SMART COOLING FAN SYSTEM

Abstract

A smart cooling fan system is disclosed, and comprises a first temperature sensor, a second temperature sensor, a first cooling fan connected to a main processor of an electronic device, a second cooling fan disposed in a housing case of the electronic device, and a microcontroller. The microcontroller is configured to, based on immediate fan rotation speed, find out a first volumetric flow rate and a second volumetric flow rate by looking up a CFM-RPM lookup table (LUT), a first PWM LUT and a second PWM LUT, the microcontroller controls the first cooling fan to produce a first airflow having the first volumetric flow rate, and also controls the second cooling fan to produce a second airflow having the second volumetric flow rate. As a result, the operating temperature of the main processor and an ambient temperature of the housing case are therefore immediately reduced.

Claims

1. A smart cooling fan system, being disposed in a housing case of an electronic device, and comprising: at least one first cooling fan, being disposed in the housing case, and being installed on or near at least one electronic chip; wherein said first cooling fan has a RPM signal outputting terminal and a PWM signal inputting terminal; at least one first temperature sensor, being disposed in the housing case for sensing a first temperature of the at least one electronic chip; at least one second cooling fan, being disposed in the housing case, and being used for exhausting a hot air produced in the housing case or feeding an external air into the housing case; wherein said second cooling fan also has a RPM signal outputting terminal and a PWM signal inputting terminal; at least one second temperature sensor, being disposed in the housing case for sensing a second temperature of an inner space of the housing case; and a microcontroller, having a memory and being selected from a group consisting of complex programmable logic device (CPLD) and field programmable gate array (FPGA), and being coupled to each said first temperature sensor, each said temperature sensor, the RPM signal outputting terminal and the PWM signal inputting terminal of each said first cooling fan, and the RPM signal outputting terminal and the PWM signal inputting terminal of each said second cooling fan; wherein the memory stores a plurality of lookup tables, and the plurality of lookup tables comprising: at least one first lookup table, recording a plurality of volumetric flow rates and a plurality of fan rotation speed corresponding to the plurality of volumetric flow rates; a second lookup table, recording L number of first duty cycle analogue values and L number of first temperature values corresponding to the L number of first duty cycle analogue values, L being an positive integer; and a third lookup table, also recording M number of second duty cycle analogue values and M number of second temperature values corresponding to the M number of second duty cycle analogue values, M being an positive integer; wherein during a normal operation of said first cooling fan and said second cooling fan, the microcontroller receiving a first immediate rotation speed of said first cooling fan and a second immediate rotation speed of said second cooling fan; wherein after receiving a data of the first temperature sensed by said first temperature sensor, the microcontroller finding out one said first duty cycle analogue value corresponding to the first temperature value from the second lookup table, and then generating and transmitting, according to the first duty cycle analogue value, a first PWM signal with a first duty cycle to the PWM signal inputting terminal of said first cooling fan, thereby controlling said first cooling fan to produce a first airflow with a first volumetric flow rate; wherein after receiving a data of the second temperature sensed by said second temperature sensor, the microcontroller finding out one said second duty cycle analogue value corresponding to the second temperature value from the third lookup table, and then generating and transmitting, according to the second duty cycle analogue value, a second PWM signal a with a second duty cycle to the PWM signal inputting terminal of said second cooling fan, thereby controlling said second cooling fan to produce a second airflow with a second volumetric flow rate.

2. The smart cooling fan system of claim 1, wherein said electronic chip is selected from a group consisting of CPU, GPU, digital signal processor (DSP), and application processor.

3. The smart cooling fan system of claim 2, wherein said first temperature sensor is a thermal diode coupled to said electronic chip.

4. The smart cooling fan system of claim 2, wherein said first temperature sensor is a thermal diode integrated in said electronic chip.

5. The smart cooling fan system of claim 1, wherein the electronic device is selected from a group consisting of server, cloud computing device, industrial computer, desktop computer, laptop computer, and all-in-one computer.

