Electronic circuit boards fastened at a frame

09655256 ยท 2017-05-16

Assignee

Inventors

Cpc classification

International classification

Abstract

An electronic circuit, comprising at least three circuit boards (2.1, 2.2, 2.3) fastened at a frame (1) and electrically connected via contact pins (7) arranged therein, and an electric connection (11), connected to a third of the circuit boards (2.1). The circuit shall show a low structural space and here be cost-effective in its production and assembly. The circuit boards (2.1, 2.2, 2.3) are arranged in levels parallel in reference to each other and are fastened at a predetermined mutual distance at the frame (1), with bases (4, 5, 6) being embodied at the faces of the frame (1), with the ends being parallel to the faces of at least two of the bases (4, 5, 6) in one level, arranged in groups, and with the embodiment of the frame (1) and the circuit boards (2.1, 2.2, 2.3) being adjusted to each other.

Claims

1. An electronic circuit, comprising: a single frame; at least three circuit boards, fastened to the single frame and electrically connected via contact pins arranged therein and arranged in levels parallel in reference to each other and fastened at the frame at a predetermined mutual distance from one another; and an electric connection connected to a third of the circuit boards; the frame including a plurality of bases projecting from a first face of the frame, wherein at least a first group of at least two bases extends from the first face of the frame to a first level above the frame to connect to a middle of the three circuit boards, and at least a second group of at least two bases extends from the first face of the frame to a second level above the frame past the middle of the three circuit boards to connect to an upper of the three circuit boards, and wherein the first group of at least two bases are lower in height than the second group of at least two bases; the frame also including at least a third group of at least two bases projecting from a second face of the frame opposite the first face of the frame to a third level below the first and second levels to connect to a lower of the three circuit boards.

2. A circuit according to claim 1, wherein the contact pins are impressed contacts.

3. A circuit according to claim 1, wherein a plurality of LED is arranged on at least one of the circuit boards.

4. A circuit according to claim 1, wherein at least one block is formed at the frame.

5. A circuit according to claim 2, wherein a plurality of LED is arranged on at least one of the circuit boards.

6. A circuit according to claim 2, wherein at least one block is formed at the frame.

7. A circuit according to claim 3, wherein at least one block is formed at the frame.

8. A circuit according to claim 5, wherein at least one block is formed at the frame.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Reference is now made more particularly to the drawings, which illustrate the best presently known mode of carrying out the invention and wherein similar reference characters indicate the same parts throughout the views.

(2) FIG. 1: a side view of a circuit.

(3) FIG. 2: a perspective view of a frame.

(4) FIG. 3: a perspective, exploded illustration of the circuit.

DETAILED DESCRIPTION

(5) In the following detailed description numerous specific details are set forth in order to provide a thorough understanding of the invention. However, it will be understood by those skilled in the art that the present invention may be practiced without these specific details. For example, the invention is not limited in scope to the particular type of industry application depicted in the figures. In other instances, well-known methods, procedures, and components have not been described in detail so as not to obscure the present invention.

(6) As discernible from FIGS. 1 through 3, an electronic circuit comprises a frame 1, at which three circuit boards 2.1, 2.2, 2.3 are fastened with electric and/or electronic components.

(7) The frame 1 is embodied in one piece from walls 3, arranged in the form of a tetragon, here a trapeze. The walls 3 essentially show a constant thickness as well as a basic height.

(8) From a face of the frame 1, according to the figures a bottom one, seven first bases 4 project, with each of them extending over at least the entire thickness of the corresponding wall 3 and over a predetermined length. The first bases 4 show an identical low height, amounting to less than 1 mm, here. Upper ends of the first bases 4 are located in a first level parallel to the face. The number and length of the first bases 4 depend on the required contacts between the circuit boards 2.1, 2.2, 2.3 and a necessary mechanic stability of the circuit.

(9) Three second and four third bases 5, 6 are formed on an upper face of the frame 1 such that each of these bases 5, 6 is aligned to one of the first bases 4.

