ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

Abstract

The present disclosure concerns a method of manufacturing an electronic device, where the electronic device includes at least one electronic component with at least one electrical winding, and at least one heat dissipation mass coating, and the method includes inserting the at least one electronic component into a cavity; pouring, before or after the insertion of the electronic component, a heat dissipation mass into the cavity so as to at least partially fill the cavity and at least partially cover the electronic component with the heat dissipation mass; removing the electronic device, namely, the electronic component covered by the heat dissipation mass coating, from the cavity. The present disclosure also concerns an electronic apparatus including at least one electronic device manufactured by the foregoing method.

Claims

1. A method of manufacturing an electronic device, wherein the electronic device comprises at least one electronic component with at least one electrical winding, and at least one heat dissipation mass coating, wherein the method comprises: inserting the at least one electronic component into a cavity; pouring, before or after the insertion of the electronic component, a heat dissipation mass into the cavity so as to at least partially fill the cavity and at least partially cover the electronic component with the heat dissipation mass; and removing the electronic device from the cavity.

2. The method according to claim 1, wherein removing the electronic device from the cavity comprises: removing the electronic component covered by the heat dissipation mass coating from the cavity.

3. The method according to claim 2, wherein the electronic device comprises a heat dissipation element, wherein the method comprises: positioning the heat dissipation element in or at the cavity before pouring, and attaching the electronic component to the heat dissipation element by curing the heat dissipation mass coating.

4. The method according to claim 3, wherein a covered side of the heat dissipation element contacts the electronic component and/or the heat dissipation mass coating and wherein an opposite side is exposed from the heat dissipation mass coating.

5. The method according to claim 1, further comprising at least partially wrapping an outer surface of the at least one heat dissipation mass coating and/or an exposed side of the at least one heat dissipation element with a polyimide film.

6. The method according to claim 2, further comprising at least partially wrapping an outer surface of the at least one heat dissipation mass coating and/or an exposed side of the at least one heat dissipation element with a polyimide film.

7. The method according to claim 3, further comprising at least partially wrapping an outer surface of the at least one heat dissipation mass coating and/or an exposed side of the at least one heat dissipation element with a polyimide film.

8. The method according to claim 4, further comprising at least partially wrapping an outer surface of the at least one heat dissipation mass coating and/or an exposed side of the at least one heat dissipation element with a polyimide film.

9. The method according to claim 3, wherein the electronic device further comprises a thermal cooling plate, wherein the method further comprises attaching the thermal cooling plate to the at least one heat dissipation element.

10. The method according to claim 4, wherein the electronic device further comprises a thermal cooling plate, wherein the method further comprises attaching the thermal cooling plate to the at least one heat dissipation element.

11. The method according to claim 5, wherein the electronic device further comprises a thermal cooling plate, wherein the method further comprises attaching the thermal cooling plate to the at least one heat dissipation element.

12. The method according to claim 9, wherein attaching the thermal cooling plate to the at least one heat dissipation element comprises: after the removal of the electronic device from the cavity, attaching the thermal cooling plate to the at least one heat dissipation element.

13. The method according to claim 3, wherein the heat dissipation mass coating contacts at least one circumferential outer surface of the heat dissipation element.

14. The method according to claim 1, wherein at least the insertion of the at least one electronic component and/or the pouring of the heat dissipation mass are carried out under vacuum.

15. The method according to claim 1, further comprising an additional potting step of potting the electronic device after removing it from the cavity.

16. The method according to claim 1, wherein the at least one heat dissipation mass coating is a thermal glue.

17. The method according to claim 16, wherein the thermal glue comprises epoxy resin and/or silicone resin.

18. The method according to claim 3, wherein the at least one heat dissipation element comprises a ceramic plate and/or a plate comprising a composite of silicone rubber and/or fiberglass.

19. An electronic apparatus, comprising at least one electronic device manufactured by the method according to claim 1.

20. The electronic apparatus according to claim 19, wherein the at least one electronic component of the at least one electronic device comprises a power electronic device, and wherein the power electronic device comprises a power conversion device.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0061] Further details, advantages, and features of the preferred embodiments of the present disclosure are described in detail with reference to the figures.

[0062] FIG. 1 shows a block diagram of a method of manufacturing an electronic device according to a first embodiment of the method of manufacturing.

[0063] FIG. 2 shows a schematic drawing of an intermediate electronic device during a manufacturing step of the method of manufacturing according to the first embodiment.

[0064] FIG. 3 shows a schematic drawing of an intermediate electronic device and a mould during a manufacturing step of the method of manufacturing according to the first embodiment.

[0065] FIG. 4 shows a schematic drawing of a first embodiment of an electronic device after the method of manufacturing according to the first embodiment of the method of manufacturing.

