SOLDERING PUMP

Abstract

A soldering pump for pumping an electrically conductive fluidin particular, a liquid soldersaid soldering pump having a feed channel which travels at least in segments along a circular path and has an inlet and an outlet, and having a device for generating a moving magnetic field, wherein the device comprises at least one permanent magnet, wherein the device is designed such that the permanent magnet is moved along the feed channel during operation.

Claims

1. Soldering pump (10, 100, 200) for pumping an electrically conductive fluid, including a liquid solder, having a feed channel (14) which travels at least in segments along a circular path (12) and has an inlet (16) and an outlet (18), and having a device (20) for generating a moving magnetic field, characterized in that the device (20) comprises at least one permanent magnet (22) and that the device (20) is designed such that the at least one permanent magnet (22) is moved along the feed channel (14) during operation.

2. Soldering pump (10, 100, 200) according to claim 1, characterized in that the at least one permanent magnetic (22) or ferromagnetic material (34) is arranged on a side of the feed channel (14) that faces away from the permanent magnet (22). (Currently amended) Soldering pump (10, 100, 200) according to claim 1, characterized in that the device (20) is designed such that, during operation, the at least one permanent permanent magnet (22) rotates about an axis of rotation (35) arranged concentrically relative to the circular path (12).

4. Soldering pump (10, 100, 200) according to claim 1, characterized in that at least two permanent magnets (22) are provided that are arranged such that the at least two permanent magnets (22) face toward the feed channel (14) with different magnetic poles (24, 26).

5. Soldering pump (10, 100, 200) according to claim 1, characterized in that a plurality of permanent magnets (22) is provided that alternately face toward the feed channel (14) with different magnetic poles (24, 26).

6. Soldering pump (10, 100, 200) according to claim 4, characterized in that the at least two permanent magnets (22) are arranged on a circular magnet path (23).

7. Soldering pump (10, 100, 200) according to claim 6, characterized in that the circular magnet path (23) is arranged concentrically relative to the circular path (12) of the feed channel (14).

8. Soldering pump (10, 100, 200) according to claim 1, characterized in that the feed channel (14) is delimited by a ferromagnetic material (34) on its side facing away from the permanent magnet (22).

9. Soldering pump (10, 100, 200) according to claim 1, characterized in that the feed channel (14) is delimited by a non-ferromagnetic material (30) on its side facing toward the at least one permanent magnet.

10. Soldering pump (10, 100, 200) according to claim 1, characterized in that the at least one permanent magnet (22) is arranged axially below the feed channel (14).

11. Soldering pump (10, 100, 200) according to claim 1, characterized in that the at least one permanent magnet (22) is arranged radially inward next to the feed channel (14).

12. Soldering pump (10, 100, 200) according to claim 1, characterized in that the at least one permanent magnet (22) is arranged radially outward next to the feed channel (14).

13. Soldering pump (10, 100, 200) according to claim 3, characterized in that an electric motor is provided, wherein the at least one permanent magnet (22) can be driven by the electric motor to rotate about the axis of rotation (35).

14. Soldering pump (10, 100, 200) according to claim 1, characterized in that the inlet (16) and the outlet (18) are arranged at ends of the feed channel (14) that face away from one another.

15. Soldering pot, including a selective soldering pot for a soldering system for selective wave soldering, comprising a soldering pump (10, 100, 200) according to claim 1.

16. Method for operating a soldering pump (10, 100, 200) according to claim 1, characterized in that the method comprises generating a magnetic field between the magnetic (22) or ferromagnetic material (34) and the permanent magnet (22) and generating, by moving the permanent magnet (22) along the feed channel (14), an eddy current in the electrically conductive fluid such that the electrically conductive fluid is moved along the circular path (12) within the feed channel (14).

17. Soldering pump (10, 100, 200) according to claim 2, characterized in that the device (20) is designed such that, during operation, the at least one permanent permanent magnet (22) rotates about an axis of rotation (35) arranged concentrically relative to the circular path (12).

