Speaker unit for a hearing aid device system, and hearing aid device system

Abstract

A speaker unit detachably mountable to a hearing aid device body configured to be positioned behind an ear of a wearer is disclosed. Further, hearing aid device system comprising the speaker unit is disclosed. The speaker unit comprises a contacting unit comprising at least one contact element and configured to be detachably mountable to a hearing aid device connector of said hearing aid device. The speaker unit further comprises a speaker unit body configured to be positioned at least partly in an ear canal of the wearer and comprising an output transducer unit configured to provide an acoustic signal based on an electrical signal input to said output transducer unit via said at least one contact element. The speaker unit further comprises a connecting unit provided between said speaker unit body and said contacting unit and including at least one wire configured to electrically connect said speaker unit body and said contacting unit. Further, the speaker unit comprises a memory unit configured to store data relating to said speaker unit.

Claims

1. A speaker unit detachably mountable to a hearing aid device body configured to be positioned behind an ear of a wearer, the speaker unit comprising: a contacting unit comprising at least one contact element and configured to be detachably mountable to a hearing aid device connector of said hearing aid device; a speaker unit body configured to be positioned at least partly in an ear canal of the wearer and comprising an output transducer unit configured to provide an acoustic signal based on an electrical signal input to said output transducer unit via said at least one contact element; a connecting unit provided between said speaker unit body and said contacting unit and including at least one wire configured to electrically connect said speaker unit body and said contacting unit; and a first printed circuit board arranged in the speaker unit body, wherein the first printed circuit board is arranged so that a length-wise direction of the first printed circuit board is arranged in a direction parallel to the length-wise direction of the speaker unit body and so that the first printed circuit board is located in a portion of the speaker unit body proximate said connecting unit.

2. The speaker unit according to claim 1, further comprising a second printed circuit board, wherein the first and second printed circuit boards are arranged perpendicular to each other.

3. The speaker unit according to claim 2, wherein said second printed circuit board is arranged on an opposite side of said output transducer unit with respect to an outlet of said output transducer unit.

4. The speaker unit according to claim 2, wherein one of said printed circuit boards is decoupled from the other at one or more frequencies via one or more decoupling elements configured to block and/or attenuate electrical signals at least certain frequencies or frequency range or ranges.

5. The speaker unit according to claim 4, wherein one or more of the decoupling elements is one of: a capacitor, an inductor, a coil, an electrical element constituting a filter, such as a low pass filter, a high-frequency choke element or other suitable element.

6. The speaker unit according to claim 1, further comprising: a memory unit configured to store data relating to said speaker unit.

7. The speaker unit according to claim 6, wherein said memory unit is arranged in said speaker unit body.

8. The speaker unit according to claim 6, wherein said data relating to said speaker unit comprises at least one of an output level of said output transducer, a right/left identification of said speaker unit, an output transducer size, a length of said connecting unit, output transducer calibration data, microphone data, an transducer type, information regarding output transducer capabilities, speaker unit type, information regarding speaker unit capabilities, a unique identifier of said speaker unit, a production date of said speaker unit, identification of a sensor, and a activation date of said speaker unit.

9. The speaker unit according to claim 1, wherein: said contacting unit comprises six contact elements including said at least one contact element and a tab, said six contact elements are distributed over a first side of said tab and/or a second side of said tab opposite to said first side of said tab, and said tab is configured to be received in a slot of said hearing aid device connector of said hearing aid device to thereby contact said six contact elements with corresponding contact surfaces of said hearing aid device connector of said hearing aid device.

10. The speaker unit according to claim 1, wherein said speaker unit body comprises at least one of a sensor and a microphone.

11. The speaker unit according to claim 1, wherein said connecting unit includes two receiver contact wires including said at least one wire, said two receiver contact wires being configured to conduct said electrical signal to be input to said output transducer unit.

12. The speaker unit according to claim 1, further comprising a multi-purpose audio and sensor system.

13. The speaker unit according to claim 1, further comprising a temperature sensor arranged to sense temperature of a skin part of an ear canal of a user when the speaker unit is mounted in the ear canal of the user.

