CONNECTION METHOD FOR YARN WIRE AND CIRCUIT BOARD

Abstract

A connection method for a yarn wire and a circuit board includes steps as follows: providing at least one yarn wire, a back adhesive, and a circuit board, at least one through hole is formed on the circuit board, and a diameter D of the through hole, a diameter d of the at least one yarn wire, a shrunken diameter d.sub.min of the yarn wire being stretched, and a jig thickness t of a jig have a relation of: 2d>D>2d.sub.min+t; placing the yarn wire on the back adhesive, aligning the yarn wire having the back adhesive with the through hole, and extruding and passing the yarn wire through the through hole by using the jig to penetrate the back adhesive; pulling the jig out along a pulling direction; and adhering a fixing back adhesive to one side of the circuit board.

Claims

1. A connection method for a yarn wire and a circuit board, comprising processes of: providing at least one yarn wire, a back adhesive, and a circuit board; wherein at least one through hole penetrates through two opposite sides of the circuit board, wherein a diameter of the through hole is defined as D, a diameter of the at least one yarn wire is defined as d, a shrunken diameter of the yarn wire being stretched is defined as d.sub.min, and a jig thickness of a jig is defined as t, the diameter of the through hole, the diameter of the at least one yarn wire, the shrunken diameter of the yarn wire being stretched, and the jig thickness having a relation of: 2d>D>2d.sub.min+t; placing the at least one yarn wire on the back adhesive so that the back adhesive is disposed on one side of the yarn wire, aligning the yarn wire with the through hole of the circuit board, and using the jig to penetrate through the back adhesive along an assembly direction such that the yarn wire is extruded into and passes through the through hole; pulling the jig out along a pulling direction, wherein the yarn wire applies a frictional force and an abutting normal force on an inner wall of a periphery of the through hole, and a portion of the yarn wire that passes through the through hole forms a protruding wire segment in a shape of a round loop; and adhering a fixing back adhesive to one side of the circuit board, wherein the fixing back adhesive is adhered to the circuit board and the protruding wire segment so that the yarn wire and the circuit board are connected and fixed to each other.

2. The connection method according to claim 1, wherein the diameter of the yarn wire ranges from 0.5 mm to 0.7 mm, and the shrunken diameter of the yarn wire being stretched ranges from 0.2 mm to 0.4 mm.

3. The connection method according to claim 1, wherein at least one perforation is formed on the back adhesive, the perforation corresponds to the through hole, and the perforation allows the jig to penetrate through the back adhesive.

4. The connection method according to claim 1, wherein one end of the jig has a holding portion, and the holding portion is bifurcated; wherein the holding portion includes two holding bars, and a retaining groove is formed between the two holding bars; wherein the retaining groove can be used to accommodate the yarn wire, so that the two holding bars can be used to hold the yarn wire.

5. The connection method according to claim 1, wherein multiple ones of the yarn wires are provided, and the yarn wires are spaced apart from each other; wherein multiple ones of the through holes are formed, the through holes are spaced apart from each other, and the through holes are arranged in a row.

6. The connection method according to claim 1, wherein the assembly direction is perpendicular to one side of the back adhesive away from the yarn wire, and the pulling direction and the assembly direction are two opposite directions.

7. The connection method according to claim 1, wherein the yarn wire and the circuit board are electrically connected.

8. The connection method according to claim 1, wherein the circuit board is partially laminated with the back adhesive so that the circuit board is bonded by adhesion to the back adhesive.

9. The connection method according to claim 1, wherein the yarn wire is a stretchable and electrically conductive yarn wire structure.

