Flip-chip Light Emitting Device and Fabrication Method

Abstract

A flip-chip light emitting device includes: a light-emitting epitaxial laminated layer with two opposite surfaces, in which, the first surface is a light-emitting surface; a first electrode and a second electrode that are separated from each other on the second surface of the light-emitting epitaxial laminated layer; a non-conductive substrate with two opposite surfaces and two side walls connecting those two surfaces, in which, the first surface is connected to the light-emitting epitaxial laminated layer through the first and the second electrodes; a first external electrode and a second external electrode on the second surface of the non-conductive substrate, which extend to the side walls of the non-conductive substrate till and at least cover parts of the side walls of the first and the second electrodes to form electrical connection.

Claims

1. A flip-chip light emitting device, comprising: a light-emitting epitaxial laminated layer with a first and a second opposing surfaces, wherein the first surface is a light-emitting surface; a first electrode and a second electrode separated from each other disposed over the second surface of the light-emitting epitaxial laminated layer; a non-conductive substrate with a first and a second opposing substrate surfaces and two side walls connecting the first and second substrate surfaces, wherein the first substrate surface is connected to the light-emitting epitaxial laminated layer through the first and the second electrodes; and a first external electrode and a second external electrode over the second substrate surface extending to the side walls of the non-conductive substrate and at least covering portions of side walls of the first and the second electrodes to form electrical connection.

2. The flip-chip light emitting device of claim 1, wherein: the light-emitting epitaxial laminated layer has a thinned single crystal substrate.

3. The flip-chip light emitting device of claim 1, wherein: edges of the first and the second electrodes extend beyond an edge of the light-emitting epitaxial laminated layer.

4. The flip-chip light emitting device of claim 1, wherein: edges of the first and the second electrodes extend beyond an edge of the light-emitting epitaxial laminated layer edge by 30 m or above, to thereby avoid short circuit of side walls of the light-emitting epitaxial laminated layer during fabrication of the first and the second external electrodes.

5. The flip-chip light emitting device of claim 1, wherein: a space between the first and the second electrodes is 40 m-150 m.

6. The flip-chip light emitting device of claim 1, wherein: the first and the second electrodes have an equal height.

7. The flip-chip light emitting device of claim 1, wherein: a plating seed layer is formed between the non-conductive substrate and the first and the second external electrodes and extends from a bottom of the non-conductive substrate to the side walls of the non-conductive substrate.

8. The flip-chip light emitting device of claim 7, wherein: the first and the second external electrodes are electroplated over the plating seed layer.

9. A fabrication method for a flip-chip light emitting device, the method comprising: (1) providing a light-emitting epitaxial wafer with two opposing surfaces, the wafer comprising a growth substrate and a light-emitting epitaxial laminated layer, wherein, a side surface of the growth substrate is a first surface; (2) determining a size of the light emitting device, and dividing the light-emitting epitaxial laminated layer into a series of light-emitting epitaxial units, and fabricating a first electrode and a second electrode that are electrically isolated on each light-emitting epitaxial unit; (3) providing a non-conductive substrate with a first and a second opposing substrate surfaces, and connecting the light-emitting epitaxial wafer to the first substrate surface in a flip-chip way; (4) cutting the non-conductive substrate to expose sides of the first and the second electrodes of each light-emitting epitaxial unit; (5) fabricating a first and a second external electrodes over the second substrate surface, wherein the first and second external electrodes extend to side walls of the non-conductive substrate and at least cover portions of the side walls of the first and the second electrodes from the second substrate surface to form electrical connection; and (6) singulating the light-emitting epitaxial wafer to form a flip-chip light emitting device; wherein the fabricated flip-chip light emitting device comprises: the light-emitting epitaxial laminated layer with the first and second opposing surfaces, wherein the first surface is a light-emitting surface; the first and second electrodes separated from each other disposed over the second surface of the light-emitting epitaxial laminated layer; the non-conductive substrate with the first and second opposing substrate surfaces and two side walls connecting the first and second substrate surfaces, wherein the first substrate surface is connected to the light-emitting epitaxial laminated layer through the first and the second electrodes; and the first and second external electrodes over the second substrate surface extending to the side walls of the non-conductive substrate and at least covering portions of side walls of the first and the second electrodes to form electrical connection.

10. The fabrication method of claim 9, wherein: in step 1), the growth substrate is a single crystal substrate.

11. The fabrication method of claim 9, wherein: edges of the first and the second electrodes formed in step (2) extend beyond an edge of the light-emitting epitaxial laminated layer.