14. The speaker unit according to claim 1, wherein said at least one contact element is formed by a contact pin, a contact pad, or a contact spring.

15. The speaker unit according to claim 1, wherein said connecting unit includes at least part of an antenna.

16. A hearing aid device system comprising: a hearing aid device body configured to be arranged behind an ear of a wearer and including an input transducer, a signal processor adapted to process a signal from the input transducer to compensate for the wearer's hearing loss, and a hearing aid device connector, and a speaker unit detachably mountable to the hearing aid device body, the speaker unit comprising: a contacting unit comprising at least one contact element and configured to be detachably mountable to said hearing aid device connector of said hearing aid device; a speaker unit body configured to be positioned at least partly in an ear canal of the wearer and comprising an output transducer unit configured to provide an acoustic signal based on an electrical signal input to said output transducer unit via said at least one contact element; a connecting unit provided between said speaker unit body and said contacting unit and including at least one wire configured to electrically connect said speaker unit body and said contacting unit; and a first circuit board arranged in the speaker unit body, wherein the first printed circuit board is arranged so that a length-wise direction of the first printed circuit board is arranged in a direction parallel to the length-wise direction of the speaker unit body and so that the first printed circuit board is located in a portion of the speaker unit body proximate said connecting unit.

17. The hearing aid according to claim 16, wherein an antenna is at least partly formed by a wire in the connecting unit.

18. The hearing aid according to claim 16, wherein the speaker unit further comprises a second printed circuit board, wherein the first and second printed circuit boards are arranged perpendicular to each other.

19. The hearing aid according to claim 18, wherein one of said printed circuit boards is decoupled from the other at one or more frequencies via one or more decoupling elements configured to block and/or attenuate electrical signals at least certain frequencies or frequency range or ranges.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The aspects of the disclosure may be best understood from the following detailed description taken in conjunction with the accompanying figures.

(2) The figures are schematic and simplified for clarity, and they just show details to improve the understanding of the claims, while other details are left out. Throughout, the same reference numerals are used for identical or corresponding parts. The individual features of each aspect may each be combined with any or all features of the other aspects. These and other aspects, features and/or technical effect will be apparent from and elucidated with reference to the illustrations described hereinafter in which:

(3) FIG. 1 illustrates a hearing aid device system;

(4) FIG. 2 illustrates a contacting unit;

(5) FIG. 3A illustrates a contacting unit;

(6) FIG. 3B illustrates the contacting unit;

(7) FIG. 4A illustrates a contacting unit;

(8) FIG. 4B illustrates the contacting unit;

(9) FIG. 5A illustrates a contacting unit;

(10) FIG. 5B illustrates the contacting unit;

(11) FIG. 6 illustrates a speaker unit;

(12) FIG. 7 illustrates a speaker unit;

(13) FIG. 8 illustrates a printed circuit board;

(14) FIG. 9A illustrates a speaker unit body;

(15) FIG. 9B illustrates the speaker unit body;

(16) FIG. 10A illustrates a speaker unit body;

(17) FIG. 10B illustrates the speaker unit body;

(18) FIG. 11A illustrates a speaker unit body; and

(19) FIG. 11B illustrates the speaker unit body.

(20) The detailed description set forth below in connection with the appended drawings is intended as a description of various configurations. The detailed description includes specific details for the purpose of providing a thorough understanding of various concepts. However, it will be apparent to those skilled in the art that these concepts may be practiced without these specific details. Several aspects of the apparatus and methods are described by various blocks, functional units, modules, components, circuits, steps, processes, algorithms, etc. (collectively referred to as “elements”). Depending upon particular application, design constraints or other reasons, these elements may be implemented using electronic hardware, computer program, or any combination thereof.