10. The connection method according to claim 1, wherein an electrically conductive adhesive is disposed between the yarn wire and the circuit board, or an insulating wire penetrates into a side of the protruding wire segment to prevent the protruding wire segment from being pulled out.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The described embodiments may be better understood by reference to the following description and the accompanying drawings, in which:

[0013] FIG. 1 is a flowchart of a connection method for a yarn wire and a circuit board according to the present disclosure;

[0014] FIG. 2 is a schematic perspective exploded view of a yarn wire and a circuit board according to the present disclosure;

[0015] FIG. 3 is a schematic perspective assembly view of the yarn wire and the circuit board according to the present disclosure;

[0016] FIG. 4 is another schematic perspective assembly view of the yarn wire and the circuit board according to the present disclosure;

[0017] FIG. 5 is a schematic view of a step of the connection method for a yarn wire and a circuit board according to the present disclosure;

[0018] FIG. 6 is a schematic view of another step of the connection method for a yarn wire and a circuit board according to the present disclosure;

[0019] FIG. 7 is a schematic view of yet another step of the connection method for a yarn wire and a circuit board according to the present disclosure;

[0020] FIG. 8 is a schematic view of still another step of the connection method for a yarn wire and a circuit board according to the present disclosure; and

[0021] FIG. 9 is a schematic perspective assembly view of the yarn wire and the circuit board according to the present disclosure.

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

[0022] The present disclosure is more particularly described in the following examples that are intended as illustrative only since numerous modifications and variations therein will be apparent to those skilled in the art. Like numbers in the drawings indicate like components throughout the views. As used in the description herein and throughout the claims that follow, unless the context clearly dictates otherwise, the meaning of a, an and the includes plural reference, and the meaning of in includes in and on. Titles or subtitles can be used herein for the convenience of a reader, which shall have no influence on the scope of the present disclosure.

[0023] The terms used herein generally have their ordinary meanings in the art. In the case of conflict, the present document, including any definitions given herein, will prevail. The same thing can be expressed in more than one way. Alternative language and synonyms can be used for any term(s) discussed herein, and no special significance is to be placed upon whether a term is elaborated or discussed herein. A recital of one or more synonyms does not exclude the use of other synonyms. The use of examples anywhere in this specification including examples of any terms is illustrative only, and in no way limits the scope and meaning of the present disclosure or of any exemplified term. Likewise, the present disclosure is not limited to various embodiments given herein. Numbering terms such as first, second or third can be used to describe various components, signals or the like, which are for distinguishing one component/signal from another one only, and are not intended to, nor should be construed to impose any substantive limitations on the components, signals or the like.

EMBODIMENT

[0024] Referring to FIG. 1, the present disclosure provides a connection method for a yarn wire and a circuit board. The connection method includes the following steps.

[0025] First, at least one yarn wire 1, a back adhesive 2, and a circuit board 3 (as shown in FIG. 2 to FIG. 4) are provided. The yarn wire 1 includes a yarn and a metal wire (not shown in the figures) that are helically twisted together. The yarn wire 1 is a stretchable and electrically conductive yarn wire structure that has properties of being stretchable and electrically conductive. Since the yarn wire is an existing technology and the present disclosure does not limit a structure of the yarn wire 1, the structure of the yarn wire 1 will not be described in detail herein. A quantity of the yarn wire 1 is not limited, and a quantity of the yarn wire 1 can be one or more. In this embodiment, a plurality of yarn wires 1 are provided to allow for greater signal transmission. The yarn wires 1 are spaced apart from each other.

[0026] The back adhesive 2 is elastic, and the back adhesive 2 is in a gel state and becomes sticky when coming in contact with heat, such that the back adhesive 2 can be bonded with the yarn wires 1 for being press-printed on fabrics. Therefore, the fabrics can provide an electrical signal transmission function while maintaining the stretchable characteristic. The circuit board 3 is a flexible circuit board suitable for being used in an environment without specific support.

