Method for manufacturing OLED device and OLED device manufactured therewith
09660209 ยท 2017-05-23
Assignee
Inventors
Cpc classification
H10K71/00
ELECTRICITY
B82Y40/00
PERFORMING OPERATIONS; TRANSPORTING
H10K85/111
ELECTRICITY
Y10S977/824
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H10K85/6572
ELECTRICITY
H10K85/1135
ELECTRICITY
H10K85/636
ELECTRICITY
Y10S977/89
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10S977/774
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
B82Y20/00
PERFORMING OPERATIONS; TRANSPORTING
H10K85/626
ELECTRICITY
H10K59/8722
ELECTRICITY
H10K50/115
ELECTRICITY
International classification
B82Y20/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
The present invention provides a method for manufacturing an OLED device and an OLED device manufactured therewith. The method for manufacturing an OLED device includes: (1) providing a substrate and forming, in sequence, an anode and a hole transporting layer on the substrate; (2) forming an emissive layer on the hole transporting layer through a solution film casting process, wherein the emissive layer comprises a red sub-pixel, a green sub-pixel, and a blue sub-pixel, of which at least one sub-pixel is formed of a quantum dot and at least one sub-pixel is formed of an organic light-emitting material; (3) forming, in sequence, an electron transporting layer and a cathode on the emissive layer; and (4) providing a package cover plate, which is set above the cathode, wherein the substrate and the package cover plate are bonded together by sealing enclosing resin to complete packaging of the OLED device. Since each sub-pixel of the emissive layer is formed through a solution film casting process, the manufacture of the OLED device requires no use of a fine metal mask so that the manufacturing cost is low, the utilization rate of material is high, and the yield rate is good.
Claims
1. A method for manufacturing an organic light-emitting diode (OLED) device, comprising: (1) providing a substrate and forming, in sequence, an anode and a hole transporting layer on the substrate; (2) forming an emissive layer on the hole transporting layer through a solution film casting process, wherein the emissive layer comprises a red sub-pixel, a green sub-pixel, and a blue sub-pixel, of which at least one sub-pixel is formed of a quantum dot and at least one sub-pixel is formed of an organic light-emitting material; (3) forming, in sequence, an electron transporting layer and a cathode on the emissive layer; and (4) providing a package cover plate, which is set above the cathode, wherein the substrate and the package cover plate are bonded together by sealing enclosing resin to complete packaging of the OLED device; wherein the anode, the hole transporting layer, the electron transporting layer, and the cathode are each formed through a vacuum thermal evaporation process and the electron transporting layer is formed of tris-(8-hydroxyquinolinato)aluminum and the hole transporting layer is formed of poly(triphenylamine) or poly(ethylenedioxythiophene).
2. The method for manufacturing the OLED device as claimed in claim 1, wherein the substrate comprises a thin-film transistor (TFT) substrate; the substrate and the package cover plate are formed of glass or a flexible material; and at least one of the substrate and the package cover plate is light transmittable.
3. The method for manufacturing the OLED device as claimed in claim 1, wherein in step (2), at least one of the sub-pixels is formed of a quantum dot and if the red sub-pixel is formed of a quantum dot, then the red sub-pixel is made by mixing an organic host material with a red quantum dot and a solvent, coating and volatizing to remove the solvent; if the green sub-pixel is formed of a quantum dot, then the green sub-pixel is made by mixing an organic host material with a green quantum dot and a solvent, coating and volatizing to remove the solvent; and if the blue sub-pixel is formed of a quantum dot, then the blue sub-pixel is made by mixing an organic host material with a blue quantum dot and a solvent, coating and volatizing to remove the solvent; the blue quantum dot comprises ZnCdS, CdSe/ZnS or nanometer SiN.sub.4, the green quantum dot comprising CdSe/ZnS or ZnSe:Cu.sup.2+, the red quantum dot comprising CdSe/CdS/ZnS; the organic host material comprises 4,4,4-tri(carbazol-9-yl)-triphenylamine or 2,4,6-tri(9H-carbazol-9-yl)-1,3,5-triazine; and the solvent comprises methanol, ethanol, chlorobenzene, or chloroform.
