LIGHT-EMITTING EPITAXIAL STRUCTURE, METHOD FOR MANUFACTURING THE SAME AND INFRARED LIGHT-EMITTING DIODE

Abstract

A light-emitting epitaxial structure includes an n-type ohmic contact layer, an n-type cladding layer, a light emitting layer, a p-type cladding layer, a p-type GaInP transition layer, a p-type Al.sub.xGa.sub.(1-x)InP transition unit and a p-type GaP ohmic contact layer that are sequentially disposed in such order, wherein in the p-type Al.sub.xGa.sub.(1-x)InP transition unit, 0<x≤0.7. An infrared light-emitting diode including the aforementioned light-emitting epitaxial structure and a method for manufacturing the light-emitting epitaxial structure are also disclosed.

Claims

1. A light-emitting epitaxial structure, comprising: an n-type ohmic contact layer; an n-type cladding layer disposed on said n-type ohmic contact layer; a light emitting layer disposed on said n-type cladding layer opposite to said n-type ohmic contact layer; a p-type cladding layer disposed on said light emitting layer opposite to said n-type cladding layer; a p-type GaInP transition layer disposed on said p-type cladding layer opposite to said light emitting layer; a p-type Al.sub.xGa.sub.(1-x)InP transition unit disposed on said p-type GaInP transition layer opposite to said p-type cladding layer; and a p-type GaP ohmic contact layer disposed on said p-type Al.sub.xGa.sub.(1-x)InP transition unit opposite to said p-type GaInP transition layer, wherein, in said p-type Al.sub.xGa.sub.(1-x)InP transition unit, 0<x≤0.7.

2. The light-emitting epitaxial structure of claim 1, wherein, in said p-type Al.sub.xGa.sub.(1-x)InP transition unit, 0<x≤0.6.

3. The light-emitting epitaxial structure of claim 1, further comprising an n-type window layer disposed between said n-type ohmic contact layer and said n-type cladding layer, and a p-type window layer disposed between said p-type cladding layer and said p-type GaInP transition layer.

4. The light-emitting epitaxial structure of claim 3, wherein said n-type ohmic contact layer is made of gallium arsenide, said n-type window layer is made of n-type doped aluminum gallium arsenide, said n-type cladding layer is made of n-type doped aluminum gallium arsenide, said p-type cladding layer is made of p-type doped aluminum gallium arsenide, and said p-type window layer is made of p-type doped aluminum gallium arsenide.

5. The light-emitting epitaxial structure of claim 1, wherein said p-type Al.sub.xGa.sub.(1-x)InP transition unit has a thickness that is smaller than 500 nm.

6. The light-emitting epitaxial structure of claim 1, wherein said p-type Al.sub.xGa.sub.(1-x)InP transition unit has an aluminum content that gradually increases in a direction from said n-type ohmic contact layer to said p-type GaP ohmic contact layer.

7. The light-emitting epitaxial structure of claim 6, wherein said p-type Al.sub.xGa.sub.(1-x)InP transition unit includes a first sublayer, a second sublayer and a third sublayer that are stacked in such order in a direction from said n-type ohmic contact layer to said p-type GaP ohmic contact layer, said first, second and third sublayers being represented by Al.sub.0.15Ga.sub.0.85InP, Al.sub.0.35Ga.sub.0.65InP and Al.sub.0.55Ga.sub.0.45InP, respectively.

8. The light-emitting epitaxial structure of claim 1, wherein said p-type Al.sub.xGa.sub.(1-x)InP transition unit is doped with zinc.