[0027] The circuit board 3 can be a flexible or a rigid circuit board. At least one through hole 31 is formed on the circuit board 3. The through hole 31 is a circular hole, and the through hole 31 penetrates through two opposite sides of the circuit board 3. A number of the through hole 31 is not limited, and the number of the through hole 31 can be one or more. Multiple through holes 31 are formed in this embodiment, and the through holes 31 are spaced apart from each other and respectively correspond with the yarn wires 1. The through holes 31 can be arranged in one row to facilitate connection with the yarn wires 1 and fixing the yarn wires 1 in place. A diameter of the through hole 31 is defined as D (as shown in FIG. 5), a diameter of the at least one yarn wire 1 is defined as d, a shrunken diameter of the yarn wire 1 being stretched is defined as d.sub.min (as shown in FIG. 6), and a jig thickness (as shown in FIG. 5) of a jig 4 is defined as t. The diameter of the through hole 31, the diameter of the at least one yarn wire 1, the shrunken diameter of the yarn wire 1 being stretched, and the jig thickness have a relation of: 2d>D>2d.sub.min+t. The present disclosure provides an optimal correspondence between the diameter d of the at least one yarn wire 1, the shrunken diameter d.sub.min of the yarn wire 1 being stretched, and the diameter D of the through hole 31. Preferably, the diameter d of the yarn wire 1 ranges from 0.5 mm to 0.7 mm, and more preferably is 0.6 mm, and the shrunken diameter d.sub.min of the shrunken diameter of the yarn wire 1 being stretched ranges from 0.2 mm to 0.4 mm, and more preferably is 0.3 mm. Therefore, the yarn wire 1 and the circuit board 3 can be smoothly connected and fixed to each other, and have a steady connection therebetween, but the present disclosure is not limited thereto.

[0028] Afterwards, the yarn wire 1 is arranged on the back adhesive 2 (as shown in FIG. 5). At this time, the back adhesive 2 is disposed on one side of the yarn wire 1. The yarn wire 1 having the back adhesive 2 is aligned with the through hole 31 of the circuit board 3. The jig 4 is used to penetrate through the back adhesive 2 along an assembly direction A so that a portion of the yarn wire 1 is extruded into and passes through the through hole 31 (as shown in FIG. 6). The assembly direction A is preferably perpendicular to one side of the back adhesive 2 away from the yarn wire 1. At least one perforation 21 can be formed on the back adhesive 2, and the perforation 21 corresponds to the through hole 31. The perforation 21 allows the jig 4 to penetrate the back adhesive 2, and the perforation 21 can be formed when the jig 4 penetrates the back adhesive 2, or formed beforehand. A diameter of the yarn wire 1 is decreased as the yarn wire 1 is stretched. The shrunken diameter of the yarn wire 1 being stretched is defined as d.sub.min. In this way, the yarn wire 1 can pass through the through hole 31 more easily.

[0029] In this embodiment, one end of the jig 4 has a holding portion 41. The holding portion 41 is bifurcated and can be used to quickly hold the yarn wire 1 to squeeze the yarn wire 1 into the through hole 31, and the holding portion 41 can also be rapidly separated from the yarn wire 1. Preferably, the holding portion 41 includes two holding bars 411 (as shown in FIG. 2), and a retaining groove 412 is formed between the two holding bars 411. The retaining groove 412 can be used to accommodate the yarn wire 1, so that the two holding bars 411 can be used to hold the yarn wire 1, thereby allowing the holding portion 41 to quickly hold the yarn wire 1 or be quickly separated from the yarn wire 1. The circuit board 3 can be partially laminated with the back adhesive 2 such that the circuit board 3 is bonded by adhesion to the back adhesive 2 to have an improved fixing effect.

[0030] The jig 4 is then pulled out along a pulling direction B (as shown in FIG. 7), the pulling direction B and the assembly direction A may be two opposite directions to facilitate the removal of the jig 4, and the pulling direction B is preferably perpendicular to one side of the back adhesive 2 away from the yarn wire 1. At this time, the yarn wire 1 recovers and expands due to the stretching being stopped, and the yarn wire 1 applies a frictional force and an abutting normal force on an inner wall 311 of a periphery of the through hole 31. Furthermore, the portion of the yarn wire 1 that passes through the through hole 31 forms a protruding wire segment 11 that is expanded and forms a circular hole so as to provide a fixing effect. The protruding wire segment 11 can be loop-shaped (as shown in FIG. 7 and FIG. 8). The protruding wire segment 11 can prevent the yarn wire 1 from being pulled out together with the jig 4.