[0066] FIG. 5 shows a schematic drawing of a second embodiment of an electronic device after a method of manufacturing according to a second embodiment of the method of manufacturing.

[0067] FIG. 6 shows an example of an electronic component and a heat dissipation element used in the method according to one of the embodiments.

[0068] FIG. 7 shows a further example of an electronic component and a heat dissipation element used in the method according to one of the embodiments.

[0069] FIG. 8 shows a further example of an electronic component and a heat dissipation element used in the method according to one of the embodiments.

[0070] FIG. 9 shows a further example of an electronic component and a heat dissipation element used in the method according to one of the embodiments.

[0071] FIG. 10 shows a further example of an electronic component and a heat dissipation element used in the method according to one of the embodiments.

[0072] FIG. 11 shows a further example of an electronic component and a heat dissipation element used in the method according to one of the embodiments.

[0073] FIG. 12 shows a schematic drawing of an electronic apparatus including an electronic device manufactured according to any one of the embodiments.

DESCRIPTION OF EMBODIMENTS

[0074] In the following explanations and drawings, functionally similar or equal features and elements have the same reference numerals and a repeated explanation of these may be omitted.

[0075] FIG. 1 shows a block diagram of a method of manufacturing an electronic device 1 according to a first embodiment of the method of manufacturing. The method of manufacturing the electronic device 1 will be explained in the following with respect to FIGS. 2 to 4, where each of FIGS. 2 to 4 shows a schematic drawing of the electronic device 1 at intermediate or final steps of the method of manufacturing according to the first embodiment thereof.

[0076] As an initial first step S0, an electronic component 2 with two electrical windings 3 is manufactured. The electronic component 2 is manufactured by winding electrical windings 3 around bobbins 16. The bobbins 16 are supported and held in a core 14. The core 14 further holds one or more magnetic core(s) (not visible), which interact(s) magnetically/electrically with the electrical windings 3.

[0077] The electronic component 2 does not necessarily need to include the bobbins 16. In addition or alternatively to winding the electrical windings 3 around bobbins 16 of the electronic component 2, the electrical windings 3 may be directly wound around the core 14 and/or the magnetic core(s) (see for example FIG. 7). In this case, the electrical windings 3 may also be pre-wound and inserted into the electronic component 2. For example, the electrical windings 3 are pre-wound on an element separate from the electronic component 2. Then, the pre-wound electrical windings 3 are slid onto the core 14 and/or the magnetic core(s).

[0078] As can be seen from FIG. 2, the electronic component 2 further includes four outer leads 15.

[0079] The outer leads 15 are connected to the electrical windings 3. The electronic component 2 is supplied with power and/or supplies power via the outer leads 15.

[0080] Referring back to FIG. 1, in a second step S1, and as shown in FIG. 3, the electronic component 2 is inserted into a cavity 5 of a mould 13.

[0081] In this exemplary embodiment, the mould 13 includes two mould-halves 17. These mouldhalves 17 are pressed together from the outside so as to have sealed-off side surfaces. For instance, the mould-halves 17 are pressed together and held via a clamp, especially a hydraulic clamp.

[0082] In a further step S2, the cavity 5 of the mould 13 is filled with a heat dissipation mass in a liquid state. In an implementation, the heat dissipation mass is a thermal glue, for instance including epoxy resin and/or silicone resin.

[0083] As denoted by the double arrow in FIG. 1 between steps S1 and S2, the cavity 5 of the mould 13 may be filled with the heat dissipation mass before the electronic component 2 is inserted into the cavity 5. In other words, step S2 may be carried out before step S1.

[0084] In step S2, the heat dissipation mass is poured into the cavity 5 of the mould 13. The heat dissipation mass is especially not injected into the cavity 5 of the mould 13.

[0085] In a further step S3, the heat dissipation mass is cured. The curing is performed with or without the use of additives. In an implementation, the heat dissipation mass includes a thermosetting resin. In an implementation, the heat dissipation mass is cured via a thermal process, especially without the use of additives.

[0086] After curing has been completed, and the heat dissipation mass is hardened, the electronic device 1 is removed from the cavity 5 in a further step S4.

[0087] The electronic device 1 includes the electronic component 2 shown in FIG. 5 as well as a heat dissipation mass coating 4, which is the result of curing the heat dissipation mass.

[0088] The heat dissipation mass coating 4 covers the electronic component 2 and provides electrical insulation thereof. In addition, the heat dissipation mass coating 4 provides excellent thermal conductivity properties.

[0089] As can be taken from FIG. 4, the finished electronic device 1 does not include a case. Instead, the heat dissipation mass coating 4 provides the functions of a case, namely protecting and insulating the electronic component 2, while simultaneously provided high thermal conductivity.

