METHOD FOR APPLICATION OF A SILICON DIOXIDE LAYER

Abstract

A method for depositing a silicon dioxide layer on a combustible and/or, in particular easily, inflammable carrier material (2, 2) for the formation of a package, in particular suitable for foodstuffs, with the following steps, in particular with the following sequence: coating of the carrier material with a silicon dioxide precursor solution prepared by dissolving an oligomeric, silicate, preferably a silicic acid tetramethyl ester homopolymer, in a solvent, said silicon dioxide precursor solution having a water content less than 5 vol. %, and hardening of the silicon dioxide precursor solution and thus forming the silicon dioxide layer on the carrier material in an at least partially vaporous ammonia atmosphere at: a temperature between 5 C. and 30 C. and/or a pressure between 900 MPa and 1200 MPa.

Claims

1-6. (canceled)

7. A method for producing a package material for foodstuffs by depositing a silicon dioxide layer on a cellulosecontaining carrier material and/or for impregnation of a voluminous carrier material with a silicon dioxide layer, wherein the carrier material is comprised of a material having a) a flash point greater than 0 C. and less than 100 C. and/or b) a combustion point greater than 20 C. and less than 150 C. and/or c) an ignition temperature greater than 100 C. and less than 600 C., wherein the method comprises: coating the carrier material with a silicon dioxide precursor solution prepared by dissolving a silicate in a solvent, said silicon dioxide precursor solution having a water content less than 25 vol. %, and hardening the silicon dioxide precursor solution to form the silicon dioxide layer on the carrier material in an at least partially vaporous ammonia atmosphere, wherein the at least partially vaporous ammonia atmosphere is at a) a temperature between 5 C. and 100 C. and b) a pressure between 10.sup.3 mbar and 10 bar.

8. The method according to claim 7, wherein the silicate is a silicic acid tetramethyl ester homopolymer.

9. The method according to claim 7, wherein the silicon dioxide layer is deposited/formed with a layer thickness less than 1 m.

10. The method according to claim 7, wherein the coating and/or the hardening is/are carried out at room temperature and/or atmospheric pressure.

11. The method according to claim 7, wherein the carrier material is made of a material with an ignition temperature greater than 150 C. and less than 300 C.

12. The method according to claim 7, wherein the carrier material, before deposition of the silicon dioxide layer, is treated with a plasma on at least one surface to be coated.

13. A wafer box, produced with a carrier material coated with a method according to the method of claim 7.

Description

[0090] Further advantages, features and details of the invention emerge from the following description of preferred examples of embodiment and on the basis of the drawings. In the figures:

[0091] FIG. 1 shows a schematic cross-sectional partial representation (not true to scale) of a first embodiment according to the invention,

[0092] FIG. 2 shows a schematic cross-sectional partial representation (not true to scale) of a second embodiment according to the invention,

[0093] FIG. 3 shows a schematic cross-sectional partial representation (not true to scale) of a third embodiment according to the invention.

[0094] Identical or identically functioning features are denoted in the figures by the same reference numbers.

[0095] FIG. 1 shows a schematic cross-sectional partial representation (not true to scale) of a package 1, represented only as a detail, with a carrier substrate 2, in particular a plastic film or a. cellulose-containing material, which on its first surface 2o has been coated at atmospheric pressure and room temperature with a ceramic layer, i.e. a silicon dioxide layer 3.

[0096] FIG. 2 shows a schematic cross-sectional partial representation (not true to scale) of a package 1, represented only as a detail, comprising: [0097] a carrier substrate 2, in particular a plastic film or a cellulose-containing material, with first surface 2o and a second, opposite-lying (lower) surface 2u, [0098] a ceramic layer 3 deposited on first surface 2o and [0099] a ceramic layer 3 deposited on second surface 2u.

[0100] FIG. 3 shows a schematic cross-sectional partial representation (not true to scale) of a voluminous carrier substrate 2, inner surfaces 2i whereof have been coated with a ceramic layer 3 by the method according to the invention. The coating of inner sides 2i of a voluminous carrier substrate 2 can also be understood to mean impregnation.

LIST OF REFERENCE NUMBERS

[0101] 1, 1 packaging/packaging film [0102] 2, 2 carrier substrate/carrier material [0103] 2o first surface [0104] 2u second surface [0105] 2i inner surface [0106] 3, 3 silicon dioxide layer [0107] 3o, 3o third surface