6. The smart cooling fan system of claim 1, wherein a readout chip is coupled the microcontroller, the RPM signal outputting terminal and the PWM signal inputting terminal of each said first cooling fan, and the RPM signal outputting terminal and the PWM signal inputting terminal of each said second cooling fan, such that the microcontroller receives the first immediate rotation speed of said first cooling fan and the second immediate rotation speed of said second cooling fan through the readout chip.

7. The smart cooling fan system of claim 1, further comprising: at least one third cooling fan, being disposed in the housing case, and being installed on or near at least one electronic module; wherein said third cooling fan also has a RPM signal outputting terminal and a PWM signal inputting terminal; at least one third temperature sensor, being disposed in the housing case for sensing a third temperature of the at least one electronic module; wherein the plurality of lookup tables further comprises a fourth lookup table, recording N number of third duty cycle analogue values and N number of third temperature values corresponding to the N number of third duty cycle analogue values, N being an positive integer; wherein during a normal operation of said third cooling fan, the microcontroller receiving a third immediate rotation speed of said third cooling fan; wherein after receiving a data of the third temperature sensed by said third temperature sensor, the microcontroller finding out one said third duty cycle analogue value corresponding to the third temperature value from the fourth lookup table, and then generating and transmitting, according to the third duty cycle analogue value, a third PWM signal with a third duty cycle to the PWM signal inputting terminal of said third cooling fan, thereby controlling said third cooling fan to produce a third airflow with a third volumetric flow rate.

8. The smart cooling fan system of claim 7, wherein the electronic module is selected from a group consisting of DRAM, hard disk drive and LED lighting device.

9. The smart cooling fan system of claim 2, wherein the microcontroller communicates with said electronic chip through a platform environment control interface (PECI), such that said electronic chip transmits the data of the first temperature sensed by the first temperature sensor to the microcontroller.

10. The smart cooling fan system of claim 3, wherein the microcontroller communicates with said electronic chip through a platform environment control interface (PECI), such that said electronic chip transmits the data of the first temperature sensed by the first temperature sensor to the microcontroller.

11. The smart cooling fan system of claim 7, further comprising a management unit coupled to a BIOS chip of the electronic device, wherein the management unit is used for communicating with an external electronic device, such that the external electronic device writes the at least one first lookup table, the second lookup table, the third lookup table, and the fourth lookup table into a storage space of the BIOS chip.

12. The smart cooling fan system of claim 11, wherein a register is adopted as the memory of the microcontroller, such that the at least one first lookup table, the second lookup table, the third lookup table, and the fourth lookup table are loaded into the memory from the storage space of the BIOS chip after the microcontroller is awakened.

13. The smart cooling fan system of claim 11, wherein the external electronic device is allowed to write a fan rotation speed controlling command into the storage space of the BIOS chip through the management unit, so as to make the microcontroller adjust the first volumetric flow rate of the first cooling fan, the second volumetric flow rate of the second cooling fan, and/or the third volumetric flow rate of the third cooling fan according to the fan rotation speed controlling command.

14. The smart cooling fan system of claim 11, wherein the management unit is selected from a group consisting of platform security processor (PSP) and Intel management engine (IME).

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The invention as well as a preferred mode of use and advantages thereof will be best understood by referring to the following detailed description of an illustrative embodiment in conjunction with the accompanying drawings, wherein:

[0038] FIG. 1 shows a first elevation view of a housing case accommodating a smart cooling fan system of the present invention therein;

[0039] FIG. 2 shows a first block diagram of the smart cooling fan system according to the present invention;

[0040] FIG. 3 shows a curve graph of CFM versus RPM;

[0041] FIG. 4 shows a second elevation view of the housing case accommodating the smart cooling fan system of the present invention therein; and

[0042] FIG. 5 shows a second block diagram of the smart cooling fan system according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0043] To more clearly describe a smart cooling fan system, embodiments of the present invention will be described in detail with reference to the attached drawings hereinafter.

