BONDING METHOD WITH CURING BY REFLECTED ACTINIC RAYS

Abstract

A method of making a device having a component with a planar surface bonded to a supporting frame with openings therein by an adhesive layer cured by actinic rays, wherein part of the adhesive layer lies in the shadow of opaque portions of the supporting frame, involves bringing the component and supporting frame together with a layer of adhesive applied between them. The part of the adhesive layer in the shadow of the opaque portions is cured by directing actinic rays obliquely through the openings so that they are reflected internally into the part of the adhesive layer in the shadow of the opaque portions.

Claims

1. A method of making an integrated device having a component with a planar surface bonded to a supporting frame with openings therein by an adhesive layer cured by actinic rays, wherein part of the adhesive layer lies in the shadow of opaque portions of the supporting frame, comprising: bringing the component and the supporting frame together with a layer of adhesive applied between them; and curing the part of the adhesive layer in the shadow of the opaque portions by directing actinic rays obliquely through the openings so that they are reflected internally into the part of the adhesive layer in the shadow of the opaque portions.

2. The method as claimed in claim 1, wherein the component with a planar surface comprises a glass carrier.

3. The method as claimed in claim 2, wherein an opaque substrate is stacked on top of the glass carrier, and the actinic rays are reflected off the opaque substrate.

4. The method as claimed in claim 3, wherein the opaque substrate is adhered to the glass carrier by a further adhesive layer, and parts of said further adhesive layer lying in the shadow of said opaque portions are cured by actinic rays reflected off the opaque substrate.

5. The method as claimed in claim 1, wherein the supporting frame is in the form of a grid defining said openings.

6. The method as claimed in claim 5, wherein said openings are square.

7. The method as claimed in claim 1, wherein the actinic rays are ultraviolet rays.

8. The method as claimed in claim 1, wherein the adhesive layer is an epoxy adhesive layer.

9. The method as claimed in claim 1, wherein said device forms part of an X-ray detector.

10. An integrated device comprising: a component with a planar surface bonded to a supporting frame with openings therein by an adhesive layer cured by actinic rays, wherein part of the adhesive layer lies in the shadow of opaque portions of the supporting frame; and wherein the part of the part of the adhesive layer in the shadow of the opaque portions is cured by actinic rays reflected internally within the device.

11. The device as claimed in claim 10, wherein the supporting frame is in the form of a grid defining said openings.

12. The device as claimed in claim 11, wherein said openings are square.

13. The device as claimed in claim 10, which is an X-ray detector.

14. The method as claimed in claim 4, wherein the supporting frame is in the form of a grid defining said openings.

15. The method as claimed in claim 6, wherein the actinic rays are ultraviolet rays.

16. The method as claimed in claim 7, wherein the adhesive layer is an epoxy adhesive layer.

17. The method as claimed in claim 8, wherein said device forms part of an X-ray detector.

18. The device as claimed in claim 10, wherein the actinic rays are ultraviolet rays.

19. The device as claimed in claim 10, wherein the adhesive layer is an epoxy adhesive layer.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The invention will now be described in more detail, by way of example only, with reference to the accompanying drawings, in which:

[0010] FIG. 1 is a bottom view of a support frame for a sub-assembly of an integrated device; and

[0011] FIG. 2 is a section along the line A-A in FIG. 1.

DESCRIPTION OF EMBODIMENTS OF THE INVENTION

[0012] FIG. 1 shows a generally planar aluminum support frame 1 for a large X-ray detector. The support frame 1 is of unitary construction and comprises a metal grid of orthogonal grid members 3, 4 defining rectangular openings 2 in the support frame 1 surrounded by a marginal portion 5. The support frame 1 provides the required mechanical strength for the device.

[0013] A glass carrier 6 is glued onto the support frame 1 by means of a layer of adhesive layer 7, which in this example is an epoxy adhesive, that needs curing by exposure to actinic rays in the form of ultraviolet light. An example of such an adhesive is EPO-TEK OG116-31.

[0014] A non-transparent silicon substrate 8 forming part of the optical stack is glued on top of the glass carrier layer 6 by means of an adhesive layer 9, preferably also an epoxy adhesive, which is also curable by exposure to actinic rays in the form of ultraviolet light at very high energy levels. The layer of epoxy adhesive is typically 80-150 microns thick.

[0015] An FOS/FOP fiber optic scintillator layer (not shown) is glued on top of the non-transparent silicon substrate 8 by another adhesive layer (not shown). This latter adhesive layer is a thermally curable adhesive.

[0016] Since the silicon substrate 8 is non transparent to ultraviolet light, the ultraviolet light must be launched into the sub-assembly after application of the adhesive layers through the openings 2 in the support frame 1. The problem is that the grid members 3, 4, mask the overlying parts of the adhesive layers. The grid members of the support frame 1 create shadows 11 within the adhesive layers. In one example the size of shadows is about 20 mm in the horizontal direction.

[0017] These shadows 11 prevent the uncured adhesive from receiving an adequate exposure, and as a result the adhesive may be improperly cured.

[0018] In order to overcome this problem, ultraviolet light, which in the illustrated non-limiting example, is collimated, is directed obliquely into the sub-assembly from collimated sources 12 as shown by arrows 13. The rays are reflected off the surface of the opaque silicon substrate 8 into the shadow regions of the adhesive layers 7, 9, although they could also be reflected from other interfaces within the stack by total internal reflection. The parts of the layer 7 within the shadow region 11 the benefit the most from the reflected rays since they are the regions that are the most masked by the grid members 3 of the frame.

[0019] Using this technique, lateral curing can be achieved, the amount of which depends on the thickness of the glass carrier. Up to 19 mm lateral curing was observed with the glass carrier using a glass carrier thickness of 2 mm, but this can be increased by increasing the thickness of the glass carrier 6.

[0020] Alternatively, instead of the collimated sources 12, an extended source 14, such as a flatbed source containing multiple sources 15 can be employed to ensure that the ultraviolet light is reflected back into the shadow regions.