4. The method for manufacturing the OLED device as claimed in claim 1, wherein in step (2), at least one of the sub-pixels is formed of a quantum dot and if the red sub-pixel is formed of a quantum dot, then the red sub-pixel is made by mixing a red quantum dot with a surface coating agent and a solvent, coating and volatizing to remove the solvent; if the green sub-pixel is formed of a quantum dot, then the green sub-pixel is made by mixing a green quantum dot with a surface coating agent and a solvent, coating and volatizing to remove the solvent; and if the blue sub-pixel is formed of a quantum dot, then the blue sub-pixel is made by mixing a blue quantum dot with a surface coating agent and a solvent, coating and volatizing to remove the solvent; the surface coating agent comprises stearic acid, trioctylphosphine oxide, or poly(methyl methacrylate); the solvent comprises methanol, ethanol, water, chlorobenzene, or chloroform; and the blue quantum dot comprises ZnCdS, CdSe/ZnS or nanometer SiN.sub.4, the green quantum dot comprising CdSe/ZnS or ZnSe:Cu.sup.2+, the red quantum dot comprising CdSe/CdS/ZnS.
5. The method for manufacturing the OLED device as claimed in claim 1, wherein in step (2), the at least one of the sub-pixels being formed of a quantum dot is that the blue sub-pixel is formed of a quantum dot.
6. The method for manufacturing the OLED device as claimed in claim 1, wherein in step (2), at least one of the sub-pixels is formed of an organic light-emitting material and if the red sub-pixel is formed of an organic light-emitting material, then the red sub-pixel is made by mixing an organic host material with a red light emissive material and a solvent, coating and volatizing to remove the solvent; if the green sub-pixel is formed of an organic light-emitting material, then the green sub-pixel is made by mixing an organic host material with a green light emissive material and a solvent, coating and volatizing to remove the solvent; and if the blue sub-pixel is formed of an organic light-emitting material, then the blue sub-pixel is made by mixing an organic host material with a blue light emissive material and a solvent, coating and volatizing to remove the solvent; the blue light emissive layer comprises 9,10-di(beta-naphthyl)anthracene, the green light emissive layer comprising tris(2-phenylpyridine)iridium, the red light emissive layer comprising 4-(dicyanomethylene)-2-methyl-6-(4-dimethylaminostyryl)-4H-pyran; the organic host material comprises 4,4,4-tri(carbazol-9-yl)-triphenylamine or 2,4,6-tri(9H-carbazol-9-yl)-1,3,5-triazine; and the solvent comprises methanol, ethanol, chlorobenzene, or chloroform.
7. The method for manufacturing the OLED device as claimed in claim 1, wherein in step (2), the at least one of the sub-pixels being formed of an organic light-emitting material is that the red sub-pixel and the green sub-pixel are formed of organic light-emitting materials.
8. An OLED device manufactured with the method claimed in claim 1, comprising a substrate, an anode formed on the substrate, a hole transporting layer formed on the anode, an emissive layer formed on the hole transporting layer, an electron transporting layer formed on the emissive layer, a cathode formed on the electron transporting layer, a package cover plate arranged above the cathode, and sealing enclosing resin arranged between the substrate and the package cover plate to bond the substrate and the package cover plate together, the emissive layer comprising a red sub-pixel, a green sub-pixel, and a blue sub-pixel, wherein each of the sub-pixels is formed through a solution film casting process and wherein at least one of the sub-pixels is made of a quantum dot and at least one of the sub-pixels is made of an organic light-emitting material.
9. The OLED device as claimed in claim 8, wherein the blue sub-pixel is formed of a quantum dot and the red sub-pixel and the green sub-pixel are formed of organic light-emitting materials.
10. An OLED device manufactured with the method claimed in claim 1, comprising a substrate, an anode formed on the substrate, a hole transporting layer formed on the anode, an emissive layer formed on the hole transporting layer, an electron transporting layer formed on the emissive layer, a cathode formed on the electron transporting layer, a package cover plate arranged above the cathode, and sealing enclosing resin arranged between the substrate and the package cover plate to bond the substrate and the package cover plate together, the emissive layer comprising a red sub-pixel, a green sub-pixel, and a blue sub-pixel, wherein each of the sub-pixels is formed through a solution film casting process and wherein at least one of the sub-pixels is made of a quantum dot and at least one of the sub-pixels is made of an organic light-emitting material; wherein the blue sub-pixel is formed of a quantum dot and the red sub-pixel and the green sub-pixel are formed of organic light-emitting materials.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The technical solution, as well as other beneficial advantages, of the present invention will become apparent from the following detailed description of an embodiment of the present invention, with reference to the attached drawings.
(2) In the drawings:
(3)
(4)
(5)
(6)
(7)
(8)
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
(9) To further expound the technical solution adopted in the present invention and the advantages thereof, a detailed description is given to a preferred embodiment of the present invention and the attached drawings.