First Embodiment

[0044] With reference to FIG. 1, there is a first elevation view of a housing case accommodating a smart cooling fan system of the present invention therein. As FIG. 1 shows, the smart cooling fan system 1 of the present invention is disposed in a housing case 21 of an electronic device, and comprises: at least one first cooling fan FA1, at least one second cooling fan FA2, at least one third cooling fan FA3, a readout chip 11, at least one first temperature sensor T1, at least one second temperature sensor T2, at least one third temperature sensor T3, and a microcontroller 13. According to the present invention, the at least one first cooling fan FA1 is disposed in the housing case 21, and is installed on or near at least one electronic chip 22 that is accommodated in the housing case 21, wherein said first cooling fan FA1 has a RPM signal outputting terminal and a PWM signal inputting terminal. In one embodiment, one said electronic chip 22 is a CPU, and another one said electronic chip 22 is GPU. It is known that, the operating temperature of the CPU (GPU) would vary dramatically with the CPU (GPU) utilization. For example, the CPU's operating temperature rises to 80-90 degrees Celsius or even more than 90 degrees Celsius in case of the CPU utilization is 60-80%. Of course, said electronic chip 22 can also be a digital signal processor (DSP) or an application processor in other practicable embodiments.

[0045] According to FIG. 1, the at least one second cooling fan FA2 is disposed in the housing case 21, and is used for regulating an inner ambient temperature of the housing case 21. Therefore, said second cooling fan FA2 is commonly disposed on a front-side plate or a rear-side plate of the housing case 21, and is arranged to face the inner space of the housing case 21 by an air-intake side thereof. Moreover, an air-exhausting side of said second cooling fan FA2 is exposed out of the housing case 21, such that said second cooling fan FA2 is controlled to exhaust a hot air produced in the housing case 21. On the other hand, by arranging said second cooling fan FA2 to face the inner space of the housing case 21 by the air-exhausting side, said second cooling fan FA2 can be controlled to feed an external air into the housing case 21. Similarly, said second cooling fan FA2 also has a RPM signal outputting terminal and a PWM signal inputting terminal.

[0046] As FIG. 1 shows, the at least one third cooling fan FA3 is disposed in the housing case 21, and is installed on or near at least one electronic module 23. In practicable embodiments, said electronic module 23 can be a DRAM, a hard disk drive and/or an LED lighting device accommodated in the housing case 21. Moreover, the said second cooling fan FA3 also has a RPM signal outputting terminal and a PWM signal inputting terminal. It needs to further explain that, this smart cooling fan system 1 can be integrated into any one type of electronic device, such as server, cloud computing device, industrial computer, desktop computer, laptop computer, and all-in-one computer.

[0047] Please continuously refer to FIG. 1, and simultaneously refer to FIG. 2 showing a first block diagram of the smart cooling fan system according to the present invention. According to FIG. 1 and FIG. 2, the readout chip 11 is coupled the microcontroller 13, the RPM signal outputting terminal of each said first cooling fan FA1, the RPM signal outputting terminal of each said second cooling fan FA2, and the RPM signal outputting terminal of each said third cooling fan FA3. It should be known that, commercial cooling fan is commonly designed to have four signal wires, including: DC voltage inputting wire, ground wire, PWM signal inputting wire, and RPM signal outputting wire. Therefore, foregoing descriptions have introduced that said first cooling fan FA1, said second cooling fan FA2 and said third cooling fan FA3 all have a RPM signal outputting terminal and a PWM signal inputting terminal. On the other hand, the at least one first temperature sensor T1 is disposed in the housing case 21 for sensing a first temperature of the at least one electronic chip 22, the at least one second temperature sensor T2 is disposed in the housing case 21 for sensing a second temperature of an inner space of the housing case 21, and the at least one third temperature sensor T3 is disposed in the housing case 21 for sensing a third temperature of the at least one electronic module 23.