12. The fabrication method of claim 9, wherein step (3) further comprises forming a metal bonding layer over the first substrate surface of the non-conductive substrate, and bonding the light-emitting epitaxial wafer on the non-conductive substrate in a flip-chip way.

13. The fabrication method of claim 9, wherein step (4) further comprises thinning the growth substrate prior to the cutting.

14. The fabrication method of claim 9, wherein step (5) further comprises forming a plating seed layer between the second substrate surface and the side walls of the non-conductive substrate, and electroplating the first and second external electrodes on the plating seed layer.

15. A light-emitting system comprising a plurality of light-emitting devices, each light-emitting device comprising: a light-emitting epitaxial laminated layer with a first and a second opposing surfaces, wherein the first surface is a light-emitting surface; a first electrode and a second electrode separated from each other disposed over the second surface of the light-emitting epitaxial laminated layer; a non-conductive substrate with a first and a second opposing substrate surfaces and two side walls connecting the first and second substrate surfaces, wherein the first substrate surface is connected to the light-emitting epitaxial laminated layer through the first and the second electrodes; and a first external electrode and a second external electrode over the second substrate surface extending to the side walls of the non-conductive substrate and at least covering portions of side walls of the first and the second electrodes to form electrical connection.

16. The system of claim 15, wherein: the light-emitting epitaxial laminated layer has a thinned single crystal substrate.

17. The system of claim 15, wherein: edges of the first and the second electrodes extend beyond an edge of the light-emitting epitaxial laminated layer.

18. The system of claim 15, wherein: edges of the first and the second electrodes extend beyond an edge of the light-emitting epitaxial laminated layer edge by 30 m or above, to thereby avoid short circuit of side walls of the light-emitting epitaxial laminated layer during fabrication of the first and the second external electrodes.

19. The system of claim 15, wherein: a space between the first and the second electrodes is 40 m-150 m.

20. The system of claim 19, wherein: the first and the second electrodes have an equal height; a plating seed layer is formed between the non-conductive substrate and the first and the second external electrodes and extends from a bottom of the non-conductive substrate to the side walls of the non-conductive substrate; and the first and the second external electrodes are electroplated over the plating seed layer.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings, which are included to provide a further understanding of the invention and constitute a part of this specification, together with the embodiments, are therefore to be considered in all respects as illustrative and not restrictive. In addition, the drawings are merely illustrative, which are not drawn to scale.

[0019] FIG. 1 is a side sectional view of a flip-chip light emitting device according to some embodiments.

[0020] FIG. 2 illustrates a first step of fabricating a flip-chip deep ultraviolet light emitting diode according to some embodiments.

[0021] FIG. 3 illustrates a second step of fabricating a flip-chip light emitting diode according to some embodiments.

[0022] FIG. 4 illustrates a third step of fabricating a flip-chip light emitting diode according to some embodiments.

[0023] FIG. 5 illustrates a fourth step of fabricating a flip-chip light emitting diode according to some embodiments.

[0024] FIG. 6 illustrates a fifth step of fabricating a flip-chip light emitting diode according to some embodiments.

[0025] FIG. 7 illustrates a sixth step of fabricating a flip-chip light emitting diode according to some embodiments.

[0026] FIG. 8 illustrates a seventh step of fabricating a flip-chip light emitting diode according to some embodiments.

[0027] FIG. 9 illustrates an eighth step of fabricating a flip-chip light emitting diode according to some embodiments.

[0028] FIG. 10 illustrates a ninth step of fabricating a flip-chip light emitting diode according to some embodiments.

[0029] FIG. 11 illustrates a tenth step of fabricating a flip-chip light emitting diode according to some embodiments.

[0030] FIG. 12 illustrates an eleventh step of fabricating a flip-chip light emitting diode according to some embodiments.

DETAILED DESCRIPTION

[0031] Further detailed description will be made to the invention with the following embodiments.