(21) The electronic hardware may include microprocessors, microcontrollers, digital signal processors (DSPs), field programmable gate arrays (FPGAs), programmable logic devices (PLDs), gated logic, discrete hardware circuits, and other suitable hardware configured to perform the various functionality described throughout this disclosure. Computer program shall be construed broadly to mean instructions, instruction sets, code, code segments, program code, programs, subprograms, software modules, applications, software applications, software packages, routines, subroutines, objects, executables, threads of execution, procedures, functions, etc., whether referred to as software, firmware, middleware, microcode, hardware description language, or otherwise.

(22) A hearing device may include a hearing aid that is adapted to improve or augment the hearing capability of a user by receiving an acoustic signal from a user's surroundings, generating a corresponding audio signal, possibly modifying the audio signal and providing the possibly modified audio signal as an audible signal to at least one of the user's ears. The “hearing device” may further refer to a device such as an earphone or a headset adapted to receive an audio signal electronically, possibly modifying the audio signal and providing the possibly modified audio signals as an audible signal to at least one of the user's ears. Such audible signals may be provided in the form of an acoustic signal radiated into the user's outer ear, or an acoustic signal transferred as mechanical vibrations to the user's inner ears through bone structure of the user's head and/or through parts of middle ear of the user or electric signals transferred directly or indirectly to cochlear nerve and/or to auditory cortex of the user.

(23) The hearing device is adapted to be worn in any known way. This may include i) arranging a unit of the hearing device behind the ear with a tube leading air-borne acoustic signals into the ear canal or with a receiver/loudspeaker arranged close to or in the ear canal such as in a Behind-the-Ear type hearing aid, and/or ii) arranging the hearing device entirely or partly in the pinna and/or in the ear canal of the user such as in a In-the-Ear type hearing aid or In-the-Canal/Completely-in-Canal type hearing aid, or iii) arranging a unit of the hearing device attached to a fixture implanted into the skull bone such as in Bone Anchored Hearing Aid or Cochlear Implant, or iv) arranging a unit of the hearing device as an entirely or partly implanted unit such as in Bone Anchored Hearing Aid or Cochlear Implant.

(24) In the description of the present disclosure below, the term “hearing aid device system” is used synonym to the hearing device described above.

(25) A “hearing system” refers to a system comprising one or two hearing devices, and a “binaural hearing system” refers to a system comprising two hearing devices where the devices are adapted to cooperatively provide audible signals to both of the user's ears. The hearing system or binaural hearing system may further include auxiliary device(s) that communicates with at least one hearing device, the auxiliary device affecting the operation of the hearing devices and/or benefitting from the functioning of the hearing devices. A wired or wireless communication link between the at least one hearing device and the auxiliary device is established that allows for exchanging information (e.g. control and status signals, possibly audio signals) between the at least one hearing device and the auxiliary device. Such auxiliary devices may include at least one of remote controls, remote microphones, audio gateway devices, mobile phones, public-address systems, car audio systems or music players or a combination thereof. The audio gateway is adapted to receive a multitude of audio signals such as from an entertainment device like a TV or a music player, a telephone apparatus like a mobile telephone or a computer, a PC. The audio gateway is further adapted to select and/or combine an appropriate one of the received audio signals (or combination of signals) for transmission to the at least one hearing device. The remote control is adapted to control functionality and operation of the at least one hearing devices. The function of the remote control may be implemented in a SmartPhone or other electronic device, the SmartPhone/electronic device possibly running an application that controls functionality of the at least one hearing device.

(26) In general, a hearing device includes i) an input unit such as a microphone for receiving an acoustic signal from a user's surroundings and providing a corresponding input audio signal, and/or ii) a receiving unit for electronically receiving an input audio signal. The hearing device further includes a signal processing unit for processing the input audio signal and an output unit for providing an audible signal to the user in dependence on the processed audio signal.

