METHOD AND SYSTEM FOR CONTINUOUS ATOMIC LAYER DEPOSITION
20170145565 ยท 2017-05-25
Inventors
- Jeffrey W. Elam (Elmhurst, IL)
- Angel Yanguas-Gil (Naperville, IL, US)
- Joseph A. Libera (Clarendon Hills, IL)
Cpc classification
H10K71/00
ELECTRICITY
Y02P70/50
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
C23C16/45551
CHEMISTRY; METALLURGY
C23C16/45527
CHEMISTRY; METALLURGY
Y02E10/549
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
International classification
C23C16/455
CHEMISTRY; METALLURGY
H01L21/02
ELECTRICITY
H01L21/311
ELECTRICITY
H01L21/67
ELECTRICITY
Abstract
A system and method for continuous atomic layer deposition. The system and method includes a housing, a moving bed which passes through the housing, a plurality of precursor gases and associated input ports and the amount of precursor gases, position of the input ports, and relative velocity of the moving bed and carrier gases enabling exhaustion of the precursor gases at available reaction sites.
Claims
1. A system for performing atomic layer deposition comprising, a housing; a moving bed which passes through the housing, the moving bed including a reaction surface configured to have a velocity V; a first precursor gas input configured to provide a first precursor gas and a second precursor gas input configured to provide a second precursor gas, the first precursor gas input and the second precursor gas input spaced apart a distance L; and a carrier gas input configured to provide a carrier gas having a flow rate of U; wherein the flow rate U, distance L, distance D, and velocity V are such that the all of the first precursor gas is reacted with the reaction surface prior to reaching the second precursor gas inlet.
2. The system as defined in claim 1, wherein the housing consists of a single volume with no removal ports and no purge components associated with the housing.
3. The system as defined in claim 1 wherein the housing includes an associated plurality of precursor gas input ports positioned to enable the plurality of precursor gases to react with the available reaction sites, thereby exhausting the precursor gases input to the housing.
4. The system as defined in claim 1, wherein the moving bed is constructed to be of a prescribed length passing through the housing to insure complete exhaustion of the precursor gases input to the housing and which react with the available reaction sites.
5. The system as defined in claim 1 further including a device coupled to the moving bed for mixing particles comprising the reaction surface.
6. The system as defined in claim 1 further including a control system for controlling at least one of (a) carrier gas flow rate, (b) velocity of motion of the moving bed, and (c) direction of motion of the moving bed relative to the carrier gas and/or the precursor gases.
7. The system as defined in claim 1, wherein the amounts of the precursor gas being less then available reaction sites of the reaction surface, thereby leading to exhaustion of the precursor gases input to the housing.
8. A system for performing atomic layer deposition comprising, a housing; a moving bed which passes through the housing of the moving bed including a reaction surface configured to have a velocity V; a first precursor gas input configured to provide a first precursor gas and a second precursor gas input configured to provide a second precursor gas, the first precursor gas input and the second precursor gas input spaced apart a distance L; a flow control in communication with the first precursor gas input and the second precursor gas input and configured to control the flow of first precursor gas and second precursor gas; and a carrier gas input configured to provide a carrier gas having a flow rate of U; wherein the flow rate U, distance L, distance D, and velocity V are such that the all of the first precursor gas is reacted with the reaction surface prior to reaching the second precursor gas inlet.
9. The system as defined in claim 8, wherein the housing consists of a single volume with no removal ports and no purge components associated with the housing.
10. The system as defined in claim 8 wherein the housing includes an associated plurality of precursor gas input ports positioned to enable the plurality of precursor gases to react with the available reaction sites, thereby exhausting the precursor gases input to the housing.
11. The system as defined in claim 8, wherein the moving bed is constructed to be of a prescribed length passing through the housing to insure complete exhaustion of the precursor gases input to the housing and which react with the available reaction sites.
12. The system as defined in claim 8 further including a device coupled to the moving bed for mixing particles comprising the reaction surface.
13. The system as defined in claim 8, wherein the amounts of the precursor gas being less then available reaction sites of the reaction surface, thereby leading to exhaustion of the precursor gases input to the housing.
14. A system for performing atomic layer deposition comprising, a housing; a moving bed which passes through the housing of the moving bed including a reaction surface configured to have a velocity V; a first precursor gas input configured to provide a first precursor gas; a second precursor gas input, upstream of the first precursor gas input relative to the moving bed, configured to provide a second precursor gas, the first precursor gas input and the second precursor gas input spaced apart a distance L.sub.2; a third precursor gas input, upstream of the second precursor gas input relative to the moving bed, configured to provide a third precursor gas, the second precursor gas input and the third precursor gas input spaced apart a distance L.sub.2; a flow control in communication with the first precursor gas input and the second precursor gas input and configured to control the flow of first precursor gas and second precursor gas; a carrier gas input configured to provide a carrier gas having a flow rate of U; wherein the flow rate U, distance L.sub.1 and L.sub.2, distance D, and velocity V are such that the all of the first precursor gas is reacted with the reaction surface prior to reaching the second precursor gas inlet.
15. The system as defined in claim 14, wherein the housing consists of a single volume with no removal ports and no purge components associated with the housing.
16. The system as defined in claim 14 wherein the housing includes an associated plurality of precursor gas input ports positioned to enable the plurality of precursor gases to react with the available reaction sites, thereby exhausting the precursor gases input to the housing.
17. The system as defined in claim 14, wherein the moving bed is constructed to be of a prescribed length passing through the housing to insure complete exhaustion of the precursor gases input to the housing and which react with the available reaction sites.
18. The system as defined in claim 14 further including a device coupled to the moving bed for mixing particles comprising the reaction surface.
