dilute sulfuric acid, dilute nitric acid, hydrobromic acid, hydroiodic acid, phosphoric acid, permanganic acid, carbonic acid, acetic acid, hydrofluoric acid, sodium hydroxide, potassium hydroxide, barium hydroxide and sodium carbonate; [0097] the anhydrous ethanol used in the present disclosure can be replaced by methanol, dipropylene glycol butyl ether, diethylene glycol butyl ether, hydrocarbon, acetone, toluene, ethyl acetate and ether; [0098] the method used in the present disclosure can also be used for plating or bonding liquid metal materials on some materials, such as plastic film materials, metal materials and ceramic materials; and [0099] the cleaning method and the cleaning qualified detection method can also be used in the fields of welding and plating of metal materials.

[0100] The foregoing description of specific exemplary embodiments of the present disclosure is for the purpose of explanation and illustration. These descriptions are not intended to limit the present disclosure to the precise form disclosed, and obviously, many changes and variations may be made in accordance with the above teachings. The purpose of selecting and describing exemplary embodiments is to explain the particular principle of the present disclosure and its practical application, so as to enable those skilled in the art to realize and utilize various exemplary embodiments and various choices and changes of the present disclosure. The scope of the present disclosure is intended to be defined by the claims and their equivalents.

[0101] In the description of the present disclosure, it should be understood that the terms center, vertical, horizontal, length, width, thickness, up, down, front, back, left, right, vertical, horizontal, top, bottom, inner, outer, clockwise, counterclockwise, axial, radial, circumferential, etc. indicate that the orientation or position relationship is based on the orientation or position relationship shown in the accompanying drawings, and is only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, therefore it cannot be understood as limitations to the present disclosure.

[0102] In addition, the terms first, second and so on are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. In the description of the present disclosure, a plurality of means more than two, unless otherwise specifically defined.