[0048] According to FIG. 1 and FIG. 2, the microcontroller 13 is coupled to the readout chip 11 as well as the first temperature sensor T1, the second temperature sensor T2 and the third temperature sensor T3. Moreover, the microcontroller 13 is also coupled to the PWM signal inputting terminal of each said first cooling fan FA1, the PWM signal inputting terminal of each said second cooling fan FA2, and the PWM signal inputting terminal of each said third cooling fan FA3. Particularly, the memory 131 is designed to store a plurality of lookup tables, and the plurality of lookup tables comprises at least one first lookup table (LUT), a second LUT, a third LUT, and a fourth LUT, of which said first LUT records a plurality of volumetric flow rates (i.e., CFM values) and a plurality of fan rotation speed corresponding to the plurality of volumetric flow rates. Moreover, the second LUT records L number of first duty cycle analogue values (e.g., 0˜255) and L number of first temperature values corresponding to the L number of first duty cycle analogue values. On the other hand, the third LUT also records M number of second duty cycle analogue values and M number of second temperature values corresponding to the M number of second duty cycle analogue values. Besides, the fourth LUT also records N number of second duty cycle analogue values and N number of second temperature values corresponding to the N number of second duty cycle analogue values. L, M and N are all positive integer. FIG. 3 shows a curve graph of CFM versus RPM. Curve A in FIG. 3 is measured by completing following steps: inputting a constant DC voltage to the DC voltage inputting wire of a No. A cooling FAN having a maximum airflow capacity of 20 CFM; and adjusting the rotation speed of the cooling fan through time-by-time increasing the duty cycle of the PWM signal that is transmitted to the PWM signal inputting wire with a constant increment (e.g., 10%.fwdarw.20%.fwdarw., . . . , .fwdarw.100%). Similarly, curve B in FIG. 3 is measured by completing following steps: inputting a constant DC voltage to the DC voltage inputting wire of a No. B cooling FAN having a maximum airflow capacity of 40 CFM; and adjusting the rotation speed of the cooling fan through time-by-time increasing the duty cycle of the PWM signal that is transmitted to the PWM signal inputting wire with a constant increment (e.g., 10%.fwdarw.20%.fwdarw., . . . , .fwdarw.100%).

[0049] Moreover, curve C in FIG. 3 is measured by completing following steps: inputting a constant DC voltage to the DC voltage inputting wire of a No. C cooling FAN having a maximum airflow capacity of 60 CFM; and adjusting the rotation speed of the cooling fan through time-by-time increasing the duty cycle of the PWM signal that is transmitted to the PWM signal inputting wire with a constant increment (e.g., 10%.fwdarw.20%.fwdarw., . . . , .fwdarw.100%). According to FIG. 3, it is found that curves A-C have a first slope, a second slope and a third slope, respectively, of which the third slope is greater than the second slope, and the second slope is greater than the first slope. In other words, in case of making the duty cycle of the PWM signal rise from P % to Q % (e.g., 30%.fwdarw.50%), the airflow volume increment of the No. C cooling fan is larger than that of the No. B cooling fan, and the airflow volume increment of the No. B cooling fan is larger than that of the No. A cooling fan. It should be understood that, the airflow volume is directly correlated with the cooling ability (heat dissipation ability) of a cooling FAN.