19. The system as defined in claim 14, wherein the amounts of the precursor gas being less then available reaction sites of the reaction surface, thereby leading to exhaustion of the precursor gases input to the housing.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0011]
[0012]
[0013]
[0014]
[0015]
[0016]
[0017]
[0018]
[0019]
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0020]
[0021] While the inputs 26 and 28 can include any valves and dosing mechanisms known in the prior art, including the ability to pulse the reactants, the embodiment of
[0022] Some advantages of this approach are:
[0023] 1. 100% materials utilization: all the precursor is consumed as part of the ALD process.
[0024] 2. Continuous operation: no need to pulse precursors.
[0025] 3. Suitable for low vapor pressure precursors.
[0026] 4. Reasonable reactor sizes, no small tolerances, robust against web vibration and other perturbations of a moving wall system.
[0027] 5. Reactor size decreases with higher reaction probabilities: suitable for large surface area substrates.
[0028] A variety of operating regimes can exist for the system 10 illustrated in
[0029] Considering the steady state equations of a precursor flowing into the system 10 with moving walls and where the surface chemistry is given by a first-order irreversible Langmuir kinetics, two regimes can be distinguished. These two regimes depend on an excess number, defined as the number of molecules per surface site, and the ratio of the flow and web velocity:
[0030] Where S.sub.0 is the average area of a surface site, n.sub.0 is the precursor density at the entrance of the inputs 26 and 28, V and S are the volume and the surface of the system 10, u is the average flow velocity and is the surface (or web) velocity.
[0031] These regions of reaction are shown substantially in
[0032] Note that, while in conventional CVD methods, complete consumption of the precursor is expected after a long enough distance of travel in a reactor, the existence of such region is not guaranteed under ALD conditions. Only when the precursor flows are carefully chosen to ensure the self-extinguishing condition, it is then possible to run the system 10 such as that depicted in
[0033] The characteristic length for precursor decay can be determined and which is given by:
here u is the average flow velocity, c.sub.0 is the final coverage after all the precursor is consumed, .sub.th is the average thermal velocity, is the bare reaction probability, d is the vertical gap of the reactor (distance from injector to moving web or bed), and epsilon is the tolerance for precursor depletion. This expressions is obtained under the assumption of a first order irreversible Langmuir kinetics to represent ALD's self-limited chemistry.
[0034] The separation between the inputs 26 and 28 depends on the velocity of the web 15, the vertical dimension of the reactor zone of the system 10, the mean thermal velocity, the reaction probability, the coverage and the tolerance that is required for the process. Characteristic values are shown in
[0035] This formula above can further be used to estimate the distance between the inputs 26 and 28. Also, from the results obtained it is clear that one critical parameter in the design feature is the bare reaction probability of the precursor. Therefore, it is important to understand the chemistry of the precursor in order to adapt the experimental setup to a particular one of the system 10. Likewise, the design of the system 10 also can affect the distance between injectors. In
[0036] The distances shown in
[0037] While more complex simulations can be used to simulate the interaction between the flow and the moving walls of the web 14, the formula as presented above captures the main features of the system 10, and the ratio u/ can be chosen from more accurate, and well known, computational fluid dynamic simulations.
[0038] The results show that a high reaction probability affects positively the distance between the inputs 26 and 28. This makes the method ideal to coat high surface area materials, since the effective reaction probability on high surface area materials is larger than that on planar substrates. In
[0039] In another embodiment, since the results above show a correlation between the dosing and the velocity of the surface of the web 14, in
[0040] In yet another embodiment shown in
[0041] In a further embodiment, shown in
[0042] In additional embodiments reasonable generalizations of the systems 10 described above, include, but are not limited to, the use of more than two channels 70 of the system 10, the variation of the spacing between the different channels 70, the use of more than one moving surfaces 54 of the web 15 and the adaptation of the reactor geometry to curved surfaces that could be used to treat surfaces directly on a roll.
[0043] The method and system adaptation described herein can be applied to any method or arrangement able to operate in an ALD mode, (thermal, plasma and radical assisted, and UV-assisted) and can be used for applications such as catalysis, photovoltaics, transparent electronics, energy storage, barrier coatings for organic photovoltaics and organic light-emitting diodes, and transparent conducting oxide materials. This method is particularly well suited for the coating of high surface area materials, for instance catalyst supports, and the coating of high-cost precursors where achieving a 100% materials utilization offers significant advantages in terms of the cost of the process.
[0044] The methodology of the invention therefore eliminates the stringent tight tolerances required in many existing spatial ALD approaches to avoid the cross-talk between different precursors in the ALD process. Instead, the method herein relies on the self-extinguishing nature of the pulse to eliminate the cross talk.
[0045] In another aspect of the methodology ALD can be used under continuous deposition of particles. The fact that the effective reaction or sticking probability becomes much larger in the presence of particles is extremely convenient for the instant invention since the speed of the continuous process relative to the size of the chamber is determined by the sticking probability.
[0046] However, the fact that the instant method does not require tight tolerances at the points where the web 15 or belt 30 crosses through the reaction embodiment means that the coating of the particles 32, as a form of the substrate in the ALD process, is enabled in the presence of mechanical agitation. This agitation greatly impacts the speed of the process by reducing the time required to achieve saturation and ensures that the particles 32 are coated homogenously. Examples of methods for increasing the mixing of the particles 32 would include including a device 80 (see
[0047] The present invention has been described herein with reference to the preferred embodiments and accompanying drawings. These embodiments and drawings do not serve to limit the invention, but are set forth for illustrative purposes. The scope of the invention is defined by the claims that follow. Those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims.