SYSTEM AND METHOD FOR REMOVING SUPPORT STRUCTURE FROM THREE-DIMENSIONAL PRINTED OBJECTS USING MICROWAVE ENERGY
20170129188 ยท 2017-05-11
Inventors
- Ron E. Dufort (Rochester, NY, US)
- Erwin Ruiz (Rochester, NY)
- Linn C. Hoover (Webster, NY, US)
- David K. Ahl (Rochester, NY, US)
- Patrick J. Howe (Fairport, NY, US)
- Andrew W. Hays (Fairport, NY, US)
Cpc classification
B33Y10/00
PERFORMING OPERATIONS; TRANSPORTING
B29C35/0805
PERFORMING OPERATIONS; TRANSPORTING
B29C2071/0045
PERFORMING OPERATIONS; TRANSPORTING
B33Y30/00
PERFORMING OPERATIONS; TRANSPORTING
B29C64/40
PERFORMING OPERATIONS; TRANSPORTING
B29C64/112
PERFORMING OPERATIONS; TRANSPORTING
B33Y80/00
PERFORMING OPERATIONS; TRANSPORTING
B29C71/04
PERFORMING OPERATIONS; TRANSPORTING
B33Y50/02
PERFORMING OPERATIONS; TRANSPORTING
International classification
B29C67/00
PERFORMING OPERATIONS; TRANSPORTING
B29C35/08
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A method of manufacturing a three-dimensional object facilitates the removal of support material from the object. The method includes moving the object to a position opposite a microwave radiator and operating the microwave radiator to change the phase of the support material from solid to liquid. A controller either monitors the expiration of a predetermined time period or a temperature of the object to determine when the microwave radiator operation is terminated. The microwave radiation does not damage the object because the support material has a dielectric loss factor that is greater than the dielectric loss factor of the object.
Claims
1. A system for producing a three-dimensional object comprising: a platen; a transport configured to move the platen; at least two ejector heads, one ejector head being configured to eject drops of a first material having a first dielectric loss factor towards the platen to form an object on the platen and at least one other ejector head being configured to eject drops of a second material having a second dielectric loss factor towards the platen to form support for the object; and a microwave radiator configured to irradiate the object and the support with microwave energy in response to the transport moving the platen to a position opposite the microwave radiator, the microwave energy heating the support to a temperature at which the support changes phase from a solid to a liquid so the support flows away from the object, the second dielectric loss factor being greater than the first dielectric loss factor.
2. The system of claim 1 further comprising: at least one controller operatively connected to the at least two ejector heads and the microwave radiator, the at least one controller being configured to: operate the one ejector head of the at least two ejector heads to eject drops of the first material having the first dielectric loss factor towards the platen to form the object on the platen; operate the other ejector head of the at least two ejector heads to eject drops of the second material having the second dielectric loss factor to form first portions of the support with the second material and to eject drops of a third material having a third dielectric loss factor towards the platen to form second portions of the support with the third material; and operate the microwave radiator to irradiate the object and the support with microwave energy to enable the second portions of the support containing the third material to begin to change phase from a solid to a liquid before the first portions of the support formed with the second material begin to change phase from a solid to a liquid, the third dielectric loss factor being greater than the second dielectric loss factor.
3. The system of claim 2, the at least one controller being further configured to operate the at least two ejector heads to form the first portions of the support with the second material on exterior areas of the object on the platen and to form the second portions of the support with the third material on interior areas of the object on the platen.
4. The system of claim 1 further comprising: a housing in which the microwave radiator is positioned, the housing having a first opening and a second opening; and at least controller operatively connected to the transport, the at least one controller being configured to operate the transport to move the platen with the object and the support to the position opposite the microwave radiator.
5. The system of claim 4, the platen further comprising: at least one opening through the platen to enable melted support to leave the platen.
6. The system of claim 5, the housing further comprising: a drain in a floor of the housing to enable the melted support that left the platen to flow out of the housing.
7. The system of claim 6 further comprising: a pump operatively connected to the drain to urge the melted support that left the platen to flow through the drain.
8. The system of claim 4, the at least one controller being further configured to: operate the transport to move the platen through the second opening of the housing to exit the housing in response to an expiration of a predetermined time period following activation of the microwave radiator.
9. The system of claim 4 further comprising: a non-contact temperature sensor configured to generate a signal indicative of a temperature of the object in the housing; and the at least one controller being operatively connected to the non-contact temperature sensor, the at least one controller being further configured to operate the transport to move the platen through the second opening of the housing to exit the housing in response to the signal generated by the non-contact temperature sensor reaching a predetermined temperature.
10. A method for producing a three-dimensional object comprising: operating a transport to move a platen; operating at least two ejector heads with at least one controller to eject drops of a first material having a first dielectric loss factor with one of the at least two ejector heads towards the platen to form an object on the platen and to eject drops of a second material having a second dielectric loss factor with the other of the at least two ejector heads towards the platen to form support for the object on the platen, the second dielectric loss factor being greater than the first dielectric loss factor; and operating a microwave radiator with the least one controller to irradiate the object and support with microwave energy in response to the transport moving the platen to a position opposite the microwave radiator, the microwave energy heating the support to a temperature at which the support changes phase from a solid to a liquid so the support flows away from the object.
11. The method of claim 10, the operation of the other ejector head of the at least two ejector heads further comprising: operating the other of the at least two other ejector heads with the at least one controller to eject drops of the second material having the second dielectric loss factor to form first portions of the support for the object on the platen with the second material and to eject drops of a third material having a third dielectric loss factor towards the platen to form second portions of the support with the third material so the operation of the microwave radiator to radiate the object and the support with microwave energy enables the second portions of the support to begin to change phase from a solid to a liquid before the first portions of the support begin to change phase from a solid to a liquid, the third dielectric loss factor being greater than the second dielectric loss factor.
12. The system of claim 11, the operation of the at least two ejector heads with the at least one controller further comprising: operating the other of the at least two ejector heads to form the first portions of the support with the second material on exterior areas of the object on the platen and to form the second portions of the support with the third material on interior areas of the object on the platen.
13. The method of claim 10 further comprising: operating the transport with the least one controller to move the platen through a first opening in a housing to position the platen opposite the microwave radiator.
14. The method of claim 13 further comprising: collecting melted support material on a floor of the housing that left the platen through at least one opening in the platen.
15. The method of claim 14 further comprising: evacuating the melted support material from the floor of the housing through a drain in the floor of the housing.
16. The method of claim 15 further comprising: pumping the melted support material through the drain with a pump operatively connected to the drain.
17. The method of claim 13 further comprising: operating the transport with the at least one controller to move the platen through a second opening in the housing to exit the platen from the housing in response to an expiration of a predetermined time period following activation of the microwave radiator.
18. The method of claim 13 further comprising: operating the transport with the at least one controller to move the platen through a second opening in the housing to exit the platen from the housing in response to a signal generated by a non-contact temperature sensor indicating a predetermined temperature has been reached.
19. An article of manufacture comprising: an object formed with a first material having a first dielectric loss factor; a portion of a support for the object formed with a second material having a second dielectric loss factor; and another portion of the support for the object formed with a third material having a third dielectric loss factor, the third dielectric loss factor being greater than the second dielectric loss factor and the second dielectric loss factor being greater than the first dielectric loss factor.
20. The article of manufacture of claim 19 wherein the portion of the support formed with the second material alone is located on an exterior of the object and the other portion of the support for the object formed with the second material having nanoparticles is located on an interior of the object.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] The foregoing aspects and other features of the method and printer are explained in the following description, taken in connection with the accompanying drawings.
[0008]
[0009]
[0010]
[0011]
[0012]
[0013]
DETAILED DESCRIPTION
[0014] For a general understanding of the environment for the method disclosed herein as well as the details for the method, reference is made to the drawings. In the drawings, like reference numerals designate like elements.
[0015]
[0016] The printer 100 includes a controller 120 operatively connected to at least the ejector head 108. The controller 120 is configured to operate the ejector head 108 with reference to object image data that has been rendered into layers that form a three-dimensional object on the platen surface 112. To form each layer of the three-dimensional object, the controller 124 operates the printer 100 to sweep the ejector head 108 one or more times in the process direction P, while ejecting drops of material onto the platen 104. In the case of multiple passes, the ejector head 108 shifts in the cross-process direction CP between each sweep. After each layer is formed, the ejector head 108 moves away from the platen 104 in the vertical direction V to begin printing the next layer.
[0017] In some embodiments, the printer 100 is sufficiently large to enable production runs comprising more than one part. Particularly, a plurality of parts can be printed in a single print job with each part being encapsulated by support material to form a block of material. In some embodiments, the controller 120 receives image data corresponding to a plurality of parts arranged in three-dimensional space with support material arranged between each of the parts to allow the plurality of parts to be printed as a single block. With reference to the image data, the controller 120 operates the ejector head 108 to form the plurality of parts in a single production run.