[0090] Further, the outer leads 15 of the electronic component protrude upwards from the heat dissipation mass coating 4. Thereby, the electronic component 2 covered by the heat dissipation mass coating 4 can be connected to further components such as a power source and/or control device.

[0091] In addition, in a further step S5, the electronic device 1 shown in FIG. 4 is wrapped in a polyimide film (due to its transparency, the polyimide film is not shown/not visible in FIG. 4). Specifically, the polyimide film is preferably Kapton®, preferably Kapton® tape. For example, Kapton® CRC and/or Kapton® EN may be employed herein. This provides additional electrical insulation of the electronic device 1, specifically of the electronic component 2.

[0092] More specifically, in step S5, outer surfaces 9 of the heat dissipation mass coating 4 are wrapped in Kapton®. Herein, only portions of the outer surfaces 9 of the heat dissipation coating 4, which correspond to a shape of the electrical windings 3 of the electronic component 2, are wrapped in Kapton®. Thereby, the electrical insulation properties can be increased, while also saving material costs.

[0093] Due to the cuboid shape of the electronic device 1, the process of wrapping the polyimide film can be easily automated, so as in particular to be carried out by a robot.

[0094] FIG. 5 shows a schematic drawing of the electronic device 1 after a method of manufacturing according to a second embodiment of the method of manufacturing.

[0095] Therein, in addition to the electronic component 2 and the heat dissipation mass coating 4 described above, the electronic device 1 includes a heat dissipation element 6.

[0096] In this exemplary embodiment, the heat dissipation element 6 is a Sil-Pad® or a ceramic plate.

[0097] The heat dissipation element 6 is attached to the heat dissipation mass coating 4 via a filler 18.

[0098] The filler 18 is preferably a thermal glue. The filler 18 fills possible gaps produced in the heat dissipation mass coating 4, especially via uneven portions of the mould 13. Thereby, excellent thermal conductivity from the heat dissipation mass coating 4 to the heat dissipation element 6 is achieved.

[0099] Further, the electronic device 1 includes a thermal cooling plate 10. As shown, the thermal cooling plate 10 is a chassis, a so-called “cold plate”. The thermal cooling plate 10 may further include cooling fins for improved heat dissipation. In addition or alternatively thereto, the thermal cooling plate 10 may further include channels for circulation of a cooling fluid therethrough.

[0100] In this exemplary embodiment, the thermal cooling plate 10 is attached, as a further manufacturing step, directly to the heat dissipation element 6. In other examples, further fillers such as thermal glue may be disposed between the heat dissipation element 6 and the thermal cooling plate 10.

[0101] Additionally, the electronic device 1 includes the polyimide film 19, which is wrapped around an outer surface 9 of the heat dissipation mass coating 4, as explained above. As can be taken from a comparison of FIG. 5 with FIG. 2, the polyimide film 19 is only wrapped around portions of the outer surface 9 corresponding to the electrical windings 3 of the electronic component 2.

[0102] In particular, only side surfaces of the heat dissipation mass coating 4 are wrapped in the polyimide film 19.

[0103] Further, in this exemplary embodiment, a case is shown in which the heat dissipation element 6 is provided outside of and is attached to the heat dissipation mass coating 4. In other words, the steps S1 and S2 as well as S3 were carried out before providing and attaching the heat dissipation element 6.

[0104] In a further exemplary embodiment, the heat dissipation element 6 is inserted into the cavity 5 (see: FIG. 3). In this case, the heat dissipation element 6 is inserted into the cavity 5 before the electronic component 2 is inserted therein. Then, the heat dissipation mass is poured into the cavity 5 and subsequently cured.

[0105] Alternatively, the heat dissipation element 6 may be inserted into the cavity 5 after pouring has been completed, especially before the electronic component 2 is inserted into the cavity 5. In another exemplary embodiment, the heat dissipation element 6 may be positioned at the cavity 5 before pouring. In this case, the heat dissipation element 6 is positioned at an opening of the mould 13. For example, in FIG. 3, the mould 13 may have an open bottom. Before pouring, the heat dissipation element 6 is positioned so as to abut against the bottoms of the side surfaces of the mould 13, i.e. so as to abut the open bottom. Then, the cavity 5 of the mould 13 is filled, via the open top thereof, with the heat dissipation mass. After curing is performed, the heat dissipation mass coating 4 adheres the heat dissipation element 6 to the electronic component 2. The mould 13 can then be opened, via the two mould-halves 17, or, depending on the size of the open bottom and the size of the heat dissipation element 6, the electronic device 1 can be pulled out of the mould 13 with the heat dissipation element 6 attached to the electronic component 2.