(27) The input unit may include multiple input microphones, e.g. for providing direction-dependent audio signal processing. Such directional microphone system is adapted to enhance a target acoustic source among a multitude of acoustic sources in the user's environment. In one aspect, the directional system is adapted to detect (such as adaptively detect) from which direction a particular part of the microphone signal originates. This may be achieved by using conventionally known methods. The signal processing unit may include amplifier that is adapted to apply a frequency dependent gain to the input audio signal. The signal processing unit may further be adapted to provide other relevant functionality such as compression, noise reduction, etc. The output unit may include an output transducer such as a loudspeaker/receiver for providing an air-borne acoustic signal transcutaneously or percutaneously to the skull bone or a vibrator for providing a structure-borne or liquid-borne acoustic signal. In some hearing devices, the output unit may include one or more output electrodes for providing the electric signals such as in a Cochlear Implant.

(28) Generally, according to the present disclosure, data is stored in a memory block which is arranged the speaker unit.

(29) The data may be general data about, for example, size, left/right arrangement, power level, and potential sensor or microphone applications, such as sensor type and/or numbers of sensors, which may respectively coincide with data printed on the box of the SU.

(30) This data can be stored in the memory by the manufacturer in connection with the final quality control.

(31) The data can also be individual test data from a supplier's final inspection of the SU. The data could include, for example, frequency response, maximum power output and distortion data which could be used for a more precise fitting of the hearing aid.

(32) The present disclosure allows more detailed information than a power level of the SU and thus, enables more precise application of the SU.

(33) Accordingly, embodiments of the present disclosure enable remote fitting. In remote fitting situation, when no hearing health care professional is present to warrant patient safety and optimum fitting, an automatic check if the correct speaker unit is applied to the correct amplifier is even more important. Risk of wrong fitting can result in undesirable fitting and in worst case situations result in too loud or too low sound level. The need for automatic detection is even more evident for end-users who are visual impaired.

(34) When storing information in the SU according to embodiments of the present disclosure, the amplifier unit can automatically adapt to the replacement SU, even if there are differences. It can also prevent the application of a SU that does not suit the end user.

(35) In addition, when speaker units have other features than emitting sound, e.g. sensor features or microphones, compatibility between the amplifier unit and the speaker unit can be checked according to embodiments of the present disclosure.

(36) Thus, embodiments of the present disclosure enable speaker units and corresponding hearing aid device systems, in which the speaker unit comprises only a receiver/transducer, in which the speaker unit comprises a receiver and at least one sensor, in which the speaker unit comprises a receiver and a microphone, and/or in which the speaker unit comprises a receiver, at least one sensor, a microphone and potentially any intelligence (e.g. a further processor) in the speaker unit, where the speaker units are exchangeable with each other while the hearing aid device system or the hearing aid device body thereof (a control element therein) is able to adapt its own signal output to the characteristics, purposes and abilities of the currently connected speaker unit.

(37) Now referring to FIG. 1 which illustrates a hearing aid device system according to an embodiment of the disclosure.

(38) The hearing aid device system 200 comprises a hearing aid device body 210 and a speaker unit 10 connectable (detachably mountable) to the hearing aid device body 210. In particular, a contacting unit 11 of the speaker unit 10 is connectable (detachably mountable) to a hearing aid device connector 211 of the hearing aid device body.

(39) The speaker unit further comprises a speaker unit body 12 and a connecting unit 13 connecting the speaker unit body 12 and the contacting unit 11.

(40) In other words, the speaker unit also referred to as speaker comprises a unit 11 (e.g. a plug) for connecting to the hearing aid housing (hearing aid device body) configured to be positioned behind the ear/pinna of the user, a body 12 (e.g. an in-the-ear part, speaker housing) holding the actual output transducer, and a unit 13 (e.g. connecting member/cable assembly/flexible member) connecting the other two parts 11 and 12 and holding wires for electrical connection between the speaker unit and the hearing aid housing.

(41) The in-the-ear part, which may be the speaker unit body as mentioned elsewhere, may be fitted with a flexible dome, either closed or open, so that it will not slip out of the hear canal and at the same time be comfortable to the user or be embedded in a mould shaped to fit the user's ear. This is most often done when a high amplification is needed and the exact fit ensures minimal risk of feedback at high levels.