18. Soldering pump (10, 100, 200) according to claim 2, characterized in that at least two permanent magnets (22) are provided that are arranged such that the at least two permanent magnets (22) face toward the feed channel (14) with different magnetic poles (24, 26).

19. Soldering pump (10, 100, 200) according to claim 2, characterized in that a plurality of permanent magnets (22) is provided that alternately face toward the feed channel (14) with different magnetic poles (24, 26).

20. Soldering pump (10, 100, 200) according to claim 5, characterized in that the at least two permanent magnets (22) are arranged on a circular magnet path (23).

Description

[0026] Additional details and advantageous embodiments of the invention are to be taken from the description below, by reference to which the embodiments of the invention illustrated in the figures are described and explained in more detail.

[0027] The figures show:

[0028] FIG. 1 a lateral view in section of a first embodiment of a soldering pump according to the invention;

[0029] FIG. 2 a plan view of a feed channel of the soldering pump according to FIG. 1;

[0030] FIG. 3 a plurality of permanent magnets, arranged on a disk, of the soldering pump according to FIG. 1;

[0031] FIG. 4 a lateral view in section of a second embodiment of a soldering pump according to the invention;

[0032] FIG. 5 a longitudinal section through the soldering pump according to FIG. 4;

[0033] FIG. 6 a lateral view in section of a third embodiment of a soldering pump according to the invention; and

[0034] FIG. 7 a plan view in section of the soldering pump according to FIG. 6.

[0035] FIG. 1 shows a lateral view in section of a first embodiment of a soldering pump 10 according to the invention. The soldering pump 10 is designed to convey an electrically conductive fluidin particular, to convey a liquid solder. Such a soldering pump 10 may, for example, be installed in a soldering pot of a system for selective wave soldering to convey the liquid solder. However, such a soldering pot is not illustrated in the figures.

[0036] The soldering pump 10 comprises a feed channel 14 which travels at least in segments along a circular path 12 and has an inlet 16 and an outlet 18. A plan view of the feed channel 14 of the soldering pump 10 is shown in FIG. 2. The inlet 16, the outlet 18, as well as the circular path 12, can be seen clearly. The inlet and the outlet 18 are arranged on ends of the feed channel 14 that face away from one another.

[0037] The soldering pump 10 furthermore comprises a device 20 for generating a rotating magnetic field. This device 20 comprises at least one permanent magnet 22. In the embodiment according to FIGS. 1 through 3, the soldering pump 10 or the device 20 comprises a plurality of permanent magnets 22 which alternately face the feed channel 14 with different magnetic poles.

[0038] Such an arrangement of a plurality of permanent magnets 22 can be clearly seen in the plan view of FIG. 3. The permanent magnets 22 are arranged on a circular magnet path 23 which is arranged concentrically relative to the circular path 12 of the feed channel 14. The alternately arranged permanent magnets 22 can be clearly seen, wherein a permanent magnet 22 is respectively arranged with its south pole 26 upward, i.e., facing toward the feed channel 14, and the permanent magnet arranged next to it is respectively arranged with its north pole 24 upward. The permanent magnets 22 in FIG. 3 are mounted on a magnet disk 28, which can also be clearly seen in FIG. 1.

[0039] As can be seen in FIG. 1, the feed channel 14 is delimited by a non-ferromagnetic material 30 into which a groove 32 is introduced. This groove 32 is closed by a ring 34 made of ferromagnetic material, wherein the feed channel 14 as a whole is delimited by the ferromagnetic material 30 and the ring 34.

[0040] The device 20 for generating a moving magnetic field is designed such that, during operation, the permanent magnets 22 rotate about an axis of rotation 35 arranged concentrically relative to the circular path 12 or the circular magnet path 23. By rotating the permanent magnets 22 arranged axially (parallel to the direction of the axis of rotation 35) below the feed channel 14, a rotating magnetic field which forms between the magnetic or ferromagnetic material 34 and the permanent magnets 22 can be generated in the feed channel 14. By means of the rotating magnetic field, eddy currents can be generated in an electrically conductive fluidin particular, in a liquid solderduring operation of the soldering pump 10. By generating the eddy currents, the electrically conductive fluid or the liquid solder can be accelerated in a direction of rotation, illustrated by the arrow 36 in FIG. 1 or by the arrows 38 in FIG. 2, along the feed channel 14 traveling at least in segments along the circular path 12, and a pumping effect of the soldering pump 10 can thus be provided.