(10) Referring to
(11) Step 1: providing a and forming, in sequence, an anode 21 and a hole transporting layer 22 on the substrate 1.
(12) Step 2: forming an emissive layer 23 on the hole transporting layer 22 through a solution film casting process, wherein the emissive layer 23 comprises a red sub-pixel 231, a green sub-pixel 232, and a blue sub-pixel 233, of which at least one sub-pixel is formed of a quantum dot and at least one sub-pixel is formed of an organic light-emitting material.
(13) Step 3: forming, in sequence, an electron transporting layer 24 and a cathode 25 on the emissive layer 23.
(14) Step 4: providing a package cover plate 2, which is set above the cathode 25, wherein the substrate 1 and the package cover plate 2 are bonded together by sealing enclosing resin 3 to complete packaging of the OLED device.
(15) In Step 2, at least one of the sub-pixels is formed of a quantum dot. If the red sub-pixel 231 is formed of a quantum dot, then the red sub-pixel 231 can be made by mixing an organic host material with a red quantum dot and a solvent, coating and volatizing to remove the solvent; if the green sub-pixel 232 is formed of a quantum dot, then the green sub-pixel 232 can be made by mixing an organic host material with a green quantum dot and a solvent, coating and volatizing to remove the solvent; and if the blue sub-pixel 233 is formed of a quantum dot, then the blue sub-pixel 233 can be made by mixing an organic host material with a blue quantum dot and a solvent, coating and volatizing to remove the solvent.
(16) The organic host material comprises TCTA (4,4,4-tri(carbazol-9-yl)-triphenylamine) or TRZ (2,4,6-tri(9H-carbazol-9-yl)-1,3,5-triazine).
(17) The compound TCTA (4,4,4-tri(carbazol-9-yl)-triphenylamine) has a structural formula as follows:
(18) ##STR00001##
(19) The compound TRZ (2,4,6-tri(9H-carbazol-9-yl)-1,3,5-triazine) has a structural formula as follows:
(20) ##STR00002##
(21) The solvent may comprise methanol, ethanol, chlorobenzene, or chloroform.
(22) In Step 2, at least one of the sub-pixels is formed of a quantum dot. If the red sub-pixel 231 is formed of a quantum dot, then the red sub-pixel 231 can be made by mixing a red quantum dot with a surface coating agent and a solvent, coating and volatizing to remove the solvent; if the green sub-pixel 232 is formed of a quantum dot, then the green sub-pixel 232 can be made by mixing a green quantum dot with a surface coating agent and a solvent, coating and volatizing to remove the solvent; and if the blue sub-pixel 233 is formed of a quantum dot, then the blue sub-pixel 233 can be made by mixing a blue quantum dot with a surface coating agent and a solvent, coating and volatizing to remove the solvent.
(23) The blue quantum dot may comprises ZnCdS, CdSe/ZnS or nanometer SiN.sub.4. The green quantum dot may comprise CdSe/ZnS or ZnSe:Cu.sup.2+. The red quantum dot may comprise CdSe/CdS/ZnS.
(24) The surface coating agent may comprise a stearic acid, trioctylphosphine oxide, or poly(methyl methacrylate).
(25) The solvent may comprise methanol, ethanol, water, chlorobenzene, or chloroform.
(26) Preferably, in Step 2, the at least one of the sub-pixels being formed of a quantum dot is that the blue sub-pixel 233 is formed of a quantum dot.
(27) In the above-described method of using a quantum dot to form a sub-pixel, the organic host material and the surface coating agent provide a common effect that is to prevent aggregation and oxidization of the quantum dot. Since a quantum dot is a nanometer particle, which is a zero-dimensional material, and has great surface activity, it is easy to aggregate so as to lead to oxidization and quenching of fluorescence.
(28) In Step 2, at least one of the sub-pixels is formed of an organic light-emitting material. If the red sub-pixel 231 is formed of an organic light-emitting material, then the red sub-pixel 231 can be made by mixing an organic host material with a red light emissive material and a solvent, coating and volatizing to remove the solvent; if the green sub-pixel 232 is formed of an organic light-emitting material, then the green sub-pixel 232 can be made by mixing an organic host material with a green light emissive material and a solvent, coating and volatizing to remove the solvent; and if the blue sub-pixel 233 is formed of an organic light-emitting material, then the blue sub-pixel 233 can be made by mixing an organic host material with a blue light emissive material and a solvent, coating and volatizing to remove the solvent.