(42) The connecting unit 13 is configured to establish contact to a mating connector 211 of the hearing aid device body 210. The hearing aid device body 210 may for example comprise an input transducer, not illustrated here, for receiving ambient sound and converting it to an electrical signal. The electrical signal may be processed in the hearing aid device body 210 by a signal processor, not illustrated, so as to compensate for a user's hearing loss. The processor provides a processed signal. The processing usually comprises one or more of frequency dependent amplification, frequency transpositioning, frequency compression, filtering etc.

(43) The speaker unit body 12 may for example comprises a receiver, not illustrated, and is configured to be positioned at or at least partly in an ear canal of a user. The receiver provides an acoustical output signal based on the processed signal. The connecting unit 13 connects the contacting unit 11 and the speaker unit body including the receiver. The connecting unit 13 may be a tube. Preferably, the connecting unit is a flexible tube or sleeve. The connecting unit 11 may comprise a number of conductors, e.g. wires. As illustrated later the number of conductors may be two or more.

(44) As there is no standard size for human ears, a variety of lengths of the connecting unit 13 may be provided, e.g. as a set of connecting elements 13 from which a best match is chosen. Further, not all users have the same need for types of receiver (included in the speaker unit 10), some users may need a high sound pressure level in order to hear, whereas others does not require the same level.

(45) For ensuring that the speaker unit 10 outputs a suitable signal to the user, a paring of the speaker unit 10 and the hearing aid device body 210, in particular (sound) processing/controlling components thereof, is advantageous. For this purpose a memory unit, here in the form of a micro-EEPROM is provided. The memory unit is provided in the speaker unit. The memory unit may be provided in the contacting unit 11 to reduce the need for additional conductors/wires in the connecting unit 13 needed to communicate with the memory unit to/from the hearing aid device body. However, alternatively, the memory unit may be provided in the speaker unit body 12.

(46) As a further alternative, a memory unit is provided in the contacting unit 11, and another memory unit is provided in the speaker unit body 12.

(47) When the speaker unit 10 is attached to the hearing aid device body 210, the electrical connection via the contacting unit 11/hearing aid device connector 211 enables the hearing aid device body 210 to read from the memory unit. Besides providing identification information, such as speaker type, and possibly left/right speaker unit identification, the memory unit is able to store information regarding speaker unit size and/or wire length, receiver calibration data, e.g. specifically measured transfer function/frequency response for the particular speaker unit, microphone data to improve directional performance. These data may be read by the hearing aid device body 210 from the memory unit. The data may be read each time the hearing aid device body 210 is powered on, but if the hearing aid device body 210 is able to detect that the speaker unit 10 has been detached in the period where the hearing aid device body 210 was not in operation, the need to read the data may be lessened. The hearing aid device body 210 preferably stores the last known speaker unit 10 connected to the hearing aid device body 210. The hearing aid device body 210 may then only confirm the identity of the speaker unit, e.g. by reading only part of the data stored in the memory unit, thereby shortening the time needed to read data. This could for instance be unique identification data.

(48) By the hearing aid device body 210 knowing specifics about e.g. the receiver (potentially included in the speaker unit body 12), the processor of the hearing aid device body 210 may be able to more accurately take into considerations about the transfer function of that particular receiver, thereby increasing the acoustic performance for the user.

(49) The hearing aid device connector 211 may be a socket having a number of conducting arms (or any other form of contacting surfaces), configured to establish electrical connection to electrically conductive contact elements of the contacting unit.

(50) The number of conducting arms (or any other form of contacting surfaces) match the number of electrically conductive contact elements of the contacting unit 11. However, such match in number is not mandatory. The contacting unit 11 may comprise a tab supporting the electrically conductive contact elements, and the tab may fit the socket provided by the hearing aid device connector 211. Such tab may be designed such that the tab could be inserted in either orientation. However, the tab may also be designed such that that there is only one way of inserting the tab into the socket.

(51) Now referring to FIG. 2 which illustrates a contacting unit according to an embodiment of the disclosure.

