Method for producing security elements, and security elements
11472216 · 2022-10-18
Assignee
Inventors
Cpc classification
G02B5/1861
PHYSICS
B42D25/328
PERFORMING OPERATIONS; TRANSPORTING
G07D7/207
PHYSICS
B42D25/20
PERFORMING OPERATIONS; TRANSPORTING
International classification
B42D25/20
PERFORMING OPERATIONS; TRANSPORTING
G07D7/207
PHYSICS
B42D25/328
PERFORMING OPERATIONS; TRANSPORTING
G03H1/00
PHYSICS
Abstract
A method for producing security elements, security elements, a security document with at least one security element as well as a transfer film with at least one security element, wherein a three-dimensional object is recorded and a surface profile of the three-dimensional object, described by a function F(x,y), is determined, wherein the function F(x,y) describes the distance between the surface profile and a two-dimensional reference surface spanned by co-ordinate axes x and y at the co-ordinate points x and y. A first microstructure is determined in such a way that the structure height of the first microstructure is limited to a predetermined value smaller than the maximum distance between the surface profile and the two-dimensional reference surface, and the first microstructure provides an observer with a first optical perception which corresponds to the surface profile of the three-dimensional object described by the function F(x,y).
Claims
1. A method for producing a security element comprising: a) recording a three-dimensional object; b) determining a surface profile of the three-dimensional object, described by a function F(x,y), wherein the function F(x,y) describes the distance between the surface profile and a two-dimensional reference surface spanned by co-ordinate axes x and y at the co-ordinate points x and y; c) determining a first microstructure in such a way that the structure height of the first microstructure is limited to a predetermined value smaller than the maximum distance between the surface profile and the two-dimensional reference surface, and that the first microstructure provides an observer with a first optical perception which corresponds to the surface profile of the three-dimensional object described by the function F(x,y); and d) introducing the first microstructure into a layer of the security element by means of lithographic methods, in such a way that the first microstructure of the layer of the security element provides the observer with the first optical perception.
2. The method according to claim 1, wherein the step a) of recording the three-dimensional object comprises the generation of a virtual three-dimensional object and/or the recording of a real three-dimensional object by means of a contact profilometer and/or a laser scanner.
3. The method according to claim 2, wherein the spatial resolution of the recording device corresponds to at least 1.5 times, the smallest structure to be represented of the surface profile of the three-dimensional object described by the function F(x,y).
4. The method according to claim 1, wherein a microstructure with a binary surface relief, a multi-step surface relief and/or a continuous surface relief is determined as first microstructure in step c).
5. The method according to claim 1, wherein the structure height of the first microstructure is chosen substantially constant over the entire surface of the first microstructure for the formation of a binary surface relief and wherein the widths of the grating grooves and/or of the grating bars of the binary surface relief of the first microstructure are chosen such that the observer is provided with the first optical perception.
6. The method according to claim 1, wherein for the formation of a continuous surface relief, the first microstructure is designed in such a way that one side in each case of the grating grooves of the continuous surface relief of the first microstructure run parallel to each other and substantially parallel to the one perpendicular to the two-dimensional reference surface, wherein, that the other sides in each case of the grating grooves run parallel to the surface profile (37) of the three-dimensional object described by the function F(x,y) at least in areas and/or wherein, for the formation of the continuous surface relief of the first microstructure, the first microstructure is designed in such a way that the first microstructure is equal to the result of the surface profile described by the function F(x,y) modulo the predetermined value of the structure height of the first microstructure.
7. The method according to claim 6, wherein the other sides in each case of the grating grooves running parallel to the surface profile of the three-dimensional object described by the function F(x,y) at least in areas are approximated in steps in such a way that the height of the stepped approximations is constant between predetermined co-ordinate points x and y of the two-dimensional reference surface and corresponds to the value at the respective co-ordinate points x and y of the first microstructure with the continuous surface relief.
8. The method according to claim 1, wherein in step d), the introduction of the first microstructure into the layer of the security element is effected by means of electron beam lithography and/or photolithography.