[0032] FIG. 1 is a cross-section structure diagram of a light emitting device according to Embodiment 1. The light emitting device comprises a transparent growth substrate 100, a light-emitting epitaxial laminated layer composed of a first semiconductor layer 101 and a second semiconductor layer 102, a first electrode 104 and a second electrode 105 connected to the first semiconductor layer 101 and the second semiconductor layer 102, a non-conductive substrate 200 connected to the light-emitting epitaxial laminated layer through the first and the second electrodes 104 and 105, a first epitaxial electrode 202 and a second epitaxial electrode 203 on the lower surface of the non-conductive substrate that extend to the side walls 200a and 200b of the non-conductive substrate till the side walls 104a and 105a of the first and the second electrodes to form a wrapped structure,

[0033] Wherein, the transparent growth substrate 100 is a thinned single-crystal substrate. In this embodiment, the growth substrate is an ultra AlN substrate and can form a 10 m-10 m thick roughening structure on the light-emitting surface. A PN junction is formed between the first semiconductor layer 101 and the second semiconductor layer 102. When the first semiconductor layer 101 is a p-type semiconductor, the second semiconductor layer 102 can be an n-type semiconductor in different electrical property and vice versa. As a preferred embodiment, a multiple-quantum well structure can be formed between the first semiconductor layer 101 and the second semiconductor layer as an active layer, which can be a neutral-type, a p-type or an n-type semiconductor. When the applied current passes through the light-emitting epitaxial laminated layer, light is emitted. When the light-emitting epitaxial laminated layer is made of nitride-based material, ultraviolet, blue or green light will be emitted; when made of AlInGaP-based material, red, orange or yellow light in amber color will be emitted. An reflective layer 103 made of Ni/Al/Ti/Pt is on the second semiconductor layer surface, for upwards reflecting the light from the upper light-emitting epitaxial laminated layer and emitting from the light-emitting surface.

[0034] The first electrode 104 is on the surface of the first semiconductor layer 101, and the second electrode 105 is on the surface of the reflective layer 103; the first and the second electrodes are about 0.5 m-5 m thick and space between them is 40 m-150 m; their ends far from the light-emitting epitaxial laminated layer are on a same plane (i.e., the first and the second electrodes 104 and 105 are of equal height), and extend towards and beyond two sides of the light-emitting epitaxial laminated layer respectively by 30 m or above. The first and the second electrodes 104 and 105 are made of any alloy comprising Cr, Ni, Co, Cu, Sn and Au; in preferred embodiments, a multi-structure like Cr/Pt/Au is adopted, and the top layer metal is Au.

[0035] An insulating layer 106 is filled in the gap between the first electrode 104 and the second electrode 105 and the gap between the first and the second electrodes 104 and 105 and the light-emitting epitaxial laminated layer to form a flat surface at the lower portion of the light-emitting epitaxial laminated layer. The insulating layer 106, on the one hand, guarantees electric isolation between the first and the second electrodes 104 and 105, and on the other hand, protects the light-emitting epitaxial laminated layer by forming a complete physical structure on the lower surface of the growth substrate 100. The insulating layer 106 can be made of SiO2, SOG, resin or photoresist.

[0036] A non-conductive substrate 200 is connected to the light-emitting epitaxial laminated layer through the first and the second electrodes 104 and 105, which is preferred to be made of heat-dissipating materials. In a preferred embodiment, a patterned metal bonding layer (not shown) is formed between the non-conductive substrate and the first and the second electrodes, which corresponds to and with area not more than 60% of the first and the second electrodes 104 and 105.

[0037] A first external electrode 202 and a second external electrode 203 are on the lower surface of the non-conductive substrate 200 and extend to the side walls 200a and 200b of the non-conductive substrate 200 till and at least cover parts of the side walls 104a and 105a of the first and the second electrodes 104 and 105 to wrap side walls 200a and 200b of the non-conductive substrate respectively and to form electrical connection with the first electrode 104 and the second electrode 105. The first and the second external electrodes are preferred to be 20m-200 m thick. In a preferred embodiment, a plating seed layer 201, preferably made of Ni/Pt/Au, is formed between the non-conductive substrate 200 and the first and the second external electrodes 202 and 203 that are electroplated on this plating seed layer 201.

[0038] FIGS. 2-12 illustrate the fabrication method for the flip-chip light emitting device as shown in FIG. 1.

[0039] As shown in FIG. 2, provide a growth substrate 100 and form a first semiconductor layer 101 and a second semiconductor layer 102 on the growth substrate 100 through epitaxial growth to form a light-emitting epitaxial wafer.

[0040] As shown in FIG. 3, determine the size of the light emitting device; remove parts of the first semiconductor layer 101 and the second semiconductor layer 102 to form a cutting channel 300 through etching, which divides this light-emitting epitaxial laminated layer into a series of light-emitting epitaxial units; etch part of the second semiconductor layer 202 of each light-emitting epitaxial unit to expose the surface 101a of the first semiconductor layer for electrode fabrication.