(52) As mentioned above, the memory unit may be provided in the contacting unit 11 or may be provided in the speaker unit body 12.

(53) FIG. 2 illustrates an embodiment of the present disclosure having the memory unit provided in the contacting unit.

(54) The contacting unit comprises a tab and three contact elements which are embodied as contact surfaces/pads/electrodes carried by the tab. Further three (or a different number of) contact elements may be provided at the opposite side of the tab.

(55) The contact elements may be connected to a printed circuit board (PCB) on which the memory unit is provided. However, the memory unit may be connected to (some of) the contact elements in another way. For example, connections within the contacting unit may be embodied by means of litz wires. The printed circuit board may embody the tab of the contacting unit.

(56) The contact elements may correspond to power and ground contacts and to I.sup.2C contacts as an I.sup.2C bus clock contact (SCL) and an I.sup.2C bus data contact (SDL).

(57) Further, some or all of the contact elements may be electrically connected (via the connecting unit 13, i.e., conducting parts of the connecting unit, e.g. wires) to the speaker unit body 12, in particular elements of the speaker unit body.

(58) Preferably, two wires dedicated to the transducer (receiver wires) are provided in the connecting unit.

(59) The memory unit may be a non-volatile random access memory (NVRAM).

(60) The contacting unit may be moulded.

(61) A housing of the contacting unit may be made by means of overmoulding or loose parts that are assembled.

(62) Now referring to FIG. 3A which illustrates a contacting unit according to an embodiment of the disclosure.

(63) As can be seen on FIG. 3A illustrating the contacting unit in a top view, the contact elements may be of a same length or may be of different lengths. Further, as can be seen in that Figure, besides the memory unit illustrated as the square in the middle of the contacting unit 11, further electronic components may be provided in the contacting unit.

(64) If a printed circuit board is provided in the contacting unit, the memory unit and the further electronic components may be provided on a same side of the printed circuit board.

(65) The further electronic components may be diodes. Preferably, the further electronic components are electrostatic discharge diodes

(66) Now referring to FIG. 3B which illustrates the contacting unit according to an embodiment of the disclosure.

(67) FIG. 3B illustrates the contacting unit of FIG. 3A in a side view. As can be seen in FIG. 3B, the memory unit and the further electronic components may be provided on a same side of the printed circuit board.

(68) As can be further seen in this Figure, the connecting unit may not extent axially from the contacting unit (i.e. parallel to the printed circuit board) but instead may extend in an angled manner.

(69) The angle, if any, is however not limited to the illustrated angle.

(70) Now referring to FIG. 4A which illustrates a contacting unit according to an embodiment of the disclosure.

(71) As can be seen on FIG. 4A illustrating the contacting unit in a top view, the memory unit and the further electronic components do not have to be arranged in a symmetric manner.

(72) Now referring to FIG. 4B which illustrates the contacting unit according to an embodiment of the disclosure.

(73) FIG. 4B illustrates the contacting unit of FIG. 4A in a side view. As can be seen in FIG. 4B, the memory unit and the further electronic components may be provided on different (opposite) sides of the printed circuit board. If more than two elements are arranged on the printed circuit board, these may be arbitrarily distributed over two opposite sides of the printed circuit board.

(74) Now referring to FIG. 5A which illustrates a contacting unit according to an embodiment of the disclosure.

(75) As mentioned above, the memory unit may be provided in the contacting unit 11 or may be provided in the speaker unit body 12.

(76) FIG. 5A illustrates an embodiment of the present disclosure in a top view having the memory unit not provided in the contacting unit.

(77) Hence, further electronic components may be arbitrarily distributed over one side or over two opposite sides of the printed circuit board without the memory unit.

(78) Different arrangements and different orientations of the elements provided in the contacting unit lead to different outer dimensions of the contacting unit, allowing an adjustment of the outer dimensions of the contacting unit to the needs, e.g. dimensions allowed by the hearing aid device body and in particular the hearing aid device connector thereof.

(79) Now referring to FIG. 5B which illustrates the contacting unit according to an embodiment of the disclosure.