[0106] Especially in the case that the heat dissipation element 6 is inserted into the cavity 5, the mould 13 having a closed bottom, the heat dissipation mass is in contact with circumferential outer surfaces 11 (see: FIG. 5) of the heat dissipation element 6. In other words, the heat dissipation mass coating 4 surrounds an outer circumference of the heat dissipation element 6.

[0107] In any of the foregoing cases in which the heat dissipation element 6 is also sealed by the heat dissipation mass coating 4, before attaching the thermal cooling plate 10, the heat dissipation element 6 includes a covered side 7 (see: FIG. 5) in contact with the electronic component 2 (either directly when sealed by the heat dissipation mass coating 4, or via the gap filler 18 when attached to the outside). Further, the heat dissipation element 6 includes a side opposite thereto which is at least partially exposed from the heat dissipation mass coating 4. The thermal cooling plate 10 is attached to the exposed side 8 of the heat dissipation element 6.

[0108] With reference to FIGS. 6 to 11, different configurations of the electronic component 2 and the heat dissipation element 6 will be described. Therein, FIGS. 6 to 11 each show a schematic drawing of an electronic component 2 and a heat dissipation element 6 used in the manufacturing methods according to the embodiments.

[0109] As can be taken from FIG. 6, the heat dissipation element 6 has a rounded oblong shape, i.e. a shape that is longer than it is wide. The heat dissipation element 6 may also be of an ellipse shape. In this case, the electronic component 2, especially a magnetic core 21 of the electronic component 2, is also of a rounded oblong shape. In other words, the shape of the electronic component 2 corresponds to the shape of the heat dissipation element 6. Thereby, excellent heat dissipation by the heat dissipation element 6 can be achieved.

[0110] As can be taken from FIG. 7, the heat dissipation element 6 and the electronic component 2 can have square shapes.

[0111] As can be taken from FIG. 8, the heat dissipation element 6 and the electronic component 2 can have circular shapes.

[0112] FIGS. 9 to 11 essentially show similar configurations as shown in FIGS. 6 to 8, where the heat dissipation element 6 further includes a projection 22 protruding into the electronic component 2.

[0113] The shape of the respective projection 22 corresponds to the shape of an opening 23 of the electronic component 2. The shape of the opening 23 is defined by the shape and size of the magnetic core 21 as well as of the electrical windings 3 wound around the magnetic core 21.

[0114] The configurations shown in embodiments six to eight are especially suited for sealing the heat dissipation element 6 with the heat dissipation mass coating 4. Therein, the projection 22 of the heat dissipation element 6 is inserted into the electronic component 2 before curing the heat dissipation mass to form the heat dissipation mass coating 4.

[0115] Thereby, the heat dissipation element 6 not only provides excellent thermal conductivity, but simultaneously further electrically insulates the electrical windings 3 from each other.

[0116] The heat dissipation element 6 can further include walls, in addition or alternatively to the projection 22, which surround the electronic component 2.

[0117] FIG. 12 shows a schematic drawing of an electronic apparatus 20 including an electronic device 1 manufactured according to any one of the foregoing embodiments.

[0118] In particular, the electronic apparatus 20 includes two electronic devices 1, which are each manufactured as elucidated above.

[0119] Further, the electronic apparatus 20 is connected to a battery 24. The electronic apparatus 20 in this exemplary embodiment is a charging apparatus for charging the battery 24. In particular, the electronic apparatus 20 is a power conversion device for supplying power to and from the battery 24.

[0120] By the aforementioned manufacturing steps and configurations of the electronic device 1, the electronic component 2, and the electronic apparatus 20, an electronic apparatus 20 is provided with excellent heat dissipation properties. In addition, due to the excellent insulation properties especially due to the heat dissipation mass coating 4, the electronic apparatus 20 is highly suitable for high-voltage applications, especially with a lower likelihood of voltage breakdowns or short-circuits.

[0121] In addition to the foregoing written explanation of the present disclosure, it is explicitly referred to FIGS. 1 to 12, which in detail show features of the present disclosure.

REFERENCE SIGNS

[0122] 1 electronic device [0123] 2 electronic component [0124] 3 electrical winding [0125] 4 heat dissipation mass coating [0126] 5 cavity [0127] 6 heat dissipation element [0128] 7 covered side of the heat dissipation element [0129] 8 exposed side of the heat dissipation element [0130] 9 outer surface [0131] 10 thermal cooling plate [0132] 11 outer circumferential surface of the heat dissipation element [0133] 12 inner circumferential surface of mould [0134] 13 mould [0135] 14 core [0136] 15 outer leads [0137] 16 bobbin [0138] 17 mould-halves [0139] 18 filler [0140] 19 polyimide film [0141] 20 electronic apparatus [0142] 21 magnetic core [0143] 22 projection [0144] 23 opening [0145] 24 battery