[0041] For driving the magnet disk 28, the soldering pump 10 comprises an electric motor (not shown in the figures) which drives the magnet disk 28 or the permanent magnets 22 such that they rotate about the axis of rotation 35.

[0042] FIG. 4 shows a lateral view in section of a second embodiment of a soldering pump 100 according to the invention, whereas FIG. 5 shows a longitudinal section through the soldering pump 100 according to FIG. 4. The elements and components corresponding to FIGS. 1 through 3 are designated with corresponding reference symbols.

[0043] In the second embodiment of the soldering pump 100, a plurality of permanent magnets 22 is provided which can be driven by a shaft 40, which in turn can be driven by an electric motor (not shown), to rotate about the axis of rotation 35 in the direction of the arrow 36. The permanent magnets 22 are arranged concentrically relative to the axis of rotation 35, wherein a permanent magnet 22 is respectively arranged with its south pole 26 radially outward (orthogonal to the axis of rotation 35), and the permanent magnet 22 arranged next to it is respectively arranged with its north pole 24 radially outward (orthogonal to the axis of rotation 35).

[0044] In the soldering pump 100, the feed channel 14 is delimited by a non-ferromagnetic material 30 which is designed as a semi-cylindrical sleeve 42. The feed channel 14 is furthermore delimited by a convex, hollow semi-cylinder 44, so that the feed channel 14 is formed between a concave inner face 46 of the sleeve 42 and a convex outer face 48 of the semi-cylinder 44. The design of the soldering pump 100 according to FIGS. 4 and 5 largely corresponds to the design of the soldering pump 10 according to FIGS. 1 through 3. However, the soldering pump 100 is particularly suitable for high volumetric flow rates of an electrically conductive fluid or a liquid solder, due to the large width 50 of the feed channel 14, which can be seen clearly in FIG. 5.

[0045] FIG. 6 shows a lateral view in section of a third embodiment of a soldering pump 200 according to the invention, whereas FIG. 7 shows a plan view in section of the soldering pump 200 according to FIG. 6. The elements and components corresponding to FIGS. 1 through 5 are designated with corresponding reference symbols.

[0046] The soldering pump 200 also comprises a plurality of permanent magnets 22 which are arranged on a magnet disk 28. For driving the magnet disk 28, the soldering pump 200 also comprises an electric motor (not shown in Figures) which drives the magnet disk 28 or the permanent magnets 22 such that they rotate about the axis of rotation 35.

[0047] In contrast to the soldering pump 10 of FIGS. 1 through 3, the permanent magnets 22 are arranged both radially inward (orthogonal to the axis of rotation 35) next to the feed channel 14 and radially outward (orthogonal to the axis of rotation 35) next to the feed channel. The feed channel 14 is completely delimited by a non-ferromagnetic material 30, except for the inlet 16 and the outlet 18. The permanent magnets 22 are arranged both radially inward and radially outward such that they alternately face toward the feed channel 14 with a south pole 26 or a north pole 24. As can be seen clearly in FIG. 6, the permanent magnets 22 arranged radially inward are arranged opposite the permanent magnets 22 arranged radially outward such that, on both sides of the feed channel 14, a north pole 24 and a south pole 26 of the opposing permanent magnets 22 respectively face one another.

[0048] By rotating the magnet disk 28 or the permanent magnets 22, a rotating magnetic field which forms between the respective north and south poles 24, 26 of the permanent magnets 22 can be generated in the feed channel 14. Since the magnetic flux is respectively generated between the north and south poles 24, 26, a soldering pump 200 with a particularly large conveying action can be provided overall.