(29) The organic host material may comprise TCTA (4,4,4-tri(carbazol-9-yl)-triphenylamine) or TRZ (2,4,6-tri(9H-carbazol-9-yl)-1,3,5-triazine) and the solvent may comprise methanol, ethanol, water, chlorobenzene, or chloroform.
(30) The blue light emissive material may comprise 9,10-di(beta-naphthyl)anthracene (ADN), which has a structural formula as follows:
(31) ##STR00003##
(32) The green light emissive material may comprise tris(2-phenylpyridine)iridium (Ir(ppy).sub.3), which has a structural formula as follows:
(33) ##STR00004##
(34) The red light emissive material may comprise 4-(dicyanomethylene)-2-methyl-6-(4-di methylaminostyryl)-4H-pyran (DCM), which has a structural formula as follows:
(35) ##STR00005##
(36) Preferably, in Step 2, the at least one of the sub-pixels being formed of an organic light-emitting material is that the red sub-pixel 231 and the green sub-pixel 232 are formed of organic light-emitting materials.
(37) The substrate 1 can be a thin-film transistor (TFT) substrate. The substrate 1 and the package cover plate 2 are formed of glass or a flexible material. At least one of the substrate 1 and the package cover plate 2 is light-transmittable. Preferably, the substrate 1 and the package cover plate 2 are both made of glass sheets. The substrate 1 and the package cover plate 2 are bonded together by means of the sealing enclosing resin 3 to prevent invasion of external moisture and oxygen so as to seal and protect internal electronic components.
(38) The anode 21, the hole transporting layer 22, the electron transporting layer 24, and the cathode 25 are each formed through a vacuum thermal evaporation process so that no fine metal mask (FMM) is needed. Preferably, the electron transporting layer 24 is formed of tris-(8-hydroxyquinolinato)aluminum (Alq3) and the hole transporting layer 22 is formed of poly(triphenylamine) (poly-TPD) or poly(ethylenedioxythiophene) (PEDOT).
(39) Referring to
(40) The emissive layer 23 comprises a red sub-pixel 231, a green sub-pixel 232, and a blue sub-pixel 233, wherein each of the sub-pixels is formed through a solution film casting process and at least one of the sub-pixels is made of a quantum dot and at least one of the sub-pixels is made of an organic light-emitting material.
(41) Preferably, the blue sub-pixel 233 is made of a quantum dot and the red sub-pixel 231 and the green sub-pixel 232 are made of organic light-emitting materials.
(42) For at least one of the sub-pixels being formed of a quantum dot, if the red sub-pixel 231 is formed of a quantum dot, then the red sub-pixel 231 can be made by mixing an organic host material with a red quantum dot and a solvent, coating and volatizing to remove the solvent; if the green sub-pixel 232 is formed of a quantum dot, then the green sub-pixel 232 can be made by mixing an organic host material with a green quantum dot and a solvent, coating and volatizing to remove the solvent; and if the blue sub-pixel 233 is formed of a quantum dot, then the blue sub-pixel 233 can be made by mixing an organic host material with a blue quantum dot and a solvent, coating and volatizing to remove the solvent.
(43) The organic host material comprises TCTA (4,4,4-tri(carbazol-9-yl)-triphenylamine) or TRZ (2,4,6-tri(9H-carbazol-9-yl)-1,3,5-triazine).
(44) The compound TCTA (4,4,4-tri(carbazol-9-yl)-triphenylamine) has a structural formula as follows:
(45) ##STR00006##
(46) The compound TRZ (2,4,6-tri(9H-carbazol-9-yl)-1,3,5-triazine) has a structural formula as follows:
(47) ##STR00007##
(48) The solvent may comprise methanol, ethanol, chlorobenzene, or chloroform.
(49) For at least one of the sub-pixels being formed of a quantum dot, if the red sub-pixel 231 is formed of a quantum dot, then the red sub-pixel 231 can be made by mixing a red quantum dot with a surface coating agent and a solvent, coating and volatizing to remove the solvent; if the green sub-pixel 232 is formed of a quantum dot, then the green sub-pixel 232 can be made by mixing a green quantum dot with a surface coating agent and a solvent, coating and volatizing to remove the solvent; and if the blue sub-pixel 233 is formed of a quantum dot, then the blue sub-pixel 233 can be made by mixing a blue quantum dot with a surface coating agent and a solvent, coating and volatizing to remove the solvent.