[0018] As shown in
[0019] The method 400 begins by removing the parts from the printer (block 404). The parts can be removed by lifting the parts 204 that contain support material 208 from the platen 104 or by moving the platen 104, which supports the parts 204 that contain the support material 208, out of the printer. If the parts require additional curing, they are exposed to the curing radiation or allowed to cool for solidification of the materials. Once the parts are cured, the bulk support material is removed using microwave energy (block 408). In previously known methods for removing bulk support material, the parts 204 are placed in a convection oven heated to a predetermined temperature at which the support material 208 changes from a solid phase to a liquid phase. For example, a convection oven can be heated to a temperature of 65 degrees Celsius to melt wax support material provided the part is left in the oven cavity for an amount of time adequate for the support material to reach the melting temperature. The part 204 containing wax support material is typically left in the heated cavity of a convection oven at a temperature of 65 degrees Celsius for approximately 60 to 120 minutes to enable the wax support material to melt and separate from the part 204. The temperature of the part 204 is typically monitored and the part 204 is removed from the oven in response to the temperature of the part reaching a predetermined threshold temperature that is below the temperature at which the build material of the part begins to deform. Because some of the support material may remain, the part 204 is further treated to remove the smaller remaining amounts of support material (block 412). In one embodiment, this further treatment includes submerging the part 204 in a rinse solution held at a predetermined temperature, for example, 60 degrees Celsius, and subjected to ultrasonic vibrations in the solution. The ultrasonic vibrations in this embodiment are applied for approximately 5 minutes. Once the vibrations are terminated, the part remains in the solution for another predetermined period of time, such as 2 minutes, before the part is removed from the support material bath and placed in a cleaning vat (block 416). The cleaning vat typically includes warm soapy water and ultrasonic vibrations are again applied to the part in the soapy water for another predetermined time period, such as 20 minutes. The part is then removed from the cleaning vat and dried (block 420). The drying can occur in ambient air or in a convection oven heated to a relatively mild temperature, such as 40 degrees Celsius.
[0020] A three-dimensional object production system 500 is shown in
[0021] The platen 104 is supported by a transport 508 that moves the block 200 with the parts 204 and the support material 208 from the position beneath the ejector head(s) 504 to the microwave heating station 520. The microwave heating station 520 includes the housing 512 having an ingress and egress to enable the transport 508 to move the block 200 into the housing 512 of the station 520 and then move the platen and the parts 204 out of the housing to the next processing station. Within the housing 512, a microwave radiator 516 is positioned to irradiate the block 200 with microwave energy while the transport 508 remains still to enable the block 200 to be subjected to the emitted microwave energy for a predetermined period of time or until the temperature of the parts 204 reach a temperature that indicates the part is approaching, but has not reached, a temperature that could damage the part. In the embodiment that monitors the part temperature, the non-contact temperature sensor 536 generates a signal indicative of the part temperature that the controller 580 compares to a predetermined temperature threshold. In one embodiment, the non-contact temperature sensor is a laser therometer. When the predetermined temperature threshold has been reached or the predetermined time period has expired, the controller 580 operates an actuator 540 that drives transport 508 to move the parts 204 out of the housing to the next processing station.
[0022] The platen 104 shown in
[0023] The above-described method and system are effective for removing support material from the parts when the support material has a dielectric loss factor that is greater than a dielectric loss factor of the build material. Dielectric loss factor is a measurement of the energy dissipated as heat by a material in an oscillating field. The dielectric loss factor of the support material enables the microwave energy to heat the support material and produce a phase change in the support material without significantly heating the build material of the part. Thus, the support material is melted and removed from the parts without damaging or adversely affecting the parts. Another advantage of using a support material that has a dielectric loss factor that is greater than the dielectric loss factor of the build material is that the support material and build material can have melting temperatures that are close to one another, but the difference in the dielectric loss factors of the two materials enables the support material to reach that temperature before the build material begins to approach the melting temperature.
[0024] It will be appreciated that variants of the above-disclosed and other features and functions, or alternatives thereof, may be desirably combined into many other different systems, applications or methods. Various presently unforeseen or unanticipated alternatives, modifications, variations, or improvements therein may be subsequently made by those skilled in the art, which are also intended to be encompassed by the following claims.