9. A security element for marking a security document wherein a layer of the security element comprises a first microstructure, wherein the first microstructure is molded in such a way that the structure height of the first microstructure is limited to a predetermined value smaller than the maximum distance between a surface profile of a three-dimensional object described by a function F(x,y) and a two-dimensional reference surface spanned by co-ordinate axes x and y, wherein the function F(x,y) describes the distance between the surface profile and the two-dimensional reference surface at the co-ordinate points x and y, and wherein the first microstructure provides an observer with a first optical perception which corresponds to the surface profile of the three-dimensional object described by the function F(x,y).
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) Embodiment examples of the invention are explained below by way of example with the aid of the accompanying figures which are not drawn to scale.
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
(12)
(13) The security element 1 can be applied to the security document e.g. by means of an adhesive layer. The security element 1 can have been applied to the security document 2 as a transfer ply of a transfer film in particular by means of hot-embossing or cold-embossing. The security element 1 can alternatively thereto also be applied as a tag or label.
(14) As shown in
(15) As shown in
(16) The security element 1 has a layer which comprises a microstructure. The layer is preferably a varnish layer with a layer thickness between 1 μm and 100 μm.
(17) The microstructure is molded in such a way that the microstructure provides an observer with a spatial optical perception of the geometric
(18)
(19) Thus,
(20) In a first step, starting from the two-dimensional image 20, a virtual three-dimensional object 21 is generated, as shown in
(21) It is also possible for real three-dimensional objects to be recorded by means of a recording device, in particular a contact profilometer and/or a laser scanner. Thus, for example, a coin can be recorded as a real three-dimensional object by means of a recording device. A contact profilometer scans the surface of the three-dimensional object by means of a stylus, for example. From the measurement data obtained in this way, a virtual three-dimensional object is generated. A laser scanner likewise generates a virtual three-dimensional object through point-by-point scanning of the surface of the three-dimensional object with a laser beam, the focus of which is varied with each scanned point. In contrast to the contact profilometer, a laser scanner is a non-contact optical recording device. It is further possible to use further non-contact optical recording devices which are based, for example, on the confocal technique or on white light interferometry, for the recording of the three-dimensional object. Furthermore, it is also possible for real three-dimensional objects to be recorded by means of a strip projection or triangulation method. With recording devices of this type, it is possible to record very large objects, in particular buildings, cars or topographies, such as for example mountains. The spatial resolution of the recording device preferably corresponds to at least 1.5 times, preferably 2 times, further preferably 2.5 times the smallest structure to be represented of the real three-dimensional object. It is further possible for real three-dimensional objects, such as for example known buildings or busts of known persons, to be recorded, which are very memorable for an observer.
(22) In a further step, a surface profile of the three-dimensional object 21 described by a function F(x,y) is determined, wherein the function F(x,y) describes the distance between the surface profile and a two-dimensional reference surface spanned by the co-ordinate axes x and y at the co-ordinate points x and y. For this purpose, the three-dimensional surface profile is projected point by point onto the two-dimensional reference surface, for example, and the corresponding distance is calculated geometrically for each point of the reference surface relative to the chosen reference surface. By this means, a surface profile described by the function F(x,y) forms, for example in the shape of a point cloud, which encodes the height information of the three-dimensional object. A large number of points, in particular between 10 and 100 million points, is preferably used and thus a correspondingly precise scanning of the surface of the three-dimensional object. The projection is preferably effected by means of suitable projection algorithms. Furthermore, the two-dimensional reference surface can be flat and/or curved.
(23) In a further step, a microstructure is determined in such a way that the structure height of the microstructure is limited to a predetermined value smaller than the maximum distance between the surface profile and the two-dimensional reference surface, and that the microstructure provides an observer 22 with a first optical perception which corresponds to the surface profile of the three-dimensional object 21 described by the function F(x,y). Thus, starting from the surface profile of the three-dimensional object 21 described by the function F(x,y), the microstructure is calculated, for example by means of a mathematical modulo operation, wherein the structure height of the microstructure is previously limited to a maximum permissible value. The microstructure is then equal to the result of the surface profile described by the function F(x,y) modulo the predetermined value of the structure height of the microstructure. The maximum permissible value of the structure height or the structure height itself is here preferably determined on the basis of boundary conditions, such as for example a maximum possible structure height or a maximization of the diffraction efficiency for a particular wavelength.