(50) The blue quantum dot may comprises ZnCdS, CdSe/ZnS or nanometer SiN.sub.4. The green quantum dot may comprise CdSe/ZnS or ZnSe:Cu.sup.2+. The red quantum dot may comprise CdSe/CdS/ZnS.
(51) The surface coating agent may comprise a stearic acid, trioctylphosphine oxide, or poly(methyl methacrylate).
(52) The solvent may comprise methanol, ethanol, water, chlorobenzene, or chloroform.
(53) In the above-described process of using a quantum dot to form a sub-pixel, the organic host material and the surface coating agent provide a common effect that is to prevent aggregation and oxidization of the quantum dot. Since a quantum dot is a nanometer particle, which is a zero-dimensional material, and has great surface activity, it is easy to aggregate so as to lead to oxidization and quenching of fluorescence.
(54) For at least one of the sub-pixels being formed of an organic light-emitting material, if the red sub-pixel 231 is formed of an organic light-emitting material, then the red sub-pixel 231 can be made by mixing an organic host material with a red light emissive material and a solvent, coating and volatizing to remove the solvent; if the green sub-pixel 232 is formed of an organic light-emitting material, then the green sub-pixel 232 can be made by mixing an organic host material with a green light emissive material and a solvent, coating and volatizing to remove the solvent; and if the blue sub-pixel 233 is formed of an organic light-emitting material, then the blue sub-pixel 233 can be made by mixing an organic host material with a blue light emissive material and a solvent, coating and volatizing to remove the solvent.
(55) The organic host material may comprise TCTA (4,4,4-tri(carbazol-9-yl)-triphenylamine) or TRZ (2,4,6-tri(9H-carbazol-9-yl)-1,3,5-triazine) and the solvent may comprise methanol, ethanol, water, chlorobenzene, or chloroform.
(56) The blue light emissive material may comprise 9,10-di(beta-naphthyl)anthracene (ADN), which has a structural formula as follows:
(57) ##STR00008##
(58) The green light emissive material may comprise tris(2-phenylpyridine)iridium (Ir(ppy).sub.3), which has a structural formula as follows:
(59) ##STR00009##
(60) The red light emissive material may comprise 4-(dicyanomethylene)-2-methyl-6-(4-di methylaminostyryl)-4H-pyran (DCM), which has a structural formula as follows:
(61) ##STR00010##
(62) In the OLED device of the present invention, the substrate 1 can be a thin-film transistor (TFT) substrate. The substrate 1 and the package cover plate 2 are formed of glass or a flexible material. At least one of the substrate 1 and the package cover plate 2 is light-transmittable. Preferably, the substrate 1 and the package cover plate 2 are both made of glass sheets. The substrate 1 and the package cover plate 2 are bonded together by means of the sealing enclosing resin 3 to prevent invasion of external moisture and oxygen so as to seal and protect internal electronic components.
(63) The anode 21, the hole transporting layer 22, the electron transporting layer 24, and the cathode 25 are each formed through a vacuum thermal evaporation process so that no fine metal mask (FMM) is needed. Preferably, the electron transporting layer 24 is formed of tris-(8-hydroxyquinolinato)aluminum (Alq3) and the hole transporting layer 22 is formed of poly(triphenylamine) (poly-TPD) or poly(ethylenedioxythiophene) (PEDOT).
(64) Referring to
(65) In summary, the present invention provides a method for manufacturing an OLED device, wherein each of sub-pixels of an emissive layer is formed through a solution film casting process and an anode, a hole transporting layer, an electron transporting layer, and a cathode are formed through vacuum thermal evaporation processes, so that the method for manufacturing the OLED device requires no use of a fine metal mask thereby making the manufacturing cost incurring with the manufacturing method low, the utilization rate of material high, and the yield rate good; and with at least one sub-pixel of the emissive layer being formed of a quantum dot and at least one sub-pixel being formed of an organic light-emitting material, the manufacturing method according to the present invention, when compared with a manufacturing method where all sub-pixels are formed of quantum dots, has a relatively low manufacturing cost and, when compared with a manufacturing method where all sub-pixels are formed of organic light-emitting materials, provides an OLED device having a better performance. An OLED device manufactured with the present invention combines the advantages of a QD-OLED and a solution-film-cast OLED so as to possesses excellent performance, allowing for application to flat panel displays, televisions, and other fields of displaying.
(66) Based on the description given above, those having ordinary skills of the art may easily contemplate various changes and modifications of the technical solution and technical ideas of the present invention and all these changes and modifications are considered within the protection scope of right for the present invention.