9. An infrared light-emitting diode, comprising the light-emitting epitaxial structure as claimed in claim 1.

10. A method for manufacturing a light-emitting epitaxial structure, comprising the steps of: a) providing a substrate; b) forming an n-type ohmic contact layer on the substrate; c) forming an n-type window layer on the n-type ohmic contact layer opposite to the substrate; d) forming an n-type cladding layer on the n-type window layer opposite to the n-type ohmic contact layer; e) forming a light emitting layer on the n-type cladding layer opposite to the n-type window layer; f) forming a p-type cladding layer on the light emitting layer opposite to the n-type cladding layer; g) forming a p-type window layer on the p-type cladding layer opposite to the light emitting layer; h) forming a p-type GaInP transition layer on the p-type window layer opposite to the p-type cladding layer; i) forming a p-type Al.sub.xGa.sub.(1-x)InP transition unit on the p-type GaInP transition layer opposite to the p-type window layer, wherein 0<x≤0.7; and j) forming a p-type GaP ohmic contact layer on the p-type Al.sub.xGa.sub.(1-x)InP transition unit opposite to the p-type GaInP transition layer.

11. The method of claim 10, wherein in step i), the p-type Al.sub.xGa.sub.(1-x)InP transition unit has an aluminum content that gradually increases during the growth of the p-type Al.sub.xGa.sub.(1-x)InP transition unit.

12. The method of claim 11, wherein the p-type Al.sub.xGa.sub.(1-x)InP transition unit includes a first sublayer, a second sublayer and a third sublayer that are stacked in such order in a direction from the n-type ohmic contact layer to the p-type GaP ohmic contact layer, the first, second and third sublayers being represented by Al.sub.0.15Ga.sub.0.85InP, Al.sub.0.35Ga.sub.0.65InP and Al.sub.0.55Ga.sub.0.45InP, respectively.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Other features and advantages of the disclosure will become apparent in the following detailed description of the embodiment(s) with reference to the accompanying drawings, in which:

[0020] FIG. 1 is a schematic view illustrating a conventional light-emitting epitaxial structure;

[0021] FIG. 2 is a schematic view illustrating an embodiment of a light-emitting epitaxial structure according to the disclosure;

[0022] FIG. 3 is a schematic view illustrating another embodiment of the light-emitting epitaxial structure according to the disclosure; and

[0023] FIG. 4 is a flow chart illustrating a method for manufacturing the light-emitting epitaxial structure according to the disclosure.

DETAILED DESCRIPTION

[0024] Before the disclosure is described in greater detail, it should be noted that where considered appropriate, reference numerals or terminal portions of reference numerals have been repeated among the figures to indicate corresponding or analogous elements, which may optionally have similar characteristics.

[0025] Referring to FIG. 2, an embodiment of a light-emitting epitaxial structure according to the disclosure includes an n-type ohmic contact layer 1, an n-type cladding layer 3, a light emitting layer 4, a p-type cladding layer 5, a p-type GaInP transition layer 7, a p-type Al.sub.xGa.sub.(1-x)InP transition unit 8 and a p-type GaP ohmic contact layer 9 sequentially disposed in such order. In the p-type Al.sub.xGa.sub.(1-x)InP transition unit 8, the value of x (i.e., an aluminum content) may be greater than 0 and not greater than 0.7 (i.e., 0<x≤0.7). In some embodiments, the value of x in the p-type Al.sub.xGa.sub.(1-x)InP transition unit 8 may be greater than 0 and not greater than 0.6 (i.e., 0<x≤0.6).

[0026] Since a bandgap of the p-type GaInP transition layer 7 is 1.87 eV, and a bandgap of the p-type GaP ohmic contact layer 9 is 2.26 eV, a difference in bandgap between the p-type GaInP transition layer 7 and the p-type GaP ohmic contact layer 9 is relatively large. Due to the large difference in bandgap, lattice mismatch will occur at an interface between the p-type GaInP transition layer 7 and the p-type GaP ohmic contact layer 9, which may lead to serious defects therebetween. Therefore, the p-type Al.sub.xGa.sub.(1-x)InP transition unit 8 is disposed between the p-type GaInP transition layer 7 and the p-type GaP ohmic contact layer 9 to reduce the bandgap difference therebetween and lessen the defects caused by lattice mismatch. Specifically, the p-type Al.sub.xGa.sub.(1-x)InP transition unit 8 grown on the p-type GaInP transition layer 7 has fewer defects and has an aluminum content that gradually increases in a direction from the n-type ohmic contact layer 1 to the p-type GaP ohmic contact layer 9. The p-type GaP ohmic contact layer 9 grown on the p-type Al.sub.xGa.sub.(1-x)InP transition unit 8 also has fewer defects.