(10) The second bases 5 show identical, low heights. The upper ends of the second bases 5 are located in a second level. Penetrating bores are inserted into every other base 5, perpendicular to the faces of the frame 1 and penetrating the second base 5 as well as the allocated first base 4. Contact pins 7 are fastened in at least some of the penetrating bores.

(11) The third bases 6 show identical heights, and with e.g., 3 mm to 10 mm they are considerably greater than the heights of the second bases 5. Upper ends of the third bases 6 are located in a third level. Penetrating bores are inserted into every third of the bases 6, perpendicular in reference to the faces of the frame 1 and penetrating the third base 6 as well as the allocated first base 4. Contact pins 7 are fastened in at least some of the penetrating bores.

(12) The first, the second, and the third level are parallel.

(13) All bases 4, 5, 6, show a width equivalent to at least the thickness of the walls 3; a length of the bases 4, 5, 6 is sized according to the number of penetrating bores of the respective base 4, 5, 6, with a minimum distance of the penetrating bores being predetermined.

(14) A block 8 is formed at the frame 1, by which it is connected via two bars 9, pointing to the frame 1, to one of the walls 3. A bottom end of the block 8 is located in a first level, an upper end in a third level. Similar to the bases 4, 5, 6, penetrating bores are inserted into the block 8, with contact pins 7 being fastened in at least some of them. A width of the block 8 is approximately equivalent to the bases 4, 5, 6 and a length is determined based on the number of penetrating bores.

(15) In an alternative embodiment several blocks 8 are arranged. In another alternative, upper ends of the block 8 and/or the blocks 8 end in the second level. The bars 9 may point inwardly or outwardly, depending on whether the corresponding block 8 is arranged inside or outside the frame 1.

(16) Furthermore, fastening apertures 10 are arranged at the frame 1, in order to fasten the circuit, e.g., in a housing.

(17) Each of the circuit boards 2.1, 2.2, 2.3 is fastened in an allocated level. A plug 11 is fastened at a third of the circuit boards 2.3 and contacted for an electric connection of the circuit. A plurality of LED 13 is arranged on surfaces of the third and a first of the circuit boards 2.3, 2.1 such that light can be emitted from the finished assembled circuit in the same primary direction.

(18) In one alternative embodiment, the first bases 4 are omitted. The first circuit board 2.1 is then directly fastened on the bottom face.

(19) The frame 1 and the circuit boards 2.1, 2.2, 2.3 are adjusted to each other. This means that contact apertures 12 in the circuit boards 2.1, 2.2, 2.3 correspond to the contact pins 7 and that the circuit boards 2.1, 2.2, 2.3 show apertures according to the embodiment of the frame 1 in order to allow assembly of the circuit boards in the allocated levels.

(20) For the production of the circuit the frame 1 is produced together with the block 8 and the fastening apertures 10 from plastic in an injection molding process. Here, the contact pins 7 are either inserted into an appropriate mold prior to the injection molding process and injected into the frame 1, or they are shot into the frame 1.

(21) The first circuit board 2.1 is fastened on the first bases 4, at least partially projecting beyond the frame 1. For this purpose, the contact apertures 12, arranged corresponding to the contact pins 7 on the first circuit board 2.1, are pressed onto the contact pins 7. Here, the LED 13 show the same alignment as the first bases 4. This way, by way of compression, the contact pins 7 are cold welded to the contact apertures 12.

(22) Subsequently, the second circuit board 2.2 is pressed onto the other side of the frame 1 and here is cold welded. For this purpose, the second circuit board 2.2 is supported on the second bases 5.

(23) Finally, the third circuit board 2.3 is pressed onto the frame 1 such that it rests on the third bases 6. The LED 13 are arranged on the part of the third circuit board 2.3 projecting from the frame 1.

LIST OF REFERENCE CHARACTERS

(24) 1 Frame 2 Circuit board 3 Wall 4 First base 5 Second base 6 Third base 7 Contact pin 8 Block 9 Bar 10 Fastening aperture 11 Plug 12 Contact aperture 13 LED