(24) In a last step, the microstructure is introduced into a layer of the security element 1, in particular by means of lithographic methods, in such a way that the microstructure provides the observer 22 with the optical perception 23 which corresponds to the surface profile of the three-dimensional object 21 described by the function F(x,y), as shown in
(25)
(26)
(27)
(28) It is further possible for the sides 42 to be approximated in steps in such a way that the height of the stepped approximations is constant between predetermined co-ordinate points x and y of the two-dimensional reference surface 32 and corresponds to the value at the respective co-ordinate points x and y of the microstructure with the continuous surface relief 40. A microstructure with a multi-step surface relief is thus produced. Advantageously, the sides of the stepped approximation run substantially parallel to the perpendicular to the two-dimensional reference surface 32. The predetermined co-ordinate points x and y preferably form a two-dimensional grid, wherein the stepped approximation is carried out in each case in a grid area of the two-dimensional grid. The smaller the grid areas of the two-dimensional grid, i.e. the higher the resolution of the grid, the better the microstructure with the continuous surface relief 40 is approximated in steps.
(29) The microstructure 44 is preferably introduced into one of the layers 45, 46. The layers 45, 46 are preferably varnish layers. The layers 45, 46 are, in particular, formed from a thermoplastic varnish (e.g. from PVC, polyester or thermoplastic acrylates) or UV-curing varnish (e.g. from an acrylate crosslinking with isocyanate (NCO)). The varnish layer 46 facing the observer is preferably transparent or translucent. The layers 45, 46 can also have the same or different colors. It is thus possible, for example, for the layer 45 to be colored green and the layer 46 to be colored red. It is further possible for one of the layers 45, 46 to be implemented as an adhesive layer. It is also advantageous if the refractive index of the layers 45, 46 differs by at least 0.2, in order to form an optical boundary layer and thus to make the microstructure 44 visible, and/or if a reflection-increasing coating, in particular made of metal and/or HRI material, is arranged directly on the microstructure 44 between the layers 45, 46.
(30) The microstructure 44 with the continuous surface relief 40 is preferably produced by means of so-called “direct writing”, i.e. a method in which either the material is removed by means of a laser according to the desired relief or a photoresist or electron-beam resist is exposed by means of a laser or an electron beam lithography machine according to the desired relief and the desired relief or its negative is subsequently obtained by developing the photoresist. “Direct writing” thus enables, in particular, the production of continuous surface reliefs of the microstructure 44 according to
(31) It is further advantageous if the layer comprising the microstructure 44 comprises a reflective layer, in particular a metal layer and/or an HRI or LRI layer (HRI—high refractive index, LRI—low refractive index).
(32) It is thus possible for the reflective layer to be molded as a metal layer made of chromium, aluminum, gold, copper, silver or an alloy of such metals. The metal layer is preferably vapor-deposited in a vacuum in a layer thickness of from 10 nm to 150 nm.
(33) Furthermore, it is also possible for the reflective layer to be formed by a transparent reflective layer, preferably a thin or finely-structured metallic layer or a dielectric HRI or LRI layer. Such a dielectric reflective layer consists, for example, of a vapor-deposited layer made of a metal oxide, metal sulfide, e.g. titanium oxide, ZnS etc. with a thickness of from 10 nm to 150 nm. The reflective layer can also be printed on, for example with a varnish with metallic pigments and/or nanopigments with a high refractive index.
(34) It is further possible for the reflective layer to be molded in areas. It is also possible for the reflective layer to be designed patterned, in particular to represent an item of information. A pattern can, for example, be a graphically designed outline, a figurative representation, an image, a motif, a symbol, a logo, a portrait, an alphanumeric character, a text and the like.
(35)
(36) The microstructures 44 of
(37) With respect to the design of the layers 45, 46, reference is made here to the above statements.
(38)
(39) It further possible for the exposure of the photoresist plate to be effected by means of a grating exposure or slit exposure using one or more intermediate masters.
(40) An embossing die is preferably produced by means of the developed photoresist plate, and the security element is produced with the aid of the embossing die. For this purpose, a microstructure is embossed into a layer of the security element, preferably a varnish layer such as a replication varnish layer.
