MICROELECTRONIC MODULE FOR CLEANING A SURFACE, MODULE ARRAY, AND METHOD FOR CLEANING A SURFACE

Abstract

A microelectronic module for cleaning a surface is described. The microelectronic module comprises at least one voltage converter for converting a provided first voltage into a higher, lower, or identical second voltage. The module also comprises at least one actuator. The actuator comprises at least one generator for generating an ionic current, an electrical plasma, harmonic components and/or an electrostatic field from the second voltage which is provided by the voltage converter. At least the voltage converter and the actuator are disposed on a thin-film, planar substrate. At least most of at least one object adhering to the surface is removed by the actuator.

Claims

1. A microelectronic module for cleaning a surface, comprising: at least one voltage converter for converting a provided first voltage into a higher, lower, or identical second voltage; at least one actuator, comprising at least one generator for generating an ionic current, an electrical plasma, harmonic components and/or an electrostatic field from the second voltage which is provided by the voltage converter; wherein at least the voltage converter and the actuator are disposed on a thin-film, planar substrate; and wherein at least most of at least one object adhering to the surface is removed by the actuator.

2. The microelectronic module as claimed in claim 1, wherein the voltage converter comprises a piezoelectric transformer.

3. The microelectronic module as claimed in claim 1, wherein the thin-film, planar substrate is a flexible and/or multidimensionally deformable film or lattice.

4. The microelectronic module as claimed in claim 1, wherein the provided first voltage for the voltage converter is provided, at least partially, via an external voltage source; and/or wherein the module further comprises an energy-generating element for generating at least a portion of the first voltage to be provided; wherein the energy-generating element comprises a solar cell arrangement or an energy-harvesting element.

5. The microelectronic module as claimed in claim 1, wherein the module comprises a plurality of actuators; and/or, wherein the module comprises at least one switching element for activating and/or deactivating the module and/or at least one of the plurality of actuators.

6. The microelectronic module as claimed in claim 1, wherein the module comprises at least one detection unit which is designed for detecting at least presence of an object adhering to the module; or wherein the actuator is further designed for detecting at least presence of an object adhering to the module.

7. The microelectronic module as claimed in claim 1, wherein the module comprises at least one sensor which is designed for gathering information regarding the module, information regarding the adhering object and/or information regarding the environment of the module, wherein the sensor is a pressure sensor, a temperature sensor and/or a humidity sensor.

8. The microelectronic module as claimed in claim 1, wherein the module comprises at least one receiver which is designed for receiving a signal, wherein the switching element can be switched depending on the signal; and/or wherein the module comprises at least one transmitter which is designed for transmitting a signal to a receiver, wherein the signal includes at least information regarding parameters detected by the module.

9. The microelectronic module as claimed in claim 6, wherein the module comprises a control element which is designed for controlling the actuator depending on ascertained information and/or presence of at least one adhering object.

10. The microelectronic module as claimed in claim 1, wherein the voltage converter, the switching element, the actuator, the detection unit, the sensor, the receiver, the transmitter and/or the control element are designed as a MEMS structure.

11. A module array comprising a plurality of microelectronic modules as claimed in claim 1.

12. The module array as claimed in claim 11, wherein the plurality of the modules is geometrically arranged such that they have a predominant direction; wherein the actuators of the plurality of the modules are arranged so as to generate a wave front and/or an excitation of a soliton wave having a defined direction of propagation.

13. The module array as claimed in claim 11, wherein the actuators of the plurality of the modules can be controlled in a delayed and/or out-of-phase manner; wherein intensity can be maximized by utilizing interference phenomena.

14. An arrangement at least of one microelectronic module or at least one module array as claimed in claim 1 on and/or in a surface of a vehicle, wherein the vehicle is an aircraft, a watercraft, or a land vehicle.

15. A method for cleaning a surface by using at least one microelectronic module or at least one module array as claimed in claim 1, converting a provided first voltage into a higher, lower, or identical second voltage; generating an ionic current, an electrical plasma, harmonic components and/or an electrostatic field depending on the second voltage; removing at least one object adhering on a surface of the module or of the module array by the generated ionic current, electrical plasma, the harmonic waves and/or the electrostatic field.

16. The microelectronic module as claimed in claim 7, wherein the module comprises a control element which is designed for controlling the actuator depending on ascertained information and/or presence of at least one adhering object.

17. The microelectronic module as claimed in claim 8, wherein the module comprises a control element which is designed for controlling the actuator depending on ascertained information and/or presence of at least one adhering object.

Description

[0039] In the drawings, reference numbers that are generally the same refer to the same parts in all the different views. The drawings are not necessarily to scale; instead, value is placed, in general, on the explanation of the principles of the invention. In the following description, different embodiments of the invention are described with reference to the following drawings, in which:

[0040] FIG. 1 shows a first embodiment of a microelectronic module;

[0041] FIG. 2 shows a module array comprising a plurality of microelectronic modules;

[0042] FIG. 3 shows the arrangement of a plurality of microelectronic modules on the surface of an aircraft; and

[0043] FIG. 4 shows a flow chart of a method for cleaning a surface.

[0044] The following detailed description refers to the attached drawings which, for the purpose of explanation, show specific details and embodiments in which the invention can be put into practice.

[0045] The expression exemplary is used in this case to mean serving as an example, a case, or an illustration. Every embodiment or configuration described herein as exemplary should not necessarily be interpreted to be preferred or advantageous over other embodiments or configurations.