[0041] As shown in FIG. 4, fabricate an electrode reflective layer 103 on the second semiconductor layer 102 of each light-emitting epitaxial unit, and determine a first electrode region 104b and a second electrode region 105b on each light-emitting epitaxial unit; cover insulating layers 106a, 106b and 106c at side walls of each light-emitting epitaxial unit and other areas apart from the first and the second electrode regions.

[0042] As shown in FIG. 5, fabricate a first electrode 104 and a second electrode 105 on the first and the second electrode regions 104b and 105b of each light-emitting epitaxial unit, wherein, the fist electrode 104 is on the first semiconductor layer 101, and the end far from the light-emitting epitaxial laminated layer extends towards the outer side of the light-emitting epitaxial laminated layer to cover the surface of the insulating layer 106a, and the edge extends beyond the light-emitting epitaxial laminated layer edge; and the second electrode 105 is on the surface of the reflective layer 103, and the end far from the light-emitting epitaxial laminated layer extends towards the outer side of the light-emitting epitaxial laminated layer to cover the surface of the insulating layer 106c, and the edge extends beyond the light-emitting epitaxial laminated layer edge; and the first and the second electrodes 104 and 105 and the insulating layer 106b constitute a complete plane.

[0043] As shown in FIG. 6, provide a non-conductive substrate 200 and bond the light-emitting epitaxial wafer after the aforesaid processing on the non-conductive substrate 200 in a flip-chip way. In a preferred embodiment, a patterned metal bonding layer (not shown) is preset on the non-conductive substrate 200, which corresponds to and with area not more than 60% of the first and the second electrodes 104 and 105. In another preferred embodiment, the growth substrate 100 can be further thinned to 20 m-200 m and roughened.

[0044] As shown in FIGS. 7 and 8, a cutting channel 300a along the first direction cuts the non-conductive substrate 200 apart to expose the sides 104a and 105a of the first and the second electrodes of each light-emitting epitaxial unit. In this step, the non-conductive substrate 200 is divided into a series of modules, each being connected to a row of light-emitting epitaxial units respectively. In one embodiment, the first and the second electrodes 104 and 105 of each light-emitting epitaxial unit are distributed bilaterally, wherein, the first electrode 104 is at left of the cutting channel 300a at the first direction and the second electrode 105 is at right. In a preferred embodiment, the cutting channel 300a can be in regular trapezoid. After cutting, distance between light-emitting epitaxial laminated layer edges is preferred to be larger than 40 m.

[0045] As shown in FIG. 9, a plating seed layer 201 is formed at the side walls 200a and 200b on the bottom of each non-conductive substrate module close to the cutting channel 300a at the first direction. The plating seed layers 201 are formed at two ends in each non-conductive substrate module close to the cutting channel 300a at the first direction, which are separated from each other and correspond to the first and the second electrodes of the light-emitting epitaxial unit.

[0046] As shown in FIG. 10, electroplate a first external electrode 202 and a second external electrode 203 on the plating seed layer 201 through metal with good ductility like Cu, Au and Pt, and ensure that the middle of the cutting channel 300a at the first direction is separated, and the first and the second external electrodes are 20 m-200 m thick.

[0047] As shown in FIG. 11, cut the non-conductive substrate apart along the cutting channel 300b at the second direction.

[0048] As shown in FIG. 12, singulate the light-emitting epitaxial wafer after the aforesaid processing to form a flip-chip light emitting device.

[0049] Compared with the flip-chip light emitting devices with singulation bonding in prior art, full wafer processing is made possible in the fabrication method disclosed in the present invention, which requires no precise chip alignment and improves fabrication efficiency of flip chips. In addition, metal with good ductility bonds the submount to the chip to form a surface mounted and flip-chip light emitting device and greatly lowers package costs. During fabrication, the external electrodes are electroplated at the parallel direction with the first cutting direction to avoid risks like short circuit and electric leakage during anode and cathode package and bonding of chips.

[0050] All references referred to in the present disclosure are incorporated by reference in their entirety. Although specific embodiments have been described above in detail, the description is merely for purposes of illustration. It should be appreciated, therefore, that many aspects described above are not intended as required or essential elements unless explicitly stated otherwise. Various modifications of, and equivalent acts corresponding to, the disclosed aspects of the exemplary embodiments, in addition to those described above, can be made by a person of ordinary skill in the art, having the benefit of the present disclosure, without departing from the spirit and scope of the disclosure defined in the following claims, the scope of which is to be accorded the broadest interpretation so as to encompass such modifications and equivalent structures.