[0027] As shown in FIG. 3, in another embodiment of this disclosure, the light-emitting epitaxial structure further includes, in addition to the layer elements shown in FIG. 2, an n-type window layer 2 disposed between the n-type ohmic contact layer 1 and the n-type cladding layer 3, and a p-type window layer 6 disposed between the p-type cladding layer 5 and the p-type GaInP transition layer 7. The n-type window layer 2 and the p-type window layer 6 both serve to spread current in the light-emitting epitaxial structure and achieve an even current distribution in the light-emitting epitaxial structure.

[0028] The p-type Al.sub.xGa.sub.(1-x)InP transition unit 8 may have a thickness that is smaller than 500 nm. In some embodiments, the thickness of the p-type Al.sub.xGa.sub.(1-x)InP transition unit 8 is 90 nm.

[0029] As mentioned above, the aluminum content of the p-type Al.sub.xGa.sub.(1-x)InP transition unit 8 gradually increases. In certain embodiments, in the direction from the n-type ohmic contact layer 1 to the p-type GaP ohmic contact layer 9, the aluminum content (i.e., the x value) of the p-type Al.sub.xGa.sub.(1-x)InP transition unit 8 gradually increases to 0.7 (i.e., 0<x≤0.7). In certain embodiments, the aluminum content is measured in molar ratio. In some embodiments, in the direction from the n-type ohmic contact layer 1 to the p-type GaP ohmic contact layer 9, the aluminum content of the p-type Al.sub.xGa.sub.(1-x)InP transition unit 8 gradually increases to 0.6 (i.e., 0<x≤0.6). Furthermore, the p-type Al.sub.xGa.sub.(1-x)InP transition unit 8 may be a layered structure, and may include a first sublayer, a second sublayer and a third sublayer that are stacked in such order in the direction from the n-type ohmic contact layer 1 to the p-type GaP ohmic contact layer 9. The first, second and third sublayers are represented by Al.sub.0.15Ga.sub.0.85InP, Al.sub.0.35Ga.sub.0.65InP and Al.sub.0.55Ga.sub.0.45InP, respectively. In certain embodiments, the first, second and third sublayers have a thickness of 30 nm.

[0030] In certain embodiments, the p-type Al.sub.xGa.sub.(1-x)InP transition unit 8 is doped with zinc. In some embodiments, a doping concentration of zinc may be 2.00E18.

[0031] In certain embodiments, as shown in FIG. 3, the light emitting layer 4 includes an InGaAs well layer 41 and an AlGaAs barrier layer 42. The AlGaAs barrier layer 42 is disposed on the InGaAs well layer 41 and away from the n-type cladding layer 3.

[0032] In some embodiments, the n-type ohmic contact layer 1 is made of gallium arsenide, and the n-type window layer 2 and the n-type cladding layer 3 are made of n-type doped aluminum gallium arsenide. A relative ratio of aluminum to gallium in the n-type window layer 2 is different from a relative ratio of aluminum to gallium in the n-type cladding layer 3. The p-type cladding layer 5 and the p-type window layer 6 are made of p-type doped aluminum gallium arsenide. A relative ratio of aluminum to gallium in the p-type cladding layer 5 is different from a relative ratio of aluminum to gallium in the p-type window layer 6. Materials and preferred values of parameters of the layers in an example of the light-emitting epitaxial structure as shown in FIG. 3 are listed in Table 1.