(80) FIG. 5B illustrates the contacting unit of FIG. 5A in a side view. As can be seen in FIG. 5B, the memory unit is not provided in the contacting unit, and the further electronic components are provided on one side of the printed circuit board. However, as mentioned above, the further electronic components may be arbitrarily distributed over two opposite sides of the printed circuit board without the memory unit.

(81) Now referring to FIG. 6 which illustrates a speaker unit according to an embodiment of the disclosure.

(82) As mentioned above, the memory unit may be provided in the contacting unit 11 or may be provided in the speaker unit body 12.

(83) FIG. 6 illustrates an embodiment of the present disclosure having the memory unit provided in the speaker unit body.

(84) In particular, the speaker unit body illustrated in FIG. 6 comprises a receiver and optionally a sensor with an I.sup.2C-interface and in addition the memory unit embodied as NVRAM.

(85) In such case, the connecting unit 13 includes two wires dedicated to the transducer (receiver wires). Further, the connecting unit 13 includes a power wire, a ground wire, an I.sup.2C bus clock wire and an I.sup.2C bus data wire which may be combined as I.sup.2C related wires.

(86) The wires included in the connecting unit connect respective contact elements of the contacting unit with respective terminals of the electronic elements in the speaker unit body including the transducer and the memory unit.

(87) Now referring to FIG. 7 which illustrates a speaker unit according to an embodiment of the disclosure.

(88) FIG. 7 again illustrates an embodiment of the present disclosure having the memory unit provided in the speaker unit body.

(89) In particular, the speaker unit body illustrated in FIG. 7 comprises a multi-purpose audio and sensor system with data acquisition/MCU/DSP, i.e., may embody an intelligent speaker unit. The speaker unit body may further comprise the memory unit embodied as NVRAM. Any of the elements included in the speaker unit body may communication via an I.sup.2C-interface.

(90) In such case, the connecting unit 13 includes for example five wires including a power wire, a ground wire, and at least a data wire. Wires included in the connecting unit may be combined as I.sup.2C related wires.

(91) The wires included in the connecting unit connect respective contact elements of the contacting unit with respective terminals of the electronic elements in the speaker unit body.

(92) Now referring to FIG. 8 which illustrates a printed circuit board according to an embodiment of the disclosure.

(93) As can be seen on FIG. 8, a printed circuit board according to embodiments of the present disclosure, whether provided in the contacting unit or in the speaker unit body, may support contact elements like electrodes or pads (e.g. solder pads). Further, the memory unit may be provided on the printed circuit board. Further electronic components may be provided on the printed circuit board as well. In addition, sensors just like a temperature sensor may be provided on the printed circuit board. The sensor may be accompanied with a sensor-to-I.sup.2C-module.

(94) The printed circuit board is not limited to a one-side assembled board. Elements may be provided on both opposite sides of the printed circuit board. Further, the printed circuit board may be a single-layer board or a two-layer board. The printed circuit board may be a multi-layer board. The printed circuit board may be coated or insulated in another form.

(95) Now referring to FIG. 9A which illustrates a speaker unit body according to an embodiment of the disclosure. In FIG. 9A, the left end of the speaker unit body corresponds to a sound outlet on which a dome may be mounted. The right end corresponds to an opening in the speaker unit body where a transition between the speaker unit body and the connecting unit is arranged.

(96) FIG. 9A illustrates one option of accommodation of a printed circuit board including the memory unit (e.g. the printed circuit board illustrated in FIG. 8) in the speaker unit body.

(97) In particular, the printed circuit board may be arranged behind (i.e. on a back of) the transducer with respect to an outlet of the transducer.

(98) The printed circuit board may be arranged behind the transducer/receiver but distanced from the transducer.

(99) When a temperature is arranged on the printed circuit board, the sensor is consequently located at a (rear) end of the speaker unit body. Thus, the temperature sensor will likely measure the air temperature outside the ear.

(100) The position of the printed circuit board as illustrated in FIG. 9A enables implementation of an easy wiring.