[0050] Herein, it needs to further explain that, CFM stands for cubic feet per minute (it is also referred to as airflow). Put simply, CFM is how much air a fan moves. The measurement is taken when the cooling fan is on a specified speed and uses both the volume of air and the rate at which it moves. For example, a commercial CPU cooling fan (i.e., said first cooling fan FA1) has the maximum airflow capacity of 30-40 CFM, a commercial computer case fan (i.e., said second cooling fan FA2) has the maximum airflow capacity of 60-120 CFM, and a commercial DRAM cooling fan (i.e., said third cooling fan FA3) has the maximum airflow capacity of 20-25 CFM. Therefore, after measuring CFM-RPM curves of each said first cooling fan FA1, each said second cooling fan FA2 and each said cooling fan FA3, duty cycle-CFM curves of each said first cooling fan FA1, each said second cooling fan FA2 and each said cooling fan FA3, duty cycle-CFM are simultaneously obtained. Subsequently, a duty cycle-duty cycle analogue value lookup table (LUT) shown as follows can be generated according to one duty cycle-CFM curve.

TABLE-US-00001 TABLE (1) Duty cycle Duty cycle (%) analogue value 0 0 39 100 59 150 78 200 100 255

[0051] After obtaining the duty cycle-duty cycle analogue value LUT like above table (1), a duty cycle analogue value-temperature LUT can be further generated as follows.

TABLE-US-00002 TABLE (2) Duty cycle Temperature analogue value (° C.) 0  0-49 100 50-59 150 60-69 200 70-89 255 80-89

[0052] It needs to further explain that, number of the switching level of the duty cycle of a PWM signal is not limited to 5 like the above-presented table (2) shows. In a practicable embodiment, the number of the switching level of the duty cycle can be set to 5, 7, or 10. Therefore, after setting the number of the switching level of the duty cycle, it can further decide a quiet and energy-saving region and a high-efficiency heat dissipation region on FIG. 3. When the smart cooling fan system 1 is operated in the quiet and energy-saving region, each said first cooling fan FA1, each said second cooling fan FA2 and each said cooling fan FA3 are controlled to have corresponding CFM value and RPM value. Similarly, after each said first cooling fan FA1, each said second cooling fan FA2 and each said cooling fan FA3 are controlled to have CFM value b and RPM value, the smart cooling fan system 1 is operated in the high-efficiency heat dissipation region. Of course, the temperature range corresponding to each said switching level of the duty cycle is also settable according to a real application condition.

[0053] In summary, the memory 131 of the microcontroller 13 stores a first LUT (i.e., CFM-RPM LUT), a second LUT (i.e., duty cycle analogue values-temperature LUT), a third LUT (i.e., duty cycle analogue values-temperature LUT), and, a fourth LUT (i.e., duty cycle analogue values-temperature LUT). By such arrangements, during a normal operation of said first cooling fan FA1, said second cooling fan FA2 and said third cooling fan FA3, the microcontroller 13 receives a first immediate rotation speed of said first cooling fan FA1, a second immediate rotation speed of said second cooling fan FA2 and a third immediate rotation speed of said third cooling fan FA3 from the readout chip 11. Subsequently, after receiving a data of the first temperature sensed by said first temperature sensor T1, the microcontroller 13 find out one said first duty cycle analogue value corresponding to the first temperature value from the second LUT (e.g., table (2)), and then generates and transmits, according to the first duty cycle analogue value, a first PWM signal with a first duty cycle to the PWM signal inputting terminal of said first cooling fan FA1, thereby controlling said first cooling fan FA1 to produce a first airflow with a first volumetric flow rate (e.g. 20 CFM).

[0054] Moreover, after receiving a data of the second temperature sensed by said second temperature sensor T2, the microcontroller 13 finds out one said second duty cycle analogue value corresponding to the second temperature value from the third LUT, and then generates and transmits, according to the second duty cycle analogue value, a second PWM signal a with a second duty cycle to the PWM signal inputting terminal of said second cooling fan FA2, thereby controlling said second cooling fan FA2 to produce a second airflow with a second volumetric flow rate (e.g., 70 CFM). In addition, after receiving a data of the third temperature sensed by said third temperature sensor T3, the microcontroller 13 finds out one said third duty cycle analogue value corresponding to the third temperature value from the fourth LUT, and then generates and transmits, according to the third duty cycle analogue value, a third PWM signal with a third duty cycle to the PWM signal inputting terminal of said third cooling fan FA3, thereby controlling said third cooling fan FA3 to produce a third airflow with a third volumetric flow rate (e.g., 20 CFM).