TABLE-US-00001 TABLE 1 Layers Materials: Dopant Thickness (nm) Doping Concentration Bandgap (eV) p-type GaP ohmic GaP: C 50 1.00E19 2.26 contact layer P-type Al.sub.xGa.sub.(1-x) InP (Al.sub.0.34Ga.sub.0.66) .sub.0.46 90 2.00E18 2.06 transition unit In.sub.0.54P: Zn P-type GaInP Ga.sub.0.46In.sub.0.54P: Zn 30 2.00E18 1.87 transition layer p-type window layer Al.sub.0.25Ga.sub.0.75AS: C 3000 5.00E17 1.74 p-type cladding Al.sub.0.45Ga.sub.0.55AS: C 400 1.00E18 1.98 layer AlGaAs barrier layer Al.sub.0.25Ga.sub.0.75AS 25 — 1.74 in the light emitting layer InGaAs well layer in InGaAs 6 — 1.29 the light emitting layer n-type cladding layer Al.sub.0.45Ga.sub.0.55AS: Te 400 1.00E18 1.98 n-type window layer Al.sub.0.25Ga.sub.0.75AS: Te 7000 5.00E17 1.74 n-type ohmic contact GaAs: Si 60 2.00E18 1.42 layer

[0033] It should be noted that each of the abovementioned layers is doped with a dopant, except for the light emitting layer 4. Each of the dopants is shown in Table 1. According to the disclosure, the p-type Al.sub.xGa.sub.(1-x)InP transition unit 8 is disposed between the p-type GaInP transition layer 7 and the p-type GaP ohmic contact layer 9 to reduce a strain therebetween without adversely affecting the performance of a light-emitting diode (e.g., an infrared light-emitting diode). In some embodiments, the p-type Al.sub.xGa.sub.(1-x)InP transition unit 8 is a p-type (Al.sub.xGa(1-.sub.x)).sub.yIn.sub.(1-y)P transition unit, wherein the value of y changes with a species and doping concentration of a p-type dopant in the p-type Al.sub.xGa.sub.(1-x)InP transition unit 8. In certain embodiments, the value of y varies in the p-type (Al.sub.xGa(1-.sub.x)).sub.yIn.sub.(1-y)P transition unit. As the value of y increases, a lattice constant of the p-type (Al.sub.xGa(1-.sub.x)).sub.yIn.sub.(1-y)P transition unit decreases. As a result, the changing y value may ensure that the lattice constant of the p-type (Al.sub.xGa(1-.sub.x)).sub.yIn.sub.(1-y)P transition unit decreases in a direction from the p-type GaInP transition layer 7 to the p-type GaP ohmic contact layer 9. In some embodiments, the p-type (Al.sub.xGa(1-.sub.x)).sub.yIn.sub.(1-y)P transition unit is represented by (Al.sub.0.34Ga.sub.0.66).sub.0.46In.sub.0.54P. In addition, when the light-emitting epitaxial structure of the disclosure is grown on a gallium arsenide substrate, in an X-ray diffraction (XRD) analysis, a diffraction peak of (Al.sub.0.34Ga.sub.0.66).sub.0.46In.sub.0.54P is located to the right of a diffraction peak of the gallium arsenide substrate at a 300 arcsec position, which provides a smoother transition of lattice constant. Furthermore, by adopting the light-emitting epitaxial structure of the present disclosure in the infrared light-emitting diode, under a current test with 350 mA, a forward voltage of the infrared light-emitting diode is lower than that of a conventional infrared light-emitting diode by approximately 0.02V.

[0034] This disclosure also provides an infrared light-emitting diode that includes the light-emitting epitaxial structure mentioned above.