(101) Alternatively, the printed circuit board may be arranged on the transducer/receiver. Such arrangement would require additional (e.g. six, dependent on the wires in the connecting unit and the contact elements of the contacting unit) solder pads. Such arrangement may be preferably selected in case no (temperature) sensor is provided on the printed circuit board.

(102) Now referring to FIG. 9B which illustrates the speaker unit body according to an embodiment of the disclosure.

(103) FIG. 9B particularly illustrates the arrangement of the printed circuit board behind the transducer/receiver as explained with reference to FIG. 9A when seen from the (rear) end of the speaker unit body.

(104) Now referring to FIG. 10A which illustrates a speaker unit body according to an embodiment of the disclosure.

(105) FIG. 10A illustrates another option of accommodation of a printed circuit board including the memory unit (e.g. the printed circuit board illustrated in FIG. 8) in the speaker unit body, where the printed circuit board is as well arranged behind (i.e. on a back of) the transducer with respect to an outlet of the transducer.

(106) However, as can be seen in FIG. 10A, a temperature sensor is located at front of the transducer and is connected to the printed circuit board by means of a flexible electric connection, e.g. a flat flexible cable (FFC).

(107) According to such arrangement, the temperature sensor has access to the air in front of the dome. In other words, the temperature sensor will measure the air temperature inside the ear potentially with variation of receiver heating and only minor influence of the outside environment.

(108) However, the printed circuit board or at least the temperature sensor may be exposed to the in-ear-climate and may thus be specifically capsuled.

(109) Underfill material has excellent characteristics with respect to heat transfer and protection of surface mounter devices (SMD).

(110) Now referring to FIG. 10B which illustrates the speaker unit body according to an embodiment of the disclosure.

(111) FIG. 10B illustrates the speaker unit body of FIG. 10A in a top view.

(112) Thus, in FIG. 10B, the course of the connection between the temperature sensor in front of the transducer and the printed circuit board behind the transducer (e.g. the FFC) is specifically well perceptible.

(113) Now referring to FIG. 11A which illustrates a speaker unit body according to an embodiment of the disclosure.

(114) FIG. 11A illustrates another option of accommodation of a printed circuit board including the memory unit (e.g. the printed circuit board illustrated in FIG. 8) in the speaker unit body, where the printed circuit board is arranged on a side of the transducer.

(115) With this arrangement, a temperature sensor placed on the printed circuit board is arranged on a side of the speaker unit body.

(116) A temperature sensor arranged this way will measure the ambient temperature in the ear canal potentially including receiver heating and minor influence of the outside environment.

(117) Now referring to FIG. 11B which illustrates the speaker unit body according to an embodiment of the disclosure and in particular a top view of the speaker unit body illustrated in FIG. 11A.

(118) As used, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well (i.e. to have the meaning “at least one”), unless expressly stated otherwise. It will be further understood that the terms “includes,” “comprises,” “including,” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It will also be understood that when an element is referred to as being “connected” or “coupled” to another element, it can be directly connected or coupled to the other element but an intervening elements may also be present, unless expressly stated otherwise. Furthermore, “connected” or “coupled” as used herein may include wirelessly connected or coupled. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items. The steps of any disclosed method is not limited to the exact order stated herein, unless expressly stated otherwise.

(119) It should be appreciated that reference throughout this specification to “one embodiment” or “an embodiment” or “an aspect” or features included as “may” means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the disclosure. Furthermore, the particular features, structures or characteristics may be combined as suitable in one or more embodiments of the disclosure. The previous description is provided to enable any person skilled in the art to practice the various aspects described herein. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects.

(120) The claims are not intended to be limited to the aspects shown herein, but is to be accorded the full scope consistent with the language of the claims, wherein reference to an element in the singular is not intended to mean “one and only one” unless specifically so stated, but rather “one or more.” Unless specifically stated otherwise, the term “some” refers to one or more.

(121) Accordingly, the scope should be judged in terms of the claims that follow.