(41) The replication varnish layer consists, for example, of a thermoplastic varnish into which a surface relief is molded by means of heat and pressure by the action of an embossing tool. Furthermore, it is also possible for the replication varnish layer to be formed by a UV-crosslinkable varnish and the surface relief to be molded into the replication varnish layer by means of UV replication. The surface relief is molded onto the uncured replication varnish layer by the action of an embossing tool and the replication varnish layer is cured immediately during or after the molding by irradiation with UV light. So-called hybrid varnish systems, which represent a combination of thermoplastic varnish and UV-crosslinkable varnish, are also possible.
(42) The replication varnish layer preferably has a layer thickness between 0.1 μm and 20 μm.
(43) It is further possible for the surface relief to be embossed into one or more zones of the layer of the security element.
(44) The photoresist plate provided for the exposure preferably has a positively acting photoresist, in particular a Shipley Microposit S1800 series photoresist, and a special light-sensitive component. It further possible for the photoresist plate to have a negatively acting photoresist.
(45) The photoresist plate provided for the exposure is preferably produced in that the photoresist is applied to a plate at a temperature of from 15° C. to 30° C. and a relative humidity of from 50% to 90%. The photoresist is preferably applied to a plate by means of spin coating.
(46) The exposure of the photoresist plate is preferably effected with light, the wavelength of which lies between 200 nm and 500 nm.
(47)
(48)
(49)
(50)
(51)
(52) The first microstructure in the zones 81 of
(53) The second microstructure in the zones 80 is here a microstructure which corresponds to the microstructures according to
(54) The zones 80 and 81 are gridded into each other by means of so-called interlacing (line width 40 μm, grid width 80 μm), i.e. in each case one zone 80 and one zone 81 are adjacent to each other and in each case alternating. Through the interlacing of the two high-resolution zones 80, 81, the grid width of which is in each case below the resolution capacity of the naked human eye, the optical effects of both zones 80, 81 can be accordingly perceived at the same time and combined, with the result that, in combination, a spatial and three-dimensional impression in true colors of the portrait which can be seen in
(55) The surface coverage of the zones 81, which have the first microstructure, on the total surface area consisting of the zones 80 and 81, which form the object 82, is 50% in
(56) It is further possible for the grid width to be varied, in particular within a predefined variation range.
(57)
(58) Starting from the carrier film 91 of the transfer film 3, a detachment layer 92 is usually present here, in order to be able to detach the security element 1 from the carrier film 91 after embossing. The optional transparent protective layer 93 formed as a protective varnish layer and, furthermore, the remaining layers of the security element 1 are preferably present on a side of the detachment layer 92 facing away from the carrier film 91.
(59) It is likewise possible for the security element 1 to be applied in the form of a laminating film, wherein the carrier film 91 remains on the security element 1 and also no detachment layer 92 is provided between the carrier film 91 and the security element 1.
(60) The security element 1 can further have an adhesive layer 94, in particular made of a cold or hot-melt adhesive.
LIST OF REFERENCE NUMBERS
(61) 1 security element
(62) 2 security document
(63) 3 geometric figure
(64) 4 security thread
(65) 5 observer
(66) 6, 7, 8 co-ordinate axes x, y, z
(67) 20 two-dimensional image
(68) 21 three-dimensional object
(69) 22 observer
(70) 23 optical perception
(71) 30 spherical profile
(72) 31, 43, 53 structure height
(73) 32 reference surface
(74) 35 incident light
(75) 36 directions
(76) 37 surface profile
(77) 34, 35 material layers
(78) 40 microstructure with continuous surface relief
(79) 41, 42 sides
(80) 44 microstructure
(81) 45, 46 layers
(82) 40 microstructure with binary surface relief
(83) 51 grating bars
(84) 52 grating grooves
(85) 60 figurative representation
(86) 61, 62, 63 color separation
(87) 64, 65, 66 grid mask
(88) 67 detail
(89) 68 dot grid
(90) 80, 81 zones
(91) 82 object
(92) 90 transfer film
(93) 91 carrier film
(94) 92 detachment layer
(95) 93 protective layer
(96) 94 adhesive layer