[0046] In the following extensive description, reference is made to the attached drawings which form a part of this description and in which, for purposes of illustration, specific embodiments in which the invention can be applied are shown. In this regard, directional terminology is used, such as, for example, top, bottom, front, back, leading, trailing, etc., with reference to the orientation of the described figure or figures. Since components of embodiments can be positioned in a number of different orientations, the directional terminology is used for purposes of illustration and is in no way limiting. It is clear that other embodiments can be used and structural or logical changes can be made without deviating from the scope of protection of the present invention. It is clear that the features of the different exemplary embodiments described herein can be combined with one another, unless specifically indicated otherwise elsewhere. The following extensive description should therefore not be interpreted to be limiting, and the scope of protection of the present invention is defined by the attached claims.

[0047] Within the scope of this description, the terms connected and coupled are used for describing both a direct as well as an indirect connection and a direct or an indirect coupling. In the figures, identical or similar elements are provided with identical reference numbers, to the extent this is appropriate.

[0048] In the method described here, the steps can be carried out in almost any arbitrary order without deviating from the principles of the invention if a temporal or functional sequence is not expressly mentioned. If it is explained in a patent claim that one step is carried out first and then multiple other steps are carried out one after the other, this is considered to mean that the first step is carried out before all the other steps, but the other steps can be carried out in any arbitrary, suitable order if a sequence has not been described within the other steps. Parts of claims, in which, for example, step A, step B, step C, step D and step E are carried out are considered to mean that step A is carried out first, step E is carried out last, and the steps B, C and D can be carried out in any arbitrary order between steps A and E, and the sequence falls within the formulated scope of protection of the claimed method. In addition, mentioned steps can be carried out simultaneously if an express wording in the claim does not state that they must be carried out separately. For example, one step can be carried out for carrying out X in the claim and one step for carrying out Y in the claim is carried out simultaneously within a single process, and the resultant process falls within the formulated scope of protection of the claimed method.

[0049] FIG. 1 shows a first embodiment of a microelectronic module 100 for cleaning a surface. The module 100 comprises a voltage converter 101 for converting a provided first voltage V1 into a higher, lower, or identical second voltage V2. The module 100 also comprises an actuator 102. The actuator 102 comprises at least one generator 103 for generating an ionic current, an electrical plasma, harmonic components and/or an electrostatic field from the second voltage v2 which is provided by the voltage converter 101. The voltage converter 101 and the actuator 102 of the module 100 are disposed on a thin-film, planar substrate 104. The voltage converter 101 and the actuator 102 of the module 100 are electrically coupled to one another. At least most of at least one object adhering to the surface is removed by means of the actuator 102. The module 100 can comprise a switching element (not illustrated) for the purpose of specifically activating and/or deactivating the actuator 103. In the embodiment shown, the module 100 receives the first voltage V1 from an external voltage source (not shown) to which the voltage converter 101 is connected. Alternatively, the voltage converter 101 can also be connected, for example, to a solar cell arrangement (not illustrated) which can be disposed on the substrate 104.

[0050] FIG. 2 shows one embodiment of a module array 200 comprising a plurality of microelectronic modules 201. Each of the microelectronic modules 201 comprises a voltage converter 202, a switching element 203, and an actuator 204 on a thin-film, planar substrate 205. Although each of the depicted modules 201 comprises a separate switching element 204, according to an alternative embodiment (not illustrated), a switching element 204 can also be provided for two or more modules 201. The multiple modules 201 can be connected to each other, for example, or they can exist independently of each other.

[0051] FIG. 3 shows one embodiment of an arrangement 300 of a plurality of microelectronic modules 301 on the surface of an aircraft 302. In the embodiment shown, multiple microelectronic modules 301 are arranged on the wings 303, 304 of the aircraft 302 in the region of the leading edge of the wing, in order to remove or at least reduce contaminants on the leading edge of the wing. The microelectronic modules 301 are connected to each other (not illustrated), in order to achieve an improvement of the cleaning effect.

[0052] FIG. 4 shows a flow chart 400 of one embodiment of a method for cleaning a surface by using at least one microelectronic module or at least one module array. In step 401, a first voltage is provided, which is converted into a second voltage which is higher than, lower than, or equal to the first voltage. In step 402, an ionic current, an electrical plasma, harmonic components and/or an electrostatic field are/is generated with the aid of the second voltage. In step 403, at least one object adhering to a surface of the module or the module array is removed by means of the generated ionic current, the electrical plasma, the harmonic waves and/or the electrostatic field.

[0053] Although the invention has been shown and described primarily with reference to certain embodiments, persons who are familiar with the technical field should understand that numerous modifications with respect to the embodiment and details can be made thereto without deviating from the nature and scope of the invention as defined by the attached claims. The scope of the invention is therefore determined by the attached claims, and it is therefore intended that all changes that fall within the literal scope or the doctrine of equivalents of the claims be included.

LIST OF REFERENCE NUMBERS

[0054] 100, 201, 301 Module [0055] 101, 202 Voltage converter [0056] 102, 204 Actuator [0057] 103 Generator [0058] 104, 205 Substrate [0059] 200 Module array [0060] 203 Switching element [0061] 300 Arrangement [0062] 302 Aircraft [0063] 303, 304 Wing [0064] 400 Flow chart [0065] 401-403 Method steps [0066] V1 First voltage [0067] V2 Second voltage