[0055] As described in more detail below, the second LUT (e.g., table (2)) is set for being accessed by the microcontroller 13 so as to control the CFM value and the RPM value of the first cooling fan FA1, and the second LUT records L number of first duty cycle analogue values (e.g. 0˜255) and L number of first temperature values corresponding to the L number of first duty cycle analogue values. Moreover, the third LUT is set for being accessed by the microcontroller 13 so as to control the CFM value and the RPM value of the second cooling fan FA2, and the third LUT records M number of first duty cycle analogue values (e.g. 0˜255) and M number of first temperature values corresponding to the M number of first duty cycle analogue values. On the other hand, the fourth LUT is set for being accessed by the microcontroller 13 so as to control the CFM value and the RPM value of the third cooling fan FA3, and the fourth LUT records N number of first duty cycle analogue values (e.g. 0˜255) and N number of first temperature values corresponding to the N number of first duty cycle analogue.

[0056] As FIG. 1 and FIG. 2 show, the readout chip 11 is a decoder, and is configured for receiving a rotation speed sensing signal for the RPM signal outputting terminal of said first cooling fan FA1, said second cooling fan FA2 or said third cooling fan FA3, and then converting the rotation speed sensing signal to a corresponding digital data transmitted to the microcontroller 13. In a practicable embodiment, the microcontroller 13 can be a CPLD chip or a FPGA chip.

[0057] In other words, the microcontroller 13 acquires an immediate rotation speed from said first cooling fan FA1, said second cooling fan FA2 and said cooling fan FA3. Subsequently, after obtaining a first volumetric flow rate (i.e., CFM value for FA1), a second volumetric flow rate (i.e., CFM value for FA2) and a third volumetric flow rate (i.e., CFM value for FA3) by accessing a CFM-RPM lookup table (LUT), a first LUT, a second LUT and a third LUT, the microcontroller 13 controls the first cooling fan FA1 to produce a first airflow having the first volumetric flow rate, controls the second cooling fan FA2 to produce a second airflow having the second volumetric flow rate, and also controls the third cooling fan FA3 to produce a third airflow having the third volumetric flow rate. As a result, the operating temperature of the at least one electronic chip (i.e., CPU or GPU) 22, an ambient temperature of the housing case 21 and at least one electronic module (i.e., DRAM, HD, LED) 23 are therefore immediately reduced and well-controlled. For example, when the operating temperature of a CPU (i.e., one said electronic chip 22) abruptly rises to 80-90 degrees Celsius, the microcontroller 13 controls the three cooling fans (FA1, FA2, FA3) to immediately be operated in the high-efficiency cooling region, so as to reduce the operating temperature of the CPU in a short time period, thereby preventing the CPU from thermal shutdown. On the contrary, in case of the operating temperature of the CPU is decreasing with the CPU utilization, the microcontroller 13 controls the three cooling fans (FA1, FA2, FA3) to be immediately operated in the quiet and energy-saving region, so as to reduce noise of the three cooling fans (FA1, FA2, FA3) in a short time period.

[0058] In a real application case, the at least one first lookup table, the second lookup table, the third lookup table, and the fourth lookup table are stored in a storage space of the BIOS chip 24. Therefore, because a register is adopted as the memory 131 of the microcontroller 13, such that the at least one first lookup table, the second lookup table, the third lookup table, and the fourth lookup table are loaded into the memory 131 from the storage space of the BIOS chip 24 after the microcontroller 13 is awakened. It is worth explaining that, the microcontroller 13 selects and loads corresponding LUTs from the BIOS chip 24 into the register (i.e., memory 131) according to the model of the electronic chip 22 and the electronic module 23.