[0031] Furthermore, glue can be dispensed between the yarn wire 1 and the circuit board 3. That is, an electrically conductive adhesive 6 (e.g., a conductive silver glue) can be disposed between the yarn wire 1 and the circuit board 3 to assist in fixing the yarn wire 1 and the circuit board 3 together, so that the yarn wire 1 and the circuit board 3 can have an improved electrical conduction and an improved fixing effect.

[0032] Finally, a fixing back adhesive 5 can be adhered to one side of the circuit board 3 (as shown in FIG. 8) by way of heat-pressing. The fixing back adhesive 5 is adhered to the circuit board 3 and the protruding wire segment 11 to enable the protruding wire segment to be more rigid and difficult to be pulled out. Therefore, the yarn wire 1 and the circuit board 3 are fixedly connected to each other and achieve an electrical connection, and the metal wire of the yarn wire 1 can be in contact with the circuitry of the circuit board 3 to achieve the electrical connection. The back adhesive 2 can also be adhered to the yarn wire 1 and the circuit board 3 by way of heat-pressing. Two pieces of adhesives are respectively heat-pressed on a top side and a bottom side of the circuit board 3 (i.e., the back adhesive 2 and the fixing back adhesive 5) to facilitate fixing the yarn wire 1 to the circuit board 3.

[0033] In addition, as shown in FIG. 9, this embodiment provides another structure for fixing the protruding wire segment 11. After a portion of the yarn wire 1 passes through the through hole 31 of the circuit board 3 to form the protruding wire segment 11, an insulating wire 7 (e.g., a plastic wire) penetrates into a side of the protruding wire segment 11. The insulating wire 7 passes through the center of the protruding wire segment 11 having the round looped shape as an anti-pulling support line to prevent the protruding wire segment 11 from being pulled out. Therefore, the yarn wire 1 and the circuit board 3 are fixedly connected to each other and achieve an electrical connection.

Beneficial Effects of the Embodiment

[0034] Therefore, in the connection method for a yarn wire and a circuit board, a through hole is formed on the circuit board, and a diameter of the through hole D, a diameter of the yarn wire d, the shrunken diameter of the yarn wire being stretched d.sub.min, and a jig thickness t of a jig have a relation of: 2d>D>2d.sub.min+t. The at least one yarn wire is placed on the back adhesive, and the jig is used to penetrate through the back adhesive along an assembly direction so that the yarn wire is extruded into and passes through the through hole. When pulling the jig out along a pulling direction, the yarn wire applies a frictional force and an abutting normal force on an inner wall of a periphery of the through hole, and a portion of the yarn wire that passes through the through hole forms a protruding wire segment that is expanded and in a shape of a round loop to prevent the yarn wire from being pulled out with the jig. The fixing back adhesive is adhered to the circuit board and the protruding wire segment and enables the protruding wire segment to be more robust and difficult to be pulled out. Therefore, the yarn wire and the circuit board are connected and fixed to each other. The connection method for a yarn wire and a circuit board provided in the present disclosure allows the yarn wire and the circuit board to be fixed and electrically conductive, and the yarn wire and the circuit board can be rapidly and smoothly assembled. Furthermore, the connection method does not use a solder such that the connection method can be eco-friendly, and the connection method can be applied to process a material that does not resist a high temperature.

[0035] The foregoing description of the exemplary embodiments of the disclosure has been presented only for the purposes of illustration and description and is not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching.

[0036] The embodiments were chosen and described in order to explain the principles of the disclosure and their practical application so as to enable others skilled in the art to utilize the disclosure and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will become apparent to those skilled in the art to which the present disclosure pertains without departing from its spirit and scope.