[0035] According to this disclosure, a method for manufacturing the abovementioned light-emitting epitaxial structure includes the steps of:

[0036] S1) providing a substrate;

[0037] S2) forming the n-type ohmic contact layer 1 on the substrate;

[0038] S3) forming the n-type window layer 2 on the n-type ohmic contact layer 1 opposite to the substrate;

[0039] S4) forming the n-type cladding layer 3 on the n-type window layer 1 opposite to the n-type ohmic contact layer 1;

[0040] S5) forming the light emitting layer 4 on the n-type cladding layer 3 opposite to the n-type window layer 2;

[0041] S6) forming the p-type cladding layer 5 on the light emitting layer 4 opposite to the n-type cladding layer 3;

[0042] S7) forming the p-type window layer 6 on the p-type cladding layer 5 opposite to the light emitting layer 4;

[0043] S8) forming the p-type GaInP transition layer 7 on the p-type window layer 6 opposite to the p-type cladding layer 5;

[0044] S9) forming the p-type Al.sub.xGa.sub.(1-x)InP transition unit 8 on the p-type GaInP transition layer 7 opposite to the p-type window layer 6, wherein 0<x≤0.7; and

[0045] S10) forming the p-type GaP ohmic contact layer 9 on the p-type Al.sub.xGa.sub.(1-x)InP transition unit 8 opposite to the p-type GaInP transition layer 7.

[0046] It should be noted that, to fulfill the needs of various chips, the n-type window layer 2 and the p-type window layer 6 need to undergo further processing according to a chip manufacturing process, such as roughening of a surface of the n-type window layer 2 and a surface of the p-type window layer 6, thereby improving the light extraction efficiency and the performance of the infrared light-emitting diode.

[0047] In step S5), the light emitting layer 4 includes the InGaAs well layer 41 and the AlGaAs barrier layer 42. The InGaAs well layer 41 is formed on the n-type cladding layer 3, and the AlGaAs barrier layer 42 is formed on the InGaAs well layer 41.

[0048] In step S9), the aluminum content of the p-type Al.sub.xGa.sub.(1-x)InP transition unit 8 gradually increases in a direction from the n-type ohmic contact layer 1 to the p-type GaP ohmic contact layer 9 during a growth of the p-type Al.sub.xGa.sub.(1-x)InP transition unit 8 as mentioned above.

[0049] The abovementioned steps of manufacturing the light-emitting epitaxial structure may also be applied in a manufacturing method of an infrared light-emitting diode.

[0050] In summary, the p-type Al.sub.xGa.sub.(1-x)InP transition unit 8 that is disposed between the p-type GaInP transition layer 7 and the p-type GaP ohmic contact layer 9 provide a transition in lattice constant between the p-type GaInP transition layer 7 and the p-type GaP ohmic contact layer 9 and reduce a difference in bandgap between the p-type GaInP transition layer 7 and the p-type GaP ohmic contact layer 9, thereby eliminating current crowding, enhancing the antistatic ability, and reducing the junction temperature and operating voltage of the light-emitting diode, all of which may further improve the electro-optical conversion efficiency, brightness, and lifespan of the light-emitting diode. As a result, the purpose of this disclosure is effectively achieved and provides high commercial values.

[0051] In the description above, for the purposes of explanation, numerous specific details have been set forth in order to provide a thorough understanding of the embodiment(s). It will be apparent, however, to one skilled in the art, that one or more other embodiments may be practiced without some of these specific details. It should also be appreciated that reference throughout this specification to “one embodiment,” “an embodiment,” an embodiment with an indication of an ordinal number and so forth means that a particular feature, structure, or characteristic may be included in the practice of the disclosure. It should be further appreciated that in the description, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of various inventive aspects, and that one or more features or specific details from one embodiment may be practiced together with one or more features or specific details from another embodiment, where appropriate, in the practice of the disclosure.

[0052] While the disclosure has been described in connection with what is (are) considered the exemplary embodiment(s), it is understood that this disclosure is not limited to the disclosed embodiment(s) but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation so as to encompass all such modifications and equivalent arrangements.