[0059] As described in more detail below, commercial CPU (GPU) is commonly coupled with a thermal diode, wherein this thermal diode is used for monitoring the operating temperature of the CPU (GPU). In such case, as FIG. 1 shows, two said electronic chips 22 are a CPU and a GPU, respectively, and two said first temperature sensors T1 includes a first thermal diode coupled to the CPU and a second thermal diode coupled to the GPU. Moreover, the microcontroller 13 communicates with the CPU and the GPU through PECI protocol, so as to receive a data of a CPU temperature sensed by the first thermal diode from the CPU as well as receive a data of a GPU temperature sensed by the second thermal diode from the GPU.

[0060] On the other hand, high-level CPU (GPU) is commonly integrated with a thermal diode therein. In such case, as FIG. 3 shows, two said electronic chip 22 are a CPU and a GPU, respectively, and two said first temperature sensors T1 includes a first thermal diode integrated in the CPU and a second thermal diode integrated in the GPU. Moreover, the microcontroller 13 communicates with the CPU and the GPU through PECI protocol, so as to receive a data of a CPU temperature sensed by the first thermal diode from the CPU as well as receive a data of a GPU temperature sensed by the second thermal diode from the GPU.

[0061] It is worth further explaining that, there is no need to calibrate the thermal diode (i.e., the first temperature sensor) integrated in a CPU (GPU) before utilizing the thermal diode to sense the operating temperature of the CPU (GPU). On the contrary, calibration is needed for the second temperature sensor T2 for monitoring the inner ambient temperature and the third temperature sensor T3 for monitoring the operating temperature of the electronic module 23. As described in more detail below, thermal resistor, having a base temperature (or called reference temperature), is adopted as the second temperature sensor T2 and the first temperature sensor, and it is necessary to calibrate the base temperature before utilizing the thermal resistor because the base temperature may vary with environment temperature.

Second Embodiment

[0062] With reference to FIG. 4, there is a second elevation view of the housing case accommodating the smart cooling fan system of the present invention therein. Moreover, FIG. 5 shows a second block diagram of the smart cooling fan system according to the present invention. After comparing FIG. 5 with FIG. 2, it is known that the second embodiment of the smart cooling fan system 1 further comprises a management unit 221 coupled to a BIOS chip 24 of the electronic device, wherein the management unit 221 is used for communicating with an external electronic device, such that the external electronic device writes the at least one first lookup table, the second lookup table, the third lookup table, and the fourth lookup table into a storage space of the BIOS chip 24. Because a register is adopted as the memory 131 of the microcontroller 13 (i.e., CPLD or FPGA), such that the at least one first lookup table, the second lookup table, the third lookup table, and the fourth lookup table are loaded into the memory 131 from the storage space of the BIOS chip 24 after the microcontroller 13 is awakened.

[0063] In a practicable embodiment, the management unit 221 can be a platform security processor (PSP) proposed by AMD or an Intel management engine (IME), wherein the PSP and the IME are both remote controllable. In other words, the external electronic device is allowed to write the at least one first LUT, the second LUT, the third LUT, and the fourth LUT into the storage space of the BIOS chip 24 through the management unit 221. In addition, the external electronic device is also allowed to write a fan rotation speed controlling command into the storage space of the BIOS chip 24 through the management unit 221, so as to make the microcontroller 13 adjust the first volumetric flow rate of the first cooling fan FA1, the second volumetric flow rate of the second cooling fan FA2, and/or the third volumetric flow rate of the third cooling fan FA3 according to the fan rotation speed controlling command.

[0064] Therefore, through the above descriptions, all embodiments of the smart cooling fan system according to the present invention have been introduced completely and clearly. Moreover, the above description is made on embodiments of the present invention. However, the embodiments are not intended to limit the scope of the present invention, and all equivalent implementations or alterations within the spirit of the present invention still fall within the scope of the present invention.